HYCON HY16F3910 HyTiny EVB User manual

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page2
Table of Contents
1. INTRODUCTION.......................................................................................................................................4
2. SAFETY PRECAUTIONS.........................................................................................................................5
3. SOFTWARE INSTALLATION REQUIREMENTS.....................................................................................6
4. DESCRIPTION OF THE HARDWARE TOOL ..........................................................................................7
4.1. HY16F3910 HyTiny EVB Application Architecture Description.............................................................9
4.2. HY16F3910 HyTiny EVB Circuit Diagram...........................................................................................10
4.3. HY16F3910 HyTiny EVB and PC Connection Diagram .....................................................................11
5. DESCRIPTION OF THE SOFTWARE TOOL.........................................................................................12
5.1. Andes V3.2.1 32-bit MCU IDE development environment..................................................................12
5.2. HYCON Bootloader Software .............................................................................................................14
5.3. HY16F Writer Software.......................................................................................................................15
6. SUMMARY..............................................................................................................................................16
7. REVISIONS.............................................................................................................................................17
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page3
Attention:
1. HYCON Technology Corp. reserves the right to change the content of this datasheet
without further notice. For most up-to-date information, please constantly visit our
website: http://www.hycontek.com .
2. HYCON Technology Corp. is not responsible for problems caused by figures or
application circuits narrated herein whose related industrial properties belong to third
parties.
3. Specifications of any HYCON Technology Corp. products detailed or contained herein
stipulate the performance, characteristics, and functions of the specified products in the
independent state. We does not guarantee of the performance, characteristics, and
functions of the specified products as placed in the customer’s products or equipment.
Constant and sufficient verification and evaluation is highly advised.
4. Please note the operating conditions of input voltage, output voltage and load current
and ensure the IC internal power consumption does not exceed that of package
tolerance. HYCON Technology Corp. assumes no responsibility for equipment failures
that resulted from using products at values that exceed, even momentarily, rated values
listed in products specifications of HYCON products specified herein.
5. Notwithstanding this product has built-in ESD protection circuit, please do not exert
excessive static electricity to protection circuit.
6. Products specified or contained herein cannot be employed in applications which
require extremely high levels of reliability, such as device or equipment affecting the
human body, health/medical equipments, security systems, or any apparatus installed in
aircrafts and other vehicles.
7. Despite the fact that HYCON Technology Corp. endeavors to enhance product quality
as well as reliability in every possible way, failure or malfunction of semiconductor
products may happen. Hence, users are strongly recommended to comply with safety
design including redundancy and fire-precaution equipments to prevent any accidents
and fires that may follow.
8. Use of the information described herein for other purposes and/or reproduction or
copying without the permission of HYCON Technology Corp. is strictly prohibited.
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page4
1. Introduction
In order to allow users to quickly get started with the application of HY16F3910 series
chips, HYCON has launched a dedicated elementary evaluation kit (Model:
HY16F3910-DS01). It is mainly composed of HY16F3910-IM02 target board (HY16F3910
HyTiny Evaluation Board, hereinafter called the ‘HY16F3910 HyTiny EVB’) and Micro USB
Cable (see Table 1-1). The PCB of HY16F3910 HyTiny EVB is very small (Size: 7x4.3 cm),
but it contains a HY16F3910-N088 chip, and the chip is designed with a total of 88 pins
output, which is convenient for engineers to test and develop; In addition, the HY16F3910
HyTiny EVB also contains a CH340E chip. This chip is used for USB to UART transmission
applications. Therefore, the HY16F3910 HyTiny EVB can be directly connected to a
computer through a Micro USB cable to achieve a 4-wire (Timeout Entry) Bootloader
transmission function. The FW update of the HY16F3910 chip can be completed through
the Bootloader, so that users can evaluate the performance of the HY16F3910 chip.
Model No.
Part Name
Description
Qty.
HY16F3910-DS01
1. HY16F3910-IM02
HY16F3910-N088 Target Board
1
2. Cable line
USB-A to Micro USB Cable/60cm
1
Table 1-1
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page5
2. Safety Precautions
Do not place heavy objects on the display panel, in order to avoid damage caused by
stress.
Place the application display boards at steady place, so as to avoid falling damage.
Do not use this product with the input voltage which is not meeting the electrical
specifications, , in order to avoid working abnormally or damage
Avoid application display boards being touched by liquid, dirt and avoid being exposed
to moisture during operation. This application should be kept in a dry environment, so
as not to affect the function and performance
Remove the power supply when not using it.
When following status occurred, please remove the power supply immediately, and
contact our engineer.
Power Supply line is worn or damaged.
Power source (battery) connected but no any light on while operating.
Component off.
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page6
3. Software Installation Requirements
(1) PC/NB hardware requirement:
IBM PC compatible X86 system CPU
4GB DDR Memory
8GB HD Hard Disk Drive Capacity
(2) Supported Products:
HY16F3910 Series
(3) Supported Hardware Model No.:
HY16F3910-DS01
(4) Supported software version:
AndeSight RDS V3.2.1 above (32-bit MCU IDE development environment)
HYCON 32-bit MCU Device V0.34 above (32-bit MCU Driver)
HYCON Bootloader V1.3 above (HYCON Bootloader software)
(5) Supported Operating system:
Win XP (32-Bit), Win 7 (32/64-Bit), Win 8 (32/64-Bit), Win10 (32/64-Bit)
(6) Apply the following interface mode:
USB COM Port mode, USB device drivers for Windows operating systems. (Figure
3-1)
Figure 3-1
Note: When the PC is connected to the USB port of the HY16F3910 HyTiny EVB for
the first time, it may encounter the problem of installing the USB driver. The following
two methods can be used to install the CH340 USB driver:
Search automatically for USB driver through the internet
Search manually for USB driver and install
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page7
4. Description of the Hardware tool
HY16F3910 HyTiny EVB has the following features:
1. Supported HY16F3910 (Timeout Entry) 4-wire Bootloader
2. Two power switching outputs (3.3V/5V)
3. Micro USB connector, provides I2C/UART communication interface
4. All pin output design of HY16F3910-N088, convenient for program development and
testing
Description of the front side and back side illustrations of HY16F3910 HyTiny EVB:
●Description of the front side illustration
U1 on the PCB is designed as 88-pin output. If you see the numbers 1 to 88 on J1 and J5, it
represents the pin number of the HY16F3910-N088. The chip's working voltage VDD5V
can be powered by 3.3V or 5V. When the USB is powered on, LD3 will light on. For the
convenience of testing, we also design an I2C/UART transmission port (such as the yellow
connector in the picture). In order to meet customer application requirements, the PCB is
also designed with an external 32768Hz low frequency oscillation circuit.
All pin out
pin1~22
Pin67~88
HY16F3910-
N088
I2C/UART
All pin out
Pin23~66
Micro
USB
connector
3.3V
5V
switch
CH340E
PCB size : 7cm x 4.3cm
RST button
Figure 4-1 The front side of PCB
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page8
●Description of the back side illustration
The reserved EDM Port on the back can be used to connect HY16F Mini link or HY16F
Writer. If the chip is already bootloader turned on, it is not necessary to update the FW
through the HY16F Mini link or HY16F Writer. As long as the bootloader software is used,
the FW can be updated by connecting the USB to the PC. The name and definition of each
pin of HY16F3910-N088 can be seen on the silk screen on the back of the PCB board.
EDM Port
Figure 4-2 The back side of PCB
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page9
4.1. HY16F3910 HyTiny EVB Application Architecture Description
SWGUI:
HYCON Bootloader AP
Andes IDE
PC/NB
Micro USB
HY17M24
HY3118
Or
Andes IDE
開發程序
Bootloader
AP
更新FW
應用測試
Application
Test
Bootloader
AP
update FW
Andes IDE
Development
program
Figure 4-3
Figure 4-3 is the system application connection diagram of HY16F3910 HyTiny EVB.
After Andes IDE develops the program, update the compiled bin file to the HY16F3910 chip
through the Bootloader AP and directly apply the test. The program development process
does not need to connect the HY16F Mini Link or the burner to update the FW (bin file)
through the EDM port. As long as the PC is connected with a Micro USB cable to the
HY16F3910 HyTiny EVB, the rest are only software operations, which makes it much
easier to develop programs and test applications.
HY16F3910 HyTiny EVB has a reserved UART/I2C port, which can be connected to
HYCON's existing development board (e.g., HY3118, and HY17M24). After confirming that
the Bootloader in the HY16F3910 chip is turned on, you can use the Andes IDE to develop
the program, update the FW through the Bootloader AP, and then execute the application
test directly.
Note: The HY16F3910 HyTiny EVB provided by HYCON enables the 4-wire Bootloader by
default, and has programmed the Bin file of the "HY16F3910_PWM" demo code (Project
code is attached below). After Micro USB is connected to 5V power supply to HY16F3910
HyTiny EVB, PT2.6 (pin85) and PT2.7 (pin84) will output PWM square wave of 60Hz and
50% duty.
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page10
4.2. HY16F3910 HyTiny EVB Circuit Diagram
1
2
3
4
5
J8
EDM
RST
VDD5V
ECK
EDIO
EDM Debug
VSS
C10
10nF
R9
4.7K/NC
VDD5V
S1
RST
Reset Circuit
VSS
Y1
32768
R10
10M
C6
15pF/NC
C11
15pF/NC
Crystal Circuit
R12
NC/1K
R11
NC/1K
VDD15
C9
1uF
VSS
VDD5V
R5
100R
R6
100R
VDD5V
C8
10uF
VSS
PT12
PT13
VDDA
C13
1uF/NC
VSS
C15
0.1uF/NC
C12
0.1uF/NC
C7
0.1uF
HY16F3910 Circuit
RTS#
PT24
PT25
RST
F1
0.5A(0805)
USB_5V
VIN=5V, VOUT=3.3V
VSS
VSS
USB_5V
USB to UART Bridge Circuit
VD+
1
VD-
2
RTS#
4
CTS#
5
GND
3
TNOW 6
VCC 7
TXD 8
RXD 9
V3 10
CH340E_MSOP10
U3
CH340E
VD+
VD-
GND
RTS#
V3
RXD
TXD
VCC
C3
0.1uF
R3
100R
R4
100R
VD+ VD-
VSS VCC
ESD Protect
DATA-
DATA+
紅
綠
白
黑
VBUS 1
D- 2
D+ 3
GND 4
Shield
5
J2
USB
VSS
1
2
3 4
5
6
U2
CSRV065V0P
VSS
CTS#
1
J3
CTS#
C4
10uF
1
J4
RTS#
TXD
RXD PT20
PT21
communic ationwi thHY16F39 10 UART
C5
10uF
A21017 V02
SCL/TX
SDA/RX
AIO0 AIO1
AIO2 AIO3
C1
0.1uF
VSS
PT1.7
26
PT2.3
1
PT2.2
2
PT2.1
3
PT2.0
4
VDD15
5
VLCD
6
VDD5V
7
VSS/VSSA
8
NC
9
VDDA
10
AIO0
11
AIO1
12
SDRV1
13
AIO2
14
AIO3
15
SDRV2
16
PT3.7
17
PT3.6
18
PT3.5
19
PT3.4
20
PT3.3
21
PT3.2
22
RST
23
PT3.1
24
PT3.0
25
PT1.2
31
PT1.6
27
PT1.5
28
PT1.4
29
PT1.3
30
PT1.1
32
PT1.0
33
NC
34
PT10.7/SEG41
35
PT10.6/SEG40
36
PT10.5/SEG39
37
PT10.4/SEG38
38
PT10.3/SEG37
39
PT10.2/SEG36
40
PT10.1/SEG35
41
PT10.0/SEG34
42
PT9.7/SEG33
43
PT9.6/SEG32
44
PT9.5/SEG31 45
PT9.4/SEG30 46
PT9.3/SEG29 47
PT9.2/SEG28 48
PT9.1/SEG27 49
PT9.0/SEG26 50
PT8.7/SEG25 51
PT8.6/SEG24 52
PT8.5/SEG23 53
PT8.4/SEG22 54
PT8.3/SEG21 55
PT8.2/SEG20 56
PT8.1/SEG19 57
PT8.0/SEG18 58
PT7.7/SEG17 59
PT7.6/SEG16 60
PT7.5/SEG15 61
PT7.4/SEG14 62
PT7.3/SEG13 63
PT7.2/SEG12 64
PT7.1/SEG11 65
PT7.0/SEG10 66
PT6.7/SEG9 67
PT6.6/SEG8 68
PT6.5/SEG7 69
PT6.4/SEG6 70
PT6.3/SEG5 71
PT6.2/SEG4 72
PT6.1/SEG3 73
PT6.0/SEG2 74
PT13.7/SEG43/COM7 75
PT13.6/SEG42/COM6 76
PT13.5/SEG1/COM5 77
PT13.4/SEG0/COM4 78
PT13.3/COM3 79
PT13.2/COM2 80
PT13.1/COM1 81
PT13.0/COM0 82
NC 83
PT2.7 84
PT2.6 85
PT2.5 86
PT2.4 87
NC 88
U1
HY16F3910_QFN88
PT12
PT13
PT14
PT15
PT16
PT17
AIO0
AIO1
AIO2
AIO3
VLCD
PT130
PT131
PT132
PT133
PT134
PT135
PT136
PT137
PT60
PT61
PT62
PT63
PT64
PT65
PT66
PT67
PT70
PT71
PT72
PT73
PT74
PT75
PT76
PT77
PT80
PT81
PT82
PT83
PT84
PT85
PT86
PT87
PT90
PT91
PT92
PT93
PT94
PT95
PT96
PT97
PT100
PT101
PT102
PT103
PT104
PT105
PT106
PT107
SDRV1
SDRV2
VDD15
PT23
PT22
PT21
PT20
VDD5V
VSS
VDDA
PT37
PT36
PT35
PT34
PT33
PT32
RST
EDIO
ECK
PT11
PT10
PT27
PT26
PT25
PT24
1
3 4
2
5 6
7 8
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
33 34
35 36
37 38
39 40
41 42
43 44
J5
Header22x2
1
3 4
2
5 6
7 8
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
33 34
35 36
37 38
39 40
41 42
43 44
J1
Header22x2
NC_Pin88
PT25
PT27
PT130
PT132
PT134
PT136
PT60
PT62
PT66
RST
PT106
PT104
PT102
PT100
PT96
PT94
PT92
PT90
PT86
PT84
PT82
PT80
PT76
PT74
PT72
PT107
PT105
PT103
PT101
PT97
PT95
PT93
PT91
PT87
PT85
PT83
PT81
PT77
PT73
PT71
PT36
C14
0.1uF/NC
VSS
REFO voltage
ECK
EDIO
VDD5V
VDD5V
PT26
PT24
PT131
PT133
PT135
PT137
PT61
PT63
PT65
PT67
PT70
1
2
J10
VDD5V
VDD5V 1
2
J9
VSS
VSS
VSS
PT75
PT64
LD3
RED LED
R8
5.1k
VSS
GND
1
VIN
2VOUT 3
U4
HT7333-SOT89
VSS
3V3
5V
VDD5V
VSS
VSS
1
3 4
2
5 6
7 8
J6
Header4X2
SCL/TX
SDA/RX
VSS
SCL/TX SDA/RX
VDD5V
NC_Pin9
NC_Pin34
NC_Pin88
NC_Pin83
P8
P7
P5
P4
P6
P3
P2
P1
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P25
P26
P27
P28
P29
P30
P31
P32
P33
P34
P35
P36
P37
P38
P39
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P50
P51
P52
P53
P54
P55
P56
P57
P58
P59
P60
P61
P62
P63
P64
P65
P66
P67
P68
P69
P70
P71
P72
P73
P74
P75
P76
P77
P78
P79
P80
P81
P82
P83
P84
P85
P86
P87
P88
P67P68 P69P70 P71
P73
P75
P77
P79
P81
P85
P87
P72
P74
P76
P78
P80
P82
P84
P86
P88
NC_Pin83 P83
PT21
VDD15
VDD5V
NC_Pin9
AIO0
SDRV1
AIO3
PT37
PT35
PT33PT32
PT34
PT36
SDRV2
AIO2
AIO1
VSS
VLCD
PT20
VDDA
PT23PT22 P1P2 P3
P5
P7
P11
P13
P15
P17
P19
P21
P4
P6
P8
P10
P12
P14
P16
P18
P20
P22
P9
P66
P64
P62
P60
P58
P56
P54
P52
P50
P48
P46
P44
P42
P40
P38
P36
P32
P30
P28
P26
P24
P37
P35
P33
P31
P29
P23
P53
P51
P49
P47
P45
P43
P66
P39
P65
P63
P61
P59
P57
P55
NC_Pin34P34PT10 PT11PT12 PT13PT14 PT15PT16 PT17ECK EDIO
P27
P25
HY16F3910 HyTiny EvaluationBoard(MicroUSB)
1
2
3
J7
PowerSwitch
5V
VCC
3V3
Layout Note : Using SS 12d00(1P2 T) 3pin DIP Switch
VDD5V VCC VDD5V
VSS
Figure 4-4
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page11
4.3. HY16F3910 HyTiny EVB and PC Connection Diagram
Refer to the following Micro USB connection PC diagram (Figure 4-5), as long as the
FW is developed in the IDE software and the bin file is generated, and then the HYCON
Bootloader AP is opened, the bin file can be burned into the HY16F3910 chip to complete
the FW update. Application test development is done only with software operations.
Figure 4-5
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page12
5. Description of the Software tool
Download 32-bit MCU IDE development environment and HYCON Bootloader software
for HY16F39 series products on HYCON official website:
HY16F39 Series web-site: https://www.hycontek.com/products/3289
32-bit MCU IDE: https://www.hycontek.com/hy_mcu/HYCON-32-bit-MCU-IDE.zip
32-bit MCU Device: https://www.hycontek.com/hy_mcu/HYCON-32-bit-MCU-Device.zip
HYCON Bootloader: https://www.hycontek.com/hy_mcu/HYCON-Bootloader.zip
After installing the 32-bit MCU IDE and 32-bit MCU Device (Please install
HYCON-32-bit-MCU-IDE first and then install HYCON-32-bit-MCU-Device. Note: Both
must be installed in the same directory on the computer, and the installation order cannot
be wrong), you can start the FW development and compilation of the HY16F3910; After
installing the HYCON Bootloader software, FW update and application testing can be
performed through the HYCON Bootloader.
5.1. Andes V3.2.1 32-bit MCU IDE development environment
For detailed Andes V3.2.1 instructions, please refer to the file "HY16F Series IDE
Software Instruction Manual (AndeSightV3.x)". HYCON official website to download the
manual: https://www.hycontek.com/hy_mcu/APD-HY16IDE030_EN.pdf
After installing 32-bit MCU IDE and 32-bit MCU Device correctly, you can start
developing HY16F3910 in Andes V3.2.1 to write code and compile to generate bin file.
Refer to the following illustration of Andes V3.2.1 development environment (Figure 5-1):
Step1: Load the "HY16F3910_PWM" demo code by Import. Click on the Build All graphic
(or compile from Project). After the compilation is completed, three bin files will be
generated in the Debug\output folder.
Step2: Click Problems to see if there are any error messages.
Step3: Check the Console to confirm that the Flash ROM usage of the demo code is
text=3916Byte, and the SRAM usage is data=0Byte.
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page13
Figure 5-1
The three bin files generated by the Debug folder can be burned into the HY16F3910 chip
through the HYCON Bootloader software. The contents of the following three bin files are
explained:
1. App Bin File: This programmed code is generated by the user application program,
programmed in the chip's App Flash ROM area, this code is necessary during the
programming.
2. Data Bin File: This programmed code is generated by the user own fixed parameters or
calibration parameters, programmed in the chip's Data Flash ROM area, this code is no
necessary, depending on the actual needs of customers.
3. App Bin and Data Bin is separated by the BIN File, the purpose is to do the application of
partition programming, if you do not need to do partition programming, you can directly
use the BIN file to replace the App Bin file.
Figure 5-2
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page14
5.2. HYCON Bootloader Software
For detailed HYCON Bootloader instructions, please refer to the file "HY16F Series
ISP Bootloader Instruction Manual". HYCON official website to download the manual:
https://www.hycontek.com/hy_mcu/APD-HY16IDE031_EN.pdf
As shown in the figure below, the operation screen 1 that will pop up after executing
HYCON Bootloader. Confirm that the USB of HY16F3910 HyTiny EVB is connected to the
computer, then the port number should appear in the column of Com Num, select the
correct IC Type and baudrate, press the OK button, it will automatically jump to the
operation screen 2.
SW GUI :
HYCON Bootloader
PC/NB
Figure 5-3 (HYCON Bootloader Operation screen 1)
As shown in the figure below, enter the operation screen 2, load the bin file generated by
the compilation of Andes V3.2.1, and then press the Write button. When the progress bar
reaches 100%, it means that the FW update of the HY16F3910 is completed.
IC information
start write
Progress bar
connection status
Exit the software
Write begin address,
default value 0
Loaded file
content
load file
Figure 5-4 (HYCON Bootloader Operation screen 2)
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page15
5.3. HY16F Writer Software
This chapter is for demonstration only.
The Bootloader status in the HY16F3910 HyTiny EVB provided by HYCON is already
enabled, so the user does not need to connect the EDM Port to start the HY16F3910
Bootloader.
The EDM Port reserved on the back of the PCB can be used to connect the HY16F
Writer. Write the value of ISP Resource Setting from the HY16F Writer software operation
interface (refer to Figure 5-4). Press Write and then OK to get the value of 01000355.After
writing this code, the HY16F3910 HyTiny EVB can use the Bootloader function.
HY16F Writer ISP Resource Setting Interface:
The following figure selects a 4-wire UART (Timeout Entry), ISP Uart Port=PT2.0&PT2.1,
and the value of the ISP Resource Setting that will be obtained is the code of 01000355.
SW GUI :
HY16F Writer
PC/NB
Figure 5-5 (HY16F Writer ISP Resource Setting)
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page16
6. Summary
This article not only introduces the hardware circuit description of HY16F3910 HyTiny
EVB, but also introduces the related software instructions. The software includes MCU IDE
development environment Andes V3.2.1 of HY16F3910 and HYCON Bootloader. The user
only needs to compile the bin file in Andes V3.2.1, and then use the HYCON Bootloader
software to burn the bin file into the HY16F3910 chip to complete the FW update, which is
convenient for the user to do subsequent application testing. This article has introduced the
software operation process in detail, so that users can better understand how to use the
HY16F3910 HyTiny EVB for program development and application.
.

HY16F3910 Elementary Evaluation Kit
HyTiny EVB User’s Manual
© 2022 HYCON Technology Corp
www.hycontek.com
APD-HY16F39IDE005-V01_EN
page17
7. Revisions
The following describes the major changes made to the document, excluding the font and
punctuation changes.
Date
Version
Page
Revision Summary
2022/10/28
V01
ALL
First edition
.
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