Orbotech DP-100SL Operating instructions

DP-100SL™
Site Preparation Guide
October 2003
Revision A

NOTICE
This document and the information contained herein belong to Orbotech Ltd.
(“Orbotech”) and may be used only as authorized by Orbotech in writing. No
part of this publication may be reproduced in any way without the prior
written consent of Orbotech.
Orbotech makes no representations or warranties with respect to the contents
hereof. Any and all implied warranties of fitness for particular purpose, other
than as specified in this manual, are hereby expressly disclaimed.
This document is subject to change without notice.
Catalog No. 0353444A
Orbotech® is a registered trademark of Orbotech Ltd.
The Orbotech and DP-100SL names are trademarks of LIS GmbH and
Orbotech Ltd. Other brand and product names referred to herein are the
trademarks of their respective owners.
Published by: Corporate Customer Support
Technical Publications Dept.
Orbotech, Ltd.
© 2003 Orbotech Ltd. All rights reserved.

The DP-100SL system is manufactured by Laser Imaging Systems GmbH & Co. KG,
Prüssingstraße 41, 07745 Jena, Germany, and by Orbotech Ltd., P.O. Box 215, Yavne, Israel
81002. The system complies with the following standards:
EN 60825, EN 60204
21 CFR CH.I (4-1-92 EDITION) & 1040.10
The DP-100SL system is a Class 1 laser product.

DP-100SL v
Site Preparation Guide
Table of Contents
1 - Introduction.............................................................................1
About This Guide ...................................................................................................1
About the DP-100SL™ ..........................................................................................1
Intended Use ..........................................................................................................3
Safety Considerations .............................................................................................3
Caring for Your System ..........................................................................................7
Noise Level .............................................................................................................7
2 - DP-100SL Physical Description .............................................9
Configuration .........................................................................................................9
Size and Weight ...................................................................................................10
Hose Lengths ........................................................................................................11
3 - Facility Physical Requirements ............................................13
Safety Requirements ............................................................................................13
Height Requirements ............................................................................................15
Floor Area ............................................................................................................16
Access — Doors and Hallways ..............................................................................17
Floors, Walls, Ceilings and Furniture ....................................................................17
Yellow Room Illumination ....................................................................................18
4 - Environment & Climate .......................................................23
Clean Room .........................................................................................................23
Climate Control ....................................................................................................23
5 - Electricity ...............................................................................27
Power Requirements ............................................................................................27
Grounding ............................................................................................................28

vi Table of Contents
Voltage Transients ............................................................................................... 28
Electrical Protection ............................................................................................. 30
Power Connectors ............................................................................................... 30
6 - Vacuum Pump.......................................................................31
7 - Communication ....................................................................33
Phone Lines ......................................................................................................... 33
Network .............................................................................................................. 33
8 - Air...........................................................................................35
Compressed Air ................................................................................................... 35
9 - Shipment and Delivery......................................................... 37
Shipping Information and Responsibility .............................................................. 37
Crates .................................................................................................................. 37
Equipment ............................................................................................................ 38
Personnel ............................................................................................................. 38
Clearances ........................................................................................................... 38
A - Approved Materials .............................................................39
Dry Film Resists ................................................................................................. 39
Films ..................................................................................................................... 41
Proof Materials .................................................................................................... 41
B - Customer Site Preparation Checklist................................43

DP-100SL 1
Site Preparation Guide
Chapter 1
Introduction
About This Guide
This guide provides site preparation information for the DP-100SL. It is
the customer's responsibility to ensure that the site at which the system is
installed conforms to all instructions and guidelines described in this
document, so as to enable proper system installation and full system
performance.
Please contact the local Orbotech representative with any questions
regarding the site preparation procedure.
About the DP-100SL™
The DP-100SL is a laser direct imaging system that receives PCB data
from CAM workstations and plots it directly on resist-coated panels.
Loading and unloading of the PCBs is done manually. The standard
configuration is a standalone system, as illustrated in Figure 1.1.

2Chapter 1
Introduction
The DP-100SL is capable of exposing large format images on inner and
outer layers, SBU and flex PCBs, printing highly accurate 2 mil lines and
spaces at ¼mil resolution.
The system is compatible with the existing production processes, operating
in a yellow room environment; it can expose all UV-sensitive dry or liquid
resists, with a wide range of substrate thicknesses. Clean room conditions
prevail in the internal imaging area of the system, ensuring that both the
panels and the optical elements are not contaminated during the printing
process.
Figure 1.1 DP-100SL Laser Direct Imaging System

DP-100SL 3
Site Preparation Guide
Intended Use
The DP-100SL is intended for the manufacturing of printed circuit boards.
It is designed to allow exposure of UV-sensitive resists, films, and similar
materials typical of the circuit board industry. However, because of the
numerous interrelations between substrate and laser imaging as the
exposing technique, the system may only be used with such UV-sensitive
materials that have been specifically approved by the manufacturer.
Approved materials are listed in Appendix A— Approved Materials.
Substrate dimensions with resist:
• max. substrate size 660.4 mm x 812.8 mm (26" x 32")
• max. exposable area 609.6 mm x 812.8 mm (24" x 32")
• max. substrate thickness 5 mm (0.196")
The machine must not be used in any way other than specified in this
manual or in the DP-100SL User Guide.
Safety Considerations
The DP-100SL is a Class 1 laser product containing high-voltage power
supplies and laser light sources. There is no danger to persons or
equipment when the system is operated in accordance with the directions
provided by Orbotech in this and other publications. All high-voltage
power supplies and laser sources are located behind protective panels.
During system service, with panels removed, the system may reach Class
4 laser radiation. Under those conditions, the imager room should have
fireproof walls and furniture and should be locked from the inside. During
service a red warning light on the outside of the room should be activated,
and all personnel in the vicinity of the system must wear protective
goggles. For a description of the safety requirements in the site, refer to
Chapter 3— Facility Physical Requirements.

4Chapter 1
Introduction
Do not remove any of the system’s protective panels.
Professional heavy-equipment movers should be employed to unload the
system and transfer it to the site. The customer is responsible for providing
necessary equipment such as forklifts with extra extension or cranes for
the unloading and unpacking of the equipment. Size and weight of system
units is listed in Table 2.1 on page 10.
System installation, disassembly, maintenance and repair must be
performed only by authorizes Orbotech customer support engineers, in
order to comply with all applicable safety requirements regarding the use
of laser devices.
Laser Safety
The DP-100SL system is classified as a Class 1 laser product, in
compliance with EN60825-1 standard.
Laser Definition
A Coherent Paladin 355-4 class 4 laser is used as main light source.
The Paladin is a 355 nm diode (UV) pumped solid-state mode-locked laser,
with the following specifications: