Intel H61 Series User manual

USER'S MANUAL
Of
Intel H61 Express Chipset
Based
M/B for Intel LGA 1155 Processors
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
NO. G03-I61M2-F
Rev: 4.0
Release date: October 31, 2011

i
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in any
area where it may become wet.
z0 to 40 centigrade is the suitable temperature. (The figure comes from the request of
the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact malfunction
and crackles due to constant thermal expansion and contraction from the welding
spots’ that connect components and PCB. Computer should go through an adaptive
phase before it boots when it is moved from a cold environment to a warmer one to
avoid condensation phenomenon. These water drops attached on PCB or the surface
of the components can bring about phenomena as minor as computer instability
resulted from corrosion and oxidation from components and PCB or as major as short
circuit that can burn the components. Suggest starting the computer until the
temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer. Using
the close case may decrease the life of other device because the higher temperature in
the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.

ii
CHAPTER 1 INTRODUCTION OF INTEL H61 MOTHERBOARDS ........................1
1-1 FEATURES OF MOTHERBOARD......................................................................1
1-1-1 SPECIAL FEATURES OF MOTHERBOARD............................................1
1-2 SPECIFICATION.................................................................................................2
1-3 LAYOUT DIAGRAM............................................................................................3
CHAPTER 2 HARDWARE INSTALLATION ...........................................................5
2-1 CPU INSTALLATION ........................................................................................5
2-2 MEMORY MODULE INSTALLATION.................................................................6
2-3 EXPANSION CARD INSTALLATION.................................................................7
2-3-1 EXPANSION SLOTS.................................................................................7
2-3-2 PROCEDURE FOR EXPANSION CARD INSTALLATION.......................7
CHAPTER 3 CONNCTORS, HEADERS & JUMPERS SETTING............................8
3-1 MOTHERBOARD INTERNAL CONNECTORS ..................................................8
3-2 I/O BACK PANEL CONNECTORS.....................................................................10
3-3 HEADERS...........................................................................................................11
3-4 JUMPER SETTING.............................................................................................13
CHAPTER 4 USEFUL HELP....................................................................................14
4-1 HOW TO UPDATE BIOS ....................................................................................14
4-2 TROUBLE SHOOTING.......................................................................................14
TABLE OF CONTENT

1
Chapter 1
Introduction of Intel H61 Motherboards
1-1 Features of Motherboard
The Intel H61 Express chipset based motherboard series are based on Intel H61
Express chipset technology which supports the innovative Intel LGA 1155 socket
Intel® Core™ i7, Intel® Core™ i5, Core™ i3.
The Intel H61 Express chipset based motherboard series comes with an integrated
DDRIII memory controller for dual channel DDRIII 800/ DDRIII 1066 /DDRIII 1333
MHz system memories which are expandable to 8 GB capacity.
The motherboard provides four serial ATAII interfaces of 3.0 Gb / s data transfer rate
for four SATA devices.
The H61 Express chipset based motherboards are integrated with megabit LAN chip
providing 10/100 Mbps data transfer rate. The H61 Express chipset based
motherboard series are embedded 6-channel HD CODEC fully compatible with
Sound Blaster Pro®standards to offer you home cinema quality and absolutely
software compatibility.
The H61 Express chipset based motherboard series offer one PCI-Express 2.0 x16
graphics slot and one PCI Express 2.0 x1 I/O slots to guarantee the rich connectivity
for the I/Os of peripherals.
Embedded USB controllers as well as capability of expanding to 8 of USB 2.0
functional ports delivering 480Mb/s bandwidth of rich connectivity, these
motherboards meet the future USB demands which are also equipped with hardware
monitor function on system to monitor and protect your system and maintain your
non-stop business computing.
Some special features--- CPU Vcore solid capacitors/CPU Smart Fan (Optional)
provide extra protection to the motherboard to extend product life and ensure system
stability.
1-1-1 Special Features of motherboard
CPU Vcore solid capacitors-High-polymer Solid Electrolysis Aluminum Capacitors
The motherboard adopts CPU Vcore solid capacitors to make it possible for
motherboard to work from 55 degrees Centigrade below zero to 125 degrees
centigrade. CPU Vcore capacitors possess superior physical characteristics to
prolong product life ten times than corresponding motherboard without capacitors
every time working temperature increases 20 degrees. Life of product of motherboard
with solid capacitors declines only 10% of those without solid capacitors as well under
same conditions.
CPU Smart Fan (Optional)—The Noise Management System
It’s never been a good idea to gain the performance of your system by sacrificing its
acoustics. CPU Smart Fan Noise Management System is the answer to control the
noise level needed for now-a-day’s high performance computing system. The system

2
will automatically increase the fan speed when CPU operating loading is high, after
the CPU is in normal operating condition, the system will low down the fan speed for
the silent operating environment. The system can provide the much longer life cycle
for both CPU and the system fans for game use and business requirements.
Notice! CPU Smart Fan is only optional for later version boards. To mask sure if
your board support this function please check BIOS settings.
1-2 Specification
Spec Description
Design zU-ATX PCB size: 17.5 cm x 23.0 cm
Chipset zIntel H61 Express Chipset
CPU Socket zsupports the innovative Intel LGA 1155 socket Intel®
Core™ i7, Core™ i5, Core™ i3 Processor
Memory Slot
zDDRIII module slot x 2
zSupport 2pcs DDRIII 800/DDRIII 1066/DDRIII 1333
memory modules expandable to 8 GB
zSupport dual channel function
Expansion Slots z1pcs PCI-Express 2.0 x16 by16 lane slot
z1pcs PCI-Express 2.0 x1 slot
Serial ATA2 zThe Intel H61chipset supports four internal SATA ports for
four SATA devices providing 3.0 Gb/sec data transfer rate
LAN chip
zIntegrated megabit PCI-E LAN chip that supports Fast
Ethernet LAN function of providing 10/100 Mbps data
transfer rate
HD Audio Chip z6-CHHD Audio Codec integrated
zAudio driver and utility included
BIOS zAMI 32MB DIP Flash ROM
Multi I/O
zPS/2 mouse connector x1
zPS/2 keyboard connector x 1
zVGA connector x1
zDVI connector x1
zHDMI connectorx1 (Optional for I61M2 series only)
zUSB 2.0 port x4 and header x2
zRJ-45 LAN connector x1
zAudio connector x1 (6-CH Audio)
zFront panel audio Header x1
zHDMI-SPDIF header x1
zFront panel header x1
zPWELED header x1
zSpeaker header x1
Item Checklist
zIntel H61 Chipset based motherboard
zDVD for motherboard utilities
zUser’s Manual
zSATA Cable
zI/O back panel shield

3
1-3 Layout Diagram
For I61M2 Series Motherboard
*Note: The above diagram is for illustration purpose only. Later board version has
moved front panel audio header to the position near USB header. Please refer to
actual product you purchase.
CPU Socket
ATX Power Connecto
r
CPU FAN1 Header
USB Headers
ATX 12V
Power Connector
RJ-45 LAN Port
Line-IN
MIC-IN
VGA Port
DDRIII Slot x 2
JBAT
Audio Connector
Line-OUT
KB/MS Power on (JP1)
DVI Port
Intel H61 Chipset
PCI Express 2.0x1 slots
VGA Port
PS/2 Mouse port
Over Keyboard Port
USB 2.0 Ports
DVI Port
HDMI port
RJ-45 over
USB 2.0
p
orts
Front Panel Audio Header
6-CH HD Audio Chip
PCI Express2.0 x16 Lane slot
HDMI-SPDIF Header
Power LED Header
HDMI Port
PS/2 Keyboard Port
USB 2.0 ports
Speaker Heade
r
JW-FP1 Header
SATA 1 Connecto
r
SATA 2 Connecto
r
SATA 4 Connecto
r
SATA 3 Connecto
r
Megabit LAN Chip
SYSFAN1 Header
JP2
PS/2 Keyboard Port

4
For I61M2-GT Series Motherboard
CPU Socket
ATX Power Connecto
r
CPU FAN1 Header
USB Headers
ATX 12V
Power Connector
RJ-45 LAN Port
Line-IN
MIC-IN
VGA Port
DDRIII Slot x 2
JBAT
Audio Connector
Line-OUT
KB/MS Power on (JP1)
Intel H61 Chipset
PCI Express 2.0x1 slots
VGA Port
PS/2 Mouse port
Over Keyboard Port
USB 2.0 Ports
DVI port
RJ-45 over
USB 2.0
p
orts
Front Panel
Audio Header
6-CH HD Audio Chip
PCI Express2.0 x16 Lane slot
HDMI-SPDIF Header
Power LED Header
DVI Port
PS/2 Keyboard Port
USB 2.0 ports
Speaker Heade
r
JW-FP1 Header
SATA 1 Connecto
r
SATA 2 Connecto
r
SATA 4 Connecto
r
SATA 3 Connecto
r
Megabit LAN Chip
SYSFAN1 Header
JP2
PS/2 Keyboard Port

5
Chapter 2
Hardware Installation
WARNING! Turn off your power when adding or removing expansion cards or
other system components. Failure to do so may cause severe
damage to both your motherboard and expansion cards.
2-1 CPU Installation
This motherboard provides an 1155-pin DIP, LGA 1155 Land Grid Array socket,
referred to as the LGA 1155 socket.
The CPU that comes with the motherboard should have a cooling FAN attached to
prevent overheating. If this is not the case, then purchase a correct cooling FAN
before you turn on your system.
NOTICE! Be sure that there is sufficient air circulation across the processor’s
heat sink and CPU cooling FAN is working correctly, otherwise it
may cause the processor and motherboard overheat and damage,
you may install an auxiliary cooling FAN, if necessary.
To install a CPU, first turn off your system and remove its cover. Locate the LGA
1155 socket and open it by first pulling the level sideways away from the socket then
upward to a 135-degree angle. Insert the CPU with the correct orientation as shown
below. The notched corner should point toward the end of the level. Because the
CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation
as shown.
When you install the CPU into the LGA 1155 socket, there’s no force required CPU
insertion; then presses the level to locate position slightly without any extra force.
Pin-1 Indicator
Ali
g
nment ke
y

6
2-2 Memory Module Installation
This motherboard provides two 240-pin DDR III DUAL INLINE MEMORY MODULES
(DIMM) socket for DDR III memory expansion available to maximum memory volume
of 8 GB DDRIII SDRAM.
Valid Memory Configurations
Bank 240-Pin DIMM PCS Maximum Capacity
DIMM1 DDR III 800/DDR III 1066/ DDR III1333 X1 4GB
DIMM2 DDR III 800/DDR III 1066/ DDR III1333 X1 4GB
Total System Memory (Max 4GB) 2 8GB
Recommend DIMM Module Combination ：
1. One DDRIII Memory Module ----Plug in DIMMM1.
2. Two DDRIII Memory Modules---Plug in DIMM1 & DIMM2 for Dual channel function
Dual channel Limited!
1. Memory modules plugged in the same color DIMM must be of the same type, same
size, and same frequency for dual channel function.
2. Dual channel function only supports when 2 DIMM Modules plug in either both DIMM1
& DIMM2.
Install DDR SDRAM modules to your motherboard is not difficult, you can refer to
figure below to see how to install DDRIII 800/ DDRIII 1066/DDRIII 1333 SDRAM
module.
DIMM2(BANK2+BANK3) DIMM1(BANK0+BANK1)
DIMM1 & DIMM2: Dual Channel
NOTICE! When you install DIMM module fully into the DIMM socket the eject
tab should be locked into the DIMM module very firmly and fit into its
indention on both sides.
Installation Tips：
Open the two plastic clips of memory slots then push down the module
vertically into the slot. See to it that the hole of the module fit into the notch of
the slot;
The two plastic clips will automatically close if the memory module is fitted in a
proper way.

7
2-3 Expansion Card Installation
2-3-1 Expansion Slots
The H61 Express chipset based motherboard series offer one PCI-Express2.0 x16
graphics slot and one PCI Express 2.0 x1 I/O slot to guarantee the rich connectivity
for the I/O of peripherals.
2-5-2 Procedure for Expansion Card Installation
1. Read the documentation for your expansion card and make any necessary
hardware or software setting for your expansion card such as jumpers.
2. Remove your computer’s cover and the bracket plate on the slot you intend to
use.
3. Align the card’s connectors and press firmly.
4. Secure the card on the slot with the screen you remove above.
5. Replace the computer system’s cover.
6. Set up the BIOS if necessary.
7. Install the necessary software driver for your expansion card.
PCI-E2.0 x16@16 Lane Slot
PCI-E 2.0 x1 slot