LG 15EL9500 User manual

OLED TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : OD01J
MODEL : 15EL9500 15EL9500-ZA
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL63267401 (1004-REV00)

LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
BLOCK DIAGRAM...................................................................................14
EXPLODED VIEW .................................................................................. 15
SVC. SHEET ...............................................................................................

LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15 uF
Ω

LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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Only for training and service purposes
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the OLED TV used OD01J chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC(77 ºF ± 9 ºF), CST: 40 ºC ± 5 ºC
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~ 50 / 60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with
BOM.
5) The receiver must be operated for about 5 minutes prior to the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC:CE, IEC
4. Module specification(General)
No. Item Specification Measurement Remark
1 Screen Size 15 inch Diagonal
2 Aspect Ratio 16:9
3 AMOLED 15 inch WXGA AMOLED HD
4 Storage Environment Temp.: -20 deg ~ 60 deg
Humidity : 10 % ~ 90 %
5 Input Voltage -0.3 ~ 14 Vdc At 25 ºC
6 Power Consumption 32 W Typica (Logic : 6 W, EL= 26 W)

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5. Model General Specification
No. Item Specification Remarks
1. Market EU(PAL Market-36Countries) DTV & Analog (Total 36 countries)
(UK/Italy/Germany/France/Spain/Sweden/Finland/Netherland/Belgium/
Luxemburg/Greece/Denmark/Czech/Austria/Hungary/Switzerland/Croatia
Turkey/Norway/Slovenia/Poland/Portugal/Ireland/Moroco/Latvia/Estonial/
Lithuania/Rumania)
DTV (MPEG2/4, DVB-C) : 2 Countries
Swenden/ Finland
Analog Only - 7 countries
(Russia/Slovakia/Bosnia/Serbia/Bulgaria/Latvia/Albania/Kazakhstan)
2. Broadcasting system 1) PAL-BG
2) PAL-DK
3) PAL-I/I’
4) SECAM L/L’
5) DVB-T/C (ID TV)
3. Receiving system Analog : Upper Heterodyne GDBV-T
Digital : COFDM , QAM - Guard Interval(Bitrate Mbit/s)
1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 4/5, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 4/5, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 4/5, 5/6, 7/8
GDVB-C
- Symbolrate :
4.0Msymbols/s to 7.2Msymbols/s
- Modulation
16QAM, 64-QAM, 128-QAM and 256-QAM
4. Mini - HDMI Input (1EA) HDMI1-DTV Support HDCP
5. USB DVIX
6. USB B For Service

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6. Module optical specification
1) Contrast Ratio(CR) is defined mathematically as :
CR = Surface Luminance at all white pixels / Surface Luminance at all black pixels
It is measured at center 1 point.
2) Surface luminance is determined after the unit has been ‘ON’ and 3minutes after lighting the module in a dark environment at
25°C ± 2 °C. Surface luminance is the luminance value at center 1 point across the AMOLED surface 50 cm from the surface with
all pixels displaying white.
3) The variation in surface luminance , d WHITE is defined as :
- d WHITE(9P) = Minimum(Lon1,Lon2,..., Lon9) / Maximum(Lon1,Lon2..., Lon9)
Where Lon1 to Lon9 are the luminance with all pixels displaying white at 9 locations.
4) Image sticking
When it changes into pattern-B after a 1 hour drive by pattern-A, it disappears within 5 seconds.
No. Item Specification Min. Typ. Max. Remark
1. Viewing Angle [CR>10] Right/Left(Up/Down) Free Degree
2. Luminance Luminance (cd/m2) 180 200
Uniformity Variation 70 80
3. Contrast Ratio CR 50,000 100,000
4. CIE Color Coordinates White Wx 0.285
Wy 0.299
RED Rx 0.667
Ry Typ. 0.333 Typ.
Green Gx -0.03 0.230 +0.03
Gy 0.675
Blue Bx 0.145
By 0.065
7. HDMI Input
(1) DTV Mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*480 31.469 / 31.5 59.94 / 60 27.00 / 27.03 SDTV 480P
2. 720*576 31.25 50 54 SDTV 576P
3. 1280*720 37.500 50 74.25 HDTV 720P
4. 1280*720 44.96 / 45 59.94 /60 74.17 / 74.25 HDTV 720P
5. 1920*1080 33.72 / 33.75 59.94 /60 74.17 / 74.25 HDTV 1080I
6. 1920*1080 28.125 50.00 74.25 HDTV 1080I
7. 1920*1080 26.97 / 27 23.97 / 24 74.17 / 74.25 HDTV 1080P
8. 1920*1080 33.716 / 33.75 29.976 / 30.00 74.25 HDTV 1080P
9. 1920*1080 56.250 50 148.5 HDTV 1080P
10. 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P

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Only for training and service purposes
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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the OLED TV with
OD01J chassis.
2. Designation
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 ºC ± 5 ºC
Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz
6) Adjustment equipments: Color Analyzer(CA-210 or CA-
110), Pattern Generator(MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, service remote control.
7) Push The “IN STOP” key - For memory initialization.
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot file Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message
If “Error” is displayed, Check connection between
computer, jig, and set.
3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
4) Click “Connect” tab. If “Can’t” is displayed, check
connection between computer, jig, and set.
5) Click “Auto” tab and set as below
6) Click “Run”.
7) After downloading, check “OK” message.
* USB DOWNLOAD (*.epk file download)
1) Put the USB Stick to the USB socket.
2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work. But your downloaded version is High, USB
data is automatically detecting.
3) Show the message “Copying files from memory”.
filexxx.bin
(4)
(7) .OK
(5)
(6)
(1)
filexxx.bin
(2) (3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
Case1 : Software version up
1. After downloading S/W by USB, TV set will reboot
automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at first.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.

4) Updating is staring.
5) Uploading completed, The TV will restart automatically.
6) If your TV is turned on, check your updated version and
Tool option.(explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote controller
2) Select “Tool Option 1” and Push “OK” button.
3) Punch in the number. (Each model hax their number)
4) Completed selecting Tool option.
3.1. Function Check
* Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART1/SCART2/ CVBS)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In
* Display and Sound check is executed by Remote control
4. Total Assembly line process
4.1. Adjustment Preparation
· W/B Equipment condition
CA210 : CH 17(OLED), Test signal : Inner pattern (85IRE)
· Above 30 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
* Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER ON ->
Enter the mode of White-Balance, the pattern will come out.
* Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10 lux).
2) Adhere closely the Color Analyzer (CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color Analyzer’s prove vertically.(80° ~ 100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
• Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
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Model Tool option1 Tool option2 Tool option3 Tool option4
15EL9500 59648 512 49312 3328
Cool 13,000 K X=0.269(±0.002)
Y=0.273(±0.002)
Color Medium 9,300 K X=0.285(±0.002)
Teperature Y=0.293(±0.002)
Warm 6,500 K X=0.313(±0.002)
Y=0.329(±0.002)
Full White Pattern
COLOR
ANALYZER
TYPE: CA-210
RS-232C Communication
CA-210
RS-232C COMMAND MIN CENTER MAX
[CMD ID DATA] (DEFAULT)
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128

** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)
* Manual W/B process using adjusts Remote control.
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “G” key at “6. White
Balance”.
* After done all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is not
same, then correct it same with BOM and unplug AC cable.
For correct it to the model’s module from factory Jig model.
* Push the “IN STOP” key after completing the function
inspection. And Mechanical Power Switch must be set
“ON”.
4.2. DPM operation confirmation
(Only Apply for MNT Model)
Check if Power LED color and Power Consumption operate
as stanard.
• Set Input to RGB and connect D-sub cable to set.
• Measurement Condition: 100-240V~, 50 / 60 Hz.
• Confirm DPM operation at the state of screen without Signal.
4.3. DDC EDID Write (HDMI 256Byte)
• Connect HDMI Signal Cable to HDMI Jack.
• Write EDID Data to EEPROM(24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
4.4. EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
- Auto Download
• After enter Service Mode by pushing “ADJ” key,
• Enter EDID D/L mode.
• Enter “START” by pushing “OK” key.
* Edid data and Model option download (RS232)
- Manual Download
* Caution
1) Use the proper signal cable for EDID Download
- Digital EDID : Pin3 exists
2) Never connect HDMI & D-sub Cable at the same time.
3) Use the proper cables below for EDID Writing
4) Download HDMI1, HDMI2, separately because HDMI1 is
different from HDMI2
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Only for training and service purposes
Item CMD1 CMD2 Data0
Download A A 0 0 When transfer the ‘Mode In’,
‘Mode In’ Carry the command.
Download A E 00 10 Automatically Download
(The use of a internal pattern)
Item
Manufacturer ID
Version
Revision
Condition
GSM
Digital : 1
Digital : 3
Data(Hex)
1E6D
01
03
DVI-D to HDMI or HDMI to HDMI
For HDMI EDID

1) HD HDMI EDID data
* Detail EDID Options are below
ⓐProduct ID
ⓑSerial No: Controlled on production line.
ⓒMonth, Year: Controlled on production line:
ex) Monthly : ‘02’ -> ‘02’
Year : ‘2009’ -> ‘13’
ⓓModel Name(Hex):
ⓔChecksum: Changeable by total EDID data.
ⓕVendor Specific(HDMI)
5. Model name & Serial number D/L
• Press “Power on” key of service remocon.
(Baud rate : 115200 bps)
• Connect RS232 Signal Cable to RS-232 Jack.
• Write Serial number by use RS-232.
• Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
5.1. Signal TABLE
CMD : A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 +…+ Data_n
Delay : 20ms
5.2. Command Set
* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write : Model Name and Serial Number write in
EEPROM,.
5.3. Method & notice
A. Serial number D/L is using of scan equipment.
B. Setting of scan equipment operated by Manufacturing
Technology Group.
C. Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0.
Model Name HEX EDID Table DDC Function
HD Model 0000 00 00 Digital
LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 12 -
MODEL MODEL NAME(HEX)
LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
INPUT MODEL NAME(HEX)
HDMI1 65030C001000011D
012 3 4 5 67 8 9 ABCDEF
00 00 FF FF FF FF FF FF 00 1E 6D a b
10 c 0103807341780ACF74A3574CB023
20 09 48 4C A1 08 00 81 C0 61 40 45 40 31 40 01 01
30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 36 00 7E 8A 42 00 00 1E 01 1D 00 72 51 D0 1E 20
50 6E 28 55 00 7E 8A 42 00 00 1E 00 00 00 FD 00 3A
60 3E 1F 46 10 00 0A 20 20 20 20 20 20 d
70 d 01 e
80 02 03 20 F1 4E 10 1F 84 13 05 14 03 02 12 20 21
90 22 15 01 26 15 07 50 09 57 07 f
A0 f 80 18 71 1C 16 20 58 2C 25 00 72 8A 42 00
B0 00 9E 01 1D 00 80 51 DO 0C 20 40 80 35 00 72 8A
C0 42 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00
D0 7E 8A 42 00 00 18 02 3A 80 18 71 38 2D 40 58 2C
E0 45 00 7E 8A 42 00 00 1E 01 1D 80 D0 72 1C 16 20
F0 10 2C 25 80 7E 8A 42 00 00 9E 00 00 00 00 00 F9
CMD LENGTH ADH ADL DATA_1 . . . Data_n CS DELAY
No. Adjust mode CMD(hex) LENGTH(hex) Description
1 EEPROM WRITE A0h 84h+n n-bytes Write (n = 1~16)

* Manual Download (Model Name and Serial Number)
If the TV set is downloaded by OTA or Service man, Sometimes
model name or serial number is initialized.(Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the ‘instart’ key of ADJ remote controller.
2) Go to the menu ‘5.Model Number D/L’ like below photo.
3) Input the Factory model name(ex 42LH4000-ZA) or Serial
number like photo.
4) Check the model name Instart menu -> Factory name
displayed (ex 42LH4000-ZA)
5) Check the Diagnostics (DTV country only) -> Buyer model
displayed (ex 42LH4000)
- 13 - LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

- 14 - LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
BLOCK DIAGRAM
DDR2 SDRAM
(1G)
IC300
NAND Flash
IC102
USB
Digital amp
(NTP3100-L)
IC700
I2S
Host Address[0:7]
DDR2 Data[0:15]
DDR2 SDRAM
(512MB)
IC301
DDR2 Data[0:15]
DDR2 Address[0:12]
IC100
(LGE3369A)
HDMI1
DDR2 Address[0:12]
FRC
(LGE7329A)
IC901
DDR2 (512MB * 2)
IC1000/1001
L/R
SERIAL FLASH
IC103
IR (light logo)
DP, DM
OLED Panel
4Ch LVDS (10 bit)
EEPROM
(IC104)
EEPROM
(HDCP)IC400
I2C
Touch Key
RS-232C
MAX3232CDR
IC701
XC5000
IC600
DRXK
(IC601)
FE_TS_ Data
Tuner_SDA I2C
Tuner_SCL I2C
V_MAIN, SIF
IF_AGC I2S
LNA
IC1002

- 15 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.
Only for training and service purposes
900
800
700
600
500
400
300
A2
LV1
200
100
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PCM_A[0]
PCM_A[1]
PCM_A[2]
PCM_A[3]
PCM_A[4]
PCM_A[5]
PCM_A[6]
PCM_A[7]
PCM_A[7]
PCM_A[6]
PCM_A[5]
PCM_A[4]
PCM_A[0]
PCM_A[1]
PCM_A[3]
PCM_A[2]
PCM_A[10]
PCM_A[11]
PCM_D[5]
PCM_D[6]
PCM_D[7]
EEPROM_SDA
USB_DM
USB_DP
FE_TUNER_SDA
IC102
HY27US08121B-TPCB
26 NC_17
27 NC_18
28 NC_19
29 I/O0
30 I/O1
31 I/O2
32 I/O3
33 NC_20
34 NC_21
35 NC_22
36 VSS_2
37 VCC_2
38 PRE
39 NC_23
40 NC_24
41 I/O4
42 I/O5
43 I/O6
44 I/O7
45 NC_25
46 NC_26
47 NC_27
48 NC_28
17
ALE
3
NC_3
6
NC_6
16
CLE
15
NC_10
14
NC_9
13
VSS_1
12
VCC_1
11
NC_8
10
NC_7
9
CE
8
RE
7
R/B
4
NC_4
5
NC_5
25 NC_16 24
NC_15
23
NC_14
2
NC_2
22
NC_13
21
NC_12
1
NC_1
20
NC_11
19
WP
18
WE
Q101
KRC103S
E
B
C
+3.3V
PCM_A[0-7,10-11]
+3.3V +3.3V
SPI_DI
/PF_CE0
SPI_CS
+3.3V
Q100
KRC103S E
B
C
+3.3V
+3.3V
S6_Reset
001:H28
FE_TUNER_SCL
SDA0
SCL0
EEPROM_SCL
Flash_WP_1
R178 22
R179 22
R134
0
R102 0
R38 15K
OPT
R37
15K
OPT
EEPROM_SDA
R33
1M
AR100
22
AR101
22
/PF_CE0
/PF_CE1
/PF_OE
/PF_WE
PF_WP
PF_ALE
/F_RB
AR103
22
AR102
22
/F_RB
/PF_OE
/PF_WE
/PF_CE1
PF_ALE
PF_WP
PCM_A[0-7]
SPI_CS
SPI_CK
SPI_CK
SPI_DO
+3.3V_ST
SW101
SWITCH
OPT
12
4 3
R101 0
OPT
SPI_DO
SPI_DI
PCM_D[5-7]
/PCM_OE
/PCM_CE
MEMC_SDA
MEMC_SCL
FE_DEMOD_SDA
SCL0
FE_DEMOD_SCL SDA0
IR R199 0
POWER_ON
+3.3V_ST
R35 100
PANEL_POWER_ON
LOGIC_POWER_ON
SB_MUTE
R23 100 Flash_WP_1
R187 100
NTP_MUTE
AMP_RST
R26100
OPT
R11 100
KEY2
KEY1
USB_OCD
R12 100 USB_CTL
PWM1
PWM0
+3.3V
PWM1
PWM0
DBG_RX
+3.3V
C101
0.1uF
C103 0.1uF
C104
0.1uF
C100
0.1uF
R18 0
R192 33
R195 33
R189 33
R196 33
R190 33
R197 33
R191 33
R198 33
R45 100
R13100
OPT
R41 100
R29 100
R156 1K
OPT
R161 1K
R128 1K
OPT
R113
1K
OPT
R162 1K
R157 1K
OPT
R108 10K
R107
10K
R34
10K
R129 3.9K
R14 33
R15 33
R16 33
R115
33
R117 4.7K
+3.3V
SDA1
EEPROM_SCL
EEPROM_SDA
R153 4.7K
R152 4.7K
EEPROM_SCL
R123 1K
R127 1K
SCL1
L100
BLM18PG121SN1D
IC101
MX25L3205DM2I-12G
3
WP#
2
SO
4
GND
1
CS#
5SI
6SCLK
7HOLD#
8VCC
R103
0
X12
12MHz
DBG_RX
DBG_TX
R180 22
R185 22
POWER_DET
+3.3V_ST
POWER_DET
R44 100
OPT
L101
DBG_TX
R176 0
MEMC_RESET
TUNER_RESET
FE_RESET
R270
+3.3V
R167
1K
R168
OPT R169
OPT
R171
OPT
R170
OPT
R173
OPT
R174
OPT
C102
10uF 6.3V
R165
OPT
R166
OPT
R21 100
C12
20pF
C13
20pF
R175 0
+24V
R132
OPT
R131
10K
R100
10K
OPT
+3.3V_ST
Q104
2SC3052
E
B
C
+3.3V_ST
R159
10K
S6_Reset
R158
100
R155
10K
R164 100
C105
4.7uF
10V C106
10uF
6.3V
R146
0
R136
5.1K
1/10W
5%
R133
OPT
R188 0
R10 0
BUF_TS_SYN
+5V_GENERAL
R194 10K
R193 10K POWER_DET
R42 100
R110
10K
OPT /PCM_CE
R114
1K
PCM_A[10]
/PCM_OE
PCM_D[6]
R120 0
OPT
PCM_A[11]
R122 0
R125 0
+3.3V
R121 0
OPT
R106
10K
R118 0
PCM_D[7]
PCM_D[5]
R124 0
R119 0
R111
10K
IC105
MAX810RTR
1
GND
3
VCC 2RESET
IC103
NCP803SN293
1
GND
3VCC 2
RESET
IC100
LGE3369A (SATURN6 NON RM)
HWRESET
D4
PCMD0/CI_D0
AC16
PCMD1/CI_D1
AA15
PCMD2/CI_D2
AA16
PCMD3/CI_D3
AC6
PCMD4/CI_D4
Y10
PCMD5/CI_D5
Y11
PCMD6/CI_D6
Y12
PCMD7/CI_D7
Y13
PCM_A0/CI_A0
AB16
PCM_A1/CI_A1
AC15
PCM_A2/CI_A2
AC14
PCM_A3/CI_A3
AB14
PCM_A4/CI_A4
AC12
PCM_A5/CI_A5
AB8
PCM_A6/CI_A6
AC13
PCM_A7/CI_A7
AA9
PCM_A8/CI_A8
AB5
PCM_A9/CI_A9
AA4
PCM_A10/CI_A10
V4
PCM_A11/CI_A11
Y4
PCM_A12/CI_A12
AB9
PCM_A13/CI_A13
AA7
PCM_A14/CI_A14
AD6
PCM_RST/CI_RST
AA14
PCM_CD/CI_CD
AB18
/PCM_OE
Y5
PCM_REG/CI_CLK
AB15
PCM_WAIT/CI_WACK
AA10
/PCM_IRQA
AC8
/PCM_WE
AC7
PCM_IOWR/CI_WR
AA5
PCM_IOR/CI_RD
W4
/PCM_CE
T4
/PF_CE0
AE6
/PF_CE1
AF6
/PF_OE
AA12
/PF_WE
AA11
PF_ALE
AC9
PF_AD15
Y14
F_RBZ
AB11
UART2_TX/SCKM
F8
UART2_RX/SDAM
D11
DDCR_DA
AB21
DDCR_CK
AC21
DDCA_CLK
J1
DDCA_DA
J2
UART_RX2
W5
UART_TX2
V5
PWM0
AB13
PWM1
AB12
PWM2
AD12
PWM3
AA13
SAR0
A4
SAR1
B4
SAR2
F4
SAR3
E4
IRIN
C4
GPIO44
AC11
GPIO96
D9
GPIO88
D10
GPIO90/I2S_OUT_MUTE
D7
GPIO91
E11
GPIO97
E8
GPIO98
E10
GPIO99
D6
GPIO103/I2S_OUT_SD3
D5
GPIO102
C5
XIN B3
XOUT A3
TESTPIN/GND E6
SPI_DI AE11
SPI_DO AF12
/SPI_CS AE12
SPI_CK AD11
USB_DP_1 B5
USB_DM_1 A5
USB_DM_2 AC10
USB_DP_2 AB10
GPIO_PM0/GPIO134 E5
GPIO_PM1/GPIO135 F5
GPIO_PM2/GPIO136 G5
GPIO_PM3/GPIO137 H5
GPIO_PM4/GPIO138 F6
GPIO_PM5/INT1/GPIO139 G6
GPIO_PM6/INT2/GPIO140 H6
GPIO131/LDE/SPI_WPn1 AC17
GPIO130/LCK AB17
GPIO132/LHSYNC/SPI_WPn AF11
GPIO60/PCM2_RESET/RX1 AA18
GPIO62/PCM2_CD_N/TX1 AA17
LHSYNC2/I2S_OUT_MUTE/RX1 E7
LVSYNC/GPIO133 AC18
GPIO79/LVSYNC2/TX1 C6
UART2_RX/GPIO84 F9
UART2_TX/GPIO85 F10
UART1_RX/GPIO86 A6
UART1_TX/GPIO87 B6
GPIO42/PCM2_CE_N AF5
GPIO43/PCM2_IRQA_N AF10
TS0_D0 AA8
TS0_D1 Y8
TS0_D2 Y9
TS0_D3 AB7
TS0_D4 AA6
TS0_D5 AB6
TS0_D6 U4
TS0_D7 AC5
TS0_SYNC AC4
TS0_VLD AD5
TS0_CLK AB4
TS1_D0 AB19
TS1_SYNC AA20
TS1_VLD AC19
TS1_CLK AA19
ET_TXD0 C10
ET_TXD1 B11
ET_TX_CLK A9
ET_RXD0 C11
ET_RXD1 C9
ET_TX_EN B10
ET_MDC A10
ET_MDIO B9
ET_COL A11
GPIO67 A7
GPIO68 B8
R177 0
OPT
R172
4.7K
PANEL_RESET
R39
1K
Soft_Reset
EEPROM_WP 4:S5
R145
22
R148
22
C107
8pF
50V
C108
8pF
50V
+3.3V +3.3V
R142 2.7K R143 2.7K
C109
0.1uF
16V
R144 2.7K
R147 2.7K
R46 100
R138 33
R139 33
R140 33
R141 33
R181 33
R182 33
R183 33
R184 33
R31 33
R30 33
R24 33
R25 33
R99
10K
LOGO_LED
Touch_Test
BUF_TS_DATA[0]
BUF_TS_VAL_ERR
BUF_TS_CLK
R47
0
+3.3V
R43 3.3K
OPT
Q12
2SC3052
OPT
E
B
C
ISP_RXD_SOC
ISP_TXD_SOC
ISP_RXD_SOC
ISP_TXD_SOC
+5V_GENERAL
R160
OPT
R163
OPT
R48 100
LNA_SWITCH_SEL
SCL
SDA
R135
30K
1%
R32
3.3K
IC104
M24512-WMW6G(REV.B)
3
E2
2
E1
4
VSS
1
E0
5SDA
6SCL
7WC
8VCC
+3.3V
R1026
4.7K
EEPROM
USB
Serial FLASH MEMORY
for BOOT
I2C
NAND FLASH MEMORY
10 : BOOT 51
11 : BOOT RISC
MCU BOOT STRAP
1 9
FLASH/GPIO
OLED
/PF_CE0
H : Serial Flash
L : NAND Flash
/PF_CE1
H : 16 bit
L : 8 bit
PM GPIO Assignment Recommended by MStar
5V Tolerance
Interrupt for ISP Wake up in STB Mode
09.08.31
POWER DETECT
Stand-by GPIO(SAR[0-3])
D6 D7 E11 B9
I2C for Tuner_5V
JTEG
MAX810 : CMOS
NCP810 : Open Drain
/RST
JTCK
JTMS
JTDO
JTINT
JTDI
/JTRST NO LED NORMAL (L)
MODEL_OPT_3 (B9) : FHD (H) / HD (L)
MODEL_OPT_0 (D6) : LCD (H) / PDP (L)
MODEL_OPT_1 (D7) : FRC (H) / NO FRC (L)
MODEL_OPT_2 (E11) : LED NORMAL (H)
PULL UP is applied on the FRC
PULL UP is applied on the JACK
ISP FOR BOOT
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MSD3368GV
FE_VMAIN R212 100
R207 100
D200
ENKMC2838-T112
A1
C
A2 NTP_MUTE
SB_MUTE
AMP_MUTE
007:Y15
R216 390
1%
Check
C214 1uF
FE_SIF 004:C13
R230 47
MS_LRCK 007:K16
MS_LRCH 007:K17
AUDIO_MASTER_CLK 007:K22
MS_SCK 007:K16
R223 22
R224 22
R225 22
R226 22
+3.3V
CEC_REMOTE
MEMC_RXE0+ 002:Z22;009:S28
MEMC_RXE0- 002:Z22;009:S28
MEMC_RXE1+ 002:Z23;009:R28
MEMC_RXE1- 002:Z22;009:R28
MEMC_RXE2+ 002:Z23;009:R28
MEMC_RXE2- 002:Z23;009:R28
MEMC_RXE3- 002:Z25;009:Q28
MEMC_RXE4- 002:Z25;009:Q28
MEMC_RXE3+ 002:Z25;009:Q28
MEMC_RXE4+ 002:Z26;009:Q28
MEMC_RXEC- 002:Z24;009:R28
MEMC_RXEC+ 002:Z24;009:Q28
MEMC_RXO1- 002:Z18;009:U28
MEMC_RXO0+ 002:Z17;009:U28
MEMC_RXO2- 002:Z18;009:U28
MEMC_RXO0- 002:Z17;009:V28
MEMC_RXO3- 002:Z20;009:T28
MEMC_RXO1+ 002:Z18;009:U28
MEMC_RXO4- 002:Z21;009:T28
MEMC_RXOC+ 002:Z19;009:T28
MEMC_RXO3+ 002:Z20;009:T28
MEMC_RXO2+ 002:Z18;009:U28
MEMC_RXO4+ 002:Z21;009:S28
MEMC_RXOC- 002:Z19;009:T28
R231 47
+3.3V
L202
BLM18PG121SN1D
+1.8V_DDR
+3.3V
L201
BLM18PG121SN1D
+3.3V_AVDD
L200
BLM18PG121SN1D
L203
BLM18PG121SN1D
+3.3V
L204
BLM18PG121SN1D
L206
BLM18PG121SN1D
+3.3V
+3.3V
L205
BLM18PG121SN1D
+3.3V_VDDP +3.3V
+1.8V_DDR
+3.3V_AVDD_MPLL
+1.26V_VDDC
+1.26V_VDDC
+3.3V_VDDP
R204 100
R208 47
R209 47
R210 47
R211 47
C207 0.047uF
C206 0.047uF
C202 0.047uF
OPT
C200 0.047uF
OPT
C203 0.047uF
C201 0.047uF
OPT C222 0.1uF
C223 0.1uF
C211 0.1uF
C213 0.1uF
C208 0.047uFR213 47
C209 0.047uFR214 47
R221 100
OPT
R222 100
OPT
C60
0.1uF
C227
0.1uF
C54
0.1uF
C280
0.1uF C62 0.1uF
C292
0.1uF
C257
0.1uF
C254
0.1uF
C283
0.1uF
C56
0.1uF
C226
0.1uF
C268
0.1uF
C52
0.1uF
C270
0.1uF C276 0.1uF
C249
0.1uF
C225
0.1uF
C267
0.1uF
C252
0.1uF
C288
0.1uF
C242
0.1uF
C53
0.1uF
C55
0.1uF
C284
0.1uF
C286
0.1uF
C50
0.1uF
C264
0.1uF
C278
0.1uF C291 0.1uF C295 0.1uF
C289
0.1uF
C297
0.1uF
C261
0.1uF
C244
0.1uF C248 0.1uF
C299
0.1uF
C238
0.1uF
C298
0.1uF
C282
0.1uF
C246
0.1uF
C251
0.1uF C271 0.1uF
C279
0.1uF
C263
0.1uF
C277
0.1uF
C260
0.1uF
C258
0.1uF
C296
0.1uF
C287
0.1uF
C290
0.1uF
C210 0.1uF
C255
0.1uF C273 0.1uF
C51
0.1uF
C294
0.1uF
C293
0.1uF
C212 10uF 10V
C237
22pF
OPT
C229
22pF
OPT
C232
22pF
OPT
C231
22pF
OPT
C285
10uF
10V
C61
0.1uF
C266
0.1uF
C240
0.1uF C274 10uF
R227
100 OPT
C265
0.1uF
C250
0.1uF
C243
0.1uF
+1.26V_VDDC
C239
0.1uF C253 0.1uF C259 0.1uF
C247
0.1uF C262 0.1uF
C256
0.1uF
C235
0.1uF
16V
C272
0.1uF
C269
0.1uF C275 10uF
C215 4.7uF
R215
10K
+3.3V_ST
R234 22K
OPT
C245 0.01uF
OPT
C241 0.01uF
OPT
R235 22K
OPT
C281
2.2uF
10V
LGE3369A (SATURN6 NON RM)
IC100
RXACKP
F1
RXACKN
F2
RXA0P
G2
RXA0N
G3
RXA1P
H3
RXA1N
G1
RXA2P
H1
RXA2N
H2
DDCD_A_DA
A1
DDCD_A_CK
B2
HOTPLUG_A
A2
RXBCKP
C3
RXBCKN
B1
RXB0P
C1
RXB0N
C2
RXB1P
D2
RXB1N
D3
RXB2P
E3
RXB2N
D1
DDCD_B_DA
E1
DDCD_B_CK
F3
HOTPLUG_B
E2
RXCCKP
AE8
RXCCKN
AD8
RXC0P
AD9
RXC0N
AF8
RXC1P
AF9
RXC1N
AE9
RXC2P
AE10
RXC2N
AD10
DDCD_C_DA
AE7
DDCD_C_CK
AF7
HOTPLUG_C
AD7
CEC
J3
HSYNC0/SC1_ID
N2
VSYNC0/SC1_FB
N1
RIN0P/SC1_R
P2
GIN0P/SC1_G
R3
BIN0P/SC1_B
R1
SOGIN0/SC1_CVBS
P3
RINM
P1
BINM
T3
GINM
R2
HSYNC1/DSUB_HSYNC
K3
VSYNC1/DSUB_VSYNC
K2
RIN1P/DSUB_R
L1
GIN1P/DSUB_G
L3
BIN1P/DSUB_B
K1
SOGIN1
L2
RIN2P/COMP_PR+
V1
GIN2P/COMP_Y+
V2
BIN2P/COMP_PB+
U1
SOGIN2
V3
VSYNC2
J5
CVBS1/SC1_CVBS
U3
CVBS2/SC2_CVBS
U2
CVBS3/SIDE_CVBS
T1
VCOM1
T2
CVBS4/S-VIDEO_Y
M1
CVBS6/S-VIDEO_C
M2
CVBS5
N3
CVBS7
M3
CVBS0/RF_CVBS
W1
VCOM0
Y3
CVBSOUT0/SC2_MNTOUT
Y2
CVBSOUT1
AA2
LVA0P AE16
LVA0M AD16
LVA1P AD15
LVA1M AF16
LVA2P AF15
LVA2M AE15
LVA3P AD13
LVA3M AF14
LVA4P AF13
LVA4M AE13
LVACKP AE14
LVACKM AD14
LVB0P AE20
LVB0M AD20
LVB1P AD19
LVB1M AF20
LVB2P AF19
LVB2M AE19
LVB3P AD17
LVB3M AF18
LVB4P AF17
LVB4M AE17
LVBCKP AE18
LVBCKM AD18
AUR0 AA3
AUL0 Y1
AUR1 AE1
AUL1 AF3
AUR2 AE3
AUL2 AE2
AUR3 AA1
AUL3 AB1
AUR4 AB2
AUL4 AC2
AUR5 AB3
AUL5 AC3
SIF0P W3
SIF0M W2
SPDIF_IN F11
SPDIF_OUT E9
AUOUTR0/HP_ROUT AF1
AUOUTL0/HP_LOUT AF2
AUOUTR1/SC1_ROUT AD3
AUOUTL1/SC1_LOUT AD1
AUOUTR2/SC2_ROUT AC1
AUOUTL2/SC2_LOUT AD2
I2S_OUT_MCK A8
I2S_OUT_WS B7
I2S_OUT_BCK C7
I2S_OUT_SD D8
I2S_IN_SD C8
VCLAMP K4
REFP H4
REFM J4
REXT G4
AUCOM AE5
AUVRM AE4
AUVRP AF4
AUVAG AD4
IC100
LGE3369A (SATURN6 NON RM)
VDDC_1 D16
VDDC_2 D17
VDDC_3 D18
VDDC_4 D19
VDDC_5 D20
VDDC_6 H18
VDDC_7 H19
VDDC_8 H20
VDDC_9 J20
VDDC_10 K20
VDDC_11 L20
VDDC_12 M20
VDDC_13 P7
VDDC_14 R7
VDDC_15 T7
VDDC_16 T22
VDDC_17 U7
VDDC_18 U20
VDDC_19 U22
VDDC_20 V7
VDDC_21 V22
VDDC_22 W11
VDDC_23 W12
VDDC_24 W19
VDDC_25 W20
VDDC_26 W22
VDDC_27 Y22
VDDP_1 H9
VDDP_2 H10
VDDP_3 H11
VDDP_4 H12
VDDP_5 N20
VDDP_6 P20
VDDP_7 W9
VDDP_8 W10
AVDD_AU W7
AVDD_DDR_1 G12
AVDD_DDR_2 G13
AVDD_DDR_3 H13
AVDD_DDR_4 H14
AVDD_DDR_5 H15
AVDD_DDR_6 H16
AVDD_DDR_7 W14
AVDD_DDR_8 W15
AVDD_DDR_9 W16
AVDD_DDR_10 W17
AVDD_DDR_11 W18
AVDD_MEMPLL_1 H17
AVDD_MEMPLL_2 T20
AVDD_MEMPLL_3 V20
AVDD_LPLL R20
AVDD_MPLL H7
AVDD_33_1 J7
AVDD_33_2 K7
AVDD_33_3 L7
AVDD_33_4 M7
AVDD_33_5 N7
AVDD_DM W8
AVDD_USB H8
GND_2
E16
GND_3
E17
GND_4
E18
GND_5
F7
GND_6
L9
GND_7
L10
GND_8
L11
GND_9
L12
GND_10
L13
GND_11
L14
GND_12
L15
GND_13
L16
GND_14
L17
GND_15
L18
GND_16
M9
GND_17
M10
GND_18
M11
GND_19
M12
GND_20
M13
GND_21
M14
GND_22
M15
GND_23
M16
GND_24
M17
GND_25
M18
GND_26
N4
GND_27
N9
GND_28
N10
GND_29
N11
GND_30
N12
GND_31
N13
GND_32
N14
GND_33
N15
GND_34
N16
GND_35
N17
GND_36
N18
GND_37
P4
GND_38
P9
GND_39
P10
GND_40
P11
GND_41
P12
GND_42
P13
GND_43
P14
GND_44
P15
GND_45
P16
GND_46
P17
GND_47
P18
GND_48
R4
GND_49
R9
GND_50
R10
GND_51
R11
GND_52
R12
GND_53
R13
GND_54
R14
GND_55
R15
GND_56
R16
GND_57
R17
GND_58
R18
GND_59
T5
GND_60
T9
GND_61
T10
GND_62
T11
GND_63
T12
GND_64
T13
GND_65
T14
GND_66
T15
GND_67
T16
GND_68
T17
GND_69
T18
GND_70
U5
GND_71
W13
GND_72
Y21
GND_73
AA23
CK+_HDMI1
D1-_HDMI1
CK-_HDMI1
R201 0
D0-_HDMI1
HDMI_SCL_1
D1+_HDMI1
R203 100
D0+_HDMI1
R200 0
HDMI_SDA_1
D2-_HDMI1
D2+_HDMI1
HPD1
5V_HDMI_1
SDA2
SCL2
R942 0
R943 0
R944
0
OPT
R945
0
OPT
R1027
4.7K
R1028
4.7K
+3.3V
2 9
AVIN/LVDS/PWR
OLED
Audio Mute
Close to IC
as close as possible
HDMI
TV/MNT
VDDC : 970mA
VDDP : 102.3mA
AVDD_AU : 36.11mA
AVDD_DDR : 18.31mA
AVDD_MEMPLL : 23.77mA
AVDD_LPLL : 4.69mA
AVDD_MPLL : 7.76mA
AVDD_33 : 281mA
AVDD_DM : 0.03mA
AVDD_OTG : 22.96mA
09.08.31
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR
TDDR_D[0-15]
ADDR2_D[0-15]
ADDR2_CKE
TDDR_A[7]
TDDR_D[3]
BDDR2_D[2]
ADDR2_D[6]
SDDR_A[11]
ADDR2_A[5]
SDDR_D[0]
BDDR2_DQS0_P
BDDR2_D[2]
/BDDR2_WE
SDDR_CKE
TDDR_A[9]
TDDR_D[8]
BDDR2_D[1]
ADDR2_D[1]
SDDR_A[6]
ADDR2_A[2]
SDDR_D[2]
BDDR2_DQS0_N
TDDR_D[13]
BDDR2_D[0]
/BDDR2_CAS
/ADDR2_MCLK
TDDR_A[8]
TDDR_D[1]
BDDR2_D[0]
ADDR2_D[3]
SDDR_A[4]
ADDR2_A[3]
TDDR_BA[2]
SDDR_D[5]
BDDR2_ODT
TDDR_D[5]BDDR2_D[5]
/BDDR2_RAS
ADDR2_BA[2]
TDDR_A[0]
TDDR_D[9]
ADDR2_D[4]
SDDR_A[2]
ADDR2_A[1]
SDDR_D[13]
BDDR2_DQS1_P
TDDR_D[2]
BDDR2_D[7]
BDDR2_CKE
SDDR_BA[1]
TDDR_D[4]
TDDR_A[10]
ADDR2_D[12]
SDDR_A[0]
ADDR2_A[0]
SDDR_D[0]
BDDR2_DQM0_P
TDDR_D[0]
BDDR2_D[6]
BDDR2_A[8]
SDDR_BA[0]
TDDR_A[2]
TDDR_D[7]
ADDR2_D[11]
SDDR_A[7]
SDDR_D[7]
BDDR2_D[1]
BDDR2_A[11]
TDDR_D[4]
TDDR_A[6]
TDDR_D[3]
BDDR2_A[0-12]
ADDR2_D[13]
SDDR_A[12]
ADDR2_DQS1_N
SDDR_D[9]
BDDR2_D[3]
BDDR2_A[6]
SDDR_ODT
TDDR_D[14]
TDDR_A[12]
TDDR_D[11]
ADDR2_MCLK
ADDR2_D[11]
SDDR_A[10]
ADDR2_DQS0_N
SDDR_D[6]
BDDR2_D[4]
BDDR2_A[4]
TDDR_D[15]
TDDR_A[5]
TDDR_D[5]
ADDR2_BA[1]
ADDR2_D[15]
SDDR_A[1]
ADDR2_DQM0_P
SDDR_D[15] BDDR2_D[15]
BDDR2_A[2]
TDDR_D[6]
TDDR_A[11]
TDDR_D[1]
ADDR2_BA[0]
ADDR2_D[10]
SDDR_A[8]
ADDR2_DQM1_P
SDDR_D[14]
BDDR2_D[8]
BDDR2_A[0]
TDDR_D[9]
TDDR_A[3] TDDR_D[6]
ADDR2_A[8]
ADDR2_D[14]
TDDR_A[7]
SDDR_A[7]
BDDR2_D[0-15]
ADDR2_DQS0_P
SDDR_D[4]
BDDR2_D[10]
BDDR2_A[12] TDDR_D[7]
TDDR_A[4]
TDDR_D[2]
ADDR2_A[11]
ADDR2_D[8]
TDDR_CKE
BDDR2_A[7]
SDDR_A[6]
ADDR2_A[0-12]
ADDR2_DQS1_P
SDDR_D[2]
BDDR2_D[13]
BDDR2_A[5]
TDDR_D[0]
TDDR_A[1]
ADDR2_A[6]
ADDR2_D[9]
ADDR2_A[5]
SDDR_A[5]
/ADDR2_WE
SDDR_D[6]
BDDR2_D[9]
BDDR2_A[10]
ADDR2_A[4]
ADDR2_D[12]
SDDR_A[5]
SDDR_A[4]
/ADDR2_CAS
SDDR_D[1]
BDDR2_D[14]
BDDR2_A[1]
ADDR2_A[2]
ADDR2_D[7]
SDDR_A[9]
SDDR_A[3]
ADDR2_ODT
SDDR_D[5]
BDDR2_D[12]
BDDR2_A[3]
ADDR2_A[0]
ADDR2_D[6]
/TDDR_WE
SDDR_A[2]
/ADDR2_RAS
SDDR_D[3]
BDDR2_D[11]
BDDR2_A[9]
ADDR2_A[7]
ADDR2_D[4]
TDDR_DQM0_P
SDDR_A[1]
SDDR_DQS0_N
SDDR_D[4]
BDDR2_D[13]
BDDR2_A[12]
ADDR2_A[12]
ADDR2_D[5]
TDDR_DQS1_N
SDDR_A[0]
SDDR_DQS1_N
SDDR_D[9]
BDDR2_D[9]
BDDR2_A[11]
ADDR2_A[9]
ADDR2_D[2]
TDDR_DQS0_N
SDDR_A[9]
SDDR_A[0-12]
SDDR_DQM0_P
SDDR_D[1]
BDDR2_D[11]
SDDR_D[0-15]
BDDR2_A[10]
TDDR_A[0-12]
ADDR2_A[10]
ADDR2_D[3]
TDDR_DQM1_P
SDDR_A[10]
SDDR_A[3]
SDDR_DQM1_P
SDDR_D[8]
BDDR2_D[15]
ADDR2_D[0]
BDDR2_A[9]
TDDR_A[1]
ADDR2_A[1]
ADDR2_D[1]
TDDR_DQS1_P
SDDR_A[11]
SDDR_DQS0_P
SDDR_D[3]
TDDR_D[12]
BDDR2_D[14]
ADDR2_D[2]
BDDR2_A[8] TDDR_A[8]
ADDR2_A[3]
ADDR2_D[0]
TDDR_DQS0_P
SDDR_A[12]
/BDDR2_MCLK
SDDR_DQS1_P
SDDR_D[8]
TDDR_D[13]
BDDR2_D[12]
ADDR2_D[7]
BDDR2_A[7]
TDDR_A[5]
ADDR2_A[12]
/TDDR_CAS
BDDR2_BA[1]
/SDDR_WE
TDDR_D[14]
SDDR_D[10]
BDDR2_D[8]
ADDR2_D[5]
BDDR2_A[6]
TDDR_A[2]
ADDR2_A[11]
/TDDR_RAS
BDDR2_BA[0]
/SDDR_CAS
SDDR_D[12]
TDDR_D[10]
BDDR2_D[10]
ADDR2_D[8]
BDDR2_A[5]
TDDR_A[12]
ADDR2_A[10]
SDDR_D[11]
TDDR_BA[0]
/SDDR_RAS
SDDR_D[11]
TDDR_D[15]
BDDR2_D[5]
ADDR2_D[10]
BDDR2_A[4]
TDDR_A[10]
ADDR2_A[8]
SDDR_D[7]
TDDR_BA[1]
SDDR_D[10]
TDDR_D[11]
BDDR2_D[7]
ADDR2_D[13]
BDDR2_A[3]
TDDR_A[3]
ADDR2_A[9]
SDDR_D[15]
BDDR2_BA[2]
TDDR_A[9]
TDDR_D[12]
SDDR_CK
BDDR2_D[4]
ADDR2_D[15]
BDDR2_A[2]
TDDR_A[11]
ADDR2_A[4]
SDDR_D[14]
BDDR2_DQM1_P
TDDR_A[6]
TDDR_D[10]
BDDR2_D[6]
ADDR2_D[14]
BDDR2_A[1]
TDDR_A[4]
ADDR2_A[6]
SDDR_D[13]
BDDR2_DQS1_N
TDDR_MCLK
/SDDR_CK
TDDR_A[0]
TDDR_D[8]
BDDR2_D[3]
ADDR2_D[9]
BDDR2_A[0]
SDDR_A[8]
ADDR2_A[7]
SDDR_D[12]
BDDR2_MCLK
SDDR_BA[2]
+1.8V_DDR
C327 10uF
C312
10uF
C336
0.1uF
C337
0.1uF
C334
0.1uF
C335
0.1uF
C333
0.1uF
C338
0.1uF
C321
0.1uF
C308
0.1uF
C304
0.1uF
C330
0.1uF
C323
0.1uF
C309
0.1uF
C316
0.1uF
C311
0.1uF
C310
0.1uF
C329
0.1uF
C326
0.1uF
C325
0.1uF
C320
0.1uF
C328
0.1uF
C314
0.1uF
C306
0.1uF
C313
0.1uF
C315
0.1uF
C307
0.1uF
C331
0.1uF
C300
0.1uF
C302
0.1uF
C324
0.1uF
C318
0.1uF
C332
0.1uF
C322
10uF
C301 10uF
C341
0.1uF
R31256
R326 56
+1.8V_DDR
R303 OPT
R305 1K 1%
R340 56
C317 0.1uF
+1.8V_DDR
AR305
56
R330 OPT
R30656
AR306
56
R32056
R344 1K 1%
R336 56
R338 56
C340
1000pF
IC100
LGE3369A (SATURN6 NON RM)
B_DDR2_A0 T26
B_DDR2_A1 AF26
B_DDR2_A2 T25
B_DDR2_A3 AF23
B_DDR2_A4 T24
B_DDR2_A5 AE23
B_DDR2_A6 R26
B_DDR2_A7 AD22
B_DDR2_A8 R25
B_DDR2_A9 AC22
B_DDR2_A10 AD23
B_DDR2_A11 R24
B_DDR2_A12 AE22
B_DDR2_BA0 AC23
B_DDR2_BA1 AC24
B_DDR2_BA2 AB22
B_DDR2_MCLK V25
/B_DDR2_MCLK V24
B_DDR2_CKE AB23
B_DDR2_ODT U26
/B_DDR2_RAS U25
/B_DDR2_CAS U24
/B_DDR2_WE AB24
B_DDR2_DQS0 AB26
B_DDR2_DQS1 AA26
B_DDR2_DQM0 AC25
B_DDR2_DQM1 AC26
B_DDR2_DQSB0 AB25
B_DDR2_DQSB1 AA25
B_DDR2_DQ0 W25
B_DDR2_DQ1 AE26
B_DDR2_DQ2 W24
B_DDR2_DQ3 AF24
B_DDR2_DQ4 AF25
B_DDR2_DQ5 V26
B_DDR2_DQ6 AE25
B_DDR2_DQ7 W26
B_DDR2_DQ8 Y26
B_DDR2_DQ9 AD25
B_DDR2_DQ10 Y25
B_DDR2_DQ11 AE24
B_DDR2_DQ12 AD26
B_DDR2_DQ13 Y24
B_DDR2_DQ14 AD24
B_DDR2_DQ15 AA24
A_MVREF
D15
A_DDR2_A0
C13
A_DDR2_A1
A22
A_DDR2_A2
B13
A_DDR2_A3
C22
A_DDR2_A4
A13
A_DDR2_A5
A23
A_DDR2_A6
C12
A_DDR2_A7
B23
A_DDR2_A8
B12
A_DDR2_A9
C23
A_DDR2_A10
B22
A_DDR2_A11
A12
A_DDR2_A12
A24
A_DDR2_BA0
C24
A_DDR2_BA1
B24
A_DDR2_BA2
D24
A_DDR2_MCLK
B14
/A_DDR2_MCLK
A14
A_DDR2_CKE
D23
A_DDR2_ODT
D14
/A_DDR2_RAS
D13
/A_DDR2_CAS
D12
/A_DDR2_WE
D22
A_DDR2_DQS0
B18
A_DDR2_DQS1
C17
A_DDR2_DQM0
C18
A_DDR2_DQM1
A19
A_DDR2_DQSB0
A18
A_DDR2_DQSB1
B17
A_DDR2_DQ0
B15
A_DDR2_DQ1
A21
A_DDR2_DQ2
A15
A_DDR2_DQ3
B21
A_DDR2_DQ4
C21
A_DDR2_DQ5
C14
A_DDR2_DQ6
C20
A_DDR2_DQ7
C15
A_DDR2_DQ8
C16
A_DDR2_DQ9
C19
A_DDR2_DQ10
B16
A_DDR2_DQ11
B20
A_DDR2_DQ12
A20
A_DDR2_DQ13
A16
A_DDR2_DQ14
B19
A_DDR2_DQ15
A17
R337 56
+1.8V_DDR
R31956
R348 OPT
R332 22
+1.8V_DDR
AR301
56
R31856
C339
0.1uF
R302 150
OPT
R31556
R304
1K 1%
AR312
56
R329 56
R327 56
R31022
R31656
R324
1K 1%
+1.8V_DDR
R333 56
R328 56
C303 1000pF
AR310
56
R31756
R346 OPT
R345 150
OPT
R349 0
AR307
56
R31456
R32156
R308
56
+1.8V_DDR
R342 56
R30756
AR309
56
R31356
AR313
56
AR300
56
R347 1K 1%
R323 56
R322 56
C305 0.1uF
C319
1000pF
AR311
56
R301 OPT
AR302
56
R300 OPT
R339 56
AR308
56
AR303
56
R325
1K 1%
R31156
R334 56
R309
22
AR304
56
R335 56
+1.8V_DDR +1.8V_DDR
R341 56
+1.8V_DDR
R343 56
R331
22
IC300
HY5PS1G1631CFP-S6
J2 VREF
J8 CK
H2
VSSQ2
B7 UDQS
N8 A4
P8 A8
L1 BA2
L2 BA0
R8 NC3
K7 RAS
F8
VSSQ3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC5
L3 BA1
J7 VSSDL
L7 CAS
F2
VSSQ4
B3 UDM
M2 A10/AP
K2 CKE
R7 NC6
M7 A2
N7 A6
M8 A0
J1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC1
N2 A3
P2 A7
H8
VSSQ1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC2
E7
VSSQ5 D8
VSSQ6 D2
VSSQ7 A7
VSSQ8 B8
VSSQ9 B2
VSSQ10
P9
VSS1 N1
VSS2 J3
VSS3 E3
VSS4 A3
VSS5
G9
VDDQ1 G7
VDDQ2 G3
VDDQ3 G1
VDDQ4 E9
VDDQ5 C9
VDDQ6 C7
VDDQ7 C3
VDDQ8 C1
VDDQ9 A9
VDDQ10
R1
VDD1 M9
VDD2 J9
VDD3 E1
VDD4 A1
VDD5
B9
DQ15 B1
DQ14 D9
DQ13 D1
DQ12 D3
DQ11 D7
DQ10 C2
DQ9 C8
DQ8 F9
DQ7 F1
DQ6 H9
DQ5 H1
DQ4 H3
DQ3 H7
DQ2 G2
DQ1 G8
DQ0
IC301
H5PS5162FFR-S6C
J2
VREF
J8
CK
H2 VSSQ2
B7
UDQS
N8
A4
P8
A8
L1
NC4
L2
BA0
R8
NC3
K7
RAS
F8 VSSQ3
F3
LDM
P3
A9
M3
A1
N3
A5
K8
CK
R3
NC5
L3
BA1
J7
VSSDL
L7
CAS
F2 VSSQ4
B3
UDM
M2
A10/AP
K2
CKE
R7
NC6
M7
A2
N7
A6
M8
A0
J1
VDDL
K3
WE
E8
LDQS
P7
A11
K9
ODT
A2
NC1
N2
A3
P2
A7
H8 VSSQ1
F7
LDQS
A8
UDQS
R2
A12
L8
CS
E2
NC2
E7 VSSQ5
D8 VSSQ6
D2 VSSQ7
A7 VSSQ8
B8 VSSQ9
B2 VSSQ10
P9 VSS1
N1 VSS2
J3 VSS3
E3 VSS4
A3 VSS5
G9 VDDQ1
G7 VDDQ2
G3 VDDQ3
G1 VDDQ4
E9 VDDQ5
C9 VDDQ6
C7 VDDQ7
C3 VDDQ8
C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J9 VDD3
E1 VDD4
A1 VDD5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
DDR2 1.8V By CAP - Place these Caps near Memory
DDR2 3 9
PI Result
OLED 09.08.31
1G bit
512M bit
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

USB DOWN STREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
USB_DP
USB_DM
D401
5.6V
CDS3C05HDMI1 D402
5.6V
CDS3C05HDMI1
5V_HDMI_1
C401
0.1uF
16V
C403
0.1uF
EEPROM_SCL
IC400
CAT24WC08W-T
3
A2
2
A1
4
VSS
1
A0
5SDA
6SCL
7WP
8VCC
R444 22
+3.3V
R436
4.7K
EEPROM_SDA
R442
4.7K
R443 22
+5V_GENERAL 5V_HDMI_1
HDMI_SDA_1
1:E33;I9
IC402
CAT24C02WI-GT3
3A2
2A1
4VSS
1A0
5
SDA
6
SCL
7
WP
8
VCC
R454
10K
EEPROM_WP
1:AO24
HDMI_SCL_1
1:E32;I9
R453
100
D403
ENKMC2838-T112
C416
0.1uF
16V
R460
33
R459
33
P401
UAR27-4K2300
1234
5
ZD401 5.6V CDS3C05HDMI1
C404
100pF
50V
IR
9:M15
C406
1000pF
50V
+5V_ST
R405
0
C405
0.1uF
16V
R404
100
LOGO_LED
R456
10K R457 10K
L615
CB3216PA501E
C417
0.1uF
16V
C418
1000pF
50V
+3.3V_HDMI_ST
R416
0
OPT GND
D400
R426 0 D2+_HDMI1
R425 0
R423 0
R424 0
R421 0
R422 0
D2-_HDMI1
D1+_HDMI1
D1-_HDMI1
D0+_HDMI1
D0-_HDMI1
R419 0
R413 0
CK+_HDMI1
CK-_HDMI1
R412 0 HDMI_CEC
R417 0
R418 0
HDMI_SCL_1
R403
1K
R401
2K
Q401
2SC3052
E
B
CR429
10K HPD1
HDMI_SDA_1
KEY2
SCL1
+3.3V_ST
Soft_Reset
P402
12507WS-08L
1
+3.3V_ST
2
GND
3
SDA1
4
SCL1
5
KEY1
6
Soft_Reset
7
Touch_Test
8
KEY2
9
.
Touch_Test
L400
CB3216PA501E
SDA1
C407
0.1uF
16V
KEY1
C408
1000pF
50V
C409
0.1uF
R458
47
L402
MLB-201209-0120P-N2
USB_OCD
001:AI16
+3.3V_P
+5V_GENERAL
R451 180
+5V_EXT
R455
10K
IC401
MIC2009YM6-TR
3ENABLE
2GND
4
FAULT/
1VIN 6
VOUT
5
ILIMIT
R452
4.7K
C415
10uF
10V
USB_CTL
R461
0
R462
0
R463
0
OPT
IC606
74LVC541A(PW)
3
A1
2
A0
4
A2
1
OE1
6
A4
5
A3
7
A5
8
A6
9
A7
10
GND 11 Y7
12 Y6
13 Y5
14 Y4
15 Y3
16 Y2
17 Y1
18 Y0
19 OE2
20 VCC
+3.3V
FE_TS_CLK
FE_TS_VAL_ERR
FE_TS_SYNC
FE_TS_SERIAL
R661
10K
R662
10K
C966
0.1uF
16V
AR604
33
1/16W BUF_TS_CLK
9:M15
BUF_TS_VAL_ERR
9:M15
BUF_TS_SYN
9:M15
BUF_TS_DATA[0]
9:M15
R464
0
R465
4.7K
OPT
JK401
DC2R019JA3
14 CEC
13 DDC/CEC_GND
5TMDS_DATA1+
20
BODY_SHIELD
12 TMDS_CLK-
11 TMDS_CLK+
2TMDS_DATA2+
19 HOT_PLUG_DETECT
18 VDD[+5V]
10 TMDS_CLK_SHIELD
4TMDS_DATA1_SHIELD
1TMDS_DATA2_SHIELD
17 RESERVED
9TMDS_DATA0-
8TMDS_DATA0+
3TMDS_DATA2-
16 SDA
7TMDS_DATA0_SHIELD
6TMDS_DATA1-
15 SCL
JP11
JP12
JP13
JP14
JP15
JP16
JP17
JP18
JP20
JP22
JP25
JP27
Q400
SSM6N15FU
3
DRAIN2
2
GATE1
1
SOURCE1
4SOURCE2
5GATE2
6DRAIN1
CEC_REMOTE
HDMI_CEC
C413
10uF
10V
C414
0.1uF
16V
L401
MLB-201209-0120P-N2
P400
TF12-9S-0.5SH
1
2
3
4
5
6
7
8
9
10
C402
220pF
50V
R435
9.1K
R427
68K
HDMI/IR/USB 4 9
OLED
USB +5V Over Current Protection --> USB Jack
USB JACK
09.08.31
UI_HW_PORT(TYPE C)
HDCP EEPROM
[IR & LED]
HDMI EDID EEPROM(2Kbit)
For CEC
Hot plug Detect
TMDS Data2 Shield
TMDS Data2+
TMDS Data2-
TMDS Data1+
TMDS Data1-
TMDS Data1 Shield
TMDS Data0+
TMDS Data0-
TMDS Data0 Shield
TMDS Clock Shield
TMDS Clock+
TMDS Clock-
DDC/CEC GND
CEC
SCL
SDA
Reserved
+5V Power
[TOUCH CONTROL]
$0.18
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Tuner
FE_TS_CLK
FE_VMAIN
+1.8V_TU
R606
390
R640
8.2K 1%
GND
L606
LQH32MN2R2K23L
IF_AGC
+1.8V_TU
TUNER_CVBS_IF_P
004:D6
R639
15K 1%
FE_SIF
004:D6
+3.3V_P
C666
1uF
10V
TUNER_SIF_IF_N
004:D6
C628
0.1uF
16V
+3.3V_P
+5V_TUNER
C664
2.2uF
16V
+3.3V_DVDD_P
TUNER_RESET
C619
0.1uF
16V
FE_TUNER_SCL
C642
0.1uF
16V
+1.8V_TU
IC604
AP1117E18G-13
2
OUT
3
IN 1ADJ/GND
+1.8V_TU
R637
1K
OPT
Q601
ISA1530AC1
E
B
C
Q600
ISA1530AC1
E
B
C
+3.3V_TU
R608 390
C616
0.1uF
16V
C625
0.1uF
16V
L600
0603CS-R27XGLW
270nH
C644 18pF
50V
C631
0.1uF
16V
+3.3V_TU
C617
0.1uF
16V
C604 39pF 50V
C646
18pF
50V
C612 0.1uF 16V
TUNER_CVBS_IF_P
+5V_GENERAL
C671
100uF
16V
C615 0.1uF
16V
+3.3V_TU
C603
120pF
50V
Q602
ISA1530AC1
E
B
C
+1.8V_TU
+3.3V_TU
+5V_TUNER +1.2V_P
C633
0.1uF
16V
L602
MLF1608A2R7J
2.7uH
IF_P
+3.3V_P
C614 0.1uF 16V
+3.3V_TU
R604
390
R609 390
C613 1000pF 50V
IF_N 004:D6
C620
0.1uF
16V
IC600
XC5000
1
VDDA_1
2
IN1
3
GND_1
4
IN2
5
GND_2
6
EXTCHOKE
7
GND_3
8
VDDA_2
9
VDDA_3
10
VDDC_1
11
GND_4
12
VDDC_2
13
VDDC_3
14
VDDA_4
15
VAGC
16
VIF
17
VDDA_5
18
SIF
19
GND_5
20
VDDC_4
21
VDDA_6
22
GND_6
23
VDDD_1
24
TESTMODE
25 DDI1
26 VDDC_5
27 DDI2
28 ADDRSEL
29 X2
30 GND_7
31 X1
32 EXTREF
33 VDDD_2
34 SCL
35 SDA
36 GND_8
37 RESET 38 VI2C 39 VDDC_6 40 VREF_N 41 VREF_P 42 VDDC_7 43 VDDC_8 44 REXT 45 VDDA_7 46 GND_9 47 VDDC_9 48 VDDA_8
R6050
R607
0
IC603
SC4215ISTRT
3
VIN
2
EN
4
NC_2
1
NC_1
5NC_3
6VO
7ADJ
8GND
R642
10K
FE_TUNER_SDA
C626
0.1uF
16V
C643 18pF 50V
C638
0.1uF
16V
C677
100uF
16V
R602
680
IC602
SC156515M-1.8TR
2
VIN
1
EN
3
GND
5ADJ
4VO
C621
0.1uF
16V
L601
MLF1608A2R7J
2.7uH
+1.2V_P +1.2V_DVDD_P
+3.3V_TU
+3.3V_AVDD_P
TUNER_SIF_IF_N
1:C9
R603
680
L604
0603CS-R39XGLW
390nH
C611
0.1uF
16V
C624
0.1uF
16V
L605
1008CS-821XGLC
+5V_TUNER
C608
0.1uF
16V
R641
20K
C601 56pF 50V
+3.3V_P
R616 2.7K
Q603
ISA1530AC1
E
B
C
L603
0603CS-12NXGLW
12nH
C618
1000pF
50V
+5V_TUNER
C639
0.1uF
16V
C662
2.2uF
16V
C627
0.1uF
16V
C630
0.1uF
16V
R638
20K
R611
1K
1/16W
5%
R610
4.99K
1%
R615
10
C623
0.1uF
16V C632
0.1uF
16V
C637 0.1uF 16V
C635
0.1uF
16V
C629
0.1uF
16V
C622
0.1uF
16V
C610
0.1uF
16V
C606
6.8pF
50V
C607
6.8pF
50V
C965
3.9pF
50V OPT
X600
31.875MHz
C609
0.1uF
16V
C645
18pF
50V
+5V_GENERAL
L614
BLM18PG121SN1D
+5V_TUNER +3.3V_TU
L616
BLM18PG121SN1D
+3.3V_P
R628
4.7K R629
4.7K
R623
100
R624
100
R63647
IF_AGC
R657
100
C641
10pF
50V
FE_DEMOD_SDA
C648
0.027uF
+3.3V_DVDD_P
FE_TS_CLK
R659
100
C654 0.1uF
IF_N
C653 0.1uF
+3.3V_DVDD_P
FE_TS_SYNC
C640
10pF
50V
C651 1000pF
50V
+1.2V_P
FE_DEMOD_SCL
C652 1000pF 50V
R635 47
+3.3V_DVDD_P
R644 47
IF_P
R660
6.8K
+3.3V_AVDD_P
FE_RESET
+3.3V_DVDD_P
C636
15pF
50V
C647
0.1uF
16V
R643 47
IC601
DRX3913K-XK
1
I2S_WS
2
VDDL_1
3
VSSL_1
4
GPIO1
5
MSTRT
6
MERR
7
VSSH_1
8
VDDH_1
9
MCLK
10
MVAL
11
MD0
12
MD1
13
MD2
14
MD3
15
VSSL_2
16
VDDL_2
17
VSSH_2
18
VDDH_2
19
MD4
20
MD5
21
MD6
22
MD7
23
I2C_SCL1
24
I2C_SDA1
25
VSSH_3
26
VDDH_3
27
VDDL_3
28
VSSL_3
29
VSYNC
30
GPIO2
31
SAW_SW
32
RSTN
33 RF_AGC
34 IF_AGC
35 VSSAL_AFE1
36 VDDAL_AFE1
37 VDDAH_AFE1
38 VSSAH_AFE1
39 INN
40 INP
41 VSSAH_CVBS
42 VDDAH_CVBS
43 CVBS
44 SIF
45 VSSAL_AFE2
46 VDDAL_AFE2
47 PDP
48 PDN
49 XI 50 XO 51 VSSAH_OSC 52 VDDAH_OSC 53 VDDH_4 54 VSSH_4 55 VSSL_4 56 VDDL_4 57 TDO 58 TMS 59 TCK 60 TDI 61 I2C_SDA2 62 I2C_SCL2 63 I2S_CL 64 I2S_DA
C634
15pF
50V
X601
20.25MHz
FE_TS_VAL
R658
4.7K
R656
100
+1.2V_DVDD_P
+3.3V_DVDD_P
FE_TS_ERR
FE_TS_SERIAL
IC605
NL17SZ08DFT2G
3
2
4
1 5
FE_TS_VAL
FE_TS_ERR
+3.3V_TU
C660
0.1uF
16V
R62747
FE_TS_VAL_ERR
L608
500
L610
500 L612
500
C658
0.1uF
16V
C659
0.1uF
16V
C668
0.1uF
16V
C678
0.1uF
16V
C683
0.1uF
16V
C685
0.1uF
16V
R634 4.7K
R645 47
R655
4.7K
OPT
R654
4.7K
OPT
+3.3V_TU +3.3V_TU_LNA
L621
500
LNA_SWITCH_SEL
D600
RCLAMP0502B
+3.3V_TU_LNA
IC1002
TB7601TU
3
VM
2
GND
4OUTPUT
1
INPUT 6VCC
5VOUT
C692
0.1uF
16V
RF_IN
C679
22uF
10V
C661
22uF
10V
C673
10uF
10V
C674
10uF
10V
C667
10uF
10V
C655
10uF
10V
C689
0.1uF
16V
C688
0.1uF
16V
C650
0.1uF
16V
C649
0.1uF
16V
C680
0.1uF
16V
C657
0.1uF
16V
C676
0.1uF
16V
C675
0.1uF
16V
C663
0.1uF
16V
C695
120pF
50V
C693 56pF 50V C694 39pF 50V
L607
0603CS-R27XGLW
270nH
C975
0.47uF
25V
5 9
OLED 09.08.31
Chip Tuner
+1.0V BLOCK
V0 = 0.8(R1+R2) / R2
R1
R2
3.3V Block
BAP70-02
Active Low
20ms
I2C Address : C2
Analog Supply Max Current(+3.3V/Operating ) : 250mA
(+1.8V/Operating ) : 75mA
Digital Supply Max Current ( +1.8V/Operating ) : 75mA
Rev(9)
C152,155
18pF=>13pF=>15pF
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only