Intel DQ77MK User manual

Intel® Desktop Board
DQ77MK
Technical Product Specification
July 2013
Part Number: G54941-004
The Intel Desktop Board DQ77MK may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DQ77MK Specification Update.

ii
Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DQ77MK Technical Product
Specification May 2012
-002 Specification Clarification October 2012
-003
Specification Clarification
May 2013
-004 Specification Clarification July 2013
This product specification applies to only the standard Intel®Desktop Board with BIOS identifier
MKQ7710H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
All Intel®desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
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trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright 2012, 2013 Intel Corporation. All rights reserved.

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Board Identification Information
Basic Desktop Board DQ77MK Identification Information
AA Revision
BIOS Revision
Notes
G39642-300
MKQ7710H.86A.0034
1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Q77 chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
Intel Q77 Express Chipset C1 SLJ83
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that
apply to the Intel®Desktop Board DQ77MK.
Specification Changes or Clarifications
Date
Type of Change
Description of Change or Clarification
October 2012 Spec Clarification
•Updated Table 41. Environmental Specifications to
address operating temperature requirements for the
board.
•Updated Section 1.11.1 Intel®vPro™ Technology to add
TPM bulleted item
•Updated Section 1.11.1.7 Trusted Platform Module (TPM)
to change TPM version and revision numbers
•Updated 1.5.2.2 Digital Visual Interface (DVI-D) and
1.5.2.3 Digital Visual Interface (DVI-I) to correct
maximum supported resolution
•Updated Section 1.8.2.1 S/PDIF Header
May 2013 Spec Clarification
•Added ENERGY STAR Note to Section 5.1.6.
•Updated Section 3.10 Hard Disk Drive Password Security
Feature.
July 2013 Spec Clarification Deleted references to ENERGY STAR.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://www.intel.com/content/www/us/en/motherboards/desktop-
motherboards/motherboards.html?wapkw=desktop+boards for the latest
documentation.

Intel Desktop Board DQ77MK Technical Product Specification
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Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel®Desktop
Board DQ77MK.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DQ77MK and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1
A description of the hardware used on Intel Desktop Board DQ77MK
2
A map of the resources of the Intel Desktop Board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DQ77MK Technical Product Specification
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Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s
Gigabits per second
I/O Input/Output
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s
1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

vii
Contents
Revision History
Board Identification Information..................................................................iii
Specification Changes or Clarifications .........................................................iii
Errata ......................................................................................................iii
Preface
Intended Audience..................................................................................... v
What This Document Contains..................................................................... v
Typographical Conventions ......................................................................... v
1Product Description
1.1 Overview......................................................................................... 13
1.1.1 Feature Summary ................................................................. 13
1.1.2 Board Layout ........................................................................ 15
1.1.3 Block Diagram ...................................................................... 17
1.2 Online Support................................................................................. 18
1.3 Processor ........................................................................................ 18
1.3.1 Graphics Subsystem.............................................................. 19
1.4 System Memory ............................................................................... 21
1.4.1 Memory Configurations .......................................................... 22
1.5 Intel®Q77 Express Chipset................................................................ 24
1.5.1 Direct Media Interface (DMI) .................................................. 24
1.5.2 Display Interfaces ................................................................. 24
1.5.3 USB..................................................................................... 26
1.5.4 SATA Interfaces .................................................................... 26
1.6 Real-Time Clock Subsystem............................................................... 28
1.7 Legacy I/O Controller........................................................................ 28
1.8 Audio Subsystem.............................................................................. 29
1.8.1 Audio Subsystem Software..................................................... 29
1.8.2 Audio Connectors and Headers................................................ 30
1.9 LAN Subsystem................................................................................ 31
1.9.1 Intel®82579LM Gigabit Ethernet Controller and Intel®82574L
Gigabit Ethernet Controller..................................................... 31
1.9.2 LAN Subsystem Software ....................................................... 32
1.9.3RJ-45 LAN Connectors with Integrated LEDs............................. 32
1.10 Hardware Management Subsystem..................................................... 33
1.10.1 Hardware Monitoring ............................................................. 33
1.10.2 Fan Monitoring...................................................................... 33
1.10.3 Chassis Intrusion and Detection .............................................. 33
1.10.4 Thermal Monitoring ............................................................... 34

Intel Desktop Board DQ77MK Technical Product Specification
viii
1.11 Intel®Security and Manageability Technologies.................................... 35
1.11.1 Intel®vPro™ Technology........................................................ 35
1.11.2 Intel Small Business Technology ............................................. 38
1.11.3 Intel®Management Engine (Intel®ME) Software and Drivers...... 39
1.12 Power Management .......................................................................... 40
1.12.1 ACPI.................................................................................... 40
1.12.2 Hardware Support ................................................................. 42
2Technical Reference
2.1 Memory Resources ........................................................................... 47
2.1.1 Addressable Memory.............................................................. 47
2.1.2Memory Map......................................................................... 49
2.2 Connectors and Headers.................................................................... 49
2.2.1 Back Panel Connectors........................................................... 50
2.2.2 Component-side Connectors and Headers................................. 51
2.3 Jumper Block ................................................................................... 63
2.4 Intel®Management Engine BIOS Extension (Intel®MEBX) Reset Header . 64
2.5 Mechanical Considerations................................................................. 65
2.5.1 Form Factor.......................................................................... 65
2.6 Electrical Considerations.................................................................... 66
2.6.1 Power Supply Considerations .................................................. 66
2.6.2 Power Supervisor .................................................................. 67
2.6.3 Fan Header Current Capability ................................................ 67
2.6.4 Add-in Board Considerations................................................... 67
2.7 Thermal Considerations..................................................................... 67
2.8 Reliability ........................................................................................ 70
2.9 Environmental.................................................................................. 70
3Overview of BIOS Features
3.1 Introduction..................................................................................... 71
3.2 BIOS Flash Memory Organization........................................................ 72
3.3 Resource Configuration ..................................................................... 72
3.3.1 PCI Express Autoconfiguration ................................................ 72
3.4 System Management BIOS (SMBIOS) ................................................. 73
3.5 Legacy USB Support ......................................................................... 73
3.6 BIOS Updates .................................................................................. 74
3.6.1 Language Support................................................................. 74
3.6.2 Custom Splash Screen ........................................................... 75
3.7BIOS Recovery................................................................................. 75
3.8 Boot Options.................................................................................... 76
3.8.1 Optical Drive Boot ................................................................. 76
3.8.2 Network Boot........................................................................ 76
3.8.3 Booting Without Attached Devices........................................... 76
3.8.4 Changing the Default Boot Device During POST......................... 76
3.9 Adjusting Boot Speed........................................................................ 77
3.9.1 Peripheral Selection and Configuration..................................... 77
3.9.2 BIOS Boot Optimizations........................................................ 77

Contents
ix
3.10 Hard Disk Drive Password Security Feature.......................................... 78
3.11 BIOS Security Features ..................................................................... 79
3.12 BIOS Performance Features ............................................................... 80
4Error Messages and Beep Codes
4.1 Speaker .......................................................................................... 81
4.2 BIOS Beep Codes ............................................................................. 81
4.3 Front-panel Power LED Blink Codes..................................................... 82
4.4 BIOS Error Messages ........................................................................ 82
4.5 Port 80h Power On Self Test (POST) Codes.......................................... 83
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance...................................................................... 89
5.1.1 Safety Standards................................................................... 89
5.1.2 European Union Declaration of Conformity Statement................ 90
5.1.3 Product Ecology Statements ................................................... 91
5.1.4 China RoHS .......................................................................... 94
5.1.5 EMC Regulations ................................................................... 95
5.1.6 e-Standby and ErP Compliance ............................................... 97
5.1.7 Regulatory Compliance Marks (Board Level) ............................. 98
5.2 Battery Disposal Information.............................................................. 99
Figures
1. Major Board Components .................................................................. 15
2. Block Diagram.................................................................................. 17
3. Memory Channel and DIMM Configuration............................................ 23
4. Back Panel Audio Connectors ............................................................. 30
5. LAN Connectors LED Locations ........................................................... 32
6. Thermal Sensors and Fan Headers...................................................... 34
7. Location of the Intel ME “M” State LED................................................ 39
8. Location of the Standby Power LED..................................................... 45
9. Detailed System Memory Address Map................................................ 48
10. Back Panel Connectors...................................................................... 50
11. Component-side Connectors and Headers............................................ 51
12. Connection Diagram for Front Panel Header......................................... 60
13. Connection Diagram for Front Panel USB 2.0 Connectors....................... 62
14. Location of the Jumper Block ............................................................. 63
15. Intel MEBX Reset Header................................................................... 64
16. Board Dimensions............................................................................. 65
17. Localized High Temperature Zones ..................................................... 68
18. Intel Desktop Board DQ77MK China RoHS Material Self
Declaration Table.............................................................................. 94

Intel Desktop Board DQ77MK Technical Product Specification
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Tables
1. Feature Summary............................................................................. 13
2. Components Shown in Figure 1 .......................................................... 16
3. Supported Memory Configurations...................................................... 21
4. DVI Port Status Conditions................................................................. 25
5. DisplayPort Status Conditions............................................................. 25
6. Audio Formats Supported by the DisplayPort Interface.......................... 25
7. Audio Jack Support........................................................................... 29
8. LAN Connector LED States................................................................. 33
9. Intel ME “M” State LED Behavior ........................................................ 39
10. Effects of Pressing the Power Switch ................................................... 40
11. Power States and Targeted System Power........................................... 41
12. Wake-up Devices and Events ............................................................. 42
13. System Memory Map......................................................................... 49
14. Component-side Connectors and Headers Shown in Figure 11................ 52
15. Serial Port Connector ........................................................................ 53
16. Front Panel Audio Header for Intel HD Audio........................................ 53
17. Front Panel Audio Header for AC ’97 Audio........................................... 53
18. Front Panel USB 2.0 Connectors......................................................... 53
19. Front Panel USB 3.0 Connector........................................................... 54
20. IEEE 1394a Connector....................................................................... 54
21. Internal Mono Speaker Header........................................................... 54
22. PCI Express Full-/Half-Mini Card Connector.......................................... 55
23. SATA Connectors.............................................................................. 56
24. S/PDIF Header ................................................................................. 57
25. Chassis Intrusion Header................................................................... 57
26. Processor, Front, and Rear Chassis (4-Pin) Fan Headers....................... 57
27. LPC Debug Header............................................................................ 57
28. Processor Core Power Connector ........................................................ 59
29. Main Power Connector....................................................................... 59
30. Front Panel Header ........................................................................... 60
31. States for a One-Color Power LED....................................................... 61
32. States for a Two-Color Power LED....................................................... 61
33. Alternate Front Panel Power/Sleep LED Header..................................... 61
34. BIOS Setup Configuration Jumper Settings .......................................... 63
35. Intel MEBX Reset Header Signals........................................................ 64
36. Recommended Power Supply Current Values (High Power) .................... 66
37. Recommended Power Supply Current Values (Low Power)..................... 66
38. Fan Header Current Capability............................................................ 67
39. Thermal Considerations for Components.............................................. 69
40. Tcontrol Values for Components ......................................................... 69
41. Environmental Specifications.............................................................. 70
42. BIOS Setup Program Menu Bar........................................................... 72
43. BIOS Setup Program Function Keys .................................................... 72
44. Acceptable Drives/Media Types for BIOS Recovery................................ 75
45. Boot Device Menu Options................................................................. 76