LG 77EG9700 User manual

Printed in KoreaP/NO : MFL68163005 (1412-REV00)
CHASSIS : EA41C
MODEL : 77EG9700 77EG9700-UA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
OLED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only

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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION .............................................................. 13
EXPLODED VIEW .................................................................................. 22
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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LGE Internal Use Only
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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LGE Internal Use Only
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Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This spec sheet is applied OLED TV with EA41C chassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Market Input voltage Frequency Remark
North
America
120V 50/60Hz Standard Voltage of each
product is marked by
models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM
5) The receiver must be operated for about 20 minutes prior to
the adjustment
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
Safety : UL, CSA, CE, IEC specification
EMC: FCC, ICES, CE, IEC specification
Wireless : Wireless HD Specification (Option)
4. General Specification
No Item Specication Remark
1 Market North America
2 Broad casting System 1 ) ATSC / NTSC-M, 64 & 256 QAM (US) 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3 Receiving System 1) ATSC / NTSC-M
4 Input Voltage AC 100 ~ 240V 50/60Hz USA (110~240V, 50/60Hz)
5 Screen Size 77 inch Wide(3840 × 2160)
6 Aspect Ratio 16:9
7 Tuning System FS
8 OLED Module 77.0” QWUXGA OLED
9Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10 Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
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5. External input format
5.1. 2D mode
5.1.1. Component input (Y, CB/PB, CR/PR)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3 720*480 31.50 60 27.027 SDTV 480P
4 720*480 31.47 59.94 27.0 SDTV 480P
5 1280*720 45.00 60.00 74.25 HDTV 720P
6 1280*720 44.96 59.94 74.176 HDTV 720P
7 1920*1080 33.75 60.00 74.25 HDTV 1080I
8 1920*1080 33.72 59.94 74.176 HDTV 1080I
91920*1080 67.500 60 148.50 HDTV 1080P
10 1920*1080 67.432 59.94 148.352 HDTV 1080P
11 1920*1080 27.000 24.000 74.25 HDTV 1080P
12 1920*1080 26.97 23.976 74.176 HDTV 1080P
13 1920*1080 33.75 30.000 74.25 HDTV 1080P
14 1920*1080 33.71 29.97 74.176 HDTV 1080P
5.1.2. HDMI Input (PC/DTV)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
HDMI-PC DDC
1 640*350 31.468 70.09 25.17 EGA
2 720*400 31.469 70.08 28.32 DOS
3 640*480 31.469 59.94 25.17 VESA(VGA)
4 800*600 37.879 60.31 40.00 VESA(SVGA)
5 1024*768 48.363 60.00 65.00 VESA(XGA)
6 1152*864 54.348 60.053 80.00 VESA
7 1280*1024 63.981 60.020 108.00 VESA (SXGA)
8 1360*768 47.712 60.015 85.50 VESA (WXGA)
9 1920*1080 67.5 60 148.5 WUXGA(Reduced Blanking)
10 3840*2160 54 24.00 297.00 UDTV 2160P
11 3840*2160 56.25 25.00 297.00 UDTV 2160P
12 3840*2160 67.5 30.00 297.00 UDTV 2160P

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LGE Internal Use Only
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No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
HDMI-DTV
1 720*480 31.47 60 27.027 SDTV 480P
2 720*480 31.47 59.94 27.00 SDTV 480P
3 1280*720 45.00 60.00 74.25 SDTV 480I
4 1280*720 44.96 59.94 74.176 SDTV 480I
5 1920*1080 33.75 60.00 74.25 SDTV 480P
6 1920*1080 33.72 59.94 74.176 SDTV 480P
7 1920*1080 67.500 60 148.50 HDTV 720P
8 1920*1080 67.432 59.939 148.352 HDTV 720P
9 1920*1080 27.000 24.000 74.25 HDTV 1080I
10 1920*1080 26.97 23.976 74.176 HDTV 1080I
11 1920*1080 33.75 30.000 74.25 HDTV 1080P
12 1920*1080 33.71 29.97 74.176 HDTV 1080P
13 3840*2160 61.43 29.970 297.00 HDTV 1080P
14 3840*2160 67.5 30.00 297.00 HDTV 1080P
15 3840*2160 135 59.94 594 HDTV 1080P
16 3840*2160 135 60 594 HDTV 1080P

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LGE Internal Use Only
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No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1920*1080 45.00 60 74.25 HDTV 1080I Side by Side, Top & Bottom
2 1280*720 45.00 60 74.25 HDTV 720P Side by Side, Top & Bottom
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 720*480 31.5 60 27.03 SDTV 480P 2D to 3D, Side by Side(Half), Top & Bottom,
Checker Board, Frame Sequential, Row
Interleaving, Column Interleaving
2 720*576 31.25 50 27 SDTV 576P
3 1280*720 45.00 60.00 74.25 HDTV 720P
37.500 50 74.25 HDTV 720P
4 1920*1080 33.75 60.00 74.25 HDTV 1080I 2D to 3D, Side by Side(Half), Top & Bottom
28.125 50.00 74.25 HDTV 1080I
5 1920*1080 27.00 24.00 74.25 HDTV 1080P 2D to 3D, Side by Side(Half), Top & Bottom,
Checker Board, Row Interleaving, Column
Interleaving
28.12 25 74.25 HDTV 1080P
33.75 30.00 74.25 HDTV 1080P
67.50 60.00 148.5 HDTV 1080P 2D to 3D, Side by Side(Half), Top & Bottom,
Checker Board, Single Frame Sequential,
Row Interleaving, Column Interleaving
56.250 50 148.5 HDTV 1080P
6 3840*2160
4096*2160
53.95 23.976 296.703 HDTV 2160P 2D to 3D,
Top & Bottom(half), Side by Side(half),
54 24.00 297.00
56.25 25.00 297.00
61.43 29.970 296.703
67.5 30.00 297.00
7 3840*2160
4096*2160
112.5 50 594 HDTV 2160P
HDTV 2160P
2D to 3D, Top & Bottom(half), Side by
Side(half), Port3 Only
5.2. 3D Mode
5.2.1. RF Input
5.2.2. HDMI Input
5.2.2.1. HDMI 1.4/2.0(3D Supported mode manually)

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LGE Internal Use Only
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No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) VIC Proposed Remark
1 640*480 31.469 / 31.5 59.94/ 60 25.125/25.2 1 Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 480P)
Secondary(SDTV 480P)
31.469 / 31.5 59.94/ 60 50.35/50.4 1 Side-by-side(Full) (SDTV 480P)
62.938/63 59.94/ 60 50.35/50.4 1 Frame packing
Line alternative
Secondary(SDTV 480P)
(SDTV 480P)
2 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 2,3 Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 480P)
Secondary(SDTV 480P)
31.469 / 31.5 59.94 / 60 54/54.06 2,3 Side-by-side(Full) (SDTV 480P)
62.938/63 59.94 / 60 54/54.06 2,3 Frame packing
Line alternative
Secondary(SDTV 480P)
(SDTV 480P)
3 720*576 31.25 50 27 17,18 Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 576P)
Secondary(SDTV 576P)
31.25 50 54 17,18 Side-by-side(Full) (SDTV 576P)
62.5 50 54 17,18 Frame packing
Line alternative
Secondary(SDTV 576P)
(SDTV 576P)
4 720*576 15.625 50 27 21 Frame packing
Field alternative
Side-by-side(Full)
Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 576I)
(SDTV 576I
(SDTV 576I
Secondary(SDTV 576I)
Secondary(SDTV 576I)
5 1280*720 37.500 50 74.25 19 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 720P)
Primary(HDTV 720P)
37.500 50 148.5 19 Side-by-side(Full) (HDTV 720P)
44.96 / 45 59.94 / 60 74.17/74.25 4 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 720P)
Primary(HDTV 720P)
44.96 / 45 59.94 / 60 148.35/148.5 4 Side-by-side(Full) (HDTV 720P)
75 50 148.5 19 Frame packing
Line alternative
Primary(HDTV 720P)
(HDTV 720P)
89.91/90 59.94 / 60 148.35/148.5 4 Frame packing
Line alternative
Primary(HDTV 720P)
(HDTV 720P)
6 1920*1080 28.125 50.00 74.25 20 Top-and-Bottom
Side-by-side(half)
Secondary(HDTV 1080I)
Primary(HDTV 1080I)
28.125 50.00 148.5 20 Side-by-side(Full) (HDTV 1080I)
33.72 / 33.75 59.94 / 60 74.17/74.25 5 Top-and-Bottom
Side-by-side(half)
Secondary(HDTV 1080I)
Primary(HDTV 1080I)
33.72 / 33.75 59.94 / 60 148.35/148.5 5 Side-by-side(Full) (HDTV 1080I)
56.25 50.00 148.5 20 Frame packing
Field alternative
Primary(HDTV 1080I)
(HDTV 1080I)
67.432/67.50 59.94 / 60 148.35/148.5 5 Frame packing
Field alternative
Primary(HDTV 1080I)
(HDTV 1080I)
5.2.2.2. HDMI 1.4b (3D Supported mode automatically)

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
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No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) VIC Proposed Remark
7 1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 32 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Primary(HDTV 1080P)
26.97 / 27 23.97 / 24 148.35/148.5 32 Side-by-side(Full) (HDTV 1080P)
28.12 25 74.25 33 Top-and-Bottom
Side-by-side(half)
Secondary(HDTV 1080P)
Secondary(HDTV 1080P)
28.12 25 148.5 33 Side-by-side(Full) (HDTV 1080P)
33.716 / 33.75 29.976 / 30.00 74.18/74.25 34 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Secondary(HDTV 1080P)
33.716 / 33.75 29.976 / 30.00 148.35/148.5 34 Side-by-side(Full) (HDTV 1080P)
43.94/54 23.97 / 24 148.35/148.5 32 Frame packing
Line alternative
Primary(HDTV 1080P)
(HDTV 1080P)
56.25 25 148.5 33 Frame packing
Line alternative
Secondary(HDTV 1080P)
(HDTV 1080P)
67.432 / 67.5 29.976 / 30.00 148.35/148.5 34 Frame packing
Line alternative
Primary(HDTV 1080P)
(HDTV 1080P)
56.250 50 148.5 31 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Secondary(HDTV 1080P)
67.43 / 67.5 59.94 / 60 148.35/148.50 16 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Secondary(HDTV 1080P)
5.2.3. HDMI-PC Input (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1024*768 48.36 60 65 HDTV 768P 2D to 3D,
Side by Side(half), Top & Bottom
2 1360*768 47.71 60 85.5 HDTV 768P 2D to 3D,
Side by Side(half), Top & Bottom
3 1920*1080 67.500 60 148.50 HDTV 1080P 2D to 3D,
Side by Side(half), Top & Bottom,
Checker Board, Single Frame Sequential,
Row Interleaving, Column Interleaving
4 3840*2160 54 24.00 297.00 HDTV 2160P 2D to 3D,
Top & Bottom(half), Side by Side(half),
56.25 25.00 297.00
67.5 30.00 297.00
5 4096*2160 54 24 297.00 HDTV 2160P 2D to 3D,
Top & Bottom(half), Side by Side(half),
6 Others - - - 640*350
720*400
640*480
800*600
1152*864
2D to 3D,
Side by Side(half), Top & Bottom
5.2.4. USB Input
5.2.4.1. USB Input (3D supported mode automatically)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1920*1080 33.75 30.000 74.25 HDTV 1080p Side by Side, Top & Bottom,
Checkerboard, MPO (Photo)

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5.2.4.2. USB Input (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1920*1080 33.75 30.000 74.25 HDTV 1080p Side by Side, Top & Bottom
Checkerboard, Single Frame Sequential,
Row Interleaving, Column Interleaving
(Photo : Side by Side, Top & Bottom)
5.2.5. DLNA Input
5.2.5.1. DLNA Input (3D supported mode automatically)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1920*1080 33.75 30.000 74.25 HDTV 1080p Side by Side, Top & Bottom,
Checkerboard, MPO (Photo)
5.2.5.2. DLNA Input (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1920*1080 33.75 30.000 74.25 HDTV 1080p Side by Side, Top & Bottom
Checkerboard, Single Frame Sequential,
Row Interleaving, Column Interleaving
(Photo : Side by Side, Top & Bottom)
5.2.6. Component Input
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1280*720 44.96 59.94 74.176 HDTV 720P Side by Side, Top & Bottom
2 1920*1080 33.75 60.00 74.25 HDTV 1080I Side by Side, Top & Bottom
3 1920*1080 33.72 59.94 74.176 HDTV 1080I Side by Side, Top & Bottom
4 1920*1080 67.500 60 148.50 HDTV 1080P Side by Side, Top & Bottom
5 1920*1080 67.432 59.94 148.352 HDTV 1080P Side by Side, Top & Bottom
6 1920*1080 27.000 24.000 74.25 HDTV 1080P Side by Side, Top & Bottom
7 1920*1080 26.97 23.976 74.176 HDTV 1080P Side by Side, Top & Bottom
8 1920*1080 33.75 30.000 74.25 HDTV 1080P Side by Side, Top & Bottom
9 1920*1080 33.71 29.97 74.176 HDTV 1080P Side by Side, Top & Bottom
●Remark: 3D Input mode
No Side by Side Top & Bottom Checkerboard Single Frame
Sequential
Frame Packing Line Interleaving Column Inter-
leaving
1
R
L
R
LLLLL
L
R
L

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to EA41C Chassis applied OLED TV
all models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15 ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p
(2) EDID downloads for HDMI
※Remark
- Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly tages can be checked by using the INSTART
Menu -> 1.ADJUST CHECK
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
3.3. Appendix
(1)Tool option menu, USB Download (S/W Update, Option and
Service only)
(2) Manual adjustment for ADC calibration and White balance.
(3) Shipment conditions, Channel pre-set
4. MAIN PCBA Adjustments
4.1. ADC Calibration
- An ADC calibration is not necessary because MAIN SoC
(LGExxxx) is already calibrated from IC Maker
4.2. MAC Address, ESN, Widevine, HDCP2.0,
DTCP Key download
4.2.1. Equipment & Condition
1) Play file: keydownload.exe
4.2.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process
- US, Canada models: DETECT -> MAC_WRITE ->
WIDEVINE_WRITE
- Korea, Mexico models: DETECT -> MAC_WRITE ->
WIDEVINE_WRITE
4) Play : START
5) Check of result: Ready, Test, OK or NG
4.2.4. Communication Port connection
1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
Port
4.2.5. Download
1) US, Canada, Japan, France models (14Y LCD TV + MAC +
Widevine + ESN + HDCP2.0 + DTCP key)
4.2.6. Inspection
- In INSTART menu, check these keys.

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LGE Internal Use Only
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4.3. LAN port Inspection (Ping Test)
4.3.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
- IP number: 12.12.2.2
4.3.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) Connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) Remove LAN CABLE
4.4. EDID Download
4.4.1 Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.4.2 Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust remocon
4.4.3 Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
※Caution) Caution: When EDID Download, must remove
HDMI Cable.
4.4.4. EDID DATA
(1) HDMI 1(C/S : E7 FD)
(2) HDMI 2(C/S : E7 ED)
(3) HDMI 3(C/S : A1 FC)

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
(3) HDMI 4(C/S : E7 CD)
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14 / OLED : CH : 17)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
※Color Analyzer Matrix should be calibrated using CS-1000
5.1.3. Equipment connection
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND Explanation
CMD DATA ID
Wb 00 00 Begin White Balance adj.
Wb 00 ff End White Balance adj.
(internal pattern disappears )
(2) Adjustment Map
Adj. item Command
(lower caseASCII)
Data Range
(Hex.)
CMD1 CMD2 MIN MAX
Cool R Gain j g 00 C0
G Gain j h 00 C0
B Gain j i 00 C0
Medium R Gain j a 00 C0
G Gain j b 00 C0
B Gain j c 00 C0
Warm R Gain j d 00 C0
G Gain j e 00 C0
B Gain j f 00 C0
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need

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Copyright © LG Electronics. Inc. All rights reserved.
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5.1.5.2. OLED White balance table
(1) Cool Mode
- Purpose : Especially B-gain fix adjust leads to the
luminance enhancement. Adjust the color temperature to
reduce the deviation of the module color temperature.
- Principle : To adjust the white balance without the
saturation, Adjust the B gain more than 192 ( If R gain or G
gain is more than 255 , G gain can adjust less than 192 )
and change the others ( R/G Gain ).
- Adjustment mode : mode – Cool
(2) Medium / Warm Mode
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature
- Principle : To adjust the white balance without the
saturation, Fix the B gain to 192 (default data) and
decrease the others
- Adjustment mode : mode – Medium
(3) Warm
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the
saturation, Fix the W gain to 192 (default data) and
decrease the others.
- Adjustment mode : mode – Warm
(4) THX(Warm)
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the
saturation, Fix the W gain to 192 (default data) and
decrease the others.
- Adjustment mode : mode – Warm
- Auto White balance 4 point
- Adjust 100 IRE White Balance
- Adjust Gamam 2.2 each IRE (60, 40, 20). Using max
luminance
- Complete 4 point gamma, W/B.
Picture is H 1/3, V 1/3
fixed Center Window size
Outer Black Picture do not need change Contrast / Brightness
Center Level can change Contrast / Bright
Window pattern of Center 0~255 level
5.1.6. Reference (White Balance Adj. coordinate and
color temperature)
(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
5.1.7. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 204 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode Coordinate Temp △uv
X Y
Cool 0.277 0.278 11,000K -0.0030
Medium 0.286 0.289 9300K 0.0000
Warm 0.313 0.329 6500K +0.0030
▪ Standard color coordinate and temperature using
CA-210(CH-17)
Mode Coordinate Temp △uv
X Y
Cool 0.277±0.002 0.278±0.002 11000K -0.0030
Medium 0.286±0.002 0.289±0.002 9300K 0.0000
Warm 0.313±0.002 0.329±0.002 6500K +0.0030
5.2. Tool Option setting & Inspection per
countries
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: EA41C Chassis applied to CANADA and
MEXICO
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu
(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX.
Selection is done using +, - KEY

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5.3. Magic Motion remote controller Check
5.3.1. Test equipment
▪ RF-remote controller for check, IR-KEY-CODE remote
controller.
▪ Check AA battery before test. A recommendation is that a
tester change battery every lots.
5.3.2. Test
(1) Make pairing with TV set by pressing “Start key(Wheel
key)” on RCU.
(2) Check a cursor on screen by pressing ‘Wheel key” of RCU
(3) Stop paring with TV set by pressing “Back+ Home” key of
RCU
5.4. Wi-Fi MAC Address Check
5.4.1. Using RS232 Command
Command Set ACK
Transmission [A][l][][Set ID][][20][Cr] [O][K][x] or [N][G]
5.4.2. Check the menu on in-start
5.5. 3D pattern test (Only for 3D models)
5.5.1. Test equipment
(1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4
support)
(2) Pattern: HDMI mode (model No. 872, pattern No. 83)
5.5.2. Test method
(1) Input 3D test signal as Fig.1.
(2) Press ‘OK” key as a 3D input OSD is shown.
(3) Check pattern as Fig2 without 3D glasses. (3D mode
without 3D glasses)
Fig.2
<OK in 3D mode without 3D glasses>
Fig.3
<NG in 3D mode without 3D glasses>
5.6. HDMI ARC Function Inspection
5.6.1. Test equipment
- Optic Receiver Speaker
- MSHG-600 (SW: 1220 ↑)
- HDMI Cable (for 1.4 version)
5.6.2. Test method
(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI2)
(2) Check the sound from the TV Set

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LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
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(3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
* Remark: Inspect in Power Only Mode and check SW version
in a master equipment
5.7. UHD 4K Test
(1) Video Inspection(UDG-4004NS)
1)Insert the HDMI Cable to TV Set.
2)Convert to HDMI Mode using TV/AV Key on ADJ remote
controller
3)Inspect the sound and picture operation well.
(Color condition, Picture noise, Sound distortion etc.)
4)Inspection 2D → 3D conversion
(2) Pattern Inspection (MSPG-7100)
1)Insert the HDMI Jack to HDMI 3 Port.
2)Convert to UHD Inspection Pattern. (Use remote
controller)
3)Check Video and Sound.
4)Convert to 64 Gray Inspection Pattern. (Refer to Pictures)
5)Check Video and Sound.
6)Inspect HDMI-CEC function. (Push Play & Pause button)
(3) 4K Inspection.(HEVC Inspection model only)
1) Insert USB that 4K video file is saved.
2) Check that the video plays normally.
5.8. PIP/ W&R Function Inspection
(1) Objective : To check the connection between sub tuner and
PCBA, and their Function
(2) Test Method : This Inspection is available only Power-Only
Status.
1) Press exit key of the Adj. R/C and Press PIP key.
2) Check that the SUB TUNER pop up window on the TV
Set.
3) Check that the normal operation (picture, sound) of DTV
on the TV Set.
6. AUDIO output check
6.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
6.2. Specification
No Item Min Typ Max Unit Remark
1 Audio
practical
max Output,
L/R
(Distor-
tion=10%
max Output)
10.35
9.09
11.5
9.59
12.65
10.05
W
Vrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)

- 19 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
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6.3. Audio Output Inspection
(1) INPUT CHECK –S KEY OF ADJUST REMOTE
CONTROLLER TO INSPECT SPEAKER
(2) When you click the first, the output volume of left & right
main speakers must be 50
(3) When you click the second, the output volume of left &
right main speakers must be 80.
(4) When you click the third, the output volume of left & right
main speakers must be 100
(5) When you click the fourth, the output volume of left main
speaker must be 50.
(6) When you click the fifth, the output volume of right main
speaker must be 50.
7. Joystick check
- Before you start a test, you must run a ‘Power Only Mode’.
(1) Channel Up Test : Press UP KEY OF SET
(2) Channel Down Test : Press DOWN KEY OF SET
(3) Volume Up Test : Press Left KEY OF SET
(4) Volume Down Test : Press Right KEY OF SET
(5) Enter Test : Press Enter KEY OF SET
- Don’t need to run a test with this sequence. For example, the
sequence such as ‘Right → Up → Down → Left
→ Enter’ is allowed.

- 20 -
LGE Internal Use Only
Copyright © LG Electronics. Inc. All rights reserved.
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8. EYE Q Green Inspection
(1) Turn on TV
(2) After 25~30 seconds, Press “EYE” button on the
Adjustment remote controller.
(3) Block the Intelligent Sensor module on the front C/A about
6 seconds.
When the “Sensor Data” is lower than 20, you can see the
“OK” message
→ If it doesn’t show “OK” message, the Sensor Module is
defected one. You have to replace that with a good one.
(4) After check the “OK” message come out, take ou t your
hand from the Sensor module.
→ Check “Sensor Data” value change from “0” to “300” or not.
If it doesn’t change the value, the sensor is also defected
one. You have to replace it.
9. GND and HI-POT Test
9.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
9.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically.
9.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
10. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)