Matsushita Electric TY-FB8TA User manual

ORDER NO. ITD0604015CE
U/V Tuner Board with Hospitality Port
TY-FB8TA
SPECIFICATIONS
Specifications
Receiving System
Receiving Channels Regular TV
VHF BAND UHF BAND CATV
2-12 (PAL/SECAM B, K1) 21-69 (PAL G, H, I/SECAM G, K, K1) S1-S20 (OSCAR)
0-12 (PAL B AUST.) 28-69 (PAL B AUST.) 1-125 (U.S.A. CATV)
1-9 (PAL B N.Z) 13-57 (PAL D, K) C13-C49 (JAPAN)
1-12 (PAL/SECAM D) 13-62 (NTSC M Japan) S21-S41 (HYPER)
1-12 (NTSC M Japan) 14-69 (NTSC M U.S.A.) Z1-Z37 (CHINA)
2-13 (NTSC M U.S.A.) 5A, 9A (AUST.)
OUTPUT
AUDIO OUT AUDIO L-R (RCA Pin Type × 2) 0.5 Vrms
VIDEO OUT VIDEO (BNC Type) 1.0 Vp-p (75 )
Others Ir System terminal × 1
INPUT
AUDIO IN AUDIO L-R (RCA Pin Type × 2) 0.5 Vrms
1

VIDEO IN VIDEO (BNC Type) 1.0 Vp-p (75 )
S-VIDEO (MINI DIN 4-pin) Y:1.0 Vp-p (75 ) C:0.286 Vp-p (75 )
ANT-IN UHF / VHF
Mass (Weight) 0.55 kg
2004 Matsushita Electric Industrial Co., Ltd. All rights reserved.
Unauthorized copying and distribution is a violation of law.
1. Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is
found, replace all parts which have been overheated or damaged by the
short circuit.
2. After servicing, see to it that all the protective devices such as
insulation barriers, insulation papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent
the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation
transformer for this check.
2. Connect a measuring network for touch currents between each
exposed metallic part on the set and a good earth ground such as a
water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure
the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each
point.
5. Reserve the AC plug in the AC outlet and repeat each of the above
measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U1
and U2, does not exceed the following values:
2

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
Note:
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA
(peak) a. c. and 2.0 mA d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies
greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a
possibility of a shock hazard, and the equipment should be repaired
and rechecked before it is returned to the customer.
Figure 1
2. Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and semiconductor "chip" components.
The following techniques should be used to help reduce the incidence of component damage caused
by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any ESD on your body by
touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging ESD wrist strap, which should be
removed for potential shock reasons prior to applying power to the unit
under test.
3

2. After removing an electrical assembly equipped with ES devices, place
the assembly on a conductive surface such as alminum foil, to prevent
electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static solder removal device. Some solder removal
devices not classified as "anti-static (ESD protected)" can generate
electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical
charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package
until immediately before you are ready to install it. (Most replacement
ES devices are packaged with leads electrically shorted together by
conductive foam, alminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a
replacement ES device, touch the protective material to the chassis or
circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all
other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES
devices. (Otherwise hamless motion such as the brushing together of
your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity (ESD) sufficient to damage an ES device).
3. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For
service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be
used.
4

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
stamped on the back of PCB.
Caution
- Pb free solder has a higher melting point than standard solder. Typically
the melting point is 50 ~ 70 °F (30~40°C) higher. Please use a high
temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
- Pb free solder will tend to splash when heated too high (about 1100 °F
or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free
solder on the pins or solder area before applying Pb solder. If this is not
practical, be sure to heat the Pb free solder until it melts, before
applying Pb solder.
- After applying PbF solder to double layered boards, please check the
component side for excess solder which may flow onto the opposite
side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin,
silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be
used.
5

4. Installation
6

5. Antenna connection
7

6. Connections of external equipment
8

7. Circuit Board Layout
7.1. HCA-Board
8. Block and Schematic Diagram
8.1. Schematic Diagram Notes
9

8.2. HCA-Board Block Diagram
8.3. HCA-Board (1 of 6) Schematic Diagram
8.4. HCA-Board (2 of 6) Schematic Diagram
10