HP E24i G4 HO Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Monitors & Display
Marketing Name / Model
[List multiple models if applicable.]
E24i G4 HO
HSD-0056-Q
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
I/F Board*1, SPS board*1, Control Board*1, Lens
Board*1
4
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
0
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps Panel*1
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
C605 in SPS Board
1
External electrical cables and cords
HDMI cable*1, DP cable*1, USB cable*1, Power
cord*1
All are inside monitor carton box
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0

Item Description Notes
Quantity of
items
included in
product
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2
Hexagon Screw Driver
1
Flathead screwdriver
1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Press quick release button to separate head and stand.
2. Use screwdriver to loosen the two screws and disassemble the rear cover.

3. Use flathead screwdriver to stick up rear cover bottom and stick up upper-left, upper-right corner with hands, and then
open the rear cover.
4. Remove 2 conductive tapes , insulating tape and unplug 2 cable.
5. Remove insulating tape and unplug lamp wire.
6. Remove the shielding.
7. Remove insulating film and loosen 6 screws and 2 HEX screws on PCBs.

8. Remove all the gaskets, thermal pad, mylar, spacer on shielding. Remove all cable on PCBs.
9. Loosen 15 screws on middle frame and decoration to remove the deco and panel.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).