Keyspan Upr-112g Manual

CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe

* Required Field

Material Composition Declaration

both international and Pan-American copyright conventions.

This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly

with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has

engineering responsibility. Adobe Reader version 7.0.5 is required to complete this declaration.

IPC-1752-1 v1.02

IPC Web Site for Information on IPC-1752 Standard

http://www.ipc.org/IPC-175x

Form Type *

Declaration Class *

Supplier Information

Company Name *

Company Unique ID

Unique ID Authority

Response Date *

Response Document ID

Contact Name *

Title - Contact

Phone - Contact *

Email - Contact *

Authorized Representative *

Title - Representative

Phone - Representative *

Email- Representative *

Supplier Comments or URL for Additional Information

Requester Item Number

Mfr Item Number

Mfr Item Name

Effective Date

Manufacturing Site

Weight

UOM

Unit Type

Version

Alternate Recommendation

Alternate Item Comments

Manufacturing Information section intentionally omitted.

CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe

* Required Field

Save the fields in

this form to a file

Import fields from a

file into this form

Clear all of the

fields on this form

Lock the fields on this

form to prevent changes

RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),

Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium

RoHS Material Composition Declaration

Declaration Type *

RoHS Declaration *

Supplier Acceptance

Exemptions: If the declared item does not contain RoHS restricted substances per the definition above except for defined RoHS exemptions, then select the corresponding response in the RoHS Declaration

above and checkboxes will appear below. Check all applicable exemptions.

1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.

7c. Lead in electronic ceramic parts (e.g. piezoelectronic devices).

2a. Mercury in straight fluorescent lamps for general purposes not exceeding 10 mg. in

halophosphate lamps

8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications

banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the

marketing and use of certain dangerous substances and preparations piezoelectronic devices).

2b. Mercury in straight fluorescent lamps for general purposes not exceeding 5 mg. in triphosphate

lamps with a normal lifetime

9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption

refrigerators

2c. Mercury in straight fluorescent lamps for general purposes not exceeding 8 mg. in triphosphate

lamps with long lifetime

10a. Deca BDE in polymeric applications

3. Mercury in straight fluorescent lamps for special purposes.

10b. Lead in lead/bronze bearing shells and bushes

4. Mercury in other lamps not specifically mentioned in this list.

11. Lead used in compliant pin connector systems.

5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.

12. Lead as a coating material for a thermal conduction module c-ring.

6a. Lead as an alloying element in steel containing up to 0.35% lead by weight.

13a. Lead in optical and filter glass.

6b. Lead as an alloying element in aluminum containing up to 0.4% lead by weight.

13b. Cadmium in optical and filter glass.

6c. Lead as an alloying element in copper containing up to 4% lead by weight.

14. Lead in solders consisting of more than two elements for the connection between the pins and the

package of microprocessors with a lead content of more than 80% and less than 85% by weight .

7a. Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by

weight or more lead).

15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier

within integrated circuit Flip Chip packages.

7b. Lead in solders for servers, storage and storage array systems, network infrastructure equipment

for switching, signalling, transmission as well as network management for telecommunications.

Declaration Signature

Instructions: Complete all of the required fields on all pages of this form. Select the "Accepted" on the Supplier Acceptance drop-down. This will display the signature area. Digitally sign