Matsushita Electric TX-22LT2F User manual

ORDERNO. ITD0203006C2
22” Diagonal LCD TV
TX-22LT2F
LH4Chassis
SPECIFICATIONS
Specifications
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Power Source
AC 100~240V, 50/60Hz
Power Consumption
Averageuse: 67W
Stand-bycondition: 5W
TV set: DC 15V, 4.1Amax.
LCD
22-inch(558mm), 16:9aspect ratioLCD panel
ScreenSize
19.17-inch(486.7mm)(W) x10.77-inch(273.6mm)(H) x / 22
-inch(558mm)(Diagonal)
Sound
Speaker
Tweeter (4x7cm 2pcs, 8 ), Woofer ( 5cm 2pcs, 4 )
AudioOutput
9W(2.5W+2.5W+4.0W(Woofer)), 10%THD
Headphones
M3(3.5mm) Jack x18 impedance
FEATURES
Aero-Hammer DoubleWoofer System (2Way
4Speaker System)
Receiving Systems/ Band name
PALB,G,H, SECAM B,G SECAM L/L’
VHFE2-E12 VHFH1-H2(ITALY)
VHFA-H (ITALY) UHFE21-E69
CATV (S01-S05) CATV S1-S10 (M1-M10)
CATV S11-S20 / (U1-
U10) CATV S21-S41 (Hyperband)
PAL525/60
Playback of NTSC tapefromsome PALvideorecorders
(VCR)
M.NTSC
Playback fromM.NTSC Videorecorders (VCR)
NTSC
Playback fromNTSC Videorecorders (VCR)
(AV INPUTONLY)
Aerial-Rear
UHF-VHF
Operating Conditions
Temperature: 41°F-95°F(5-35°C)
Humidity: 5%-90%RH (non-condensing)
Connection Terminals
AV1
21Pinsocket (Audio/Videoin, TV out, RGB in)
AV2
21Pinsocket (Audio/Videoin, Audio/Videoout, S-Video,
Q-Link)
AV3
VIDEO
RCAPIN Typex1
S-VIDEO
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Mini DIN 4-pin
AUDIO L-R
RCAPIN Typex2
Dimensions(WxH xD)
Including TV Stand
586mm x424mm x240mm
TV Set Only
586mm x388mm x67mm
Weight (Mass)
11.5kgNet
Note:
Design and Specificationsare subject tochangewithout notice.
Weight and Dimensionsshownare approximate.
2002 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, see to itthat all the protective devices such as
insulation barriers, insulation papers shields are properly
installed.
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3. After servicing, make the following leakage current checks to
prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2. Connect ameasuring network for touch currents between each
exposed metallicpart on the set and agood earth ground such as
awater pipe, as showninFigure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to
measure the potential across the measuring network.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reserve the AC plug inthe AC outlet and repeat each of the above
measure.
6. The potential at anypoint (TOUGHCURRENT) expressed as
voltage U1and U2, does not exceed the following values:
For a. c.:U1= 35 V(peak) and U2= 0.35 V(peak);
For d. c.:U1= 1.0V,
Note:
The limit value of U2= 0.35 V (peak) fora. c. and U1= 1.0 V ford. c. correspond tothe values 0.7
mA (peak) a. c. and 2.0 mA d. c.
The limit value U1= 35 V (peak) fora. c. correspond tothe value 70 mA (peak) a. c. for
frequencies greaterthan100 kHz.
7. Incase ameasurement isout of the limits specified, there isa
possibilityof ashock hazard, and the equipment shouldbe
repaired and rechecked before itisreturned to the customer.
Figure 1
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2. Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischarging ESDwrist strap,
whichshouldbe removed for potential shock reasons prior to
applying power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as alminum foil,
to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
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electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, alminum foil or
comparableconductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficient
todamage an ES device).
3. About lead free solder (PbF)
Note: Leadis listedas (Pb) inthe periodic table of elements.
Inthe information below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.
The LeadFree Solderusedinourmanufacturing process and discussedbelowis (Sn+Ag+Cu).
That is Tin(Sn), Silver(Ag) and (Cu) although othertypes are available.
This model uses PbFree solderinit’s manufacture due toenvironmental conservation issues.
Forservice and repairwork, we’dsuggest the use of Pbfree solderas well, although Pbsolder
maybe used.
PCBs manufacturedusing leadfree solderwill have the PbF withina leaf Symbol
stampedon the back of PCB.
Caution
-Pb free solder has ahigher melting point than standard solder.
Typicallythe melting point is50 ~ 70 ~F(30~40~C)higher. Please
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use ahigh temperature soldering iron and set itto 700 ± 20 ~F
(370 ± 10 ~C).
-Pb free solder will tend to splash when heated too high (about 1100
~For600~C).
Ifyou must use Pb solder, please completelyremove all of the Pb
free solder on the pins or solder area before applying Pb solder. If
thisisnot practical, be sure to heat the Pb free solder until it
melts, before applying Pb solder.
-After applying PbF solder to doublelayered boards, please check
the component side for excess solder which mayflow onto the
opposite side. (see figure below)
SuggestedPbfree solder
There are several kinds of Pbfree solderavailable forpurchase. This product uses Sn+Ag+Cu
(tin, silver, copper) solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder
canalsobeused.
4. Self Check
1. Self-Check isused to automaticallycheck the bus lines and
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hexadecimal code of the TV set.
2. To get into the Self-Check mode press the Down( )
button on the customer controlsat the front of the set, at the
same time pressing the Recall button on the remote control,
andthe screen will show :
If the CCU ports have beencheckedand found tobe incorrect ornot locatedthen“--” will
appearinplace of “O.K.”.
5. Chasis Board Layout
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6. Servicing method
6.1. Removing tiltbase
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6.2. Removing rear panel
6.3. Removing speaker unit
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