National Semiconductor CLINK3V28BT-85 User manual

Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 1 of 28
Channel Link Demonstration Kit
User Manual
P/N CLINK3V28BT-85
Rev 2.1
Interface Products

Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 2 of 28
Table of Contents
INTRODUCTION ............................................................................................................ 3
CONTENTS OF DEMO KIT............................................................................................ 4
APPLICATIONS ............................................................................................................. 4
FEATURES AND EXPLANATIONS.................................................................................
TRANSMITTER................................................................................................................ 6
RECEIVER ................................................................................................................... 11
HOW TO HOOK UP THE DEMO BOARDS (OVERVIEW) ............................................ 5
TRANSMITTER BOARD ................................................................................................ 6
SELECTABLE JUMPER SETTINGS FOR THE TX BOARD ........................................................ 6
LVDS MAPPING BY IDC CONNECTOR ............................................................................. 6
TX OPTIONAL: PARALLEL TERMINATION FOR TXIN........................................................... 9
BOM (BILL OF MATERIALS) .......................................................................................... 10
RECEIVER BOARD ..................................................................................................... 11
SELECTABLE JUMPER SETTINGS FOR THE RX BOARD ..................................................... 12
LVDS MAPPING BY IDC CONNECTOR ........................................................................... 13
RX OPTIONAL: SERIES TERMINATION FOR RXOUT ......................................................... 14
BOM (BILL OF MATERIALS) .......................................................................................... 15
TROUBLESHOOTING ................................................................................................. 19
ADDITIONAL INFORMATION...................................................................................... 20
APPLICATION NOTES .................................................................................................... 20
APPENDIX ................................................................................................................... 21
26-MINI D CABLE AND CONNECTOR ............................................................................... 21
TRANSMITTER AND RECEIVER SCHEMATICS ................................................................... 28

Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 3 of 28
Introduction:
National Semiconductor - Interface Products Group Channel Link evaluation kit
contains a Transmitter (Tx) board, a Receiver (Rx) board along with interfacing
cables. This kit will demonstrate the Channel Link chipset transmitting data streams
using Low Voltage Differential Signaling (LVDS).
The Transmitter board accepts LVTTL/LVCMOS data signals from an incoming data
source along with the clock signal. The LVDS Transmitter converts the
LVTTL/LVCMOS parallel lines into four serialized LVDS data pairs plus a LVDS
clock. The serial data streams toggle at 3.5 times the clock rate.
The Receiver board accepts the LVDS serialized data streams plus clock and
converts the data back into parallel LVTTL/LVCMOS data signals and clock.
The user simply needs to provide the proper LVTTL/LVCMOS data input and clock
to the Transmitter and the chipset will serialize, transmit, and deserialize the data
converting it back into the LVTTL/LVCMOS parallel bus plus clock. A power down
feature is also provided that reduces current draw when the link is not required.

Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 4 of 28
Contents of the Evaluation Kit:
1) One Transmitter board with the DS90CR287MTD - 28 bit Transmitter
2) One Receiver board with the DS90CR288AMTD - 28 bit Receiver
3) One 2-meter Amphenol Spectra Strip Cable interface
4) One 60-pin IDC Flat Ribbon Cable
5) Evaluation Kit Documentation (this manual)
6) DS90CR287/288A Datasheet
7) Channel Link Application Notes AN-1041 and AN-1108
Channel Link Typical Application:
PCB
PCB
SHIELD
LVDS Cable
(media dependent)
GND
RxCLK
TX
DS90CR287
RX
DS90CR288A
RxOUT
0
1
2
25
26
27
TxIN
0
1
2
25
26
27
TxCLK
/PD /PD
LVCMOS/
LVTTL
The diagram above illustrates the use of the Channel Link chipset (Tx/Rx). This
chipset is able to transmit 28 bits of LVTTL/LVCMOS data using four LVDS channels
for a total throughput of 2.38 Gbps (297.5 Mbytes/s).
Input clock rate is specified to be between 20 MHz to 85 MHz maximum. The
interconnect between the two devices may be a variety of media including: twisted
pair cables, twin-ax cables, and / or backplanes for example. Driving between the
two devices is a function of interconnect skew and clock rate. Distances up to ten
meters are possible at the lower clock rates and distances of 1 to 2 meters is
possible at the higher clock rates. Please refer to the chipset datasheet for more
information and parametric tables.

Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 5 of 28
How to set up the Evaluation Kit:
The PCB routing for the Tx input pins (TxIN) have been laid out to accept incoming
data from a 60-pin IDC connector. The TxOUT/RxIN interface uses the 3M MDR
connector and Spectra Strip cable. This typical cable provides minimal skew
between LVDS channels and can typically support longer lengths than atwisted pair
cable. Please follow these steps to set up the evaluation kit for bench testing and
performance measurements:
1) Connect one end of the Spectra Strip cable to the transmitter board and the other
end to the receiver board. This is a standard pinout cable, longer lengths are
available for purchase from Alliance Technology – see www.alliancet.com
2) Jumpers have been configured at the factory, they should not require any
changes for operation of the chipset. See text on Jumper settings for more
details.
3) For the incoming data, connect a flat (ribbon) cable to the transmitter board to a
data source (signal generator, pattern generator, BERT tester, etc). Connect the
60-pin flat cable from the receiver board to the receiver load (BERT or other
equipment). Scope probes may also be connected directly to the pins if desired.
Mini-coax cable with headers on one end may also be used. This type of cable is
supplied with some test equipment. The 60-pin IDC equipment interface cable is
supplied with this kit which can be used to build custom cables.
4) Power for the Tx and Rx boards must be supplied externally through TP1 (Vcc).
Grounds for both boards are connected through TP2 (GND) (see section below).
5) Data applied to the inputs is now serialized, transmitted, deserialized and re-
driven at the receiver outputs.
This evaluation kit can also be used to evaluate the performance of other National
Semiconductor’s 28-bit and 21-bit Channel Link Serdes chipset. Simply replace the
existing DS90CR287/288A devices with a different 28-bit or 21-bit device chipset
and follow the above procedure. For evaluation of 21-bit device chipset, user needs
to pull TxIN[21:27] high or low.
Power Connection:
The Transmitter and Receiver boards must be powered by supplying power
externally through TP1 (Vcc) and TP2 (GND) on EACH board. Information on
maximum supply voltage can be found on device datasheet’s Absolute Maximum
Ratings section. The maximum voltage that should ever be applied to the Channel
Link Transmitter (DS90CR287) or Receiver (DS90CR288A) Vcc terminal is +4V
MAXIMUM.

Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 6 of 28
Channel Link Transmitter Board Description:
J1 (60 position) accepts 28 bit LVTTL/LVCMOS data, clock and also the PD* control
signal.
The Channel Link Transmitter board is powered externally. For the transmitter to be
operational, the Power Down pin must be set HIGH with a jumper.
The 3M MDR connector (J2) provides the interface for LVDS signals for the
Receiver board.
Vcc and Gnd MUST be
applied externally here
1 2
GND TXIN0
GND TXIN1
GND TXIN2
GND TXIN3
GND TXIN4
GND TXIN5
GND TXIN6
GND TXIN7
GND TXIN8
GND TXIN9
GND TXIN10
GND TXIN11
GND TXIN12
GND TXIN13
GND TXIN14
GND TXIN15
GND TXIN16
GND TXIN17
GND TXIN18
GND TXIN19
GND TXIN20
GND TXIN21
GND TXIN22
GND TXIN23
GND TXIN24
GND TXIN25
GND TXIN26
GND TXIN27
GND TXCLKIN
GND GND
59 60
J1 /PD
J2
Pin 26
Pin 14
Pin 1
Pin 13
NC OUT0-
GND OUT0+
NC NC
OUT1- GND
OUT1+ NC
OUT2- GND
OUT2+ NC
NC NC
NC CLK-
GND CLK+
NC NC
OUT3- GND
OUT3+ NC
TxOUT LVDS signals
3M MDR connector
60-pin IDC Connector
Note: JP1 is not used

Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 7 of 28
Jumper Settings for the Tx Board
Jumper Purpose Settings
/PD PowerDown = ON = OFF
(JP2) Vcc GND Vcc GND
(ON: Tx is operational; OFF: Tx powers down)
Default setting is JP2 set HIGH (to Vcc), operational mode.

Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 8 of 28
Tx LVDS Mapping by IDC Connector
The following two figures illustrate how the Tx inputs are mapped to the IDC
connector (J1) (Note – labels are also printed on the demo boards). The 26-pin
MDR connector pinout is also shown.
TX
OU
T2
TX
OU
T
0
6059
2
Pin 1
TX
OU
T
0
GND TXIN0
GND TXIN1
GND TXIN2
GND TXIN3
GND TXIN4
GND TXIN5
GND TXIN6
GND TXIN7
GND TXIN8
GND TXIN9
GND TXIN10
GND TXIN11
GND TXIN12
GND TXIN13
GND TXIN14
GND TXIN15
GND TXIN16
GND TXIN17
GND TXIN18
GND TXIN19
GND TXIN20
GND TXIN21
GND TXIN22
GND TXIN23
GND TXIN24
GND TXIN25
GND TXIN26
GND TXIN27
GND TXCLKIN
GND GND
J1
TX
OU
T
3
TX
OU
T1
TX
OU
T2
60-pin IDC Connector
(Transmitter Board)
Previous Cycle Next Cycle
TXOUT3
TXOUT2
TXOUT1
TXOUT0
TXCLKOUT
TXIN23 TXIN17 TXIN16 TXIN11 TXIN10 TXIN5 TXIN27
TXIN26 TXIN25 TXIN24 TXIN22 TXIN21 TXIN20 TXIN19
TXIN18 TXIN15 TXIN14 TXIN13 TXIN12 TXIN9 TXIN8
TXIN7 TXIN6 TXIN4 TXIN3 TXIN2 TXIN1 TXIN0
TX
OU
T1
TX
OU
T1
PIN # NAME
1NC
2GND
3NC
4OUT1-
5OUT1+
6OUT2-
7OUT2+
8NC
9NC
10 GND
11 NC
12 OUT3-
13 OUT3+
14 OUT0-
15 OUT0+
16 NC
17 GND
18 NC
19 GND
20 NC
21 NC
22 CLK-
23 CLK+
24 NC
25 GND
26 NC
J2
TxOUT LVDS signals
3M MDR connector
Parallel LVTTL/LVCMOS Data Inputs Mapped to LVDS Outputs

Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 9 of 28
Tx Board Options: 50 Ohm Termination for TxIN
On the Tx demo board, the 29 inputs have an option for 50 Ohm terminations.
There are 0402 pads for this purpose. One side is connected to the signal line and
the other side is tied to ground. These pads are unpopulated from the factory but
are provided if the user needs to install a 50 Ohm termination. R1 TO R28 are
associated with the Tx data input lines. R29 is associated with CLKIN. Some test
equipment may require a 50 Ohm load.
Mapping of Transmitter Inputs for the Optional Termination Resistors is shown
below:
Tx Pin
Names
Tx Pin
Number
Termination
Resistor
TxIN0 51 R1
TxIN1 52 R2
TxIN2 54 R3
TxIN3 55 R4
TxIN4 56 R5
TxIN5 2 R6
TxIN6 3 R7
TxIN7 4 R8
TxIN8 6 R9
TxIN9 7 R10
TxIN10 8 R11
TxIN11 10 R12
TxIN12 11 R13
TxIN13 12 R14
TxIN14 14 R15
TxIN15 15 R16
TxIN16 16 R17
TxIN17 18 R18
TxIN18 19 R19
TxIN19 20 R20
TxIN20 22 R21
TxIN21 23 R22
TxIN22 24 R23
TxIN23 25 R24
TxIN24 27 R25
TxIN25 28 R26
TxIN26 30 R27
TxIN27 50 R28
TxCLKIN 31 R29
50 Ohm Termination
(Optional)
TX

Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 10 of 28
BOM (Bill of Materials) Transmitter PCB:
HSL Demo Board Schematic REV1
HSL8TXR1 Revision: 1 Channel Link
Item Qty Reference Part Pkg Size
1 1 C1 10 µF CASE D
2 4 C2,C6,C10,C14 0.1 µF 1206 (3216)
3 4 C3,C7,C11,C15 22 µF 7343 (D)
4 3 C4,C8,C12 0.001 µF 0805 (2012)
5 3 C5,C9,C13 0.01 µF 0805 (2012)
6 2 JP2 3_PIN_HEADER 0.1" spacing
7 1 J1 IDC30X2 IDC60
8 1 J2 3M_MDR 26MDR
9 29 R1,R2,R3,R4,R5,R6,R7,R8, Optional 0402 PAD
R9,R10,R11,R12,R13,R14,
R15,R16,R17,R18,R19,R20,
R21,R22,R23,R24,R25,R26,
R27,R28,R29
10 8 R30,R32,R33,R34,R35, 0 Ohm 0402
R36,R37
11 2 TP1,TP2 N/A TP_.2"X.2"
12 1 U1 DS90CR287MTD 56-pin TSSOP