Doc: DUSTY User’s Guide, Rev 1.4 2 of 19
Outline
1. INTRODUCTION....................................................................................................................................... 4
1.1. DESCRIPTION....................................................................................................................................... 4
2. SYSTEM OVERVIEW................................................................................................................................ 5
2.1. SMARTMESH IP™ TECHNOLOGY OVERVIEW.......................................................................................... 5
2.2. DUSTY IN A SMARTMESH IP™ NETWORK .............................................................................................. 5
2.3. SMARTMESH IP™ FEATURES............................................................................................................... 6
2.4. LTC5800-IPM -SMARTMESH IP™ WIRELESS 802.15.4E SYSTEM-ON-CHIP.......................................... 6
2.5. BLOCK DIAGRAM .................................................................................................................................. 8
2.6. MODULESPECIFICATIONS...................................................................................................................... 8
3. CONNECTORS ......................................................................................................................................... 9
4. USAGE.................................................................................................................................................... 12
4.1. POWER SUPPLY ................................................................................................................................. 12
5. BOARD LAYOUT.................................................................................................................................... 13
5.1. DUSTY PCB-ANT MOUNTINGSUGGESTION........................................................................................... 14
6. FIRMWARE UPLOAD............................................................................................................................. 15
7. SOFTWARE DEVELOPMENT................................................................................................................ 16
8. REFERENCES AND USEFUL LINKS.................................................................................................... 17
8.1. DATA SHEETS AND DOCUMENTS.......................................................................................................... 17
8.2. TOOLS............................................................................................................................................... 17
8.3. WEB SITES ........................................................................................................................................ 17
9. FCC STATEMENT:................................................................................................................................. 18
9.1. RF RADIATION EXPOSURE STATEMENT:.............................................................................................. 18
9.2. FCC INFORMATION TO OEM INTEGRATOR........................................................................................... 19
10. CERTIFICATION................................................................................................................................. 19
Illustrations
IMAGE 1MESH NETWORK..................................................................................................... 5
IMAGE 2LTC 5800 IPM..................................................................................................... 7
IMAGE 3DUSTY BLOCK DIAGRAM ........................................................................................... 8
IMAGE 4DUSTY PINOUT TOP VIEW......................................................................................... 9
IMAGE 5DUSTY DIMENSIONS .............................................................................................. 13
IMAGE 6DUSTY MOUNTING SAMPLE....................................................................................... 14
IMAGE 7REQUIRED TOOLS TO UPLOAD FIRMWARE ...................................................................... 15
Tables
TABLE 1PINOUT DESCRIPTION ............................................................................................ 10
TABLE 2SIGNAL SHORT DESCRIPTION.................................................................................... 11
