HYCON HY17M24 Series Instructions for use

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page2
Table of Contents
1. PACKAGE CONTENTS............................................................................................................................4
2. SAFETY PRECAUTIONS.........................................................................................................................5
3. SOFTWARE INSTALLATION REQUIREMENTS.....................................................................................6
3.1. Software installation requirements........................................................................................................6
3.2. Software installation..............................................................................................................................6
4. INTRODUCTION OF STARTED EVALUATION KIT................................................................................7
4.1. Architecture Description........................................................................................................................7
4.2. Introduction to HY-Dongle.....................................................................................................................7
4.3. HY-Dongle Schematic...........................................................................................................................9
4.4. Target Board Introduction....................................................................................................................10
4.5. Target Board Schematic...................................................................................................................... 11
4.6. Steps to connect HY-Dongle and Target Board ..................................................................................12
5. REVISIONS.............................................................................................................................................13
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HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page3
Attention:
1、HYCON Technology Corp. reserves the right to change the content of this datasheet
without further notice. For most up-to-date information, please constantly visit our
website: http://www.hycontek.com .
2、HYCON Technology Corp. is not responsible for problems caused by figures or
application circuits narrated herein whose related industrial properties belong to third
parties.
3、Specifications of any HYCON Technology Corp. products detailed or contained herein
stipulate the performance, characteristics, and functions of the specified products in the
independent state. We do not guarantee of the performance, characteristics, and
functions of the specified products as placed in the customer’s products or equipment.
Constant and sufficient verification and evaluation is highly advised.
4、Please note the operating conditions of input voltage, output voltage and load current
and ensure the IC internal power consumption does not exceed that of package
tolerance. HYCON Technology Corp. assumes no responsibility for equipment failures
that resulted from using products at values that exceed, even momentarily, rated values
listed in products specifications of HYCON products specified herein.
5、Notwithstanding this product has built-in ESD protection circuit, please do not exert
excessive static electricity to protection circuit.
6、Products specified or contained herein cannot be employed in applications which
require extremely high levels of reliability, such as device or equipment affecting the
human body, health/medical equipment, security systems, or any apparatus installed in
aircrafts and other vehicles.
7、Despite the fact that HYCON Technology Corp. endeavors to enhance product quality
as well as reliability in every possible way, failure or malfunction of semiconductor
products may happen. Hence, users are strongly recommended to comply with safety
design including redundancy and fire-precaution equipment to prevent any accidents
and fires that may follow.
8、Use of the information described herein for other purposes and/or reproduction or
copying without the permission of HYCON Technology Corp. is strictly prohibited.
.

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page4
1. Package Contents
HY17M24-DS01 is an entry-level evaluation kit tool for the HY17M24 series products,
which includes accessories such as HY10000-CM01 (HY-Dongle), HY17M24-AM03 (Target
Board), and Interface line. The relevant hardware equipment is shown in the following
figure:
Figure 1-1
Model No.
Part Name
Description
Quantity
HY17M24-DS01
1. HY10000-CM01
HY-Dongle Board
1
2. HY17M24-AM03
HY17M24 Target Board
1
3. Interface line
5pin to 5pin (2.54mm pitch)
1
Table 1-1
.

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page5
2. Safety Precautions
Do not place heavy objects on the display panel, in order to avoid damage caused by
stress.
Place the application display boards at steady place, so as to avoid falling damage.
Do not use this product with the input voltage which is not meeting the electrical
specifications, in order to avoid working abnormally or damage.
Avoid application display boards being touched by liquid, dirt and avoid being exposed
to moisture during operation. This application should be kept in a dry environment, so
as not to affect the function and performance.
Remove the power supply when not using it.
When following status occurred, please remove the power supply immediately, and
contact our engineer.
Power Supply line is worn or damaged.
Power source (battery) connected but no any light on while operating.
Component off.
.

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page6
3. Software installation requirements
3.1. Software installation requirements
The configuration required to run the HY17M24-DS01 kit is as follows:
(1) PC/NB hardware requirements:
X86 system CPU compatible with IBM PC
512 MB memory (recommended 1GB)
1GB HD hard disk space
(2) Supported product models:
HY17M series products
(3) Supported hardware models:
HY17M24-DS01: HY17M24 started evaluation kit
(4) Software support version:
UART 1CH ENOB V1.0 and above
(5) Operating system requirements:
Windows XP, Windows Vista, Windows 7, Windows 8, Windows 10
(6) Applicable interface mode:
USB Port with CH340 driver.
3.2. Software installation.
(1) Installation of USB Port Driver
The HY17M24-DS01 uses the USB-SERIAL CH340 driver for its USB Port (as shown in
Figure 3-1). If the driver is not already installed on your computer, you can download and
install the CH340 Driver yourself.
Figure 3-1
(2) Installation ofADC Signal Analysis Software
To install the software for ADC signal analysis, first decompress the HY17M24-EVP-V1_0
software package, and then decompress the compressed file UART-1CH-ENOB-V1_0
within it. You can then install the software by running the extracted file. Once the
installation is complete, you can open the software by running the file
located in the directory \HYCON\UART 1CH ENOB.
Note: Please run the software as an administrator.
.

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page7
4. Introduction of Started Evaluation Kit
4.1. Architecture Description
The HY10000-CM01 (HY-Dongle) serves as a control device between the HY17M24-AM03
(Target Board) and the ADC signal analysis software. It is used as an evaluation tool by
connecting it to the HY-Dongle USB port. Please refer to the assembly diagram below for
more information:
SW GUI
UART_ENOB
PC/NB
I2C or UART
HY10000-CM01
(HY-Dongle) HY17M24-AM03
(Target Board)
Figure 4-1
4.2. Introduction to HY-Dongle
The HY-Dongle Board (Model: HY10000-CM01) is compatible with HYCON 8-bit and 32-bit
MSP series products (as shown in Figure 4-2). By default, it uses I2C to communicate with
the Target Board and sends the sampledADC signal through USB communication to the
ADC signal analysis software on the computer. The following is an introduction to the
control board:
U2 U1 RST
ISP LED J1
Figure 4-2
(1) U1
Function: The main chip of HY-Dongle Board, using HYCON's 32-Bit Flash type MCU,
Model: HY16F198B (LQFP64).
(2) U2
Function: Control chip for CH340 USB to UART.
(3) LED
Function: HY-Dongle power indicator, LED light on means that HY-Dongle power
supply is normal.
.

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page8
(4) J1
Function: Communication interface between HY-Dongle and Target Board.
Description: HY-Dongle supports UART, I2C, User define 3-wire protocol and Target
Board communication.
(5) RST
Function: Reset button of HY-Dongle.
(6) ISP
Function: Online firmware update for HY-Dongle.
Description: After ISP is shorted, the HY16F198B Bootloader function can be used to
update the HY-Dongle to support HYCON products at any time. The HY-Dongle
program code supporting HY17M24-AM03 is pre-burned and does not require
additional settings for operation. Please contact HYCON FAE if you need to use this
function to change the HY-Dongle program code.
Note: The above only explains the basic functions that will be used by the HY10000-CM01
(HY-Dongle Board). For other unlisted components, please refer to the circuit diagram or
contact HYCON's FAE technical support. .

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page9
4.3. HY-Dongle Schematic
Figure 4-3
Note: This HY-Dongle Board circuit diagram "HY10000-CM01_HY-Dongle_A19023
V02.pdf" is placed in HY17M24-DS01 directory (HY17M24-EVP-V1_0 \Schematic) can be
used for reference.
.

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page10
4.4. Introduction to Target Board
Target Board (Model: HY17M24-AM03) is commonly used in HY17M24 series products (as
shown in Figure 4-4). This Target Board can be used as a demonstration board in addition
to ADC signal analysis software.
J1 U1 U2
Figure 4-4
Note: When HY17M24-AM03 is used as the Target Board of the ADC signal analysis tool,
the HY17M24_ADC_UART (Project placed in: HY17M24-EVP-V1_0 \Sample_Code
directory) programs can be burned in HY17M24-SOP16 (U1) chips and can be directly
used with software, the burning method Please refer to the H08 CIDE software instructions.
(1) U1
Function: Target Board main chip, using HYCON's 8-bit MTP type MCU, model:
HY17M24 (SOP16).
(2) U12
Function: The sensor of the Target Board. It can be used for pressure sensor SOP6
package general type.
(3) J1
Function: communication port of the target chip
Description: The function is defined as follows
Pin
Name
Direction
1-1
PCAL
HAO correction
2-2
VDD
The Chip Power
3-3
SCL
Communication of SCL
4-4
SDA
Communication of SDAL
5-5
VSS
Ground
Table 4-1
Note: The above only explains the basic functions that HY17M24-SOP16 Target Board
will use, other parts not listed please refer to the schematic or to contact HYCON's FAE
technical support.
.

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page11
4.5. Target Board Schematic
Figure 4-5
Note: This Target Board schematic "HY17M24-AM03_Target Board_A20001 V01.pdf" is
placed in HY17M24-DS01 directory (HY17M24-EVP-V1_0 \Schematic) can be used for
reference.
.

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page12
4.6. Steps to connect HY-Dongle and Target Board
Step1: Use Interface Line to connect to HY-Dongle’s J1 and Target Board’s J1.
Step2: Connect the HY-Dongle to the USB port of the computer (the L1 LED will be on).
Step3: After Step1 and 2 (as shown in Figure 4-6), you can start to operate the software.
Figure 4-6
.

HY17M24 Started Evaluation Kit
Hardware User Manual
© 2023 HYCON Technology Corp
www.hycontek.com
APD-HY17MIDE008-V01_EN
page13
5. Revisions
The following describes the major changes made to the document, excluding the font and
punctuation changes.
Version
Page
Date
Revision Summary
V01
ALL
2023/06/05
First edition
.
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