MICROELETTRICA MC30-R2 User manual

MC30-R2
Doc. N° MO-0462-ING
Copyright 2012
FW: 1290.37.01.x
Date
06.09.2022
Rev.
1
Pag.
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MICROPROCESSOR
OVERCURRENT and EARTH FAULT RELAY
with AUTORECLOSE
TYPE
OPERATION MANUAL

MC30-R2
Doc. N° MO-0462-ING
Copyright 2012
FW: 1290.37.01.x
Date
06.09.2022
Rev.
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1. General Utilization and Commissioning Directions _________________________________________________________3
1.1 - Storage and Transportation _____________________________________________________________________3
1.2 - Installation __________________________________________________________________________________3
1.3 - Electrical Connection___________________________________________________________________________3
1.4 - Measuring Inputs and Power Supply _______________________________________________________________3
1.5 - Outputs Loading ______________________________________________________________________________3
1.6 - Protection Earthing ____________________________________________________________________________3
1.7 - Setting and Calibration _________________________________________________________________________3
1.8 - Safety Protection _____________________________________________________________________________3
1.9 - Handling ____________________________________________________________________________________3
1.10 - Maintenance ________________________________________________________________________________4
1.11 - Waste Disposal of Electrical & Electronic Equipment __________________________________________________4
1.12 - Fault Detection and Repair _____________________________________________________________________4
2. General _________________________________________________________________________________________5
2.1 - Power Supply ________________________________________________________________________________5
2.2 - Operation and Algorithms _______________________________________________________________________6
2.2.1 - Reference Input Values _____________________________________________________________________6
2.2.2 - Input quantities ___________________________________________________________________________6
2.2.3 - Time Current Curves IEC (TU1029 Rev.0) ______________________________________________________8
2.2.4 - Time Current Curves IEEE (TU1028 Rev.0) ______________________________________________________9
3. Functions and Settings (Function) ____________________________________________________________________10
3.1 - T> (F49) - Thermal Image protection level ________________________________________________________10
3.1.1 - Thermal Image Curves (TU0445 Rev.0) _______________________________________________________11
3.2 - I> (1F51) - First overcurrent protection level _______________________________________________________12
3.3 - I>> (2F51) - Second overcurrent protection level ___________________________________________________13
3.4 - IH (3F51) - Third overcurrent protection level ______________________________________________________14
3.4.1 –Automatic doubling or Overcurrent thresholds on current inrush ____________________________________14
3.5 - Io> (1F51N) - First Earth Fault protection level _____________________________________________________15
3.6 - Io>> (2F51N) - Second Earth Fault protection level__________________________________________________16
3.7 - IoH (3F51N) - Third Earth Fault protection level_____________________________________________________16
3.8 - BF (F51BF) - Breaker Failure ___________________________________________________________________17
3.9 - I.R.F. - Internal Relay Failure ___________________________________________________________________17
3.10 - RCL - Reclosing function ______________________________________________________________________18
3.11 - Osc - Oscillographic Recording _________________________________________________________________20
3.12 - Comm –Communication Parameters ____________________________________________________________20
3.13 - LCD –Display and Buzzer operation _____________________________________________________________20
4. Logic Blocking of Functions _________________________________________________________________________21
4.1 - Blocking Outputs_____________________________________________________________________________21
4.2 –Blocking Inputs _____________________________________________________________________________21
5. Output Relays ___________________________________________________________________________________21
6. Digital Inputs____________________________________________________________________________________22
7. Selfdiagnostic ___________________________________________________________________________________22
8. Relay Management _______________________________________________________________________________23
9. Signalizations ___________________________________________________________________________________24
10. Keyboard Buttons _______________________________________________________________________________24
11. Serial Communication Port ________________________________________________________________________25
11.1 . Main RS485 Serial Communication Port __________________________________________________________25
11.2 - Communication Port on Front Face Panel _________________________________________________________26
12. MENU AND VARIABLES ___________________________________________________________________________27
12.1 - Real Time Measurements _____________________________________________________________________27
12.2 - Measure (Instantaneous Measurements) _________________________________________________________27
12.3 - Counter (Operation Counters) _________________________________________________________________27
12.4 –Trip/Ev. (Event Recording)____________________________________________________________________28
12.5 - R/W Set (Programming / Reading the Relay Settings) _______________________________________________29
12.5.1 - CommAdd (Communication Address) ________________________________________________________29
12.5.2 - Time/Date (Time/Date) ___________________________________________________________________29
12.5.3 - RatedVal (Rated Input Values) _____________________________________________________________29
12.5.4 - Function (Functions) _____________________________________________________________________30
12.6 - RelayCfg (Relay Configuration) _________________________________________________________________32
12.7 - Commands ________________________________________________________________________________33
12.8 - Info&Ver (Firmware - Info&Version) _____________________________________________________________33
13. Keyboard Operational Diagram _____________________________________________________________________34
14. Password ______________________________________________________________________________________35
14.1 - MS-Com Password __________________________________________________________________________35
15. Maintenance ___________________________________________________________________________________35
16. Power Frequency Insulation Test ____________________________________________________________________35
17. Connection Diagram _____________________________________________________________________________36
18. Overall Dimensions ______________________________________________________________________________36
19. Direction for Pcb's Draw-Out and Plug-In _____________________________________________________________37
19.1 - Draw-Out _________________________________________________________________________________37
19.2 - Plug-In ___________________________________________________________________________________37
20. Electrical Characteristics __________________________________________________________________________38

MC30-R2
Doc. N° MO-0462-ING
Copyright 2012
FW: 1290.37.01.x
Date
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1. General Utilization and Commissioning Directions
Always make reference to the specific description of the product and to the Manufacturer's instruction.
Carefully observe the following warnings.
1.1 - Storage and Transportation
Must comply with the environmental conditions stated in the product's specification or by the applicable IEC
standards.
1.2 - Installation
Must be properly made and in compliance with the operational ambient conditions stated by the Manufacturer.
1.3 - Electrical Connection
Must be made strictly according to the wiring diagram supplied with the Product, to its electrical
characteristics and in compliance with the applicable standards particularly with reference to human safety.
1.4 - Measuring Inputs and Power Supply
Carefully check that the value of input quantities and power supply voltage are proper and within the
permissible variation limits.
1.5 - Outputs Loading
Must be compatible with their declared performance.
1.6 - Protection Earthing
When earthing is required, carefully check its effectiveness.
1.7 - Setting and Calibration
Carefully check the proper setting of the different functions according to the configuration of the protected
system, the safety regulations and the co-ordination with other equipment.
1.8 - Safety Protection
Carefully check that all safety means are correctly mounted, apply proper seals where required and
periodically check their integrity.
1.9 - Handling
Notwithstanding the highest practicable protection means used in designing M.S. electronic circuits, the
electronic components and semiconductor devices mounted on the modules can be seriously damaged by
electrostatic voltage discharge which can be experienced when handling the modules.
The damage caused by electrostatic discharge may not be immediately apparent, but the design reliability and
the long life of the product will have been reduced. The electronic circuits produced by M.S. are completely
safe from electrostatic discharge (8 kV IEC 255.22.2) when housed in their case; withdrawing the modules
without proper cautions expose them to the risk of damage.
a.
Before removing a module, ensure that you are at the same electrostatic potential as the equipment by
touching the case.
b.
Handle the module by its front-plate, frame, or edges of the printed circuit board. Avoid touching the
electronic components, printed circuit tracks or connectors.
c.
Do not pass the module to any person without first ensuring that you are both at the same electrostatic
potential. Shaking hands achieves equipotential.
d.
Place the module on an antistatic surface, or on a conducting surface which is at the same potential as
yourself.
e.
Store or transport the module in a conductive bag.
More information on safe working procedures for all electronic equipment can be found in BS5783
and IEC 147-OF.

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1.10 - Maintenance
Make reference to the instruction manual of the Manufacturer; maintenance must be carried-out by specially
trained people and in strict conformity with the safety regulations.
1.11 - Waste Disposal of Electrical & Electronic Equipment
(Applicable throughout the European Union and other European countries with separate collection program).
This product should not be treated as household waste when you wish dispose of it. Instead, it should be
handed over to an applicable collection point for the recycling of electrical and electronic equipment.
By ensuring this product is disposed of correctly, you will help prevent potential negative consequence to the
environment and human health, which could otherwise be caused by inappropriate disposal of this product. The
recycling of materials will help to conserve natural resource.
1.12 - Fault Detection and Repair
Internal calibrations and components should not be altered or replaced.
For repair, please ask the Manufacturer or its authorized Dealers.
Misapplication of the above warnings and instruction relieves the Manufacturer of any liability.

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2. General
The MC is a very innovative and versatile line of Protective Relays which takes advantage of the long and
successful experience coming from the M-Line.
The main features of the MC-Line relays are:
Compact draw-out execution for Flush Mounting or for assembly in 19” 3U chassis for 19” Rack systems.
User friendly front face with 2x8 characters LCD Display, four signal Leds, four keys for complete local
management and 9-pin socket for local RS232 serial communication.
Four user programmable Output Relays. On request one of the Output Relays can be replaced by a Can Bus
port for control of additional I/O modules.
Three optoisolated, selfpowered Digital Inputs.
RS485 communication port (independent from the RS232 port on front panel)
Totally draw-out execution with automatic C.T. shorting device.
Input currents are supplied to 3 current transformers: measuring phase currents.
An additional internal CT directly measures the residual (Zero Sequence) current of the three inputs.
Current inputs can be 1 or 5A: selection between 1A or 5A is made by movable jumpers provided on the Relay
card. (see Fig 1)
The Measuring Ranges of the different inputs
respectively are:
Phase Currents
:
(0.1-40)In
Residual Current
:
(0.01-10)In
Make electric connection in conformity with the
diagram reported on relay's enclosure.
Check that input currents are same as reported
on the diagram and on the test certificate.
2.1 - Power Supply
The auxiliary power is supplied by a built-in module fully isolated an self-protected.
The relay can be fitted with two different types of power supply:
Type 1
24V(-20%) / 110V(+15%) a.c.
24V(-20%) / 125V(+20%) d.c.
Type 2
80V(-20%) / 220V(+15%) a.c.
90V(-20%) / 250V(+20%) d.c.
Before energizing the unit check that supply voltage is within the allowed limits.

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Doc. N° MO-0462-ING
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2.2 - Operation and Algorithms
2.2.1 - Reference Input Values
Display
Description
Setting Range
Step
Unit
I1
100
A
Rated Primary current of phase C.T.
1
-
9999
1
A
I2
5
A
Rated Secondary current of phase C.T.
1
-
5
1/5
A
In
100
A
Reference primary current of the relay
1
-
9999
1
A
Freq
50
Hz
System rated frequency
50
-
60
10
Hz
TW
30
min
Warming-up time constant for Thermal Image
1
-
60
1
min.
Ib
105
%In
Max. admissible continuous overload for Thermal Image
50
-
130
1
%In
2.2.2 - Input quantities
2.2.2.1 - Mains Frequency (Freq)
The relay can operate either in 50Hz or 60Hz systems.
The rated Mains Frequency “Freq”must be set accordingly.
2.2.2.2 - Phase Current inputs (I1)
The relay directly displays the r.m.s. value of the Phase Currents “IA”, “IB”, “IC” flowing in the Primary
of the input Current Transformers and refers all its measurements to that value.
To make the relay properly working with any C.T., when programming the relay settings, input the value
“I1”of the primary current of the phase C.Ts
2.2.2.3 - Earth Fault Current Input (Ion)
Same as for the Phase Currents, the relay directly displays the r.m.s. value of the Zero Sequence
Residual Current flowing at the Primary of the Current Transformers.

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rs
atTKB
1
Is
I
A
t(I) +••














+
−






=α
2.2.2.4 - Algorithm of the time current curves
The Time Current Curves are generally calculated with the following equation :
(1)
where :
t(I) = Actual trip time delay when the input current equals “I”
I = Maximum of the three input currents.
Is = Set minimum pick-up level
K =
Ts= Set time delay : t(I) = Tswhen
tr = Operation time of the output relay on pick-up (7ms).
The parameters “A” and “a” have different values for the different Time Current Curves.
Curve Name
Curve Identifier
A
B
a
IEC A Inverse
A
0.14
0
0.02
IEC B Very Inverse
B
13.5
0
1
IEC C Extremely Inverse
C
80
0
2
IEEE Moderate Inverse
MI
0.0104
0.0226
0.02
IEEE Short Inverse
SI
0.00342
0.00262
0.02
IEEE Very Inverse
VI
3.88
0.0963
2
IEEE Inverse
I
5.95
0.18
2
IEEE Extremely Inverse
EI
5.67
0.0352
2
The maximum measuring current is “40xIn” for phase elements and “10xOn” for the neutral
element.
1
a110A−






−
10
II
s
=

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2.2.3 - Time Current Curves IEC (TU1029 Rev.0)

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2.2.4 - Time Current Curves IEEE (TU1028 Rev.0)

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3. Functions and Settings (Function)
The relay is provided with two groups of setting “ ” and “ ”.
Group
Functions
T>, I>, I>>, IH, Io>, Io>>, IoH, BF, IRF, RCL, Osc, Comm, LCD.
T>, I>, I>>, IH, Io>, Io>>, IoH, RCL.
3.1 - T> (F49) - Thermal Image protection level
FuncEnab
→
Enable
[Disable / Enable]
Options
→
No Param
No Parameters
TripLev
→
Tal
50.00
%Tb
(50.00 110.00)
step
1
%Tb
→
Tst
100.00
%Tb
(10.00 100.00)
step
1
%Tb
Timers
→
No Param
No Parameters
Description of variables
FuncEnab
:
If disable the function is disactivated.
Tal
:
Thermal prealarm temperature.
Tst
:
Reset level.
Warming-up is computed proportionally to the square of the largest phase current “I”.
-Allowed overloading time (See Curve)
The trip time delay “t”of the thermal element, depends on the warming-up time constant
“tw”, on the previous thermal status (Ip/In)2, on the admissible continuous overload (Ib) and, of
course, on the actual load (I)
tw
=
Warming-up time constant
(1-60)min.
I
=
Largest of the three phase currents
Ip
=
Preheating current: Steady-State Current corresponding to the thermal status
existing at the moment when the current is increased to the overload value “I”
Ib
=
Continuously admissible current
(50-130)%In, step 1%In
In
=
Rated primary current of phase C.Ts

n
=
Natural logarithm
Reset takes please when the simulated temperature drops below the programming level [Tst].
An alarm signal is issued when the computed warming exceeds the set percentage “Tal”of the Full
Load temperature “Tb”.
:where
(Ib/In)(I/In)
(Ip/In)(I/In)
twt22
22








−
−
= n 

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3.1.1 - Thermal Image Curves (TU0445 Rev.0)

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3.2 - I> (1F51) - First overcurrent protection level
FuncEnab
→
Enable
[Disable / Enable]
Options
→
TCC
A
[D / A / B / C / MI / VI / I / EI / / SI ]
→
BI
Disable
[Disable / Enable]
→
Trg
Enable
[Disable / Enable]
→
Sh1
No
[No / Yes]
→
Sh2
No
[No / Yes]
→
Sh3
No
[No / Yes]
→
Sh4
No
[No / Yes]
TripLev
→
I>
0.1
In
(0.10 4.00)
step
0.01
In
Timers
→
tI>
0.05
s
(0.05 60.00)
step
0.01
s
Description of variables
FuncEnab
:
If disable the function is disactivated
TCC
:
Time current curves
D
=
Independent Definite Time
A
=
IEC A Inverse
B
=
IEC B Very Inverse
C
=
IEC C Extremely Inverse
MI
=
IEEE Moderate Inverse Curve
VI
=
IEEE Very Inverse Curve
I
=
IEEE Inverse Curve
EI
=
IEEE Extremely Inverse Curve
SI
=
IEEE Short Inverse Curve
BI
:
Operation controlled by Blocking Digital Input
Trg
:
Function operation triggers the oscillographic wave form capture
(see § Oscillographic Recording)
Sh1
:
Tripping of this function (1F51) starts (Yes) or not (No) the first reclosure shot.
Sh2
:
Tripping of this function (1F51) starts (Yes) or not (No) the 2nd reclosure shot.
Sh3
:
Tripping of this function (1F51) starts (Yes) or not (No) the 3rd reclosure shot.
Sh4
:
Tripping of this function (1F51) starts (Yes) or not (No) the 4th reclosure shot.
I>
:
Minimum phase current pick-up level (limited to 40 times In)
tI>
:
Trip time delay

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3.3 - I>> (2F51) - Second overcurrent protection level
FuncEnab
→
Enable
[Disable / Enable]
Options
→
BI
Disable
[Disable / Enable]
→
2xI
Disable
[Disable / Enable]
→
Trg
Enable
[Disable / Enable]
→
Sh1
No
[No / Yes]
→
Sh2
No
[No / Yes]
→
Sh3
No
[No / Yes]
→
Sh4
No
[No / Yes]
TripLev
→
I>>
0.05
In
(0.50 40.00)
step
0.01
In
Timers
→
tI>>
0.05
s
(0.05 60.00)
step
0.01
s
→
t2xI
0.02
s
(0.02 9.99)
step
0.01
s
Description of variables
FuncEnab
:
If disable the function is disactivated
BI
:
Operation controlled by Blocking Digital Input
2xI
:
Automatic threshold doubling on inrush
Trg
:
Function operation triggers the oscillographic wave form capture
(see § Oscillographic Recording)
Sh1
:
Tripping of this function (2F51) starts (Yes) or not (No) the first reclosure shot.
Sh2
:
Tripping of this function (2F51) starts (Yes) or not (No) the 2nd reclosure shot.
Sh3
:
Tripping of this function (2F51) starts (Yes) or not (No) the 3rd reclosure shot.
Sh4
:
Tripping of this function (2F51) starts (Yes) or not (No) the 4th reclosure shot.
I>>
:
Minimum phase current pick-up level (limited to 40 times In)
tI>>
:
Trip time delay
t2xI
:
Trip time delay

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3.4 - IH (3F51) - Third overcurrent protection level
FuncEnab
→
Enable
[Disable / Enable]
Options
→
BI
Disable
[Disable / Enable]
→
2xI
Enable
[Disable / Enable]
→
Trg
Enable
[Disable / Enable]
→
Sh1
No
[No / Yes]
→
Sh2
No
[No / Yes]
→
Sh3
No
[No / Yes]
→
Sh4
No
[No / Yes]
TripLev
→
IH
0.5
In
(0.50 40.00)
step
0.01
In
Timers
→
tIH
0.05
s
(0.05 60.00)
step
0.01
s
→
t2xI
0.02
s
(0.02 9.99)
step
0.01
s
Description of variables
FuncEnab
:
If disable the function is disactivated
BI
:
Operation controlled by Blocking Digital Input
2xI
:
Automatic threshold doubling on inrush
Trg
:
Function operation triggers the oscillographic wave form capture
(see § Oscillographic Recording)
Sh1
:
Tripping of this function (3F51) starts (Yes) or not (No) the first reclosure shot.
Sh2
:
Tripping of this function (3F51) starts (Yes) or not (No) the 2nd reclosure shot.
Sh3
:
Tripping of this function (3F51) starts (Yes) or not (No) the 3rd reclosure shot.
Sh4
:
Tripping of this function (3F51) starts (Yes) or not (No) the 4th reclosure shot.
IH
:
Minimum phase current pick-up level (limited to 40 times In)
t2xI
:
Trip time delay
tIH
:
Trip time delay
3.4.1 –Automatic doubling or Overcurrent thresholds on current inrush
For some of the phase Overcurrent functions it is possible to have the set trip level [Is] automatically
doubled when strong inrush current is detected.
If at circuit Breaker switch-on (i.e. when the input current rises from zero to a minimum measurable value)
the current increases from 0 to 1.5 times the rated value [In] in less than 60ms, the set minimum pick-up
level [Is] is dynamically doubled ([Is]→[2Is]) and keeps this value until the input current drops below
1.25xIn or the set time [t2xI] has elapsed.
This functionality is very useful to avoid spurious tripping of the instantaneous or short-time delayed
Overcurrent elements that could be experienced at switch-on of reactive loads like Transformer or
Capacitors.

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3.5 - Io> (1F51N) - First Earth Fault protection level
FuncEnab
→
Enable
[Disable / Enable]
Options
→
TCC
D
[D / A / B / C / I / VI / EI / MI / SI ]
→
BI
Disable
[Disable / Enable]
→
Trg
Enable
[Disable / Enable]
→
Sh1
No
[No / Yes]
→
Sh2
No
[No / Yes]
→
Sh3
No
[No / Yes]
→
Sh4
No
[No / Yes]
TripLev
→
Io>
0.01
Ion
(0.01 4.00)
step
0.01
Ion
Timers
→
tIo>
0.05
s
(0.05 60.00)
step
0.01
s
Description of variables
FuncEnab
:
If disable the function is disactivated
TCC
:
Time current curves
D
=
Independent Definite Time
A
=
IEC A Inverse
B
=
IEC B Very Inverse
C
=
IEC C Extremely Inverse
MI
=
IEEE Moderate Inverse Curve
VI
=
IEEE Very Inverse Curve
I
=
IEEE Inverse Curve
EI
=
IEEE Extremely Inverse Curve
SI
=
IEEE Short Inverse Curve
BI
:
Operation controlled by Blocking Digital Input
Trg
:
Function operation triggers the oscillographic wave form capture
(see § Oscillographic Recording)
Sh1
:
Tripping of this function (1F51N) starts (Yes) or not (No) the first reclosure shot.
Sh2
:
Tripping of this function (1F51N) starts (Yes) or not (No) the 2nd reclosure shot.
Sh3
:
Tripping of this function (1F51N) starts (Yes) or not (No) the 3rd reclosure shot.
Sh4
:
Tripping of this function (1F51N) starts (Yes) or not (No) the 4th reclosure shot.
Io>
:
Minimum Zero Sequence Residual Current Pick-up level
tIo>
:
Trip time delay

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3.6 - Io>> (2F51N) - Second Earth Fault protection level
FuncEnab
→
Enable
[Disable / Enable]
Options
→
BI
Disable
[Disable / Enable]
→
Trg
Enable
[Disable / Enable]
→
Sh1
No
[No / Yes]
→
Sh2
No
[No / Yes]
→
Sh3
No
[No / Yes]
→
Sh4
No
[No / Yes]
TripLev
→
Io>>
0.01
Ion
(0.01 9.99)
step
0.01
Ion
Timers
→
tIo>>
0.05
s
(0.05 60.00)
step
0.01
s
Description of variables
FuncEnab
:
If disable the function is disactivated
BI
:
Operation controlled by Blocking Digital Input
Trg
:
Function operation triggers the oscillographic wave form capture
(see § Oscillographic Recording)
Sh1
:
Tripping of this function (2F51N) starts (Yes) or not (No) the first reclosure shot.
Sh2
:
Tripping of this function (2F51N) starts (Yes) or not (No) the 2nd reclosure shot.
Sh3
:
Tripping of this function (2F51N) starts (Yes) or not (No) the 3rd reclosure shot.
Sh4
:
Tripping of this function (2F51N) starts (Yes) or not (No) the 4th reclosure shot.
Io>>
:
Minimum Zero Sequence Residual Current Pick-up level
tIo>>
:
Trip time delay
3.7 - IoH (3F51N) - Third Earth Fault protection level
FuncEnab
→
Enable
[Disable / Enable]
Options
→
BI
Disable
[Disable / Enable]
→
Trg
Enable
[Disable / Enable]
→
Sh1
No
[No / Yes]
→
Sh2
No
[No / Yes]
→
Sh3
No
[No / Yes]
→
Sh4
No
[No / Yes]
TripLev
→
IoH
0.01
Ion
(0.01 9.99)
step
0.01
Ion
Timers
→
tIoH
0.05
s
(0.05 60.00)
step
0.01
s
Description of variables
FuncEnab
:
If disable the function is disactivated
BI
:
Operation controlled by Blocking Digital Input
Trg
:
Function operation triggers the oscillographic wave form capture
(see § Oscillographic Recording)
Sh1
:
Tripping of this function (3F51N) starts (Yes) or not (No) the first reclosure shot.
Sh2
:
Tripping of this function (3F51N) starts (Yes) or not (No) the 2nd reclosure shot.
Sh3
:
Tripping of this function (3F51N) starts (Yes) or not (No) the 3rd reclosure shot.
Sh4
:
Tripping of this function (3F51N) starts (Yes) or not (No) the 4th reclosure shot.
IoH
:
Minimum Zero Sequence Residual Current Pick-up level
tIoH
:
Trip time delay

MC30-R2
Doc. N° MO-0462-ING
Copyright 2012
FW: 1290.37.01.x
Date
06.09.2022
Rev.
1
Pag.
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of
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3.8 - BF (F51BF) - Breaker Failure
FuncEnab
→
Enable
[Disable / Enable]
Options
→
TrR
Relay1
Relay1 –Relay2 –Relay3 –Relay4
TripLev
→
No Param
No Parameters
Timers
→
tBF
0.20
s
(0.05 0.75)
step
0.01
s
Description of variables
FuncEnab
:
If disable the function is disactivated
TrR
:
Output relay programmed for trip command to the Circuit Breaker
tBF
:
Trip time delay
Operation: If after the time “tBF” from pick-up of the programmed relay “TrR” the current measured still
exceeds 5%In, the output relay associated to the “BF” function is operated (relay another than TrR).
3.9 - I.R.F. - Internal Relay Failure
FuncEnab
→
No Param
No Parameters
Options
→
Opz
Trip
[NoTrip / Trip]
TripLev
→
No Param
No Parameters
Timers
→
No Param
No Parameters
Opz
:
The variable “Opz”can be programmed to trip the output relays same as the
other protection functions (Opz = TRIP), or to only operate the “IRF”signal led
without tripping the output relays (Opz = NoTRIP).

MC30-R2
Doc. N° MO-0462-ING
Copyright 2012
FW: 1290.37.01.x
Date
06.09.2022
Rev.
1
Pag.
18
of
38
3.10 - RCL - Reclosing function
FuncEnab
→
Enable
[Disable / Enable]
Options
→
Rsh
1
[1 / 2 / 3 / 4]
TripLev
→
No Param
No Parameters
Timers
→
RCLtr
5
s
(0.10 300)
step
0.1
s
→
RCLt1
2
s
(0.10 300)
step
0.1
s
→
RCLt2
4
s
(0.10 300)
step
0.1
s
→
RCLt3
6
s
(0.10 300)
step
0.1
s
→
RCLt4
8
s
(0.10 300)
step
0.1
s
Description of variables
FuncEnab
:
If disable the function is disactivated
Rsh
:
Number of reclosure shots to Lock-out.
RCLtr
:
Reset interval (reclaim time)after any successful reclosure
RCLt1
:
Reclosing time interval of first reclosing shot
RCLt2
:
Reclosing time interval of 2nd reclosing shot
RCLt3
:
Reclosing time interval of 3rd reclosing shot
RCLt4
:
Reclosing time interval of 4th reclosing shot
The status of the Circuit Breaker (C/B) is indicated by one normally open contact of the C/B itself and is
detected by a digital input of the relay.
Any time the Circuit Breaker (C/B) is closed either manually or automatically the Reclaim time “RCLtr” is
started.
During “RCLtr” after manual closure of the C/B operation starting of any of the protection function stops
the “RCLtr” time counting:
-if the protection element is reset before tripping, the timer “RCLtr” is restarted.
-it the protection function trips (end of its trip time delay) the autoreclosure is blocked.
Autoreclose shot is started on C/B opening after “RCLtr” operated by tripping of one of the
protection functions programmed to control the first reclose shot;
C/B opening operated manually or by one function not programmed to control the next reclosure shot,
activates the Lock-out status of the Automatic Reclosure.
Reset from the Lock-out status takes place by manual closure of the C/B.
Autoreclose shots (after the first) are started on C/B opening during “RCLtr” operated by tripping
of one of the protection functions programmed to control this reclose shot;
During “RCLtr” operation starting (during the trip time delay) of any of the protection functions
programmed to initiate the next Reclosure Shot, stops the “RCLtr” time counting:
-if the protection element is reset before tripping, the timer “RCLtr” is restarted.
-if the protection element trips (end of its trip time delay) the Automatic Reclosure sequence
proceeds initiating the next reclosure shot.
C/B opening operated manually or by one function not programmed to control the next reclosure shot,
activates the Lock-out status of the Automatic Reclosure and the indication of “ ”.
Reset from the Lock-out status takes place by manual closure of the C/B.
After “RCLtr”is expired the relay is ready for a new reclosure sequence.
As soon as the C/B is opened due to tripping of one of the protection functions programmed to initiate an
automatic reclosure shot, the relevant reclose time delay (RCLt1, RCLt2, RCLt3, RCLt4) is started and, at
the end of this time delay, the reclose command is issued. The C/B is then automatically reclosed and the
reclaim time “RCLtr”is started again.
If the closed status of the C/B is not detected within 0.3s from expiry of the reclose time delay, the relay
indicates “ ”.

MC30-R2
Doc. N° MO-0462-ING
Copyright 2012
FW: 1290.37.01.x
Date
06.09.2022
Rev.
1
Pag.
19
of
38

MC30-R2
Doc. N° MO-0462-ING
Copyright 2012
FW: 1290.37.01.x
Date
06.09.2022
Rev.
1
Pag.
20
of
38
3.11 - Osc - Oscillographic Recording
FuncEnab
→
Enable
[Disable / Enable]
Options
→
Trg
Trip
[Disable / Start / Trip / Ext.Inp.]
TripLev
→
No Param
No Parameters
Timers
→
tPre
0.30
s
(0.10 0.50)
step
0.1
s
→
tPost
0.30
s
(0.10 1.50)
step
0.1
s
Description of variables
FuncEnab
:
If disable the function is disactivated
Trg
:
Disab
=
Function Disable (no recording)
Start.
=
Trigger on time start of protection functions
Trip
=
Trigger on trip (time delay end) of protection functions
Ext.Inp.
=
Trigger from the Digital Input D3
tPre
:
Recording time before Trigger
tPost
:
Recording time after Trigger
When the option “Start” or “Trip” is selected:
The oscillographic recording is started respectively by the “Time Start” or by the “Time End” of any of the
functions that have been programmed to Trigger the Wave Form Capture (I>, I>>, IH, Io>, Io>>, IoH).
The “Osc” Function includes the wave Form Capture of the input quantities (IA, IB, IC, Io) and can totally
store a record of 3 seconds.
The number of events recorded depends on the duration of each individual recording (tPre + tPost).
In any case the number of event stored can not exceed ten (10 x 0.3 sec).
Any new event beyond the 3 sec capacity of the memory, cancel and overwrites the former records (FIFO
Memory).
3.12 - Comm –Communication Parameters
FuncEnab
→
No Param
No Parameters
Options
→
LBd
9600
[9600 / 19200 / 38400]
→
RBd
9600
[9600 / 19200]
→
Mod
8,n,1
[8,n,1 / 8,o,1 / 8,e,1]
→
RPr
Modbus
[IEC103 / Modbus]
TripLev
→
No Param
No Parameters
Timers
→
No Param
No Parameters
Description of variables
LBd
:
Local Baud Rate (Front panel RS232 communication speed)
RBd
:
Remote Baud Rate
(Rear panel terminal blocks RS485 communication speed)
Mod
:
Remote mode (communication parameters)
Note: Any change of this setting becomes valid at the next power on
RPr
:
Remote Protocol
3.13 - LCD –Display and Buzzer operation
FuncEnab
→
No Param
No Parameters
Options
→
Key
BeepON
[BeepOFF / BeepON]
→
BkL
Auto
[Auto / On]
TripLev
→
No Param
No Parameters
Timers
→
No Param
No Parameters
Description of variables
Key
:
Buzzer “Beep” on operation of Keyboard buttons.
BkL
:
LCD Backlight continuously “ON” or switched-on Automatically on operation of
Keyboard buttons.