Macnica TI GE PHY HSMC CARD User manual

2019/10/31 © 2019 Macnica, Inc.
http://www.m-pression.com
Reference Manual
TI GE PHY HSMC CARD
Revision
A
2019/10/31

TI GE PHY HSMC CARD
2Reference Manual - TI GE PHY HSMC CARD
© Macnica, Inc.
© 2019 Macnica, Inc.
Disclaimer
The information in this document (hereinafter called “Information”) is subject to change without notice.
Macnica Inc. (Developer) makes no warranty of any kind regarding this document, or of any liability arising out
of the application or use of information in this document, and assumes no responsibility for any errors that may
appear in this document.
This document is distributed without any charge and reselling or copying without written authorization by
Developer is restricted.
IN NO EVENT WILL DEVELOPER BE LIABLE FOR ANY CONSEQUENTIAL, INDIRECT, EXEMPLARY,
SPECIAL, OR INCIDENTAL DAMAGES, INCLUDING ANY LOST DATA AND LOST PROFITS, ARISING
FROM OR RELATING TO YOUR USE OF THE INFORMATION, EVEN IF YOU HAVE BEEN ADVISED OF
THE POSSIBILITY OF SUCH DAMAGES. THE TOTAL CUMULATIVE LIABILITY OF DEVELOPER IN
CONNECTION WITH YOUR USE OF THE INFORMATION IN THIS DOCUMENT, WHETHER IN
CONTRACT OR TORT OR OTHERWISE, WILL IN NO EVENT EXCEED THE AMOUNT OF FEES PAID BY
YOU TO DEVELOPER HEREUNDER FOR USE OF THE INFORMATION. YOU ACKNOWLEDGE THAT
THE FEES, IF ANY, REFLECT THE ALLOCATION OF RISK SET FORTH IN THIS AGREEMENT AND
THAT DEVELOPER WOULD NOT MAKE AVAILABLE THE INFORMATION TO YOU WITHOUT THESE
LIMITATIONS OF LIABILITY.
The Information is not intended for use in the development of on-line control equipment in hazardous
environments requiring failsafe controls, such as in the operation of nuclear facilities, aircraft
navigation or communications systems, air traffic control, life support, or weapons systems
(“High-Risk Applications”). Developer specifically disclaims any express or implied warranties of
fitness for such High-Risk Applications. You represent that use of the Information in such High-Risk
Applications is fully at your risk.

TI GE PHY HSMC CARD
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© Macnica, Inc.
Contents
1. Read This First ________________________________________________________________ 4
1.1 Important Information........................................................................................................... 4
1.2 Developer Information........................................................................................................... 5
1.3 Inquiries ................................................................................................................................. 5
2. For Ensuring Safe Use __________________________________________________________ 6
2.1 Legend.................................................................................................................................... 6
2.2 Cautions ................................................................................................................................. 6
3. Unpacking ___________________________________________________________________ 9
4. Functions and Features of the Card ______________________________________________ 10
4.1 Main Features ...................................................................................................................... 10
4.2 Product Specifications.......................................................................................................... 10
4.3 Block Diagram ...................................................................................................................... 11
4.4 Card Layout .......................................................................................................................... 11
5. Components on the Card ______________________________________________________ 13
5.1 Connector Pin Assignments ................................................................................................. 13
6. Handling Precautions _________________________________________________________ 15
6.1 Connecting/disconnecting to the HSMC.............................................................................. 15
6.2 Using the Mounted IC .......................................................................................................... 15
7. Document Revision History ____________________________________________________ 16

TI GE PHY HSMC CARD
4Reference Manual - TI GE PHY HSMC CARD
© Macnica, Inc.
1. Read This First
1.1 Important Information
READ FIRST:
⚫Before using this card, be sure to read this Reference Manual.
⚫Keep this Reference Manual so you can refer to it when necessary.
⚫You should sufficiently understand the card’s configuration before you use it.
Card Application:
⚫This card is a High Speed Mezzanine Card (hereafter HSMC) daughter card that can be
connected to and used with any HSMC that complies with HSMC standard. Combining with
an FPGA evaluation board (hereafter Evaluation board), this card supports the development
and verification of hardware and software of Gigabit Ethernet i/o interface. Use this card
correctly in line with the application.
People Who Are Expected to Use This Card:
⚫Only people who carefully read and understood this manual and the Getting Started manual
should use this card. You need a fundamental understanding of FPGA, logic circuits,
electronic circuits, and micro-computers to use this card.
Precautions When Using This Card:
⚫This card is a development support card used for the purpose of your hardware and software
development and evaluation. This card cannot be used in your mass production products.
Furthermore, when you want to use the card’s reference design for your products, please be
sure to confirm if it withstands practical use at your own risk by doing necessary and
sufficient tests and evaluations.
⚫Macnica Incorporated (hereafter Macnica Inc.) has no liability for any results arising from
the use of the card.
⚫Macnica Inc. will attempt to provide either free or paid support to handle repair of faults or
workarounds for faults with the card. This does not mean, however, that Macnica Inc.
guarantees to provide a workaround or fix under all circumstances.
⚫Macnica Inc. cannot anticipate every possible circumstance that might involve a potential
hazard. The warnings and precautions in this Reference Manual and on the card are
therefore not all-inclusive. You are responsible for using the card correctly and safely.
⚫Even if there are faults with devices that are mounted on the card, Macnica Inc. will not
replace it with a fault-fixed device.
⚫Each interface is not guaranteed to connect with all products.
⚫The card will not be replaced if you damaged or modified the card.
⚫The card uses lead-free parts.
⚫The rights to the trademarks and registered trademarks of the vendors noted in this manual
belong to their respective vendors.

TI GE PHY HSMC CARD
Reference Manual - TI GE PHY HSMC CARD 5
© Macnica, Inc.
Improvement Policy:
⚫Macnica Inc. pursues a policy of continuous improvement in design, performance, and safety
of the product.
Macnica Inc. reserves the right to change, wholly or partially, specifications, designs, this
Reference Manual, and other documentation at any time, without prior notice to customers.
Warranty:
⚫Macnica Inc. offers to exchange this card free of charge only in case of initial malfunction
noticed by you within 30 days from the delivery.
Macnica Inc. cannot exchange cards in cases where the malfunction is caused by the
following reasons:
(1) Misuse, abuse of the card or use under abnormal conditions
(2) Remodeling or repair
(3) A fire, earthquake, fall or other accidents
Figures:
⚫Some figures in this manual may differ from your purchased card.
1.2 Developer Information
The Developer of this card is:
Macnica Inc.
1-6-3 Shin-Yokohama, Kouhoku-ku, Yokohama, 222-8561 JAPAN
1.3 Inquiries
In case you have any inquiries about the use of this card, please contact sales office you purchased or
make inquiries through the contact form on the following web site.
Inquiries page:
http://www.m-pression.com/contact/inquiry
Inquiries to:
Macnica Inc.
Sales and Planning Advanced Technology
1-5-5 Shin-Yokohama, Kouhoku-ku, Yokohama, 222-8563 JAPAN
TEL: [phone]

TI GE PHY HSMC CARD
6Reference Manual - TI GE PHY HSMC CARD
© Macnica, Inc.
2. For Ensuring Safe Use
Be sure to follow the instructions given in this Manual which are intended to prevent harm to the
user and others as well as material damage.
2.1 Legend
Danger
Indicates an imminent hazardous situation which if not avoided will result in
death or serious injury.
Warning
Indicates a potentially hazardous situation which if not avoided could result in
death or serious injury.
Caution
Indicates a potentially hazardous situation which if not avoided may result in
minor or moderate injury or in property damage.
2.2 Cautions
Danger
If an AC adapter is needed, be sure to use the AC adapter provided in the
package or one that meets the specifications described in this manual.
Using an AC adapter not meeting the specifications described in this manual
may cause the card to emit heat, explode, or ignite.
Warning
Do not apply strong impacts or blows to the card.
Doing so may cause the card to emit heat, explode, or ignite, or the equipment in
the card to fail or malfunction. This may also cause fire.
Do not put this card or the AC adapter in cooking appliances such as microwave
ovens, or high-pressure containers. Doing so might cause this card or AC
adapter to emit heat, explode, ignite, or emit smoke, or its parts to break or
warp.
Do not cover or wrap this card that is in use with cloth or other materials that
are likely to allow heat to build up inside the wrapping.
This will cause heat to build up inside the wrapping which may cause this card
to ignite or malfunction.
When disposing of this card, do not dispose of it along with general household
waste.
Throwing this card into fire may cause it to explode. Dispose of this card
following the laws, regulations, and ordinances governing waste disposal.
Do not pull the power supply cable with excessive force or place heavy items on
it.
Do not damage, break, bundle, or tamper with the power supply cable.
Damaged parts of the power supply cable might cause a short circuit resulting
in fire or accidents involving electrical shock.
Do not plug or unplug the power plug with wet or moist hands.
This might cause injuries or equipment malfunctions or failures due to
electrical shock.

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© Macnica, Inc.
Warning
(Continued from
previous page)
Plug the power plug securely into the outlet.
If the power plug is not securely plugged into the outlet, it may cause accidents
involving electrical shock or fire due to heat emitted.
Do not connect many electrical cords to a single socket or connect an AC adapter
to an outlet that is not rated for the specified voltage.
Doing so may cause the equipment to malfunction or fail, or lead to accidents
involving electrical shock or fire due to heat emitted.
Periodically remove any dust accumulated on the power plug and around the
outlet (socket).
Do not use a power plug with dust accumulated on it because doing so will lead
to insulation failure due to moisture which may lead to fire.
Remove any dust on the power plug and around the outlet with a dry cloth.
Do not place any containers, such as cups or vases, filled with water or other
liquids on the card.
If the card is exposed to water or other liquids, it will cause a malfunction or
electric shock. If you spilled water or other liquid on this card, immediately stop
using the card, turn off the power, and unplug the power plug. If you have any
requests for repairs or technical consultation, please contact the sales office you
purchased or Mpression inquiry URL.
Keep the card and accessories out of the reach of children. Failure to do so may
lead to injuries.
Caution
Do not place the card on unstable places such as shaky stands or tilted
locations.
Doing so may cause injuries or cause this card to malfunction if the card should
fall.
Do not attempt to use or leave the card in places subject to strong direct
sunlight or other places subject to high temperatures such as in cars in hot
weather.
Doing so might cause the card to emit heat, break, ignite, run out of control,
warp, or malfunction. Also, some parts of the equipment might emit heat,
causing burn injuries.
Do not use the card in places subject to extremely high or low temperatures or
severe temperature changes.
Doing so may cause the card to fail or to malfunction. Always be sure to use the
card within a temperature range of 5°C to 35°C and a humidity range of 0% to
85%.
Unplug the power supply when doing maintenance on equipment in which the
card is embedded.
Failure to do so may lead to accidents involving electrical shock.
Do not place the card in locations where excessive force might be applied to it.
Doing so may cause the printed circuit board to warp, leading to breakage of the
printed circuit board, missing parts or malfunctioning parts.

TI GE PHY HSMC CARD
8Reference Manual - TI GE PHY HSMC CARD
© Macnica, Inc.
Caution
(Continued from
previous page)
When using the card together with expansion boards or other peripheral
equipment, be sure to carefully read each of their manuals and to use them
correctly.
Developer does not guarantee the operation of specific expansion boards or
peripheral devices when used in conjunction with this card unless they are
specifically mentioned in this Manual or their successful operation with this
card has been confirmed in separate documents.
Turn off the power switch when moving or connecting the card.
Failure to do so may cause this card to fail or lead to accidents involving
electrical shock.
Do not clean this card by using a rag containing chemicals such as benzine or
thinner.
Doing so could degrade the card. When using a chemically treated cloth, comply
with its directions and warnings.
Do not immediately turn on the power if you find that moisture has condensed
onto this card after removing it from the box.
Condensation may form if the card is cold when moved from the box into a warm
room.
Turning on the power while there is moisture on the card may cause it to
malfunction or shorten the service life of the parts.
Allow the card to reach room temperature when you first take it out of the box.
If condensation or moisture has occurred on this card, first wait for the moisture
to fully evaporate before installing or connecting the card to other equipment.
Operation of the card cannot be guaranteed if it has been disassembled,
dismantled, altered, modified, or rebuilt.

TI GE PHY HSMC CARD
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© Macnica, Inc.
3. Unpacking
During unpacking, check to make sure that all required items are included, and that nothing is
damaged.
If something is missing or visibly damaged, contact your sales agent within 30 days after receiving
your purchase.
TI GE PHY HSMC CARD : 1 set
5mm Spacer : 2 sets
32mm Spacer : 2 sets
Nut : 2 sets
4mm Pan Head Screw : 4 sets
Packing list/precautions: 1 set
Packing list/precautions (English): 1 set
Circuit diagram
To download these files, go to the URL
noted on the “Packing List and
Precautions”.
Reference Manual
Getting Started
Reference Design

TI GE PHY HSMC CARD
10 Reference Manual - TI GE PHY HSMC CARD
© Macnica, Inc.
4. Functions and Features of the Card
4.1 Main Features
This card is a daughter card for expanding functions, that complies with High-Speed Mezzanine
Card (hereafter HSMC) specifications. By inserting this card into an evaluation board, you can use a
variety of FPGA functions to evaluate Gigabit Ethernet.
The evaluation board which has been verified to connect with this card so far is Intel Cyclone® V GT
FPGA development kit.
Refer to the following links for more detailed information and related details.
⚫Information for the Cyclone V device family
Documentation: Cyclone V Devices
⚫Documentation for Intel Cyclone V GT FPGA development kit
Cyclone V GT FPGA Development Kit
4.2 Product Specifications
The product specifications for this card are shown below.
Table 4-1 Product specifications
Product Specifications
TI GE PHY HSMC CARD
External Dimensions
78.105 mm × 80.00 mm
Printed circuit board
4-layer FR4
HSMC
1
Power Supply
12 V, 3.3 V, 2.5 V, 1.1 V
Gigabit Ethernet PHY
Texas Instruments DP83867IR
IDT clock
Texas Instruments DP83867IR
Interface
RJ45

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© Macnica, Inc.
4.3 Block Diagram
Figure 4-1 shows the block diagram of this card.
Figure 4-1 TI GE PHY HSMC CARD Block Diagram
4.4 Card Layout
Figure 4-2 and Figure 4-3 show the layout of the card.
Figure 4-2 TI GE PHY HSMC CARD Layout (Front)
RJ45
DP83867
SG-210STF
25MHz/125MHz
MDIO
GMII
LED
25MHz
1
2
3
4

TI GE PHY HSMC CARD
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Figure 4-3 TI GE PHY HSMC CARD Layout (Back)
Table 4-2 CN1 HSMC Pin Assignments
No.
Reference
Functions
Details
1
CN2
Ethernet port RJ45
Wurth Electronics 7499111000A
2
U2
Gigabit Ethernet PHY
Texas Instruments DP83867IR
3
LED1
LED2
LED3
PHY status indicators
Default status
LED1 on: Link establish
LED2 on: 1000BASE-T link
LED3 on: Receiving or sending
4
X1
Clock oscillator
Epson SG-210STF 25MHz
5
CN1
Interface for Intel FPGA Development
Kit
High Speed Mezzanine Card (HSMC)
connector
Samtec ASP-122952-01
5

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© Macnica, Inc.
5. Components on the Card
5.1 Connector Pin Assignments
Table 5-1 CN1 HSMC Pin Assignments
Board
HSMC
Pin#
BANK
Pin#
HSMC
Board
1
BANK A
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
HSMC_TX_P3
17
18
HSMC_RX_P3
HSMC_TX_N3
19
20
HSMC_RX_N3
HSMC_TX_P2
21
22
HSMC_RX_P2
HSMC_TX_N2
23
24
HSMC_RX_N2
HSMC_TX_P1
25
26
HSMC_RX_P1
HSMC_TX_N1
27
28
HSMC_RX_N1
HSMC_TX_P0
29
30
HSMC_RX_P0
HSMC_TX_N0
31
32
HSMC_RX_N0
HSMC_SDA
33
34
HSMC_SCL
35
36
37
38
HSMC_CLK_OUT0
39
40
HSMC_CLK_IN0
TX_CLK
HSMC_D0
41
BANK B
42
HSMC_D1
HSMC_D2
43
44
HSMC_D3
3.3V
3.3V
45
46
12V
12V
HSMC_TX_D_P0
47
48
HSMC_RX_D_P0
HSMC_TX_D_N0
49
50
HSMC_RX_D_N0
3.3V
3.3V
51
52
12V
12V
PHY_RESET_N
HSMC_TX_D_P1
53
54
HSMC_RX_D_P1
RX_DV
HSMC_TX_D_N1
55
56
HSMC_RX_D_N1
COL
3.3V
3.3V
57
58
12V
12V
TX_EN
HSMC_TX_D_P2
59
60
HSMC_RX_D_P2
CRS
TX_ERR
HSMC_TX_D_N2
61
62
HSMC_RX_D_N2
RX_ERR
3.3V
3.3V
63
64
12V
12V
PWRDOWN_INT_N
HSMC_TX_D_P3
65
66
HSMC_RX_D_P3
MDIO
HSMC_TX_D_N3
67
68
HSMC_RX_D_N3
MDC
3.3V
3.3V
69
70
12V
12V
TX0
HSMC_TX_D_P4
71
72
HSMC_RX_D_P4
RX0
TX1
HSMC_TX_D_N4
73
74
HSMC_RX_D_N4
RX1
3.3V
3.3V
75
76
12V
12V
TX2
HSMC_TX_D_P5
77
78
HSMC_RX_D_P5
RX2
TX3
HSMC_TX_D_N5
79
80
HSMC_RX_D_N5
RX3
3.3V
3.3V
81
82
12V
12V
TX4
HSMC_TX_D_P6
83
84
HSMC_RX_D_P6
RX4
TX5
HSMC_TX_D_N6
85
86
HSMC_RX_D_N6
RX5
3.3V
3.3V
87
88
12V
12V
TX6
HSMC_TX_D_P7
89
90
HSMC_RX_D_P7
RX6
TX7
HSMC_TX_D_N7
91
92
HSMC_RX_D_N7
RX7
3.3V
3.3V
93
94
12V
12V
GTX_CLK
HSMC_CLK_OUT_P1
95
96
HSMC_CLK_IN_P1
RX_CLK
HSMC_CLK_OUT_N1
97
98
HSMC_CLK_IN_N1
GND
3.3V
3.3V
99
100
12V
12V
HSMC_TX_D_P8
101
BANK C
102
HSMC_RX_D_P8
HSMC_TX_D_N8
103
104
HSMC_RX_D_N8
3.3V
3.3V
105
106
12V
12V
HSMC_TX_D_P9
107
108
HSMC_RX_D_P9
HSMC_TX_D_N9
109
110
HSMC_RX_D_N9
3.3V
3.3V
111
112
12V
12V
HSMC_TX_D_P10
113
114
HSMC_RX_D_P10
HSMC_TX_D_N10
115
116
HSMC_RX_D_N10

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Board
HSMC
Pin#
BANK
Pin#
HSMC
Board
3.3V
3.3V
117
118
12V
12V
HSMC_TX_D_P11
119
120
HSMC_RX_D_P11
HSMC_TX_D_N11
121
122
HSMC_RX_D_N11
3.3V
3.3V
123
124
12V
12V
HSMC_TX_D_P12
125
126
HSMC_RX_D_P12
HSMC_TX_D_N12
127
128
HSMC_RX_D_N12
3.3V
3.3V
129
130
12V
12V
HSMC_TX_D_P13
131
132
HSMC_RX_D_P13
HSMC_TX_D_N13
133
134
HSMC_RX_D_N13
3.3V
3.3V
135
136
12V
12V
HSMC_TX_D_P14
137
138
HSMC_RX_D_P14
HSMC_TX_D_N14
139
140
HSMC_RX_D_N14
3.3V
3.3V
141
142
12V
12V
HSMC_TX_D_P15
143
144
HSMC_RX_D_P15
HSMC_TX_D_N15
145
146
HSMC_RX_D_N15
3.3V
3.3V
147
148
12V
12V
TP2
HSMC_TX_D_P16
149
150
HSMC_RX_D_P16
TP3
TP1
HSMC_TX_D_N16
151
152
HSMC_RX_D_N16
TP4
3.3V
3.3V
153
154
12V
12V
HSMC_CLK_OUT_P2
155
156
HSMC_CLK_IN_P2
CLK_FR_PHY
HSMC_CLK_OUT_N2
157
158
HSMC_CLK_IN_N2
GND
3.3V
3.3V
159
160
HSMC_PRSTn
GND

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© Macnica, Inc.
6. Handling Precautions
6.1 Connecting/disconnecting to the HSMC
Always turn off the power to the evaluation board when connecting or disconnecting the card to the
HSMC connector on the evaluation board.
Note that connecting or disconnecting the card while the power is on may result in damage to or
destruction of the device.
You need to arrange sufficient anti-static prevention measures because the act of contacting the card
with a person or any object carrying a static charge may also result in damage to or destruction of the
device.
6.2 Using the Mounted IC
Refer to the following site and data sheet to use the IC that is mounted on the card. It should not be
used in nonstandard ways.
IC
Model
Link
Gigabit Ethernet PHY
DP83867IR
http://www.ti.com/lit/ds/symlink/dp83867ir.pdf

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7. Document Revision History
Date
Revision
Changes
October 31, 2019
A
First Edition