Intel DCCP847DYE User manual

Intel® Next Unit of Computing
Board DCP847SKE
Technical Product Specification
January 2013
Order Number: G81548-002
The Intel Next Unit of Computing Board DCP847SKE may contain design defects or errors known as errata that may cause the product to deviate from
published specifications. Current characterized errata are documented in the Intel Next Unit of Computing Board DCP847SKE Specification Update.

Revision History
Revision Revision History Date
001 First release of the Intel
®
Next Unit of Computing Board DCP847SKE
Technical Product Specification
January 2013
002 Specification clarification January 2013
This product specification applies to only the standard Intel®Next Unit of Computing Board with
BIOS identifier GKPPT10H.86A.
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WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
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use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar
locations. The suitability of this product for other PC or embedded non-PC applications or other
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conflicts or incompatibilities arising from future changes to them.
Intel Next Unit of Computing Boards may contain design defects or errors known as errata, which may
cause the product to deviate from published specifications. Current characterized errata are available on
request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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* Other names and brands may be claimed as the property of others.
Copyright 2013, Intel Corporation. All rights reserved.

iii
Board Identification Information
Basic Intel®Next Unit of Computing Board DCP847SKE
Identification Information
AA Revision
BIOS Revision
Notes
G79416-101 GKPPT10H.86A.0026 1,2
G79416-104 GKPPT10H.86A.0036 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Intel®QS77 PCH and Intel®Celeron®processor 847 used on this AA revision consists
of the following components:
Device
Stepping
S-Spec Numbers
Intel Celeron 847 Q0 SR08N
Intel BD82QS77 C1 SLI8B
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel®Desktop Board DCP847SKE.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
January 2013 Spec Clarification Deleted the note in Section 3.8 on page 60 regarding removing
power before setting or clearing the hard disk drive password.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.

Intel Desktop Board DCP847SKE Technical Product Specification
iv

v
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel®Next Unit
of Computing Board DCP847SKE.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Next Unit of
Computing Board DCP847SKE and its components to the vendors, system integrators,
and other engineers and technicians who need this level of information. It is
specifically not intended for general audiences.
What This Document Contains
Chapter Description
1
A description of the hardware used on Intel Next Unit of Computing Board
DCP847SKE
2
A map of the resources of the Intel Next Unit of Computing Board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DCP847SKE Technical Product Specification
vi
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

vii
Contents
Revision History
Board Identification Information ..................................................................iii
Errata ......................................................................................................iii
Preface
Intended Audience..................................................................................... v
What This Document Contains..................................................................... v
Typographical Conventions ......................................................................... v
1Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout (Top) ............................................................... 13
1.1.3 Board Layout (Bottom) .......................................................... 15
1.1.4 Block Diagram ...................................................................... 17
1.2 Online Support ................................................................................. 18
1.3 Processor ........................................................................................ 18
1.4 System Memory ............................................................................... 19
1.4.1 Memory Configurations .......................................................... 20
1.5 Intel®QS77 Express Chipset .............................................................. 22
1.5.1 Direct Media Interface (DMI) .................................................. 22
1.5.2 Display Interfaces ................................................................. 22
1.6 Graphics Subsystem ......................................................................... 22
1.6.1 Integrated Graphics............................................................... 22
1.6.2 USB..................................................................................... 24
1.7 SATA Interface................................................................................. 24
1.7.1 AHCI Mode ........................................................................... 24
1.8 Real-Time Clock Subsystem ............................................................... 25
1.9 LAN Subsystem ................................................................................ 25
1.9.1 Intel®82579V Gigabit Ethernet Controller ................................ 26
1.9.2 LAN Subsystem Software ....................................................... 26
1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27
1.10 Hardware Management Subsystem ..................................................... 28
1.10.1 Hardware Monitoring ............................................................. 28
1.10.2 Fan Monitoring ...................................................................... 28
1.10.3 Thermal Solution ................................................................... 29
1.11 Power Management .......................................................................... 30
1.11.1 ACPI .................................................................................... 30
1.11.2 Hardware Support ................................................................. 32

Intel Desktop Board DCP847SKE Technical Product Specification
viii
2Technical Reference
2.1 Memory Resources ........................................................................... 35
2.1.1 Addressable Memory ............................................................. 35
2.1.2 Memory Map......................................................................... 37
2.2 Connectors and Headers.................................................................... 37
2.2.1 Back Panel Connectors........................................................... 38
2.2.2 Connectors and Headers (Bottom)........................................... 39
2.3 BIOS Setup Configuration Jumper....................................................... 46
2.4 Mechanical Considerations ................................................................. 48
2.4.1 Form Factor.......................................................................... 48
2.5 Electrical Considerations .................................................................... 49
2.5.1 Power Supply Considerations .................................................. 49
2.5.2 Fan Header Current Capability ................................................ 50
2.6 Thermal Considerations ..................................................................... 50
2.7 Reliability......................................................................................... 53
2.8 Environmental.................................................................................. 53
3Overview of BIOS Features
3.1 Introduction..................................................................................... 55
3.2 BIOS Flash Memory Organization........................................................ 56
3.3 System Management BIOS (SMBIOS) ................................................. 56
3.4 Legacy USB Support ......................................................................... 56
3.5 BIOS Updates .................................................................................. 57
3.5.1 Language Support ................................................................. 57
3.5.2 Custom Splash Screen ........................................................... 58
3.6 BIOS Recovery................................................................................. 58
3.7 Boot Options .................................................................................... 59
3.7.1 Network Boot........................................................................ 59
3.7.2 Booting Without Attached Devices ........................................... 59
3.7.3 Changing the Default Boot Device During POST......................... 59
3.8 Hard Disk Drive Password Security Feature .......................................... 60
3.9 BIOS Security Features ..................................................................... 61
4Error Messages and Blink Codes
4.1 Front-panel Power LED Blink Codes..................................................... 63
4.2 BIOS Error Messages ........................................................................ 63
4.3 Port 80h POST Codes ........................................................................ 64
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance...................................................................... 71
5.1.1 Safety Standards................................................................... 71
5.1.2 European Union Declaration of Conformity Statement ................ 72
5.1.3 Product Ecology Statements ................................................... 73
5.1.4 EMC Regulations ................................................................... 75

Contents
ix
5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance ................. 78
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 79
5.2 Battery Disposal Information.............................................................. 80
Figures
1. Major Board Components (Top).......................................................... 13
2. Major Board Components (Bottom)..................................................... 15
3. Block Diagram.................................................................................. 17
4. Memory Channel and SO-DIMM Configuration ...................................... 21
5. LAN Connector LED Locations............................................................. 27
6. Thermal Solution and Fan Header ....................................................... 29
7. Location of the Standby Power LED..................................................... 34
8. Detailed System Memory Address Map ................................................ 36
9. Back Panel Connectors ...................................................................... 38
10. Connectors and Headers (Bottom) ...................................................... 39
11. Connection Diagram for Front Panel Header ......................................... 44
12. Connection Diagram for Front Panel USB 2.0 Dual-Port Header............... 45
13. Location of the BIOS Configuration Setup Jumper ................................. 46
14. Board Dimensions............................................................................. 48
15. Localized High Temperature Zones ..................................................... 51
Tables
1. Feature Summary............................................................................. 11
2. Components Shown in Figure 1 .......................................................... 14
3. Components Shown in Figure 2 .......................................................... 16
4. Supported Memory Configurations ...................................................... 19
5. LAN Connector LED States ................................................................. 27
6. Effects of Pressing the Power Switch ................................................... 30
7. Power States and Targeted System Power ........................................... 31
8. Wake-up Devices and Events ............................................................. 32
9. System Memory Map ........................................................................ 37
10. Connectors and Headers Shown in Figure 10........................................ 40
11. PCI Express Full-Mini Card Connector .................................................. 41
12. Dual-Port Front Panel USB 2.0 Header................................................. 42
13. 19 V Internal Power Supply Connector ................................................ 43
14. Front Panel Header ........................................................................... 43
15. States for a One-Color Power LED....................................................... 44
16. BIOS Setup Configuration Jumper Settings .......................................... 47
17. Fan Header Current Capability............................................................ 50
18. Thermal Considerations for Components.............................................. 52
19. Tcontrol Values for Components
......................................................... 52
20. Environmental Specifications.............................................................. 53
21. AccepDrives/Media Types for BIOS Recovery ....................................... 58
22. Boot Device Menu Options ................................................................. 59

Intel Desktop Board DCP847SKE Technical Product Specification
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23. Master Key and User Hard Drive Password Functions ............................ 60
24. Supervisor and User Password Functions ............................................. 61
25. Front-panel Power LED Blink Codes..................................................... 63
26. BIOS Error Messages ........................................................................ 63
27. Port 80h POST Code Ranges .............................................................. 64
28. Port 80h POST Codes ........................................................................ 65
29. Typical Port 80h POST Sequence ........................................................ 69
30. Safety Standards.............................................................................. 71
31. EMC Regulations............................................................................... 75
32. Regulatory Compliance Marks ............................................................ 79

11
1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
Processor
•Soldered-down Intel®Celeron®processor 847 with up to 17 W TDP
―Integrated graphics
―Integrated memory controller
Memory
•Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module
(SO-DIMM) sockets
•Support for DDR3 1333 MHz and DDR3 1066 MHz SO-DIMMs
•Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
•Support for non-ECC memory
•Support for 1.35 V low voltage JEDEC memory
Chipset
Intel®QS77 Express Chipset consisting of the Intel®QS77 Express Platform
Controller Hub (PCH)
Graphics
•Integrated graphics support for processors with Intel®Graphics Technology:
―Two High Definition Multimedia Interface* (HDMI*) back panel connectors
Audio Intel
®
High Definition Audio via the HDMI v1.4a interfaces
Peripheral
Interfaces
•USB 2.0 ports:
―Three front panel ports (via one dual-port internal header and one front
panel connector)
―Two ports are implemented with vertical back panel connectors
―One port is reserved for the PCI Express* Half-Mini Card
―One port is reserved for the PCI Express Full-Mini Card
•SATA port:
―One internal mSATA port (PCI Express Full-Mini Card) for SSD support
Expansion
Capabilities
•One PCI Express Half-Mini Card connector
•One PCI Express Full-Mini Card connector
BIOS
•Intel®BIOS resident in the Serial Peripheral Interface (SPI) Flash device
•Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and System Management BIOS (SMBIOS)
continued

Intel Desktop Board DCP847SKE Technical Product Specification
12
Table 2. Feature Summary (continued)
LAN Support
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel®82579V Gigabit
Ethernet Controller
Hardware Monitor
Subsystem
Hardware monitoring subsystem, based on a Nuvoton NPCE791C embedded
controller, including:
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•One processor fan header
•Fan sense input used to monitor fan activity
•Simple fan speed control

Product Description
13
1.1.2 Board Layout (Top)
Figure 1 shows the location of the major components on the top-side of Intel Next Unit
of Computing Board DCP847SKE.
Figure 1. Major Board Components (Top)

Intel Desktop Board DCP847SKE Technical Product Specification
14
Table 3 lists the components identified in Figure 1.
Table 3. Components Shown in Figure 1
Item from Figure 1 Description
A Battery
B Standby power LED
C Processor fan header
D Onboard power button
E Power LED
F Hard Disk Drive LED
G Thermal solution

Product Description
15
1.1.3 Board Layout (Bottom)
Figure 2 shows the location of the major components on the bottom-side of Intel Next
Unit of Computing Board DCP847SKE.
Figure 2. Major Board Components (Bottom)

Intel Desktop Board DCP847SKE Technical Product Specification
16
Table 4. Components Shown in Figure 2
Item from
Figure 2 Description
A Back panel connectors
B PCI Express Full-Mini Card connector
C PCI Express Half-Mini Card connector
D Front panel dual-port USB 2.0 header
E BIOS setup configuration jumper
F Front panel USB 2.0 connector
G Front panel header
H DDR3 SO-DIMM 2 socket
I DDR3 SO-DIMM 1 socket
J Internal DC power connector

Product Description
17
1.1.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the board.
Figure 3. Block Diagram

Intel Desktop Board DCP847SKE Technical Product Specification
18
1.2 Online Support
To find information about…
Visit this World Wide Web site:
Intel Next Unit of Computing Board
DCP847SKE
http://www.intel.com/products/motherboard/index.htm
Next Unit of Computing Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel Next
Unit of Computing Board DCP847SKE
http://ark.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.3 Processor
The board has a soldered-down Intel Celeron processor 847 with Integrated Graphics
Technology and integrated memory controller.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 49 for information on power supply requirements for this board.

Product Description
19
1.4 System Memory
The board has two 204-pin SO-DIMM sockets and supports the following memory
features:
•1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts
•Support for 1.35 V Low Voltage DDR3 (new JEDEC specification)
•Two independent memory channels with interleaved mode support
•Unbuffered, single-sided or double-sided SO-DIMMs
•16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 35 for information on the total amount of addressable
memory.
•Minimum recommended total system memory: 1024 MB
•Non-ECC SO-DIMMs
•Serial Presence Detect
•XMP profile support for voltage detection
•DDR3 1333 MHz and DDR3 1066 MHz SDRAM SO-DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with SO-DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the SO-DIMMs may not function under
the determined frequency.
Table 5 lists the supported SO-DIMM configurations.
Table 5. Supported Memory Configurations
Raw Card
Version
SO-DIMM
Capacity
DRAM Device
Technology
DRAM
Organization
# of DRAM
Devices
A 1 GB 1 Gb 64 M x 16 8
2 GB 2 Gb 128 M x 16 8
B 1 GB 1 Gb 128 M x 8 8
2 GB 2 Gb 256 M x 8 8
C 512 MB 1 Gb 64 M x 16 4
1 GB 2 Gb 128 M x 16 4
F
2 GB 1 Gb 128 M x 8 16
4 GB 2 Gb 256 M x 8 16
8 GB 4 Gb 512 M x 8 16
Note: System memory configurations are based on availability and are subject to change.

Intel Desktop Board DCP847SKE Technical Product Specification
20
For information about…
Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm
1.4.1 Memory Configurations
The processor supports the following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both SO-DIMM channels are equal. Technology and device width can
vary from one channel to the other but the installed memory capacity for each
channel must be equal. If different speed SO-DIMMs are used between channels,
the slowest memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single SO-DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed SO-DIMMs
are used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm