Intel DZ77BH-55K User manual

Intel® Desktop Board
DZ77BH-55K
Technical Product Specification
August 2012
Order Number: G56579-004
The Intel®Desktop Board DZ77BH-55K may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DZ77BH-55K Specification Update.

Revision History
Revision Revision History Date
001 First release of the Intel®Desktop Board DZ77BH-55K Technical Product
Specification April 2012
002 Specification Clarification update May 2012
003 Updated the Board Identification Information section June 2012
004 Specification Clarification update August 2012
This product specification applies to only the standard Intel®Desktop Board DZ77BH-55K with
BIOS identifier BHZ7710H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
All Intel®desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, 3rd generation Intel Core processor family, and 2nd generation Intel Core processor family are
trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright 2012 Intel Corporation. All rights reserved.

iii
Board Identification Information
Basic Desktop Board DZ77BH-55K Identification Information
AA Revision BIOS Revision Notes
G39008-400 BHZ7710H.86A.0057 1,2
G39008-500 BHZ7710H.86A.0057 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Z77 processor used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
Intel Z77 Express Chipset C1 SLJC7
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel®Desktop Board DZ77BH-55K.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
May 2012 Spec Clarification Reconfigured Table 22 on page 52.
August 2012 Spec Clarification Updated to show eSATA through the PCH and not through a
Marvell controller.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.

Intel Desktop Board DZ77BH-55K Technical Product Specification
iv

v
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
Intel®Desktop Board DZ77BH-55K.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DZ77BH-55K and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DZ77BH-55K
2 A map of the resources of the Intel Desktop Board
3
The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DZ77BH-55K Technical Product Specification
vi
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

vii
Contents
Revision History
Board Identification Information..................................................................iii
Specification Changes or Clarifications..........................................................iii
Errata ......................................................................................................iii
Preface
Intended Audience..................................................................................... v
What This Document Contains..................................................................... v
Typographical Conventions ......................................................................... v
1Product Description
1.1 Overview......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout........................................................................ 13
1.1.3 Block Diagram ...................................................................... 16
1.2 Online Support................................................................................. 17
1.3 Processor ........................................................................................ 17
1.3.1 Graphics Subsystem .............................................................. 18
1.3.2 Processor Graphics................................................................ 18
1.3.3 PCI Express x16 Graphics....................................................... 18
1.4 System Memory ............................................................................... 19
1.4.1 Memory Configurations .......................................................... 20
1.5 Intel®Z77 Express Chipset ................................................................ 22
1.5.1 Direct Media Interface (DMI) .................................................. 22
1.5.2 Display Interfaces ................................................................. 22
1.5.3 USB..................................................................................... 24
1.5.4 SATA Interfaces.................................................................... 25
1.6 Real-Time Clock Subsystem............................................................... 27
1.7 Legacy I/O Controller........................................................................ 27
1.7.1 Consumer Infrared (CIR)........................................................ 27
1.8 Audio Subsystem.............................................................................. 28
1.8.1 Audio Subsystem Software..................................................... 28
1.8.2 Audio Subsystem Components................................................ 29
1.9 LAN Subsystem................................................................................ 30
1.9.1 Intel®82579V Gigabit Ethernet Controller ................................ 30
1.9.2 LAN Subsystem Software ....................................................... 31
1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 31
1.10 Hardware Management Subsystem..................................................... 32
1.10.1 Hardware Monitoring and Fan Control ...................................... 32
1.10.2 Fan Monitoring...................................................................... 32
1.10.3 Chassis Intrusion and Detection .............................................. 32
1.10.4 Thermal Monitoring ............................................................... 33

Intel Desktop Board DZ77BH-55K Technical Product Specification
viii
1.11 Power Management .......................................................................... 34
1.11.1 ACPI.................................................................................... 34
1.11.2 Hardware Support ................................................................. 37
1.12 Board Status LEDs............................................................................ 42
1.13 Onboard Power Button ...................................................................... 44
2Technical Reference
2.1 Memory Resources ........................................................................... 45
2.1.1 Addressable Memory ............................................................. 45
2.1.2 Memory Map......................................................................... 47
2.2 Connectors and Headers.................................................................... 47
2.2.1 Back Panel Connectors........................................................... 48
2.2.2 Component-side Connectors and Headers................................. 49
2.3 Jumper Block ................................................................................... 59
2.4 Mechanical Considerations ................................................................. 61
2.4.1 Form Factor.......................................................................... 61
2.5 Electrical Considerations.................................................................... 62
2.5.1 Power Supply Considerations .................................................. 62
2.5.2 Fan Header Current Capability ................................................ 63
2.5.3 Add-in Board Considerations................................................... 63
2.6 Thermal Considerations..................................................................... 64
2.7 Reliability......................................................................................... 67
2.8 Environmental.................................................................................. 67
3Overview of BIOS Features
3.1 Introduction..................................................................................... 69
3.2 BIOS Flash Memory Organization........................................................ 70
3.3 Resource Configuration ..................................................................... 70
3.3.1 PCI Autoconfiguration ............................................................ 70
3.4 System Management BIOS (SMBIOS) ................................................. 71
3.5 Legacy USB Support ......................................................................... 71
3.6 BIOS Updates .................................................................................. 72
3.6.1 Language Support................................................................. 72
3.6.2 Custom Splash Screen ........................................................... 73
3.7 BIOS Recovery................................................................................. 73
3.8 Boot Options.................................................................................... 74
3.8.1 Optical Drive Boot ................................................................. 74
3.8.2 Network Boot........................................................................ 74
3.8.3 Booting Without Attached Devices ........................................... 74
3.8.4 Changing the Default Boot Device During POST......................... 74
3.9 Adjusting Boot Speed........................................................................ 75
3.9.1 Peripheral Selection and Configuration ..................................... 75
3.9.2 BIOS Boot Optimizations........................................................ 75
3.10 BIOS Security Features ..................................................................... 76
3.11 Back to BIOS Button......................................................................... 77
3.12 BIOS Performance Features............................................................... 77

Contents
ix
4Error Messages and Beep Codes
4.1 Speaker .......................................................................................... 79
4.2 BIOS Beep Codes ............................................................................. 79
4.3 Front-panel Power LED Blink Codes..................................................... 80
4.4 BIOS Error Messages ........................................................................ 80
4.5 Port 80h Power On Self Test (POST) Codes.......................................... 81
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance...................................................................... 87
5.1.1 Safety Standards................................................................... 87
5.1.2 European Union Declaration of Conformity Statement ................ 88
5.1.3 Product Ecology Statements ................................................... 89
5.1.4 EMC Regulations ................................................................... 91
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 94
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 95
5.2 Battery Disposal Information.............................................................. 96
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram.................................................................................. 16
3. DIMM Configuration .......................................................................... 21
4. Back Panel Audio Connectors ............................................................. 29
5. LAN Connectors LED Locations ........................................................... 31
6. Thermal Sensors and Fan Headers...................................................... 33
7. Location of the Standby Power LED..................................................... 40
8. Location of the VR Status LEDs .......................................................... 41
9. Location of Board Status LEDs............................................................ 42
10. Location of the Onboard Power Button ................................................ 44
11. Detailed System Memory Address Map................................................ 46
12. Back Panel Connectors ...................................................................... 48
13. Component-side Connectors and Headers............................................ 49
14. Connection Diagram for Front Panel Header......................................... 56
15. Connection Diagram for Front Panel USB 2.0 Headers ........................... 58
16. Location of the Jumper Block ............................................................. 59
17. Board Dimensions............................................................................. 61
18. Localized High Temperature Zones ..................................................... 65
Tables
1. Specification Changes or Clarifications...................................................iii
2. Feature Summary............................................................................. 11
3. Components Shown in Figure 1 .......................................................... 14
4. Supported Memory Configurations...................................................... 20
5. HDMI Port Status Conditions.............................................................. 23
6. DisplayPort Status Conditions............................................................. 23

Intel Desktop Board DZ77BH-55K Technical Product Specification
x
7. Audio Formats Supported by the HDMI and DisplayPort Interfaces.......... 23
8. Audio Jack Support........................................................................... 28
9. LAN Connector LED States................................................................. 31
10. Effects of Pressing the Power Switch ................................................... 34
11. Power States and Targeted System Power ........................................... 35
12. Wake-up Devices and Events ............................................................. 36
13. Board Status LEDs............................................................................ 43
14. System Memory Map ........................................................................ 47
15. Component-side Connectors and Headers Shown in Figure 13................ 50
16. IEEE 1394a Header........................................................................... 51
17. Front Panel Audio Header for Intel HD Audio........................................ 51
18. Front Panel Audio Header for AC ’97 Audio........................................... 51
19. S/PDIF Header ................................................................................. 51
20. SATA Connectors.............................................................................. 52
21. Dual-Port Front Panel USB 2.0 Headers ............................................... 52
22. Front Panel USB 3.0 Connector........................................................... 52
23. Chassis Intrusion Header................................................................... 53
24. Processor, Front and Rear Chassis, and Auxiliary (4-Pin) Fan Headers..... 53
25. Back Panel CIR Emitter (Output) Header ............................................. 53
26. Front Panel CIR Receiver (Input) Header ............................................. 53
27. Alternate Front Panel Power LED Header.............................................. 54
28. Processor Core Power Connector ........................................................ 55
29. Main Power Connector....................................................................... 55
30. Front Panel Header ........................................................................... 56
31. States for a One-Color Power LED....................................................... 57
32. States for a Two-Color Power LED ...................................................... 57
33. BIOS Setup Configuration Jumper Settings .......................................... 60
34. Fan Header Current Capability............................................................ 63
35. Thermal Considerations for Components.............................................. 65
36. Tcontrol Values for Components ......................................................... 66
37. Environmental Specifications.............................................................. 67
38. BIOS Setup Program Menu Bar........................................................... 70
39. BIOS Setup Program Function Keys .................................................... 70
40. AccepDrives/Media Types for BIOS Recovery ....................................... 73
41. Boot Device Menu Options................................................................. 74
42. Supervisor and User Password Functions ............................................. 76
43. BIOS Beep Codes ............................................................................. 79
44. Front-panel Power LED Blink Codes..................................................... 80
45. BIOS Error Messages ........................................................................ 80
46. Port 80h POST Code Ranges .............................................................. 81
47. Port 80h POST Codes ........................................................................ 82
48. Typical Port 80h POST Sequence ........................................................ 86
49. Safety Standards.............................................................................. 87
50. EMC Regulations............................................................................... 91
51. Regulatory Compliance Marks ............................................................ 95

11
1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Processor •3
rd
generation Intel
®
Core processor family and 2
nd
generation Intel
®
Core
processor family processors with up to 95 W TDP in an LGA1155 socket
―Two PCI Express* 3.0 x16 graphics interfaces (operates in x8 mode when
both slots are populated)
―Integrated memory controller with dual channel DDR3 memory support
―Integrated graphics processing (processors with Intel®HD Graphics)
―External graphics interface controller
Memory •
Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
•Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
•Support for non-ECC memory
•Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
•Support for XMP memory
Note: DDR3 1600 MHz DIMMs are only supported by 3rd generation Intel Core
processor family processors
Chipset Intel
®
Z77 Express Chipset consisting of the Intel
®
Z77 Platform Controller
Hub (PCH)
Audio •10-channel (8 + 2) Intel
®
High Definition Audio via the Realtek* ALC898 audio
codec
•8-channel (7.1) Intel HD Audio via the High Definition Multimedia Interface*
(HDMI*)
Graphics •Integrated graphics support for processors with Intel HD Graphics:
―HDMI v1.4a
―DisplayPort* v1.1a
•Support for PCI Express* 3.0 x16 add-in graphics cards
Note: PCI Express 3.0 is only supported by 3rd generation Intel Core
processor family processors
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR) and hardware
management support
continued

Intel Desktop Board DZ77BH-55K Technical Product Specification
12
Table 2. Feature Summary (continued)
Peripheral
Interfaces
•Six USB 3.0 ports:
―Four ports implemented with stacked back panel connectors (blue)
―Two ports implemented through one dual-port internal connector (blue)
•Ten USB 2.0 ports:
―Four ports implemented with stacked back panel connectors (two black
and two orange high current charging ports)
―Six front panel ports are implemented through three dual-port internal
headers
•Eight Serial ATA (SATA) ports:
―Two SATA 6.0 Gb/s interfaces through the Intel Z77 Express Chipset with
Intel®Rapid Storage Technology RAID support (blue)
―Two SATA 6.0 Gb/s interfaces through a Marvel 88SE9172 controller
(gray)
―One back panel eSATA 3.0 Gb/s port through the PCH (red)
―Three internal SATA 3.0 Gb/s interfaces through the Intel Z77 Express
Chipset with Intel Rapid Storage Technology RAID support (black)
•Two IEEE 1394a ports:
―One port via a back panel connector
―One port via a front-panel header (blue)
BIOS •
Intel®BIOS resident in the SPI Flash device
•Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and SMBIOS
Instantly Available
PC Technology
•Support for PCI* Local Bus Specification Revision 2.2
•Support for PCI Express* Revision 2.0
•Suspend to RAM support
•Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports
LAN Support Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel
®
82579V Gigabit
Ethernet Controller
Expansion
Capabilities
•Two PCI Express 3.0 x16 bus add-in card connectors from the processor (2
nd
PCI Express slot is electrically x8)
•Three PCI Express 2.0 x1 bus add-in card connectors from the PCH
•Two Conventional PCI bus add-in card connectors from the PCH via a PCI
bridge
Note: PCI Express 3.0 is only supported by 3rd generation Intel Core
processor family processors
Hardware Monitor
Subsystem
•Hardware monitoring and fan control through the Nuvoton I/O controller
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Four fan headers using PWM control
•Four fan sense inputs used to monitor fan activity
•Fan speed control using voltage control (4-pin fan headers front, rear, and
auxiliary) with selectable support in BIOS for 3-wire fans
•Support for Platform Environmental Control Interface (PECI)

Product Description
13
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board
DZ77BH-55K.
Figure 1. Major Board Components
Table 3 lists the components identified in Figure 1.

Intel Desktop Board DZ77BH-55K Technical Product Specification
14
Table 3. Components Shown in Figure 1
Label Description
A PCI Express x1 bus add-in card connector
B Conventional PCI bus add-in card connector
C PCI Express x16 bus add-in card connector (x8 electrical; x16 compatible)
D Front panel audio header
E Conventional PCI bus add-in card connector
F PCI Express x1 bus add-in card connector
G PCI Express x16 bus add-in card connector
H Battery
I PCI Express x1 bus add-in card connector
J Rear chassis fan header
K Back panel connectors
L 12 V processor core voltage connector (2 x 4 pin)
M LGA1155 processor socket
N VR status LEDs
O Processor fan header
P DIMM 3 (Channel A DIMM 0)
Q DIMM 1 (Channel A DIMM 1)
R DIMM 4 (Channel B DIMM 0)
S DIMM 2 (Channel B DIMM 1)
T Front chassis fan header
U Piezoelectric speaker
V Main power connector (2 x 12)
W LED2 (Power Fault)
X Onboard power button
Y Standby power LED
Z SATA 3.0 Gb/s connector through the PCH (black)
AA Intel Z77 Express Chipset
BB SATA 6.0 Gb/s connector through the PCH (blue)
CC SATA 3.0 Gb/s connector through the PCH (black)
DD SATA 6.0 Gb/s connector through a Marvel 88SE9172 controller (gray)
EE Alternate front panel power LED header
FF Front panel header
GG Power On Self Test (POST) code LED display
HH Front panel USB 2.0 connectors
II Chassis intrusion header
JJ Consumer IR receiver (input) header
KK Front panel USB 3.0 connector (blue)
LL Consumer IR transmitter (output) header
continued

Product Description
15
Table 3. Components Shown in Figure 1 (continued)
Label Description
MM BIOS configuration jumper block
NN S/PDIF out header
OO Board status LEDs
PP Auxiliary fan header
QQ IEEE 1394a front panel header

Intel Desktop Board DZ77BH-55K Technical Product Specification
16
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram

Product Description
17
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DZ77BH-55K http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DZ77BH-55K http://ark.intel.com
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.3 Processor
The board is designed to support 3rd generation Intel Core processor family and 2nd
generation Intel Core processor family processors.
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W. The processors listed above are only
supported when falling within the wattage requirements of the Intel Desktop Board
DZ77BH-55K.See the Intel web site listed below for the most up-to-date list of
supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above.Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor.Refer to
Section 2.5.1 on page 62 for information on power supply requirements for this board.

Intel Desktop Board DZ77BH-55K Technical Product Specification
18
1.3.1 Graphics Subsystem
The board supports graphics through either the processor Intel HD Graphics or a PCI
Express x16 add-in graphics card.
1.3.2 Processor Graphics
The board supports integrated graphics through the Intel®Flexible Display Interface
(Intel®FDI) for processors with Intel HD Graphics.
1.3.2.1 Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
•3D Features
DirectX* 11 (2nd generation Intel Core processor family processors support
CS4.0 only) support
OpenGL* 3.0 support
Shader Model 4.0
•Video
High-Definition content at up to 1080p resolution
Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video
formats
Intel®HD Graphics with Advanced Hardware Video Transcoding (Intel®Quick
Sync Video)
Note: Intel Quick Sync is enabled with the appropriate software application
Blu-ray* S3D via HDMI 1.4a
Dynamic Video Memory Technology (DVMT) 5.0 support
Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
1.3.3 PCI Express x16 Graphics
3rd generation Intel Core processor family processors support PCI Express 3.0, 2.x, and
1.x and 2nd generation Intel Core processor family processors support PCI Express 2.x
and 1.x:
•PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
1 GB/s each direction per lane.The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a total bandwidth of
32 GB/s.
•PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
500 MB/s each direction per lane.The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direction, simultaneously, for a total bandwidth of
16 GB/s.

Product Description
19
•PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
250 MB/s each direction per lane.The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direction, simultaneously, for a total bandwidth of
8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com
1.4 System Memory
The board has four DIMM sockets and supports the following memory features:
•1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
•1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)
•Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
•32 GB maximum total system memory (using 4 Gb memory technology).Refer to
Section 2.1.1 on page 45 for information on the total amount of addressable
memory.
•Minimum total system memory: 1 GB using 512 MB x16 module
•Non-ECC DIMMs
•Serial Presence Detect
•DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs
Note: DDR3 1600 MHz DIMMs are only supported by 3rd generation Intel Core
processor family processors
•XMP version 1.3 performance profile support for memory speeds of 1600 MHz and
higher
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure.This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance.If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.

Intel Desktop Board DZ77BH-55K Technical Product Specification
20
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity Configuration (Note)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
1.4.1 Memory Configurations
The 3rd generation Intel Core processor family and 2nd generation Intel Core processor
family processors support the following types of memory organization:
•Dual channel (Interleaved) mode.This mode offers the highest throughput for
real world applications.Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal.Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal.If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode.This mode is equivalent to single channel
bandwidth operation for real world applications.This mode is used when only a
single DIMM is installed or the memory capacities are unequal.Technology and
device width can vary from one channel to the other.If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm