Intel NUC 8 Mainstream-G NUC8i5INH Configuration guide

Intel® NUC Products
NUC8i5INH / NUC8i7INH
Technical Product Specification
Regulatory Models: NUC8IN
June 2019
version 003

iii
The Intel NUC Products NUC8i5INH/NUC8i7INH may contain design defects or errors known as errata that may cause the product to deviate from
published specifications. Current characterized errata are documented in the Intel NUC Products NUC8i5INH/NUC8i7INH Specification Update.
Revision History
Revision
Revision History
Date
001
First release of Intel NUC Products NUC8i5INH/NUC8i7INH Technical Product
Specification
March 2019
002
First production release of the Intel NUC Products NUC8i5INH/NUC8i7INH
Technical Product Specification
May 2019
003
Specification Clarification
June 2019
Disclaimer
This product specification applies to only the standard Intel®NUC Boards, Kits and Mini PCs with BIOS
identifier INWHL357.0028.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO
LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR
ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL
INJURY OR DEATH MAY OCCUR.
All Intel®NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for
installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC
or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc.
may not be supported without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does
not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or
other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each
processor family, not across different processor families: Go to:
Learn About Intel®Processor Numbers
Intel NUC Boards and kits may contain design defects or errors known as errata, which may cause the product to deviate
from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product
order.
Intel, Pentium and Celeron are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright 2019 Intel Corporation. All rights reserved.

Intel NUC Products NUC8i5INH/NUC8i7INH
Technical Product Specification
iv
Note: For this Technical Products Specification, the use of
Intel NUC Products NUC8i5INH/NUC8i7INH
Board Identification Information
Basic Intel®NUC Board Identification Information
Intel NUC Board
AA Revision
BIOS Revision
Notes
NUC8i5INB
K29935-300
INWHL357.0028 or newer
1, 2
NUC8i7iNB
K29936-402
INWHL357.0028 or newer
1, 2
Notes:
1The AA number is found on a small label on the Front USB connectors.
2Intel®Core™ i5-8265U/ i7-8565U processor are used on this AA revision consists of the following component:
3
Device
Stepping
S-Spec Number(s)
Intel Core i5-8265U
W0
SREJR
W0
SREJQ
V0
SRFFX
Intel Core i7-8565U
W0
SREJP
V0
SRFFW
Product Identification Information
Intel® NUC Products NUC8i5INH/NUC8i7INH {x} †Identification Information
Product Name
Intel® NUC Board
Differentiating Features
NUC8i5INHX
NUC8i5INB
8GB LPDDR3-2133 solder-down Memory with power
adapter
NUC8i5INHJA
HDD kit with power adapter, 16GB Intel® Optane™ Module,
1TB HDD, 8GB LPDDR3-2133 solder-down Memory,
Microsoft Windows 10 Home, “Intel® NUC 8 Home, a Mini
PC with Windows 10”
NUC8i5INHPA
SSD kit with power adapter, 256 M.2 SSD, 8GB LPDDR3-
2133 solder-down Memory, Microsoft Windows 10 Home,
“Intel® NUC 8 Home, a Mini PC with Windows 10”
NUC8i5INHP
NUC8i5INB
SSD kit with power adapter, 256GB M.2 SSD, 8GB LPDDR3-
2133 solder-down Memory
NUC8i7INHX
NUC8i7INB
8GB LPDDR3-2133 solder-down Memory with power
adapter
NUC8i7INHJA
HDD kit with power adapter, 16GB Intel® Optane™ Module,
1TB HDD, 8GB LPDDR3-2133 solder-down Memory,
Microsoft Windows 10 Home, “Intel® NUC 8 Home, a Mini
PC with Windows 10”
NUC8i7INHZ
HDD and SSD kit with power adapter, 1TB HDD and 256GB
M.2 SSD, 8GB LPDDR3-2133 solder-down Memory

v
NUC8i7INHPA
SSD kit with power adapter, 256GB M.2 SSD, 8GB LPDDR3-
2133 solder-down Memory, Microsoft Windows 10 Home,
“Intel® NUC 8 Home, a Mini PC with Windows 10”
NUC8i7INHP
SSD kit with power adapter, 256GB M.2 SSD, 8GB LPDDR3-
2133 solder-down Memory
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that apply to
the Intel NUC Products NUC8i5INH / NUC8i7INH.
Specification Changes or Clarifications
Date
Type of Change
Description of Changes or Clarifications
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See
http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.

Intel NUC Products NUC8i5INH/NUC8i7INH
Technical Product Specification
vi
Preface
This Technical Product Specification (TPS) specifies the layout, components, connectors, power
and environmental requirements, and the BIOS for Intel® NUC Products NUC8i5INH/NUC8i7INH
are with pre-installed Hard Drive Disk(HDD), Solid-state disk(SSD), Optane Memory, Soldered-
down memory, and operating system.
Intended Audience
The TPS is intended to provide detailed technical information about Intel NUC Products
NUC8i5INH/NUC8i7INH and their components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter
Description
1
A description of the hardware used in Intel NUC Product NUC8i5INH/NUC8i7INH
2
A map of the resources of the Intel NUC Board
3
The features supported by the BIOS Setup program
4
A description of the front panel blink codes and BIOS error messages
5
The features of the Intel NUC Kits and Mini PCs
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of
these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

vii
Other Common Notation
#
Used after a signal name to identify an active-low signal (such as USBP0#)
bpp
Bits per pixel
GB
Gigabyte (1,073,741,824 bytes)
GBps
Gigabytes per second
Gbps
Gigabits per second
KB
Kilobyte (1024 bytes)
Kb
Kilobit (1024 bits)
kbps
1000 bits per second
MB
Megabyte (1,048,576 bytes)
MBps
Megabytes per second
Mb
Megabit (1,048,576 bits)
Mbps
Megabits per second
TDP
Thermal Design Power
xxh
An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V
Volts. Voltages are DC unless otherwise specified.
*
This symbol is used to indicate third-party brands and names that are the property of their respective
owners.

ix
Contents
Revision History..............................................................................................................iii
Note: For this Technical Products Specification, the use of Intel NUC Products
NUC8i5INH/NUC8i7INH........................................................................................................................... iv
Board Identification Information..................................................................................................................... iv
Product Identification Information................................................................................................................. iv
Errata............................................................................................................................................................................ v
Preface ..............................................................................................................................vi
Intended Audience................................................................................................................................................vi
What This Document Contains........................................................................................................................vi
Typographical Conventions ..............................................................................................................................vi
Contents ........................................................................................................................... ix
1Product Description ............................................................................................... 13
1.1 Overview ......................................................................................................................................................13
1.1.1 Feature Summary ..................................................................................................................13
1.1.2 Board Layout (Top) ...............................................................................................................15
1.1.3 Board Layout (Bottom) ........................................................................................................16
1.1.4 Block Diagram......................................................................................................................... 18
1.2 Online Support..........................................................................................................................................19
1.3 Processor..................................................................................................................................................... 19
1.4 Graphics Capabilities ..............................................................................................................................20
1.4.1 AMD Radeon™ 540X Graphics.......................................................................................... 20
1.4.2 High Definition Multimedia Interface* (HDMI*) ......................................................... 20
1.4.3 Mini DisplayPort* (mDP*)....................................................................................................20
1.5 USB................................................................................................................................................................. 22
1.6 SATA Interface........................................................................................................................................... 22
1.6.1 AHCI Mode................................................................................................................................ 22
1.7 Real-Time Clock Subsystem................................................................................................................23
1.8 Audio Subsystem ..................................................................................................................................... 24
1.9 LAN Subsystem......................................................................................................................................... 25
1.9.1 Intel® WGI219V Gigabit Ethernet Controller.............................................................. 25
1.9.2 LAN Subsystem Software...................................................................................................25
1.9.3 RJ-45 LAN Connector with Integrated LEDs.............................................................. 26
1.9.4 Wireless Network Module.................................................................................................. 26
1.10 Hardware Management Subsystem .................................................................................................27
1.10.1 Hardware Monitoring ...........................................................................................................27
1.10.2 Fan Monitoring........................................................................................................................27
1.10.3 Thermal Solution...................................................................................................................28

x
1.11 Power Management ................................................................................................................................29
1.11.1 ACPI............................................................................................................................................. 29
1.11.2 Hardware Support.................................................................................................................31
1.11.3 HDMI Consumer Electronics Control (CEC) ................................................................ 33
1.12 Intel Platform Security Technologies ..............................................................................................35
1.12.1 Intel® Virtualization Technology......................................................................................35
1.12.2 Intel® Platform Trust Technology ...................................................................................35
2Technical Reference............................................................................................... 37
2.1 Memory Resources .................................................................................................................................. 37
2.1.1 Addressable Memory...........................................................................................................37
2.2 Connectors and Headers.......................................................................................................................37
2.2.1 Front Panel Connectors......................................................................................................38
2.2.2 Back Panel Connectors .......................................................................................................38
2.2.3 Headers and Connectors (Top)........................................................................................ 39
2.2.4 Connectors and Headers (Bottom)................................................................................. 40
2.3 BIOS Security Jumper ............................................................................................................................44
2.4 Mechanical Considerations..................................................................................................................46
2.4.1 Form Factor..............................................................................................................................46
2.4.2 Weight ........................................................................................................................................47
2.5 Electrical Considerations ...................................................................................................................... 47
2.5.1 Power Supply Considerations.......................................................................................... 47
2.5.2 Fan Header Current Capability.........................................................................................47
2.6 Thermal Considerations........................................................................................................................ 48
2.7 Reliability .....................................................................................................................................................51
2.8 Environmental ...........................................................................................................................................51
3Overview of BIOS Features................................................................................... 53
3.1 Introduction................................................................................................................................................ 53
3.2 BIOS Flash Memory Organization .....................................................................................................53
3.3 System Management BIOS (SMBIOS) ..............................................................................................53
3.4 Legacy USB Support ...............................................................................................................................54
3.5 BIOS Updates.............................................................................................................................................54
3.5.1 Language Support................................................................................................................. 55
3.6 BIOS Recovery ...........................................................................................................................................55
3.7 Boot Options..............................................................................................................................................55
3.7.1 Network Boot...........................................................................................................................55
3.7.2 Booting Without Attached Devices ................................................................................56
3.7.3 Changing the Default Boot Device During POST...................................................... 56
3.7.4 Power Button Menu..............................................................................................................57
3.8 Hard Disk Drive Password Security Feature.................................................................................. 58
3.9 BIOS Security Features .......................................................................................................................... 58
4Error Messages and Blink Codes......................................................................... 60
4.1 Front-panel Power LED Blink Codes................................................................................................60

Contents
xi
5Intel NUC Kit Features ........................................................................................... 61
5.1 Chassis Front Panel Features.............................................................................................................. 61
5.2 Chassis Rear Panel Features................................................................................................................ 62
Figures
Figure 1. Major Board Components (Top) ....................................................................................................... 15
Figure 2. Major Board Components (Bottom) ................................................................................................16
Figure 3. Block Diagram...........................................................................................................................................18
Figure 4. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ...............................................................................24
Figure 5. LAN Connector LED Locations...........................................................................................................26
Figure 6. Thermal Solution and Fan Header................................................................................................... 28
Figure 7. Location of the Standby Power LED ...............................................................................................33
Figure 8. CEC Connector .........................................................................................................................................34
Figure 9. Front Panel Connectors, Controls and Indicators.....................................................................38
Figure 10. Back Panel Connectors ...................................................................................................................... 38
Figure 11. Headers and Connectors (Top).......................................................................................................39
Figure 12. Connectors and Headers (Bottom) ...............................................................................................40
Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ......Error! Bookmark not
defined.
Figure 14. Location of the CIR Sensor...............................................................................................................43
Figure 15. Location of the BIOS Security Jumper ........................................................................................44
Figure 16. Board Dimensions................................................................................................................................ 46
Figure 17. Board Height Dimensions .................................................................................................................47
Figure 18. Localized High Temperature Zones .............................................................................................49
Figure 19. Intel® NUC Products NUC8i5INH/NUC8i7INH Features –Front ....................................... 61
Figure 20. Intel® NUC Products NUC8i5INH/NUC8i7INH Features –Rear ......................................... 62
Tables
Table 1. Feature Summary.....................................................................................................................................13
Table 2. Components Shown in Figure 1......................................................................................................... 15
Table 3. Components Shown in Figure 2......................................................................................................... 17
Table 4. LAN Connector LED States................................................................................................................... 26
Table 5. Effects of Pressing the Power Switch............................................................................................... 29
Table 6. Power States and Targeted System Power ...................................................................................30
Table 7. Wake-up Devices and Events..............................................................................................................31
Table 8. HDMI 1 CEC expected behavior..........................................................................................................33
Table 9. Headers and Connectors Shown in Figure 11.............................................................................. 39
Table 10. Connectors and Headers Shown in Figure 12 ...........................................................................41
Table 11. SATA Power Header (0.5 mm Pitch) .............................................................................................. 41
Table 12. Single-Port Internal USB 2.0 Headers (1.25 mm Pitch)......................................................... 42
Table 13. Consumer Electronics Control (CEC) Connector (1.25 mm Pitch) ....................................42
Table 14. SDXC Card Reader Connector.......................................................................................................... 42
Table 15. BIOS Security Jumper Settings........................................................................................................45

xii
Table 16. Select Weights and ............................................................................................................................... 47
Table 17. Select Chassis Dimensions .................................................................................................................47
Table 18. Fan Header Current Capability......................................................................................................... 47
Table 19. Thermal Considerations for Components................................................................................... 50
Table 20. Tcontrol Values for Components ...................................................................................................50
Table 21. Environmental Specifications...........................................................................................................51
Table 22. Acceptable Drives/Media Types for BIOS Recovery ............................................................... 55
Table 23. Boot Device Menu Options................................................................................................................56
Table 24. Master Key and User Hard Drive Password Functions........................................................... 58
Table 25. Supervisor and User Password Functions...................................................................................59
Table 26. Front-panel Power LED Blink Codes ............................................................................................. 60
Table 27. Components Shown in Figure 19 ...................................................................................................61
Table 28. Components Shown in Figure 20 ...................................................................................................62

13
1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the product.
Table 1. Feature Summary
Board Form Factor
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
Processor
Soldered-down 8th Generation Intel® Core™ i5 Quad-core Processors with 15W
TDP, 1.60 GHz
―TDP-up 25W
―6 MB SmartCache, 3.60 GHz Max Turbo Frequency
―Integrated memory controller
―Integrated PCH
Soldered-down 8th Generation Intel® Core™ i7 Quad-core Processors with 15W
TDP, 1.80 GHz
―TDP-up 25W
―8 MB SmartCache, 4.60 GHz Max Turbo Frequency
―Integrated memory controller
―Integrated PCH
Memory
Soldered-down LPDDR3 1866 MHz(4GB), LPDDR3 2133 MHz(8GB), Duel channel
Soldered-down 4 GB or 8 GB memory technology
Support for non-ECC memory
Support for 1.2 V low voltage JEDEC memory
Graphics
Discrete graphic support with AMD Radeon™ 540X:
―One full-sized High Definition Multimedia Interface (HDMI) and one Mini
DisplayPort (mDP) interface of rear panel.
―HDMI™ 4K Support, DisplayPort 1.4 HDR
Audio
ADM Integrated HD-Audio Controller (Azalia) and Codec via the HDMI and mDP
interfaces supporting compressed 7.1digital audio
Realtek ALC256 HD Audio via a stereo microphone/headphone 3.5 mm jack on the
front panel and 3.5mm combination speaker
Expansion Capabilities
One M.2 connector supporting M.2 2280 (key type M) modules
Storage
One SATA 6.0 Gbps port (black)
―Supports one 2.5“ SSD or HDD up to 9.5mm
1TB Hard Drive Disk included.
One full-sized SDXC slot
BIOS
Intel®BIOS resident in the Serial Peripheral Interface (SPI) Flash device
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and
System Management BIOS (SMBIOS)
Continued

14
Table 1. Feature Summary (continued)
Peripheral Interfaces
USB 3.1 gen2 ports:
―One USB TypeA and USB TypeC ports are implemented with external front
panel connectors.
―Two USB TypeA ports are implemented with external back panel connectors
(blue)
Consumer Infrared (CIR)
Consumer Electronics Control (CEC) header
Front panel header
USB 2.0 ports:
―Two ports via an internal common IO header
LAN Support
Gigabit (10/100/1000 Mbps) LAN subsystem using the Intel WGI219V Gigabit Ethernet
Controller
Hardware Monitor
Subsystem
Hardware monitoring subsystem, based on an ITE8991VG embedded controller,
including:
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
One processor fan header
Fan sense input used to monitor fan activity
Fan speed control
Wireless
Soldered down Intel® Wireless-AC 9560D2WG module
Intel wireless802.11ac R2, 2x2, Dual Band, Wi-Fi
Bluetooth® 5
Maximum Transfer speed up to 1.73Gbps
•Next Generation Form Factor (NGFF) 12x16 soldered-down package

Product Description
15
1.1.2 Board Layout (Top)
Figure 1 shows the location of the major components on the top-side of Intel NUC Boards
NUC8INB
Figure 1. Major Board Components (Top)
.
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item from Figure 1
Description
A
Thermal solution
B
Processor fan header
C
Consumer Infrared (CIR) sensor
D
Wireless LAN module

16
1.1.3 Board Layout (Bottom)
Figure 2 shows the location of the major components on the bottom-side of Intel NUC Mini PC
NUC8i5INH/NUC8i7INH.
Figure 2. Major Board Components (Bottom)

Product Description
17
Table 3. Components Shown in Figure 2
Item from
Figure 2
Description
A
19V DC input jack
B
Back panel USB 3.1 gen2 connectors
C
Mini Display Port
D
HDMI connector
E
LAN jack
F
SDXC card reader slot
G
Front panel single-port USB 2.0 connector (1.25 mm pitch)
H
Front panel single-port USB 2.0 connector (1.25 mm pitch)
I
M.2 connector
J
Front panel USB 3.1 gen2 connector
K
Front panel USB 3.1 gen2 connector
L
Front panel stereo speaker/headphone/microphone jack
M
Power button / power LED
N
+5 V Standby Power Indicator LED
O
SATA 6.0 Gb/s connector
P
BIOS security jumper
Q
Battery (lithium coin cell, CR2032, 3.0V)
R
Consumer Electronic Control (CEC) connector

18
1.1.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the board.
Figure 3. Block Diagram

Product Description
19
1.2 Online Support
To find information about…
Visit this World Wide Web site:
Intel NUC Products NUC8i5INH/NUC8i7INH
http://www.intel.com/NUC
NUC Board Support
http://www.intel.com/NUCSupport
Available configurations for Intel NUC Products
NUC8i5INH/NUC8i7INH
http://ark.intel.com
BIOS and driver updates
http://downloadcenter.intel.com
Integration information
http://www.intel.com/NUCSupport
1.3 Processor
Intel NUC Mini PC NUC8i5INH/NUC8i7INH has a soldered-down System-on-a-Chip (SoC),
which consists of one of following:
Soldered-down 8th Generation Intel® Core™ i5 Quad-core Processors with 15W TDP, 1.60 GHz
TDP-up 25W
6 MB SmartCache, 3.60 GHz Max Turbo Frequency
Integrated memory controller
Integrated PCH
Soldered-down 8th Generation Intel® Core™ i7 Quad-core Processors with 15W TDP, 1.80 GHz
TDP-up 25W
8 MB SmartCache, 4.60 GHz Max Turbo Frequency
Integrated memory controller
Integrated memory
NOTE
The board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 47 for information on power supply requirements for the board.

20
1.4 Graphics Capabilities
The kit supports graphics computing through AMD Radeon™ 540X
1.4.1 AMD Radeon™ 540X Graphics
The AMD Radeon graphics controller features the following:
Supports HDR-10 video playback.
Multi View Coding (MVC) support for Blu-ray 3D content.
3D graphics hardware acceleration supporting DirectX 12, OpenCL* 2.0, OpenGL 4.5
Dedicated Unified Video Decoder hardware (UVD) for H.264, HEVC, VC-1, MPEG-4, MPEG-
2, and MVC decode
Non-HBR compressed audio pass-through up to 6.144 Mbps, support AC-3, MPEG1, MP3
(MPEG1 layer 3), MPEG2, AAC, DTS, ATRAC, Dolby Digital+, WMA Pro, and DTS-HD
HBR compressed audio pass-through up to 24.576 Mbps, support DTS-HD Master Audio
and Dolby True HD.
Supports content protection using High-Bandwidth Digital Content Protection (HDCP) 2.2
Support only GDDR5 DRAM.
Supports AMD FreeSync™ technology
1.4.2 High Definition Multimedia Interface* (HDMI*)
The HDMI ports are compliant with the HDMI 2.0b specification. The HDMI ports support
standard, enhanced, or high definition video, plus multi-channel digital audio on a single cable.
The maximum supported resolution is 4096 x 2160 @ 60 Hz, 36bpp.
1.4.2.1 Integrated Audio Provided by the HDMI Interfaces
The following audio technologies are supported by the HDMI 2.0b interfaces directly from
the SoC:
•AC3 - Dolby* Digital
•Dolby®-TrueHD Bitstream Capable
For information about
Refer to
HDMI technology
http://www.hdmi.org
1.4.3 Mini DisplayPort* (mDP*)
DisplayPort is a digital communication interface that utilizes differential signaling to achieve a
high bandwidth bus interface designed to support connections between PCs and monitors,
projectors, and TV displays. DisplayPort is suitable for display connections between consumer
electronics devices such as high definition optical disc players, set top boxes, and TV displays.
The maximum supported resolution is 7680 x 4320 @ 30Hz, 24bpp. DisplayPort via mini
Display Port connector is compliant with the DisplayPort 1.4 specification.
DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple
independent video streams (daisy-chain connection with multiple monitors) over a single

Product Description
21
DisplayPort. This will require the use of displays that support DisplayPort 1.4 and allow for
this feature.
For information about
Refer to
DisplayPort technology
http://www.displayport.org