Hadish ZL-43BF5152 User manual

LED TV
SERVICE MANUAL
CHASSIS : 2936P636
MODEL : ZL-43BF5152
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION ................................................................20
TROUBLE SHOOTING ............................................................................21
BLOCK DIAGRAM...................................................................................28
EXPLODED VIEW ..................................................................................29
SVC. SHEET ...............................................................................................

SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
AC Volt-meter
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
To Instrument's
exposed
METALLIC PARTS
0.15uF
1.5 Kohm/10W
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1 Ω
*Base on Adjustment standard

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimiz e bodily motions when handling unpack a g e d
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circ uit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

SPECIFICATION
1. GENERAL DESCRIPTION
HK.T.RT2936P636X is an integration board of power supply, LED driver and TV control board. That’s a
digital and analog TV control board, which is suitable for the Australia、Middle East 、Southeast Asia
and Colombia market. It is designed to apply the LVDS (Low Voltage Differential Signaling) as the
interface. It can support LED backlight TFT panel between 24’to 43’,maximum resolution supported
is 1920x1080.
HK.T.RT2936P636X’s power part is an energy-efficient ultrathin DC-line switching power supply unit,
with max 55/75 watts multi-output.
Main Promotion Power and backlight Spec.
Power
Power Output
Backlight Value
Backlight Connectors
65W
12V和19V
30V-44V/30W
2PIN-2.0
+2PIN-2.0
2PIN-2.0
+3PIN-2.0
65W
12V和24V
45V-63V/35W
65W
12V和32V
64V-94V/35W
75W
12V和24V
45V-63V/40W
75W
12V和33V
64V-94V/45W
75W
12V和48V
95V-140V/45W
Note:
1. The accuracy of backlight current is 5%.
2. Due to the requirements of the harmonic current in electromagnetic compatibility
(IEC61000-3-2), the rated input power should be less than 75W when the TV set is undering
the rated input voltage.

2. STANDARD CONFIGURATION
Pictures are for reference only, specific to prevail in kind.
标准配置二
销售地区 ，主要端口 （澳洲、中东、东南亚）
Functions
【HK.T. RT2936P636X 】HEADPHONE，YPbPr，AV IN，RF(IEC头)，
HDMI3，HDMI 2（ARC），HDMI 1，USB X2，COAX OUT
Notes
FRONT VIEW
SIDE VIEW

3. FEATURE
3.1 FEATURE 1
Chipset
RTD2936
Market
Australia、Middle East、Colombia 、Southeast Asia
Panel
Type
TFT-LED;
Resolution
Max. 1920*1080
Interface
Single/Dual LVDS 6bit/8bit
Input Signal
Analog TV
(ATV)
PAL 、SECAM System
Receiving range:48.25MHz-863.25MHz
Input impedance:75Ω
Video System: PAL,SECAM
Sound System :BG,DK,I, NICAM/A2
Teletext ：1000Pages
Max Storage Channels ：100CH
NTSC System
Video System : NTSC /PAL ‐ N/PAL ‐
M Sound System :M/N
CC: CC1, 2, 3 and4, Text 1, 2, 3 and
4, XDS (eXtension Data Service)
Digital TV
(DVB-T/T2+C)
Receiving Range
VHF(52.5MHz-219MHz)
UHF(474MHz-862MHz)
Input impedance
75Ω
Channel bandwidth
6MHz/7MHz/8MHz
Modulation
DVB-T/T2:
COFDM,2K/8K,QPSK,16QA,64QAM ,
128QMA,256QAM
DVB-C:16-256QAM
Video system
MPEG-2, MPEG-4, H.264, AVS,H.265
Sound system
MPEG-1 layer 1/2, MPEG-2 layer 2,
DRA
Basic function
EPG, Subtitle, LCN,
Teletext
Max Storage Channels
>800CH(dynamic)
Digital TV
(ISDB-T)
nput level
‐ 83~ ‐ 8dBm
C/N
≦ 16dB (Air) ≦ 28dB (Cable)
Channel bandwidth
6MHZ
Modulation
ISDB
Video system
H.264
Sound system
Support MPEG1 Layer 1,2
and 3(mp3), and MPEG2 Layer 2
Basic function
EPG, CC,GINGA( Optional )

3.2 FEATURE 2
AV CVBS
Video system: PAL /NTSC /SECAM Video
Level: 1.0Vp-p +/-5%
Input Signal
HDMI
Version 1.4a
HDCP HDCP 1.4a compliant receiver
Format 480i,480P,576i,576p,720p,1080i,1080p
YUV
Signal
Y: 1Vp-p@75ohm
UV :0.7Vp-p@75ohm
Format
480i,480P,576i,576p,720p,1080i,1080p
CVBS Audio
L/R RCA Input
0.2- 2.0 Vrms
YPBPR Audio
Output Signal
Audio Output
Fre.q Response
100Hz-15KHz @±3dB
(1KHz, 0dB reference signal)
Max Output power
2x8W(8Ω) THD+N<10%
Power
Input
AC100-240V
Operate
Normal and Low power mode
Manage
Standby＜0.5W
Panel Voltage
5V,12V
Picture
Video decoder
H/W auto multi-standard detection and color decoding.
High performance adaptive 3D comb filter for Y/C separation. Handling of
weak and noisy off-air signals.
Support 3-ch for CVBS and S-Video output.
De-interlace
3D De-interlacing with Low Angle Detection
Noise Reduction
MPEG De-block&De-ringingnoise reduction
Picture Enhance
Digital hut,saturation,brightness and contrast adjustments .
Support DLTI/DCTI video-quality improvement. Support
Black/white level extension and ACC. Support 2D Y
peaking filter and coring.
sRGB compliance and Gamma correction.
Scaling
Support 4:3 / 16:9 with Non-linear scaling
Advanced Scaling Engine
Other
Amplifier
2 X 8W (8Ω),
OSD language
English、Thai、Farsi、Malay、Lao,.etc.
Key definition
SOURCE、MENU、CH+、CH-、VOL+、VOL-、POWER
Interface
Input
ATV/DTV
1 IEC /N 75 Ω
CVBS
1 RCA terminal
YPBPR
3 RCA terminal
CVBS@YPBPR Audio
2 RCA terminal
HDMI
3 HDMI terminal
USB Slot
1 USB Slot(Horizontal) (SUPPORT Double
USB )
Output
Earphone
1 Earphone terminal
Coax
1 RCA terminal(orange)

Note: Licenses involved in specifications above are supposed to be obtained by customers themselves.
4.MEDIA PLAYER FORMAT
Movie format (by Video codec)
File
Extension
Container
P/N
Video Decoder
External
Resolution
MPEG
MPEG1
O
768x576
MPEG2 MP@HL
O
1920x1080
H.264
H.264 BP LV4.0
O
1920x1080
H.264 MP LV4.0
O
1920x1080
H.264 HP LV4.0
O
1920x1080
MPEG
MPEG-4 SP@HL 3.0
O
1920x1080
MPEG-4 ASP@HL 4.0
O
1920x1080
*.mp4
*.mov
*.3gp
MP4
(MPEG-4 Part 14)
H.264
H.264 BP LV 4.0
O
1920x1080
H.264 MP LV 4.0
O
1920x1080
H.264 HP LV 4.0
O
1920x1080
MPEG
MPEG-4 SP@HL 3.0
O
1920x1080
MPEG-4 ASP@HL 4.0
O
1920x1080
*.mkv
MKV
(Matroska Video)
H.264
H.264 BP LV 4.0
O
1920x1080
H.264 MP LV 4.0
O
1920x1080
H.264 HP LV 4.0
O
1920x1080
MPEG
MPEG-4 SP@HL 3.0
O
1920x1080
MPEG-4 ASP@HL 4.0
O
1920x1080
*.mpg /
*.mpeg
*.vob
PS
(Program Stream)
MPEG
MPEG1
O
768x576
MPEG
1/2/4
MPEG2 MP@HL
O
1920x1080
Others
(ts)
TS
(Transport Stream)
MPEG
MPEG2 MP@HL
O
1920x1080
H.264
H.264 BP LV 4.0
O
1920x1080
H.264 MP LV 4.0
O
1920x1080
H.264 HP LV 4.0
O
1920x1080
H.264 MVC
O
1920x1080
AVS
AVS Jizhun Profile
LV6.0
O
1920x1080
*.rm
*.rmvb
RM
RV 8 (rv30)
O
1920x1080
RV 9 (rv40)
O
1920x1080
RV 10 (rv40)
O
1920x1080
*.flv
FLV
(FLash Video)
H.264
H.264 BP LV 4.0
O
1920x1080
H.264 MP LV 4.0
O
1920x1080
H.264 HP LV 4.0
O
1920x1080

Movie format (by Audio codec)
File
Extension
Container
P/N
Audio Decoder (For MM
Video)
External
-
*.avi
AVI (Audio
Video
Interleave)
Generic
(MTK)
wav : PCM / ADPCM
O
MPEG1 Layer1/2
O
MP3 (MPEG1 Layer3)
O
Window Media Audio
V8
O
H.264
MPEG2 AAC (AAC-LC)
O
MPEG4 AAC-LC
O
MPEG4 HE-AAC
O
*.wma
*.wmv
ASF (Advanced
Systems Format)
Generic
(MTK)
Window Media Audio
V8
O
Window Media Audio
V9
O
*.mp4
MP4
(MPEG-4 Part 14)
Generic
(MTK)
MPEG1 Layer1/2
O
MP3 (MPEG1 Layer3)
O
H.264
MPEG2 AAC (AAC-LC)
O
MPEG4 AAC-LC
O
MPEG4 HE-AAC
O
*.mkv
MKV
(Matroska Video)
Generic
(MTK)
wav : PCM / ADPCM /
A-law PCM / u-law PCM
O
MPEG1 Layer1/2
O
MP3 (MPEG1 Layer3)
O
Window Media Audio
V8
O
H.264
MPEG2 AAC (AAC-LC)
O
MPEG4 AAC-LC
O
MPEG4 HE-AAC
O
*.mpg /
*.mpeg
*.vob
PS
(Program Stream)
Generic
(MTK)
MPEG1 Layer1/2
O
MP3 (MPEG1 Layer3)
O
PS System
Layer don't
have MP3
flag in spec.
DVD LPCM
O
Others
(ts)
TS
(Transport Stream)
Generic
(MTK)
MPEG1 Layer1/2
O
DVD LPCM
O

DRA
O
H.264
MPEG2 AAC (AAC-LC)
O
MPEG4 AAC-LC
O
MPEG4 HE-AAC
O
*.rm
RM
(RealMedia)
Generic
(MTK)
cook : COOK
(RealAudio6)
O
H.264
raac : MPEG4 AAC-LC
(RealAudio9)
O
racp : MPEG4 HE-AAC
(RealAudio10)
O
*.flv
FLV
(FLash Video)
Generic
(MTK)
MP3 (MPEG1 Layer3)
O
H.264
MPEG2 AAC (AAC-LC)
O
MPEG4 AAC-LC
O
MPEG4 HE-AAC
O
Photo format
File
Extension
Container
-
Decoder
method
-
*.jpg
JPEG
baseline
H/w
*.bmp
BMP (Bitmap)
S/W
*.png
PNG (Portable Network
Graphics)
S/W
Music format
File
Extension
-
-
Decoder
method
-
*.mp3
MPEG-1/2 Audio
Layer-3
*.wav
LPCM/ADPCM
*.m4a
Advanced Audio
Coding
Note1: Licenses are required for Divx,MPEG,H.264,AC3, MP3,WMA and ACC.

5. SUBSTITUTABLE PRIMARY MATERIALS
5.1 GENERAL MATERIALS
Including SMT capacitors, SMT resistors, diodes, transistors, MOSFET, connectors, common
inductance, electrolytic capacitor, PCB etc., and having no obvious changes in appearance or
color. Our company has two or three alternative suppliers with these materials; maybe we will
alternative use these materials for follow-up mass production due to delivery time, stock or other
reasons. We no longer notice your company the alternative materials used. If necessary, you can
apply for using related materials (mention as above) in samples stage.
(Note: The alternative materials which have been accepted by our materials Confirmation
department and PP will enter our system.)
5.2 KEY MATERIALS
The table is for reference only, the actual is the standard.
NAME
TYPE
BRAND
BACKUP TYPE
BACKUP
BRAND
SPI FLASH
GD25Q64
GigaDevice
W25Q64
EN25Q64
Winbond
EON
LDO
HH1117-ADJ
HUAHONG
BL1117
BEILING
AP1117
AP
CRYSTAL
'X-24.000MHz
ML
'X-24.000MHz
FL
'X-27.000MHz
ML
'X-27.000MHz
FL
DC_DC
SY8113BADC
SILERGY
XC8113
XC
SY8120B1ABC
SILERGY
XC8112B
XC
AMP
R3118E
RDA
TPA3138
TI
AD52050
ESMT

6. FUNCTION LAYOUT
6.1 THE TOP VIEW OF HK.T.RT2936P636X
6.2 THE BOTTOM VIEW OF HK.T.RT2936P636X

7. PCB DIMENSION AND CONFIGURABLE
7.1 PCB DIMENSION
PCB Height=20.00mm PCB
Length=134.50mm PCB
Width=153mm
PCB Screw Bore Size: Diameter is 3.5mm
7.2 CONFIGURABLE
The structure chart is for a reference only; the actual item is the standard.
Jack configuration can be adjusted according to your jack terminal, it just depends on your board basic, and
the final bracket Configuration is determined by the practical sample.
8. INTERFACE DEFINITION
Below, please see the definition and description from left PIN to right PIN or from up PIN to down
PIN.
◆ CN10(2X15 Pin / 2.0): TO LVDS
NO
DEFINITION
NO
DEFINITION
1
VCC
2
VCC
3
VCC
4
GND
5
GND
6
NC
7
RX00-
8
RX00+
9
RX01-
10
RX01+
11
RX02-
12
RX02+
13
GND
14
GND
15
RX0C-
16
RX0C+
17
RX03-
18
RX03+
19
RXE0-
20
RXE0+
21
RXE1-
22
RXE1+
23
RXE2-
24
RXE2+
25
GND
26
GND
27
RXEC-
28
RXEC+
29
RXE3-
30
RXE3+

NO
DEFINITION
DESCRIPTION
1
+5V
5V Power Supply
2
R
Red Indicator
3
G
Green Indicator
4
IR
Remote Receive
5
GND
GND
6
K0
SOURCE
7
K1
MENU
◆ CN8 (14Pin / 2.0): TO IR/KEY BOARD
8
8
8
8
8
8
8
K2
CH+
9
K3
CH-
10
K4
Vol+
11
K5
Vol-
12
K6
POWER
13
K7
(Reserved)
14
GND
Ground
◆ CN12 (4 Pin / 2.54): SPEAKER OUT
NO
DEFINITION
DESCRIPTION
1
LOUTP
Left Speak Out +
2
LOUTN
Left Speak Out-
3
ROUTN
Right Speak Out-
4
ROUTP
Right Speak Out+

◆ CNW1 (2 pin 2.0): MAIN BOARD POWER
NO
DEFINITION
DESCRIPTION
1
12V
12V Power Supply
2
GND
Ground
◆ XW1 AC INPUT CONNECTOR
NO
DEFINITION
DESCRIPTION
1
L
LIVE
2
N
NEUTRAL
9. ELECTRICAL CHARACTERISTICS
9.1 INPUT ELECTRICAL SPECIFICATIONS
9.1 .1 AC INPUT CHARACTERISTICS
Input
Minimum
Nominal
Maximum
Unit
Voltage
90
100-240
264
V
Current
---
---
1.5
A
Frequency range
50/60 ± 5%
Hz
Efficiency(Full Load)
80%minimum at 220Vac
Standby Power Consumption
≦ 0.5W at 240Vac input and no load condition
Inrush Current
80Atyp peak, 100Vac；100Atyp peak, 240Vac
Leakage Current
Less Than 0.35mA, 240Vac input
Input Fuse
T3.15AL/250Vac

9.1.2 DIMMING CHARACTERISTICS
Dimming type
Digital dimming
Parameter
Min
Typical
Max
Unit
Remark
PWM_REF
Input
Duty
20
80
100
%
100%Maximum Duty
Maximum Brightness
Frequency
22
25
28
KHz
9.2 LED DRIVER POWER OUTPUT CONNECTOR
◆ CNW2、CNW3 (2 pin 2.0): INVERTER
NO.
DEFINITION
1
LED-
2
LED+
◆ CNW4、CNW5(3 pin 2.0): INVERTER
NO.
DEFINITION
1,2
LED-
3
LED+
◆ OUTPUT PROTECTION SPECIFICATION
Signal Name
LED Short Protection
LED Open Protection
Specification
Specification
LED output
Auto restart
Shut down or auto restart
9.3 SHORT CIRCUIT PROTECTION
When any output is short circuited to ground, the power supply is automatically protected, and the continuous
short circuit is not damaged. The output impedance is less than 0.1 ohms, which is defined as a short-circuit
circuit.

9.4 RESET AFTER SHUTDOWN
If the power supply latches into a shutdown state because of 1 fault condition on its output, the power
supply shall return to normal operation only after the fault has been removed，or the PS-On has been cycled
off/on, or the AC INPUT has been cycled off/on with a off time of ten
second.
10. FUSE PROTECTION
The Fuse inside the power supply shall open when the AC input current is over the rated current of
fuse. This Fuse protection will cause switching power supply to fail.
10.1 SAFETY
The power supply shall compliance with the following Criterion:
1) UL60950/UL60065
2) EN60950-1/EN60065
3) IEC60950/IEC60065
4) GB4943-2011/GB8898-2011
10.2 ISOLATION
HI-POT
Input To Output
3000Vac 50Hz 1minute ≤10mA
Input To FG
3000Vac 50Hz 1minute ≤10mA
Output To FG
Non Isolated
INSULATION RESISTANCE
Input To Output
DC500V 50MΩmin (at room temperature)
Input To FG
DC500V 50MΩmin (at room temperature)
Output To FG
Non Isolated
11. CONFIGURATION & GENERAL PRECAUTIONS
Relative Humidity: ≤80%
Storage Temperature: -10 ~ + 60℃ Operation
Temperature: 0 ~ +40℃
Keep the board away from conductor, static electricity and water when it is working.
Don’t push or pull the connectors when the board is working.
Clean the board with soft dry cloth when it’s dirty.

ADJUSTMENT INSTRUCTION
Follow the steps below to upgrade the software:
After exiting the mode (install_RTD2936.img )
1. First the software file with the name
Copy the compressed USB into the root
We disconnect the city, after the power inside the Ac
2. device is disconnected from the power supply
Turn on the device. The device turns on and the upgrade begins
The device's headlight flashes when it is updated. When you upgrade
When the device is restarted.
important points:
The device should not be unplugged when updating.