Gigabyte MD71-HB0 User manual

MD71-HB0 Quick Reference Guide
No. Code Descripon
1 ID_SW ID buon with LED
2 USB3_MLAN Sever management LAN port (top)/USB 3.0 ports
3 LAN1 GbE Ethernet LAN port #1
4 LAN2 GbE Ethernet LAN port #2
5 LAN3_4 GbE Ethernet LAN port #3 (top)/GbE LAN port #4 (boom)
6 COM1 Serial port
7 VGA_1 VGA port
8 CPU1_FAN CPU fan connector (for secondary CPU)
9 P12V_AUX2 2x4 pin 12V power connector (for secondary CPU)
10 PMBUS PMBus connector
11 ATX1 2x12 pin main power connector
12 P12V_AUX1 2x4 pin 12V power connector (for primary CPU)
13 SYS_FAN5 System fan connector#5
14 CPU0_FAN CPU fan connector (for primary CPU)
15 J2 Funcon jumper switch #2
16 J1 Funcon jumper switch #1
17 SYS_FAN4 System fan connector #4
18 SYS_FAN3 System fan connector #3
19 SATA1 Slimline connector #1 (SATA 6Gb/s signal/ for SATA#4~#7)
20 SATA0 Slimline connector #0 (SATA 6Gb/s signal/ for SATA#0~#3)
21 SSATA0 Slimline connector #0 (SATA 6Gb/s signal/ for sSATA#0~#3)
22 SYS_FAN2 System fan connector #2
23 SYS_FAN1 System fan connector #1
24 IPMB IPMB connector
25 SATA_DOM2 SATA DOM support power connector for SSATA port #5
26 SSATA5 SATA 6Gb/s connector #5
27 LAN4_ACT LAN#4 Acve LED
28 SSATA4 SATA 6Gb/s connector #4
29 SATA_DOM1 SATA DOM support power connector for SSATA port #4
30 SW_RAID SATA RAID upgrade key
31 LAN3_ACT LAN#3 Acve LED
32 F_USB3 USB USB 3.0 header
33 FP_1 Front panel header
34 BMC_FLH1 BMC Flash ROM
35 BP_1 HDD back plane board header
36 U2 1 Slimline connector #1 (PCIe 3.0 x4 signal)
37 U2 0 Slimline connector #0 (PCIe 3.0 x4 signal)
38 BAT Baery socket
No. Code Descripon
39 CLR_CMOS Clear CMOS jumper
40 LPC_TPM TPM connector
41 COM2 Serial port cable connector
42 CASE_OPEN Case open intrusion alert header
43 PCIE_1 PCIe x8 slot #1 (Gen3 x4)
44 PCIE_2 PCIe x16 slot #2 (Gen3 x16)
45 PCIE_3 PCIe x8 slot #3 (Gen3 x8)
46 PCIE_4 PCIe x16 slot #4 (Gen3 x16)
47 PCIE_5 PCIe x8 slot #5 (Gen3 x8)
48 PCIE_6 PCIe x16 slot #6 (Gen3 x16)
49 LED_BMC BMC firmware readiness LED
50 M2_SK2 M.2 slot #2 (PCIe Gen3 x4, Support NGFF-22110/2280)
51 M2_SK1 M.2 slot #1 (PCIe Gen3 x4, Support NGFF-22110/2280)
52 LED_M22 M.2 slot #2 LED acve LED
53 LED_M21 M.2 slot #1 LED acve LED
&38
3ULPDU\
CPU1
(Secondary)
DIMM_P0_F0
DIMM_P0_E0
DIMM_P0_D0 DIMM_P0_D1
DIMM_P0_A1 DIMM_P0_A0
DIMM_P0_B0
DIMM_P0_C0
DIMM_P1_J1 DIMM_P1_J0
DIMM_P1_K0
DIMM_P1_L0
DIMM_P1_I0
DIMM_P1_H0
DIMM_P1_G0 DIMM_P1_G1
12 3 4 5 6 7
8
9
11
10
12
13141516
17181920212223
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42 43 44 45 46 47 48
49
50
52
51
53
Front Panel Header #1
1
2423
2
No. Pin Define
1 Power LED+
3 No Pin
5 Power LED-
7 HDD LED+
9 HDD LED-
11 Power Buon
13 GND
15 Reset Buon
17 GND
19 ID Buon
21 GND
23 NMI Switch
No. Pin Define
2 5V Standby
4 ID LED+
6 ID LED-
8 System Status LED+
10 System Status LED-
12 LAN1 Acve LED+
14 LAN1 Link LED-
16 SMBus Data
18 SMBus Clock
20 Case Open
22 LAN2 Acve LED+
24 LAN2 Link LED-
HDD Back Plane Board Header
No. Pin Define
1 Reserved
3 GND
5 BPMI_LOAD
7 BPMI_CLK
9 GLED_AMB_N
11 FAN_IRQ_N
13 BP_SCL
15 BP_SDA
17 SMB_U2_TMP_SCL
19 SMB_U2_TMP_SDA
21 PH_HP_SCL0
23 PH_HP_SDA0
25 PH_HP_SCL1
27 PH_HP_SDA1
29 P3V3_AUX
No. Pin Define
2 BPMI DIN/OUT
4 BPMI DIN/IN
6 GND
8 PLD_Program_EN
10 GLED_GRN_N
12 Reserved
14 GND
16 BP_RST_N
18 GND
20 I2C_DEV_RST
22 GND
24 GND
26 GND
28 GND
30 P3V3_AUX
12
2930
ATX Power
No. Pin Define
1 GND
2 GND
3 GND
4 GND
5 +12V
6 +12V
7 +12V
8 +12V
24 12
13
1
No. Pin Define
1 3.3V
2 3.3V
3 GND
4 +5V
5 GND
6 +5V
7 GND
8 Power Good
9 5VSB
10 +12V
11 +12V
12 3.3V
No. Pin Define
13 3.3V
14 -12V
15 GND
16 PS_ON
17 GND
18 GND
19 GND
20 -5V
21 +5V
22 +5V
23 +5V
24 GND
8 4
5 1
Installing CPU and Heat Sink
2
3
1
4
3
2
4
1
Memory Populaon Configuraon
DIMM
Capacity
(GB) 1 Slot per
Channel 2 Slot per Channel
DIMM Density
Speed (MT/s); Voltage (V)
Slot Per Channel (SPC)
DIMM Per Channel (DPC)
1DPC 1DPC 2DPC
1.2V
2666 2666 2666
1.2V 1.2V
Ranks Per
DIMM and
Data Width
4Gb 8Gb
8GB 16GB
4GB 8GB
8GB 16GB
16GB
32GB
N/A
N/A
2H-64GB
4H-128GB
N/A
N/A 4H 128GB
32GB
64GB
2H 64GB
Type
RDIMM
RDIMM
RDIMM
RDIMM
LRDIMM
LRDIMM
3DS
RDIMM
3DS
QRx 4
8Rx 4
QRx4
SRx4
SRx8
DRx8
DRx4
QRx4
8Rx4
Intel Optane DCPMM DIMM Populaon Rule
Modes
iMC0
Slot1
Channel0Channel1Channel2 Channel0Channel1Channel2
Slot0 Slot1 Slot0 Slot1 Slot0 Slot1 Slot0 Slot1 Slot0 Slot1 Slot0
iMC1
DRAM1
DRAM2
DRAM3
DRAM1
DRAM2
DRAM3
DRAM1
DRAM2
DRAM3
Symmetric Populaon with the Socket
AD --
--
--
--
--
--
--
--
--
DCPMM
MM DCPMM
AD+MM DCPMM
DRAM1
DRAM2
DRAM3
DRAM1
DRAM2
DRAM3
DRAM1
DRAM2
DRAM3
--
--
--
DCPMM
DCPMM
DCPMM
2-1-1
2-1-1
2-1-1
Modes
iMC0
Slot1
Channel0Channel1Channel2 Channel0Channel1Channel2
Slot0 Slot1 Slot0 Slot1 Slot0 Slot1 Slot0 Slot1 Slot0 Slot1 Slot0
iMC1
DRAM1
DRAM1
DRAM1
DRAM1
DRAM1
DRAM1
Asymmetric Populaon with the Socket
AD --
--
--
--
--
--
--
--
AD*
DRAM1
DRAM1
DRAM1
DRAM1
DRAM1
DRAM1
--
--
DCPMM
DCPMM
2/1-1-1
2/1-1-1
* 2nd socket has no DCPMM DIMM
 AD=All Modes; MM= Memory Mode.
 For MM, general NM/FM rao is between 1:4 and 1:16. Excess capacity for FM can be used for AD (NM= Near Memory; FM= Far Memory)
 For each individual populaon, sockets are normally symmetric with excepons for 1DCPMM per socket and 1 DCPMM per node case.
 No DDR4 single rank x8 for either DCPMM Memory Mode or APP-Direct Mode
 No mixing of DCPMM and NVDIMMs within the plaorm.
 DDR channel and DIMM slot nomenclature may vary depending on plaorm implementaon.
 Matrix targets configs for opmized Intel Optane DCPMM to DRAM cache rao in MM and MM + AD modes.
-- -- --
--
DRAM1
DRAM2
DRAM3
RDIMM
DCPMM Any Capacity (uniformly for all channels for a given configuraon
LRDIMM
LRDIMM 3DS LRDIMM3DS RDIMM
3DS RDIMM
RDIMM
RDIMM
Capacity
Capacity
DDR4 Type
See Validaon Matrix
(DDR4 DIMMs Vaildated
with DCPMM*)
No. Desripon
1 VGA port
2 Serial port
3 GbE Eternet LAN port #3
4 GbE Eternet LAN port #4
5 10Gb/s LAN port #2
6 10Gb/s LAN port #1
7 Server Management 10/100/1000 LAN port
8 USB 3.0 ports
9 ID buon with LED
1 2
3
4
5
7
6
9
8
Off 10Mbps data rate
State Description
Yellow On 1Gbps data rate
Green On 100Mbps data rate
10/100/1000 LAN LED:
ID buon/LED:
Blue On System identifcation
is active.
Off System identifcation
is disabled.
State Description
Speed LED Link/Acvity
LED
Rear I/O Connector
SATA Connector/SATA DOM
9
1
No. Pin Define
1 GND
2 TXP
3 TXN
4 GND
5 RXN
6 RXP
7 GND
8 5V
9 GND
13
1
3
No. Pin Define
1 5V
2 GND
3 No Connect
PMBUS
1
5No. Pin Define
1 PMBus Clock
2 PMBus Data
3 PMBus Alert
4 GND
5 3.3V Sense
TPM Connector
1413
21 No. Pin Define
1 Clock
2 P_3V3_AUX
3 LPC_RST
4 P3V3
5 LPC_LAD0
6 IRQ_SERIAL
7 LPC_LAD1
No. Pin Define
8 No Connect
9 LPC_LAD2
10 No Pin
11 LPC_LAD3
12 GND
13 LPC_FRAME_N
14 GND
IPMB
1
4No. Pin Define
1 Clock
2 GND
3 Data
4 VCC
CPU/System FAN
4 1
1
4
No. Pin Define
1 GND
2 +12V
3 Sense
4 Speed Control
USB 3.0 Header
120
1011
No. Pin Define
1 Power
2 IntA_P1_SSRX-
3 IntA_P1_SSRX+
4 GND
5 IntA_P1_SSTX-
6 IntA_P1_SSTX+
7 GND
8 IntA_P1_D-
9 IntA_P1_D+
10 NC
No. Pin Define
11 IntA_P2_D+
12 IntA_P2_D-
13 GND
14 IntA_P2_SSTX+
15 IntA_P2_SSTX-
16 GND
17 IntA_P2_SSRX+
18 IntA_P2_SSRX-
19 Power
20 No Pin
No. Pin Define
1 NDCD-
2 NSIN
3 NSOUT
4 NDTR-
5 GND
6 NDSR-
7 NRTS-
8 NCTS-
9 NRI-
10 No Pin
910
1 2
Serial Port Cable Connector
Jumper Sengs
No. Desripon
1 Clear CMOS Jumper
1-2 Close: Normal operaon (Default seng)
2-3 Close: Clear CMOS data.
-
21',3

-
21',3

1
Clear supervisor password
BIOS recovery mode
Force ME update
ME_UPDATE
BIOS_PWD
ON
ME recovery mode Normal [Default]
Normal [Default]
Normal [Default]
Normal [Default]
OFF
BIOS_RCVR
ME_RCVR
J2
1
2
3
4
HOST_SMBUS_SEL
PMBUS_SEL
ON
CPLD debug mode Normal [Default]
Normal [Default]
BIOS defined
BIOS defined
Stop initial power on
when BMC is not ready
OFF
S3_MASK
DB_PLD
J1
1
2
3
4
BMC Firmware Readiness LED
State Descripon
On BMC firmware is inial
Blink BMC firmware is ready
Off AC loss
BMC Firmware Readiness LED (LED_BMC):
Case Open Intrusion Header
Open: Normal operaon.
Closed: Acve chassis intruson alert.
SATA RAID Upgrade Key
No. Pin Define
1 GND
2 P_3V3_AUX
3 GND
4 PCH_SATA_RAID_KEY
4
1
No. Pin Define
1 Enable LAN Link/Acve LED
2 P_3V3_AUX
12
LAN3/LAN4 Acve LEDs

Regulatory Noces Connect With Us
WEEE Symbol Statement
The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other
waste. Instead, the device should be taken to the waste collecon centers for acvaon of the treatment, collecon, recycling and
disposal procedure. The separate collecon and recycling of your waste equipment at the me of disposal will help to conserve
natural resources and ensure that it is recycled in a manner that protects human health and the environment.
For more informaon about where you can drop off your waste equipment for recycling, please contact your local government
office, your household waste disposal service or where you purchased the product for details of environmentally safe recycling.
 When your electrical or electronic equipment is no longer useful to you, "take it back" to your local or regional waste
collecon administraon for recycling.
 If you need further assistance in recycling, reusing in your "end of life" product, you may contact us at the Customer Care
number listed in your product's user's manual and we will be glad to help you with your effort.
GIGABYTE产品未故意添加和使用有害物质（Cd、Pb、Hg、Cr+6、PBDE和PBB）。所有部件和元件均经过严格挑选，符合RoHS要求。此
外，我们GIGABYTE一直致力于开发不使用国际上禁止的有毒化学品的产品。
GIGABYTE products have not intended to add and safe from hazardous substances (Cd, Pb, Hg, Cr+6, PBDE and PBB). The parts and components
have been carefully selected to meet RoHS requirement. Moreover, we at GIGABYTE are connuing our efforts to develop products that do not use
internaonally banned toxic chemicals.
Restricon of Hazardous Substances (RoHS) Direcve Statement
限制使用有害物质 (RoHS) 指令声明
California Proposion 65 Warning
WARNING:
This product can expose you to chemicals including Lead, which is known to the State of California to cause cancer, and Bisphenol A
(BPA), which is known to the State of California to cause birth defects or other reproducve harm. For more informaon go to
www.P65Warnings.ca.gov.
Baery Warning:
Incorrectly installing a baery or using incompable baery may increase the risk of ifre explosion. Replace the baery only with
the same or equivalent type.
 Do not disassemble, crush, punchture baeries.
 Do not store or place your baery pack next to or in a heat source such as a fire, heatgenerang appliance, can or exhaust
vent. Heang baery cells to temperatures above 65oC (149oF) can cause explosion or fire.
 Do not aempt to open or service baeries. Do not dispose of baeries in a fire or with household waste.
电池警告：
电池安装不当或使用不兼容的电池会增加火灾爆炸风险。更换电池时，只可使用相同或同等类型的电池。
 请勿拆解、挤压、刺破电池。
 请勿将电池存放或放置在热源中或旁边，如火源、产生热的设备、罐体或排气口。电池温度升至65oC (149oF)以上
可能导致爆炸或火灾。
 请勿尝试打开或维修电池。电池废弃时，请勿投入火中或者作为家庭废弃物进行处理。
依照中华人民共和国的有毒有害物质的限制要求(China RoHS)提供以下的表格：
中华人民共和国电子信息产品中有毒有害物质或元素的名称及含量标识格式
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