MicroP XRF-2000 Series User manual

Operating
MANUAL
For XRF-2000 Series
Rev. 5.12
December 26, 2012

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XRF-2000 Series Operating Manual
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IMPORTANT –PLEASE READ THIS FIRST!
COPYRIGHT○
c2011 MicroP Co., Ltd. ALL RIGHT RESERVED
PLEASE READ CAREFULLY THE OPERATION AND
APPROPRIATE MAINTENANCE INSTRUCTIONS IN THIS
MANUAL BEFOREATTEMPTING TO OPERATE THE EQUIPMENT.
NOTWITHSTANDING MICRO PIONEER’S LIMITED WARRANTY,
MICRO PIONEER WILL NOTASSUME ANY LIABILITY FOR
INJURY, LOSS OR DAMAGE TO PERSONNEL, PROPERTY OR
TO THE EQUIPMENT IF IT IS NOT CONNECTED OR OPERATED
PROPERY.
SERVICE AND REPAIR OF THE SYSTEM SHOULD BE LIMITED
TO QUALIFIED PERSONNEL ONLY. THE SYSTEM MUST BE
DISCONNECTED FROM THE ELECTRICAL POWER SOURCE
BEFORE SERVICING.
MICRO PIONEER RESERVES THE RIGHT TO MAKE CHANGES
AND IMPROVEMENTS IF THE SYSTEM, AS WELLAS IN THE
SPECIFICATIONS AND DESCRIPTIONS PROVIDED IN THIS
MANUAL WITHOUT PRIOR NOTICE. FOR ADDITIONAL
INFORMATION, PLEASE CONTACT:
MicroP Co., Ltd.
RM# 704 Dae-Ryung Post Tower 6th
50-3 Kasan-Dong, Geumcheon-Gu, Seoul 153-715 Korea
www.micropioneer.com
TEL : [phone]
[e-mail]

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Table of Content
1. Introduction
1.1 System Purpose................................................................................. 6
1.2 Principles of Operation....................................................................... 7
1.3 Typical Specification........................................................................... 8
2. System Operation
2.1 Safety Considerations...................................................................... 10
2.2 Radiation Safety............................................................................... 11
2.3 Site Preparation................................................................................ 11
2.4 Software Installation......................................................................... 12
2.5 Drive Installation............................................................................... 13
2.5.1 Connect System to Computer................................................ 13
2.5.2 Install Drivers ......................................................................... 14
2.5.3 To Increase System Speed.................................................... 17
2.5 Running XRF-2000 Software ........................................................... 18
3. Main Window
3.1 File Menu ......................................................................................... 19
3.1.1 Config Window....................................................................... 19
3.1.2 Administrator Login ................................................................ 20
3.1.3 Exit......................................................................................... 21
3.2 Display ............................................................................................. 21
3.3 Cal.................................................................................................... 22
3.4 Etc.................................................................................................... 23
3.5 MicroP Co., Ltd................................................................................. 23
4. Main Toolbar
4.1 System Configuration....................................................................... 25
4.2 Set Limit ........................................................................................... 25
4.3 SET Measuring Time........................................................................ 25
4.4 View Statistic Window...................................................................... 26
4.4.1 File menu ............................................................................... 26
4.4.2 Print Menu.............................................................................. 27
4.4.3 Diff Block Menu...................................................................... 28
4.4.4 Setup Menu............................................................................ 29
4.5 Spectrum Window
4.5.1 Qualitative Analysis................................................................ 36
4.5.2 Editing and Manipulating Spectra........................................... 37
4.6 Camera Display Window.................................................................. 41
4.6.1 Sub Beam. ............................................................................. 42
4.6.2 Find beam Center .................................................................. 43
4.7 Stage Control Window...................................................................... 46
4.8 Periodic Table. ................................................................................. 46
4.9 2D&3D Measure Window................................................................. 47
4.9.1 2D(Step)................................................................................. 47

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4.9.2 2D(Point)................................................................................ 47
4.9.3 3D(Scan)................................................................................ 48
4.9.4 3D(Point)................................................................................ 48
4.10 Random Stage. .............................................................................. 49
4.11 Set Measuring Unit......................................................................... 49
4.12 Set Decimal Point........................................................................... 50
4.13 Cal File Select Window .................................................................. 50
4.14 Recalibration Window..................................................................... 51
4.15 New Calibration.............................................................................. 52
4.15.1 Thickness Calibration........................................................... 52
4.15.2 Quantitative Calibration........................................................ 56
4.15.3 Plating bath Calibration........................................................ 62
4.16 System Adjustment Window........................................................... 67
4.17 Focus Laser ................................................................................... 68
4.18 Lamp.............................................................................................. 68
4.19 Set Y Stage Auto Move.................................................................. 68
4.20 Auto Cycle Measurement............................................................... 68
4.21 Auto Cycle Number........................................................................ 68
5. How To Measure...................................................................................... 68
5.1 Loading Sample ............................................................................... 68
5.2 Adjust Focus. ................................................................................... 68
5.3 Select Cal File and Click Start Button............................................... 68
6. Maintenance............................................................................................. 69
7. Troubleshooting...................................................................................... 69
Appendix
A. X-RAY FLUORESCENCE (XRF)............................................................. 71
B. New Calibration for Disk........................................................................ 73
C. New calibration for RoHS...................................................................... 80
D. Calibration for CSFP.............................................................................. 85

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1. Introduction
1.1 System Purpose
XRF-2000 systems are designed to measure the thickness of multi
coating elements or detect the elements in analyzed samples and
determine their concentrations using X-Ray fluorescence (XRF).
The analysis performed by XRF-2000 series can by divided into three
categories:
Thickness measurement –measure the thickness of multilayer
coating
Qualitative analysis –Identification of the elements in a sample
and inspection of the acquired spectra on a comparative basis.
Quantitative analysis –Quantitative determination of the
concentrations of the elements in a sample. This is performed
after carrying out calibration procedures, using a pre-analyzed set
of standards and empirical models, or via the fundamental
parameters method.
The system software (XRayV5) runs under Windows XP, Vista or higher.
XRF-2000 Series

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1.2 Principles of Operation
XRF-2000 Series systems utilize the phenomenon that when a sample is
irradiated with x-ray radiation, the sample’s atoms are excited. As the
atoms return to their stable state, they emit x-ray photons (X-ray
Fluorescence –XRF).
Each element has its distinct characteristic emission lines. The energy of
these lines are documented in tables and stored in the computer’s
memory. A given sample’s elements are identified by comparing the lines
in the acquired spectrum to the corresponding element lines listed in the
system’s database.
The intensity (magnitude) of the element’s lines in the acquired spectrum
is related to its concentration or thickness. Increasing the concentration
or thickness of an element result is an increase in the intensity of the
fluorescent radiation characteristic of that element. By using empirical or
theoretical physical models, the system can provide precise qualitative
and quantitative analysis or thickness measurement.
XRF-2000 Series systems employ a proportional counter or Si PIN diode
detector to detect x-rays emitted from the sample. These detectors are
capable of acquiring a spectrum containing many lines from many
elements simultaneously. The counters or detectors convert the x-ray
photons to proportional electric pulses. These signals are amplified and
converted into a digital form by the Analog-to-Digital Converter (ADC).
The data of the accumulated spectra are stored and displayed on the
computer’s monitor as a spectra histogram.
Besides characteristic lines, any observed spectrum also contains
background signals, their characteristic dependent on many factors,
especially excitation conditions. In order to reduce background and
increase useful signal, X-ray high voltage and emission current can be
varied, as well as utilizing changeable special filters. All these allow
optimizing the spectrum of exciting X-ray beam for any given application.
ED-XRF analysis tools enjoy the following advantages:
Broad concentration range from ppm (mg/Kg) levels up to 100%.
Sensitivity to all the elements in the periodic table from
Magnesium to Uranium.
Fast response: Typical analysis time is usually under a few
minutes.
Simultaneous analysis of many elements.
Non-destructive: The X-ray radiation does not leave any effects in
the sample after analysis. Rare or precious samples are well as
calibration standards can be tested an unlimited number of times
without losing any of their authentic properties.
Flexibility of sample form: The sample may be in solid, powder,

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liquid or thin film form; or even be a few layers of elements plated
on a thick base substrate. In most cases, samples are analyzed
with minimal preparations.
1.3 TYPICAL SPECIFICATIONS
Input Power
115/220 VAC, 50/60Hz, 150W (maximum) Typically 220VAC 0.5A
Power Cable
The power cable will be supplied by the local MP representative to meet
IEC 224 or IEC 245 standards.
The inner wire diameter should be at least 0.75mm.
Fuse
On the Main Power: 2A
Power On/Off Switch
Once the AC input cable is connected from the system to the wall,
system power up and shut-down should be done using the On/Off switch
on the front right side of the system.
Connect to PC
Only one connection by USB Cable
XRF-2000
USB Cable
XRF-2000Series PC
XRF-2000 Series

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2. System Operation
2.1 Safety Considerations
Standard Procedures
All standard safety procedures for operating electrical machinery should
apply to spectrometers of this series.
Each system is intended to be operated only as indicated in its Operation
Manual.
Maintenance work inside the machine should be performed only by
authorized personnel.
Power Source
This product is intended to operate from a power source that does not
supply more than 230 volts RMS (in 220 volt version) or 120 volts RMS
(in 115 volt version) between either supply conductors or between supply
conductor and ground. A protective ground connection by way of the
grounding conductor in the power cord is essential for safe operation.
Grounding the Product
This product is grounded through the grounding conductor of the power
cord. To avoid electrical shock, plug the power cord into a properly wired
receptacle before connecting to the product input or output terminals. A
protective ground connection by way of grounding conductor in the
power cord is essential for safe operation.
Danger arising from loss of Ground
Upon loss of the protective ground, all accessible conductive parts
(including knobs and controls that may appear to be insulated) can
render an electric shock.
Use the proper power cord
Use only the power cord and connector specified for your product and
valid in the country where the machine in installed. Make sure that both
are in good condition and do not use extension cables.
Use the proper fuse
To avoid fire hazard, use only a fuse of the correct type, voltage rating
and current rating as specified.