Intel DH67BL User manual
Intel® Desktop Board DH67GD and
Intel® Desktop Board DH67BL
Technical Product Specification
January 2012
Order Number: G13843-003
The Intel Desktop Board DH67GD and Intel Desktop Board DH67BL may contain design defects or errors known as errata that may cause the product to
deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DH67GD and Intel Desktop Board DH67BL
Specification Updates.
ii
Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DH67GD and Intel®Desktop
Board DH67BL Technical Product Specification
January 2011
-002 Specification Clarification January 2012
-003 Specification Clarification January 2012
This product specification applies to only the standard Intel®Desktop Board DH67GD and Intel®
Desktop Board DH67BL with BIOS identifier BLH6710H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
All Intel®desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, Core i7, and Core i5 are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright ©2011-2012, Intel Corporation. All rights reserved.
iii
Board Identification Information
Basic Desktop Board DH67GD Identification Information
AA Revision BIOS Revision Notes
G10206-202 BLH6710H.86A.0062 1,2
G10206-203 BLH6710H.86A.0062 1,2
G10206-204 BLH6710H.86A.0076 1,2
G10206-205 BLH6710H.86A.0076 1,2
G10206-206 BLH6710H.86A.0076 1,2
G10206-207 BLH6710H.86A.0105 1,2
G10206-208 BLH6710H.86A.0119 1,2
G10206-209 BLH6710H.86A.0119 1,2
G10206-210 BLH6710H.86A.0119 1,2
Basic Desktop Board DH67BL Identification Information
AA Revision BIOS Revision Notes
G10189-202 BLH6710H.86A.0062 1,2
G10189-203 BLH6710H.86A.0062 1,2
G10189-204 BLH6710H.86A.0076 1,2
G10189-205 BLH6710H.86A.0076 1,2
G10189-206 BLH6710H.86A.0076 1,2
G10189-207 BLH6710H.86A.0119 1,2
G10189-208 BLH6710H.86A.0119 1,2
G10189-209 BLH6710H.86A.0119 1,2
G44434-200
(LAD sku)
BLH6710H.86A.0119 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Intel®82H67 PCH Express Chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
82H67 Platform Controller
Hub (PCH)
B2 SLH82
82H67 Platform Controller
Hub (PCH)
B3 SLJ49
Intel Desktop Board DH67GD and Intel Desktop Board DH67BL Technical Product
Specification
iv
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel Desktop Board DH67GD and Intel Desktop Board DH67BL.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
January 2012 Spec Clarification Updated Table 14 to correct callouts B and C
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
v
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel®Desktop
Board DH67GD and Intel®Desktop Board DH67BL.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DH67GD and Intel Desktop Board DH67BL and its components to the vendors,
system integrators, and other engineers and technicians who need this level of
information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on Intel Desktop Board DH67GD and Intel
Desktop Board DH67BL
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
Intel Desktop Board DH67GD and Intel Desktop Board DH67BL Technical Product
Specification
vi
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vii
Contents
1Product Description
1.1Overview........................................................................................ 11
1.1.1Feature Summary ................................................................ 11
1.1.2Board Layout ....................................................................... 13
1.1.3Block Diagram ..................................................................... 15
1.2Legacy Considerations...................................................................... 16
1.3Online Support................................................................................ 16
1.4Processor ....................................................................................... 17
1.4.1PCI Express x16 Graphics
...................................................... 17
1.5System Memory .............................................................................. 18
1.5.1Memory Configurations ......................................................... 19
1.6Intel®H67 Express Chipset ............................................................... 21
1.7Graphics Subsystem ........................................................................ 21
1.7.1Integrated Graphics.............................................................. 21
1.7.2USB ................................................................................... 24
1.8SATA Interfaces .............................................................................. 25
1.9Real-Time Clock Subsystem .............................................................. 26
1.10Legacy I/O Controller....................................................................... 26
1.10.1Consumer Infrared (CIR)....................................................... 26
1.11Audio Subsystem............................................................................. 27
1.11.1Audio Subsystem Software .................................................... 27
1.11.2Audio Subsystem Components ............................................... 27
1.12LAN Subsystem............................................................................... 29
1.12.1Intel®82579V Gigabit Ethernet Controller................................ 29
1.12.2LAN Subsystem Software....................................................... 30
1.12.3RJ-45 LAN Connector with Integrated LEDs .............................. 30
1.13Hardware Management Subsystem .................................................... 31
1.13.1Hardware Monitoring............................................................. 31
1.13.2Fan Monitoring
..................................................................... 31
1.13.3Chassis Intrusion and Detection.............................................. 31
1.13.4Thermal Monitoring .............................................................. 32
1.14Power Management ......................................................................... 33
1.14.1ACPI................................................................................... 33
1.14.2Hardware Support ................................................................ 35
2Technical Reference
2.1Memory Resources .......................................................................... 41
2.1.1Addressable Memory............................................................. 41
2.1.2Memory Map........................................................................ 43
2.2Connectors and Headers................................................................... 43
2.2.1Back Panel Connectors
.......................................................... 44
2.2.2Component-side Connectors and Headers ................................ 45
2.3Jumper Block .................................................................................. 54
Intel Desktop Board DH67GD and Intel Desktop Board DH67BL Technical Product
Specification
viii
2.4Mechanical Considerations ................................................................ 56
2.4.1Form Factor......................................................................... 56
2.5Electrical Considerations................................................................... 57
2.5.1Power Supply Considerations ................................................. 57
2.5.2Fan Header Current Capability................................................ 58
2.5.3Add-in Board Considerations .................................................. 58
2.6Thermal Considerations.................................................................... 58
2.7Reliability ....................................................................................... 61
2.8Environmental ................................................................................ 61
3Overview of BIOS Features
3.1Introduction ................................................................................... 63
3.2BIOS Flash Memory Organization....................................................... 64
3.3Resource Configuration .................................................................... 64
3.3.1PCI Autoconfiguration ........................................................... 64
3.4System Management BIOS (SMBIOS)................................................. 65
3.5Legacy USB Support ........................................................................ 65
3.6BIOS Updates ................................................................................. 66
3.6.1Language Support ................................................................ 66
3.6.2Custom Splash Screen .......................................................... 67
3.7BIOS Recovery................................................................................ 67
3.8Boot Options................................................................................... 68
3.8.1Optical Drive Boot ................................................................ 68
3.8.2Network Boot....................................................................... 68
3.8.3Booting Without Attached Devices........................................... 68
3.8.4Changing the Default Boot Device During POST ........................ 68
3.9Adjusting Boot Speed....................................................................... 69
3.9.1Peripheral Selection and Configuration..................................... 69
3.9.2BIOS Boot Optimizations ....................................................... 69
3.10BIOS Security Features .................................................................... 70
3.11BIOS Performance Features .............................................................. 71
4Error Messages and Beep Codes
4.1Speaker ......................................................................................... 73
4.2BIOS Beep Codes ............................................................................ 73
4.3Front-panel Power LED Blink Codes.................................................... 74
4.4BIOS Error Messages ....................................................................... 74
4.5Port 80h POST Codes ....................................................................... 75
Contents
ix
5Regulatory Compliance and Battery Disposal Information
5.1Regulatory Compliance..................................................................... 81
5.1.1Safety Standards.................................................................. 81
5.1.2European Union Declaration of Conformity Statement................ 82
5.1.3Product Ecology Statements................................................... 83
5.1.4EMC Regulations .................................................................. 85
5.1.5ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 88
5.1.6Regulatory Compliance Marks (Board Level)............................. 89
5.2Battery Disposal Information............................................................. 90
Figures
1. Major Board Components.................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration
........................................... 20
4. Back Panel Audio Connectors ............................................................ 28
5. LAN Connector LED Locations
............................................................ 30
6. Thermal Sensors and Fan Headers ..................................................... 32
7. Location of the Standby Power LED
.................................................... 39
8. Detailed System Memory Address Map ............................................... 42
9. Back Panel Connectors ..................................................................... 44
10. Component-side Connectors and Headers ........................................... 45
11. Connection Diagram for Front Panel Header ........................................ 51
12. Connection Diagram for Front Panel USB 2.0 Headers
........................... 53
13. Location of the Jumper Block............................................................. 54
14. Board Dimensions
........................................................................... 56
15. Localized High Temperature Zones..................................................... 59
Tables
1. Specification Changes or Clarifications ................................................. iv
2. Feature Summary............................................................................ 11
3. Components Shown in Figure 1 ......................................................... 14
4. Supported Memory Configurations ..................................................... 18
5. HDMI Port Status Conditions ............................................................. 22
6. DVI Port Status Conditions................................................................ 22
7. DisplayPort Status Conditions............................................................ 23
8. Audio Jack Support
.......................................................................... 27
9. LAN Connector LED States
................................................................ 30
10. Effects of Pressing the Power Switch .................................................. 33
11. Power States and Targeted System Power........................................... 34
12. Wake-up Devices and Events ............................................................ 35
13. System Memory Map ....................................................................... 43
14. Component-side Connectors and Headers Shown in Figure 10................ 46
15. IEEE 1394a Header (DH67GD only).................................................... 47
16. Front Panel Audio Header for Intel HD Audio........................................ 47
17. Front Panel Audio Header for AC ’97 Audio .......................................... 47
Intel Desktop Board DH67GD and Intel Desktop Board DH67BL Technical Product
Specification
x
18. Front Panel USB Headers.................................................................. 47
19. SATA Connectors............................................................................. 48
20. S/PDIF Header
................................................................................ 48
21. Chassis Intrusion Header
.................................................................. 48
22. Processor, Front, and Rear Chassis (4-Pin) Fan Headers
....................... 48
23. Back Panel CIR Emitter (Output) Header
............................................. 48
24. Front Panel CIR Receiver (Input) Header............................................. 49
25. Processor Core Power Connector........................................................ 50
26. Main Power Connector...................................................................... 50
27. Front Panel Header
.......................................................................... 51
28. States for a One-Color Power LED...................................................... 52
29. States for a Two-Color Power LED...................................................... 52
30. Alternate Front Panel Power/Sleep LED Header .................................... 52
31. LPC Debug Header........................................................................... 53
32. BIOS Setup Configuration Jumper Settings.......................................... 55
33. Recommended Power Supply Current Values (High Power) .................... 57
34. Recommended Power Supply Current Values (Low Power)
..................... 57
35. Fan Header Current Capability........................................................... 58
36. Thermal Considerations for Components ............................................. 60
37. Tcontrol Values for Components ........................................................ 60
38. Environmental Specifications............................................................. 61
39. BIOS Setup Program Menu Bar.......................................................... 64
40. BIOS Setup Program Function Keys.................................................... 64
41. Acceptable Drives/Media Types for BIOS Recovery ............................... 67
42. Boot Device Menu Options ................................................................ 68
43. Supervisor and User Password Functions............................................. 70
44. BIOS Beep Codes ............................................................................ 73
45. Front-panel Power LED Blink Codes.................................................... 74
46. BIOS Error Messages ....................................................................... 74
47. Port 80h POST Code Ranges.............................................................. 75
48. Port 80h POST Codes ....................................................................... 76
49. Typical Port 80h POST Sequence........................................................ 80
50. Safety Standards............................................................................. 81
51. EMC Regulations
............................................................................. 85
52. Regulatory Compliance Marks............................................................ 89
11
1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
Processor •Intel®Core™ i7, Intel®Core™ i5, and Intel®Core™ i3 processors with up to
95W TDP in an LGA1155 socket
―One PCI Express* 2.0 x16 graphics interface
―Integrated memory controller with dual channel DDR3 memory support
―Integrated graphics processing (processors with Intel®Graphics
Technology)
―External graphics interface controller
Memory •Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
•Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
•Support for non-ECC memory
•Support for 1.35 V low voltage JEDEC memory
Chipset Intel®H67 Express Chipset consisting of the Intel®H67 Express Platform
Controller Hub (PCH)
Graphics •Integrated graphics support for processors with Intel Graphics Technology:
―High Definition Multimedia Interface* (HDMI*)
―DVI-I
―DisplayPort* (DH67GD only)
•Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
Audio •10-channel (7.1 + 2) Intel High Definition Audio via the Realtek ALC892 audio
codec
continued
Intel Desktop Board DH67GD and Intel Desktop Board DH67BL Technical Product
Specification
12
Table 2. Feature Summary (continued)
Peripheral
Interfaces
•Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
•Fourteen USB 2.0 ports:
―Six ports are implemented with stacked back panel connectors (black)
―Eight front panel ports implemented through four internal headers
•Two SATA 6.0 Gb/s interfaces through Intel H67 Express Chipset with Intel®
Rapid Storage Technology RAID support (blue)
•Two internal Serial ATA (SATA) 3.0 Gb/s interfaces through Intel H67 Express
Chipset with Intel Rapid Storage Technology RAID support (black)
•One internal eSATA port (red)
•One back panel eSATA port (red)
•Two IEEE 1394a ports (DH67GD only):
―One port via a back panel connector
―One port via an internal header for front panel cabling
Expansion
Capabilities
•One PCI Express 2.0 x16 add-in card connector
•Two PCI Express 2.0 x1 add-in card connectors
•One Conventional PCI bus connector
BIOS •Intel®BIOS resident in the SPI Flash device
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available
PC Technology
•Support for PCI* Local Bus Specification Revision 2.2
•Support for PCI Express* Revision 2.0
•Suspend to RAM support
•Wake on PCI, PCI Express, LAN, front panel, Consumer Infrared (CIR), and
USB ports
LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel®82579V Gigabit
Ethernet Controller
Legacy I/O Control Nuvoton W83677HG-i I/O controller for CIR and hardware management support
Hardware Monitor
Subsystem
•Hardware monitoring through the Nuvoton I/O controller
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Three fan headers
•Two fan sense inputs used to monitor fan activity
•Fan speed control
Intel Desktop Board DH67GD and Intel Desktop Board DH67BL Technical Product
Specification
14
Table 3 lists the components identified in Figure 1.
Table 3. Components Shown in Figure 1
Item/callout
from Figure 1
Description
A PCI Conventional bus add-in card connector
B PCI Express x1 add-in card connector
C IEEE 1394a front panel header (DH67GD only)
D PCI Express x1 bus add-in card connector
E PCI Express x16 bus add-in card connector
F Back panel connectors
G Processor core power connector (2 x 2)
H Rear chassis fan header
I LGA1155 processor socket
J Processor fan header
K DIMM 3 (Channel A DIMM 0)
L DIMM 1 (Channel A DIMM 1)
M DIMM 4 (Channel B DIMM 0)
N DIMM 2 (Channel B DIMM 1)
O Front chassis fan header
P Chassis intrusion header
Q Low Pin Count (LPC) Debug header
R Consumer IR emitter (output) header
S Consumer IR receiver (input) header
T Main power connector (2 x 12)
U Battery
V Piezoelectric speaker
W Intel H67 Express Chipset
X SATA connectors
Y Front panel header
Z Alternate front panel power LED header
AA BIOS Setup configuration jumper block
BB Front panel USB 2.0 headers (4)
CC Standby power LED
DD S/PDIF out header
EE Front panel audio header
Intel Desktop Board DH67GD and Intel Desktop Board DH67BL Technical Product
Specification
16
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
•No parallel port connector
•No floppy drive connector
•No serial port connector or header
•No PS/2 connectors
•No PATA connector
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DH67GD and Intel
Desktop Board DH67BL
http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel
Desktop Board DH67GD and
Intel Desktop Board DH67BL
http://ark.intel.com
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
Product Description
17
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, and Intel Core i3
processors in an LGA1155 socket
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W Thermal Design Power (TDP). The
processors listed above are only supported when falling within the wattage
requirements of Intel Desktop Board DH67GD and Intel Desktop Board DH67BL. See
the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 57 for information on power supply requirements for this board.
1.4.1 PCI Express x16 Graphics
The Intel Core i7, Intel Core i5, and Intel Core i3 processors in an LGA1155 socket
support discrete add in graphics cards via the PCI Express 2.0 x16 graphics connector:
•Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (500 MB/s) per lane. The maximum theoretical bandwidth on the
interface is 8 GB/s in each direction, simultaneously, for an aggregate of 16 GB/s
when operating in x16 GEN2 mode.
•Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (250 MB/s) per lane. The maximum theoretical bandwidth on the
interface is 4 GB/s in each direction, simultaneously, for an aggregate of 8 GB/s when
operating in x16 GEN1 mode.
For information about Refer to
PCI Express technology http://www.pcisig.com
Intel Desktop Board DH67GD and Intel Desktop Board DH67BL Technical Product
Specification
18
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
•1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
•Support for 1.35V Low Voltage DDR3 (new JEDEC specification)
•Two independent memory channels with interleaved mode support
•Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
•32 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
•Minimum recommended total system memory: 512 MB
•Non-ECC DIMMs
•Serial Presence Detect
•DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity
Configuration (Note)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
512 MB SS 1 Gbit 64 M x16/empty 4
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x4/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm
Product Description
19
1.5.1 Memory Configurations
The Intel Core i7, Intel Core i5, and Intel Core i3 processors in the LGA1155 socket
support the following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
•Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
Intel Desktop Board DH67GD and Intel Desktop Board DH67BL Technical Product
Specification
20
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
The Intel Core i7, Intel Core i5, and Intel Core i3 processors require memory to be
populated in the DIMM 1 (Channel A, DIMM 1) socket.
For best memory performance always install memory into the blue DIMM memory
sockets if only installing two DIMMs in your configuration.
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