Huawei MU609 Installation instructions

HUAWEI MU609 HSPA Mini PCIe Module
Hardware Guide
Issue 03
Date 2014-12-04

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HUAWEI MU609 HSPA Mini PCIe Module
Hardware Guide
About This Document
Issue 03 (2014-12-04)
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About This Document
Revision History
Document
Version
Date Chapter Descriptions
01 2013-07-24 Creation
02 2014-01-06
3.10 Updated Figure3-9 Circuit of the USIM card
interface
5.6.2 Updated 5.6.2 Power Consumption
5.7 Updated 5.7 Reliability Features
5.8 Updated 5.8 EMC and ESD Features
6.5 Added 6.5 Label
03 2014-12-04
1 Added two editions description of MU609
module
2 Updated Table 2-1 Features and Figure 2-1
Circuit block diagram of the MU609 module
3 Updated definitions of pins
4.4.2 Updated Table 4-4 MU609 module
conducted Tx power
5.4.2 Updated Table 5-5 Averaged standby DC
power consumption of MU609 module
5.5 Updated Table 5-9 Test conditions and
results of the reliability of the MU609 module
6.2 Updated Figure 6-1 Dimensions of the
MU609 module
6.4 Added packaging of MU609 module
6.6 Added Antenna Plug
6.7 Added Thermal Design Guide
7 Updated Table 7-1 product certifications

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Document
Version
Date Chapter Descriptions
9 Updated Appendix A Circuit of Typical
Interface

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Contents
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Contents
1 Introduction....................................................................................................................................8
2 Overall Description ......................................................................................................................9
2.1 About This Chapter........................................................................................................................... 9
2.2 Function Overview............................................................................................................................ 9
2.3 Circuit Block Diagram..................................................................................................................... 10
3 Description of the Application Interfaces..............................................................................12
3.1 About This Chapter......................................................................................................................... 12
3.2 Mini PCIe Interface......................................................................................................................... 12
3.3 Power Interface.............................................................................................................................. 17
3.3.1 Power Sources and Grounds ................................................................................................ 17
3.3.2 Power Supply Time Sequence .............................................................................................. 17
3.4 Signal Control Interface.................................................................................................................. 18
3.4.1 WAKE# Signal....................................................................................................................... 19
3.4.2 RESIN_N Signal.................................................................................................................... 20
3.4.3 W_DISABLE# Signal............................................................................................................. 21
3.4.4 LED_WWAN# Signal............................................................................................................. 21
3.5 USB Interface................................................................................................................................. 22
3.6 USIM Card Interface ...................................................................................................................... 23
3.6.1 Overview................................................................................................................................ 23
3.6.2 Circuit Recommended for the USIM Card Interface.............................................................. 24
3.7 Audio Interface ............................................................................................................................... 25
3.8 RF Antenna Connector................................................................................................................... 26
3.9 Reserved Pins................................................................................................................................ 27
3.10 NC Pins........................................................................................................................................ 27
4 RF Specifications.........................................................................................................................29
4.1 About This Chapter......................................................................................................................... 29
4.2 Operating Frequencies................................................................................................................... 29
4.3 Conducted RF Measurement......................................................................................................... 30
4.3.1 Test Environment................................................................................................................... 30
4.3.2 Test Standards....................................................................................................................... 30
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 30
4.4.1 Conducted Receive Sensitivity.............................................................................................. 30

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4.4.2 Conducted Transmit Power................................................................................................... 31
4.5 Antenna Design Requirements ...................................................................................................... 32
4.5.1 Antenna Design Indicators..................................................................................................... 32
4.5.2 Interference ........................................................................................................................... 34
4.5.3 GSM/WCDMA/GPS Antenna Requirements......................................................................... 34
5 Electrical and Reliability Features ...........................................................................................36
5.1 About This Chapter......................................................................................................................... 36
5.2 Absolute Ratings ............................................................................................................................ 36
5.3 Operating and Storage Temperatures............................................................................................ 36
5.4 Power Supply Features.................................................................................................................. 37
5.4.1 Input Power Supply ............................................................................................................... 37
5.4.2 Power Consumption.............................................................................................................. 38
5.5 Reliability Features......................................................................................................................... 42
5.6 EMC and ESD Features................................................................................................................. 44
6 Mechanical Specifications.........................................................................................................46
6.1 About This Chapter......................................................................................................................... 46
6.2 Dimensions and Interfaces............................................................................................................. 46
6.3 Dimensions of the Mini PCI Express Connector............................................................................ 47
6.4 Packaging....................................................................................................................................... 48
6.5 Label............................................................................................................................................... 49
6.6 Specification Selection for Fasteners............................................................................................. 50
6.6.1 Installing the Mini PCIe Adapter on the Main Board.............................................................. 50
6.6.2 Romoving the Mini PCIe Adapter from the Main Board ........................................................ 52
6.7 Antenna Plug.................................................................................................................................. 53
6.8 Thermal Design Guide ................................................................................................................... 54
7 Certifications................................................................................................................................56
7.1 About This Chapter......................................................................................................................... 56
7.2 Certifications................................................................................................................................... 56
8 Safety Information......................................................................................................................57
8.1 Interference .................................................................................................................................... 57
8.2 Medical Device............................................................................................................................... 57
8.3 Area with Inflammables and Explosives......................................................................................... 57
8.4 Traffic Security................................................................................................................................ 58
8.5 Airline Security................................................................................................................................ 58
8.6 Safety of Children........................................................................................................................... 58
8.7 Environment Protection.................................................................................................................. 58
8.8 WEEE Approval.............................................................................................................................. 58
8.9 RoHS Approval............................................................................................................................... 58
8.10 Laws and Regulations Observance ............................................................................................. 59
8.11 Care and Maintenance................................................................................................................. 59

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8.12 Emergency Call............................................................................................................................ 59
8.13 Regulatory Information................................................................................................................. 59
8.13.1 CE Approval (European Union)........................................................................................... 59
8.13.2 FCC Statement.................................................................................................................... 60
9 Appendix A Circuit of Typical Interface................................................................................61
10 Appendix B Acronyms and Abbreviations..........................................................................62

HUAWEI MU609 HSPA Mini PCIe Module
Hardware Guide
Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI MU609 Mini PCIe module (hereinafter referred to as the MU609
module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the MU609 module.
MU609 module has two editions: GPS and No GPS.

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Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the MU609 module and provides:
Function Overview
Circuit Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature Description
Physical
Dimensions
Dimensions (L × W × H): 51 mm × 30.4 mm × 3.3 mm
Weight: about 12 g
Operating
Bands
WCDMA/HSDPA/HSUPA/HSPA: Band 1, Band 2, Band 5, Band
8
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
GPS L1: 1575.42 MHz
Operating
Temperature –20°C to +60°C
Storage
Temperature –40°C to +85°C
Power
Voltage DC 3.0 V–3.6 V (typical value is 3.3 V)
AT
Commands See the HUAWEI MU609 HSPA LGA Module AT Command Interface Specification.
Application
Interface
(52-pin Mini
PCIe interface
One standard USIMcard (Class B and Class C)
Audio interface: PCM interface
USB 2.0 (High Speed)

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Feature Description
RESIN_N: Reset module
WAKE#: Wake up signal
W_DISABLE# Signal (the software version is planning)
LED_WWAN#: Active-low LED signal indicating the state of the
module
Antenna
connector WWAN MAIN antenna connector x1
WWAN AUX antenna connector x1
GPS antenna connector x1
Data Services GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s
EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s
WCDMA PS: UL 384 kbit/s; DL 384 kbit/s
HSPA: UL 5.76 Mbit/s; DL 14.4 Mbit/s
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU609 Mini PCIe Adapter. The
major functional unit of the Mini PCIe Adapter contains the following parts:
LGA Module
Control signals
Antenna Connectors

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Figure 2-1 Circuit block diagram of the MU609 module

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Description of the Application Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU609
module, including:
Mini PCIe Interface
Power Interface
Signal Control Interface
USB Interface
USIM Card Interface
Audio Interface
RFAntenna Connector
Reserved Pins
NC Pins
3.2 Mini PCIe Interface
The MU609 module uses a Mini PCIe interface as its external interface. For details
about the module and dimensions, see "Dimensions and Interfaces".

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Figure 3-1 shows the sequence of pins on the interface of the Mini PCIe Adapter.
Figure 3-1 Sequence of Mini PCIe interface
Top Bottom
Table 3-1 shows the pin definitions of the Mini PCIe interface.
Table 3-1 Pin definitions of the Mini PCIe Interface
PIN
No.
Pin Name Pad
Type
Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
Comments
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
1 WAKE# WAKE# O
Open collector
active low signal.
This signal is
used to wake up
the host.
VOL –0.3 - 0.45 -
2 3.3Vaux VCC_3V3 PI 3.3 V DC supply
input. - 3.0 3.3 3.6 -
3 COEX1 NC - Not connected - - - - -
4 GND GND - Ground - - - - -
5 COEX2 NC - Not connected - - - - -
6 1.5 V NC - Not connected - - - - -
7 CLKREQ# NC - Not connected - - - - -

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PIN
No.
Pin Name Pad
Type
Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
Comments
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
8 UIM_PWR USIM_PWR PO Power source for
the external
USIM card
- 1.75 1.8 1.98 USIM_PWR
=1.8 V
- 2.75 2.85 3.3 USIM_PWR
=2.85 V
9 GND GND - Ground - - -
10 UIM_DATA USIM_DAT
A I/O External USIM
data signal
VIH 0.7 x
USIM_
PWR
- 3.3
USIM_PWR
=1.8 V or
2.85 V
VIL 0 0.2 x
USIM_
PWR
VOH 0.7 x
USIM_
PWR
- 3.3
VOL 0 0.2 x
USIM_
PWR
11 REFCLK- NC - Not connected - - - - -
12 UIM_CLK USIM_CLK O External USIM
clock signal
VOH 0.7 x
USIM_
PWR
- 3.3 USIM_PWR
=1.8 V or
2.85 V
VOL 0 0.2 x
USIM_
PWR
13 REFCLK+ NC - Not connected - - - - -
14 UIM_RESE
T USIM_RES ET O External USIM reset signal
VOH 0.7 x
USIM_
PWR
- 3.3 USIM_PWR
=1.8 V or
2.85 V
VOL 0 - 0.2 x
USIM_
PWR
15 GND GND - Ground - - - - -
16 UIM_Vpp NC - Not connected - - - - -
17 Reserved Reserved - Reserved - - - - -
18 GND GND - Ground - - - - -
19 Reserved Reserved - Reserved - - - -

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PIN
No.
Pin Name Pad
Type
Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
Comments
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
20 W_DISABL
E# W_DISABL E# I
The
W_DISABLE#
signal is an
active low signal
that when
asserted (driven
low) by the
system shall
disable radio
operation.
The software
version is
planning.
VIH 1.2 1.8 2.1 -
VIL –0.3 - 0.5 -
21 GND GND - Ground - - - - -
22 PERST# RESIN_N I Reset module
Active-low
VIH 1.2 1.8 2.1 -
VIL –0.3 - 0.5
23 PERn0 NC - Not connected - - - - -
24 3.3Vaux VCC_3V3 PI 3.3 V DC supply
input. 3.0 3.3 3.6 -
25 PERp0 NC - Not connected - - - - -
26 GND GND - Ground - - - - -
27 GND GND - Ground - - - - -
28 1.5 V NC - Not connected - - - - -
29 GND GND - Ground - - - - -
30 SMB_CLK NC - Not connected - - - - -
31 PETn0 NC - Not connected - - - - -
32 SMB_DATA NC - Not connected - - - - -
33 PETp0 NC - Not connected - - - - -
34 GND GND - Ground - - - - -
35 GND GND - Ground - - - - -
36 USB_D- USB_DM I/O USB signal D- - - - - -
37 GND GND - Ground - - - - -
38 USB_D+ USB_DP I/O USB signal D+ - - - - -

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PIN
No.
Pin Name Pad
Type
Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
Comments
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
39 3.3Vaux VCC_3V3 PI 3.3 V DC supply
input. - 3.0 3.3 3.6 -
40 GND GND - Ground - - - - -
41 3.3Vaux VCC_3V3 PI 3.3 V DC supply
input. - 3.0 3.3 3.6 -
42 LED_WWA
N# LED_WWA N# I
Mode indicator
Current sink
Drive strength:
10 mA
- - - - -
43 GND GND - Ground - - - - -
44 LED_WLAN
# NC - Not connected - - - - -
45 Reserved PCM_CLK O PCM interface
clock VOH 1.35 - 1.8 -
VOL 0 - 0.45 -
46 LED_WPA
N# NC - Not connected - - - - -
47 Reserved PCM_DOU
T O PCM I/F data out VOH 1.35 - 1.8 -
VOL 0 - 0.45 -
48 1.5 V NC - Not connected - - - - -
49 Reserved PCM_DIN I PCM I/F data in VIH 1.2 1.8 2.1 -
VIL –0.3 - 0.5 -
50 GND GND - Ground - - - - -
51 Reserved PCM_SYN
C O PCM interface sync VOH 1.35 - 1.8 -
VOL 0 - 0.45 -
52 3.3Vaux VCC_3V3 PI 3.3 V DC supply
input. - 3.0 3.3 3.6 -

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Pindicates power pins; Iindicates pins for digital signal input; Oindicates pins for digital
signal output. PO indicates power output pins; PI indicates power input pins.
VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates
Low-level Output voltage; VOH indicates High-level Output voltage.
The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact with us for more details about
this information.
The NC (Not Connected) pins are floating and there are no signal connected to these pins.
Therefore, these pins should not be used.
3.3 Power Interface
3.3.1 Power Sources and Grounds
The PCIe Mini Card provides two power sources: one is 3.3 Vaux (+3.3 Vaux) and the
other is 1.5 V (+1.5 V). For the PCIe Adapter, however, +3.3 Vaux is the only voltage
supply that is available. The input voltage is 3.3 V±9%, as specified by PCI Express
Mini CEM Specifications 1.2.
Table 3-2 Power and ground specifications
Pin No. Pin Name Pad Type Description Min. (V) Typ. (V) Max. (V)
2, 24, 39, 41 and 52 VCC_3V3 PI 3.3 V DC supply
input. 3.0 3.3 3.6
4, 9, 15, 18, 21, 26,
27, 29, 34, 35, 37,
40, 43, and 50
GND - Ground - - -
To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors
of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.
3.3.2 Power Supply Time Sequence
Power on Sequence
Do not toggle RESIN_N pin during the power on sequence. Pulling RESIN_N pin low
will extend time for module startup.

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Figure 3-2 Power on timing sequence
Parameter Remarks Time (Nominal value) Unit
TPD+ Power Valid to USB
D+ high 3.0–5.0 s
Power off Sequence
Cutting off the 3.3V power supply will power off the module.
Figure 3-3 Power off timing sequence
3.4 Signal Control Interface
The signal control part of the interface in the MU609 Mini PCIe module consists of the
following:
WAKE# Signal
RESIN_N Signal
W_DISABLE# Signal
LED_WWAN# Signal

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Table 3-3 lists the pins on the signal control interface.
Table 3-3 Definitions of the pins on the signal control interface
Pin
No. Pin Name Pad Type Description Parameter Min. (V)
Typ.
(V)
Max.
(V)
1 WAKE# O Open collector active low signal. This signal is used to
wake up the host. VOL –0.3 - 0.45
22 RESIN_N I Reset module
Active-low VIH 1.2 1.8 2.1
VIL –0.3 - 0.5
20 W_DISABLE# I
The W_DISABLE# signal is
an active low signal that when
asserted (driven low) by the
system shall disable radio
operation.
The software version is
planning.
VIH 1.2 1.8 2.1
VIL –0.3 - 0.5
42 LED_WWAN# I Mode indicator
Current sink
Drive strength: 10 mA
- - - -
3.4.1 WAKE# Signal
WAKE# pin (signal that the module uses to wake up the host) supports software
control.
This signal is used for 3G module to wake up the host. It is designed as an OC gate,
so it should be pulled up by the host and it is active-low.
When the module wakes up the host, the WAKE# pin will output low-level-voltage to
wake the host.

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Figure 3-4 Connections of the WAKE# pin
3.4.2 RESIN_N Signal
The RESIN_N pin is used to reset the module's system. When the module software
stops responding, the RESIN_N pin can be pulled down to reset the module
hardware.
The RESIN_N signal is internally pulled up to 1.8 V, which is automatically on when
3.3 V is applied and it is active-low.
Figure 3-5 Connections of the RESIN_N pin