Helwett Packard FF 12904E Assembly instructions

EL-MF877-00 Page 1
Template Revision B
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP FF 12904E Main Processing Unit(JH263A)
HP FF 12904E TAA Main Processing Unit(JH267A)
HPE 12904E v2 Main Processing Unit(JH668A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sqcm
3
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardantsweighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0

EL-MF877-00 Page 2
Template Revision B
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
Sleeve
M3
Tweezers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove all of the films 1.
2. Remove shielding fingers 2.
3. Unscrew the screws on part 3, and then remove part 3.
4. Unscrew the screws on part 4, and then remove part 4.
5. Remove shading foam 5 from part 4.
6. Unscrew the screws on heatsink 7, and then remove heatsink 7.
7. Unscrew the screws on PCB 8, and then remove PCB 8.
8. Unscrew the screws on PCB 9, and then remove PCB 9.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)
Figure 1 Treatments to the product（front view）