HP Pavilion W1858 Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP w1858 Flat Panel Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
2
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
1
External electrical cables and cords
3
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
Include the cartridges, print heads, tubes, vent
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
ESD wrist ring Wrist which forfend static
1
ESD glove Glove which forfend static
1
Screwdriver type:3220/5200
、
shank type2#
：φ
=5mm
、
L=85mm
1
Screwdriver type:3220/5200
、
shank type hexagram
：φ
=5mm
、
L=85mm
1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the screws of stand，get down the stand
2. Dismantle BEZEL
3. Dismantle the button，pull out the pin of KEPC board ,get down the KEPC board
4. Pull out the PIN of power of key board ,and get down it
5. Rdismantle REAR COVER
6. Dismantle the D-SUB screws and HDMI screws
7. Pull out the pin of speaker , get down the right and left speaker .
8. Pull out the PIN of lamp
9. Dismantle the screws of PANEL
10. Pull out the PIN of FFC cabel，separate the mainframe and PANEL
11. Dismantle the screws of main board and PWPC board
12. First :tear off the black tape ;Second: pull out the connector PIN which connect PWPC and main board;Third: take off
both boards
13. Pull out the pin of KEPC cable and FFC cable
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1
HP w1858 disassembly SOP
FROM：IE/NPI/huijuan.ye
DATE：Oct-17-08

1. dismantle the screws of stand，get down the stand

2. dismantle BEZEL

3. dismantle the button，pull out the pin of KEPC board ,get
down the KEPC board

4.pull out the PIN of power of key board ,and get down it

5. dismantle REAR COVER

6. dismantle the DVI screws and D-SUB screws

7. pull out the pin of speaker , get down the right and left speaker

8.pull out the PIN of lamp

9. dismantle the screws of PANEL

10.pull out the PIN of FFC cabel，separate the
mainframe and PANEL

11. dismantle the screws of main board and PWPC board

12. First :tear off the aluminum foil
Second: pull out the connector PIN which connect
PWPC and main board
Third: take off both boards

13.pull out the pin of KEPC cable and FFC cable