Panasonic SDR-S26P User manual

©Panasonic Corporation 2009. Unauthorized
copying and distribution is a violation of law.
Model No.SDR-S26P
SDR-S26PC
SDR-S26EG
SDR-S26EE
SDR-S26EB
SDR-S26EP
SDR-S26EF
SDR-S26EC
SDR-S26GC9
SDR-S26GN
SDR-S26GJ
SDR-S26GK
SDR-S26PU
SDR-S26PR
SDR-S26GT
VOL.2
Colours
(K)........Black Type
(N)........Gold Type (except SDR-S26EF)
(A)........Blue Type (except SDR-S26EE/PR/GK)
(R)........Red Type (except SDR-S26EE/GT/PR)
SD Card Video Camera
ORDER NO.VM0901010CE
B27

1 Safety Precaution 3
1.1. General Guidelines 3
2 Warning 4
2.1. Prevention of Electrostatic Discharge (ESD) to
Electrostatic Sensitive (ES) Devices 4
2.2. Service caution based on legal restrictions 5
2.3. Caution for AC Cord (For EB/GC9) 6
3 Specifications 7
4 Service Mode 8
4.1. Service Menu 8
4.2. About Default Setting 10
5 Service Fixture & Tools 11
5.1. Service Tools and Equipment 11
6 Measurements and Adjustments 12
6.1. Service Positions 12
6.2. Location for Connectors of the Main P.C.B. and Sub
P.C.B. 14
6.3. Location for CSP IC 痴of the Main P.C.B. and Sub P.C.B.
16
6.4. Temperature Profile for Heat Resistance of CSP IC 18
7 Block Diagrams 19
7.1. POWER SUPPLY BLOCK DIAGRAM 19
7.2. CAMERA DRIVE BLOCK DIAGRAM 20
7.3. LENS DRIVE BLOCK DIAGRAM 21
7.4. SYSTEM CONTROL BLOCK DIAGRAM 22
7.5. AUDIO/VIDEO BLOCK DIAGRAM 23
7.6. MONITOR BLOCK DIAGRAM 24
8 Schematic Diagrams 25
8.1. MAIN (MAIN CONNECTION (1/4)) SCHEMATIC
DIAGRAM 25
8.2. MAIN (MAIN CONNECTION (2/4)) SCHEMATIC
DIAGRAM 26
8.3. MAIN (MAIN CONNECTION (3/4)) SCHEMATIC
DIAGRAM 27
8.4. MAIN (MAIN CONNECTION (4/4)) SCHEMATIC
DIAGRAM 28
8.5. MAIN (MEMORY) SCHEMATIC DIAGRAM 29
8.6. MAIN (TG/AFE) SCHEMATIC DIAGRAM 30
8.7. MAIN (RESIZE) SCHEMATIC DIAGRAM 31
8.8. MAIN (KAO) SCHEMATIC DIAGRAM 32
8.9. MAIN (LENS DRIVE (1/4)) SCHEMATIC DIAGRAM 33
8.10. MAIN (LENS DRIVE (2/4)) SCHEMATIC DIAGRAM 34
8.11. MAIN (LENS DRIVE (3/4)) SCHEMATIC DIAGRAM 35
8.12. MAIN (LENS DRIVE (4/4)) SCHEMATIC DIAGRAM 36
8.13. MAIN (VIDEO (1/4)) SCHEMATIC DIAGRAM 37
8.14. MAIN (VIDEO (2/4)) SCHEMATIC DIAGRAM 38
8.15. MAIN (VIDEO (3/4)) SCHEMATIC DIAGRAM 39
8.16. MAIN (VIDEO (4/4)) SCHEMATIC DIAGRAM 40
8.17. MAIN (USB HOST) SCHEMATIC DIAGRAM 41
8.18. MAIN (AVIO) SCHEMATIC DIAGRAM 42
8.19. MAIN (LCD) SCHEMATIC DIAGRAM 43
8.20. MAIN (SUB-POWER) SCHEMATIC DIAGRAM 44
8.21. MAIN (MIC) SCHEMATIC DIAGRAM 45
8.22. SUB (SUB CONNECTION (1/4)) SCHEMATIC DIAGRAM
46
8.23. SUB (SUB CONNECTION (2/4)) SCHEMATIC DIAGRAM
47
8.24. SUB (SUB CONNECTION (3/4)) SCHEMATIC DIAGRAM
48
8.25. SUB (SUB CONNECTION (4/4)) SCHEMATIC DIAGRAM
49
8.26. SUB (SYSCON (1/4)) SCHEMATIC DIAGRAM 50
8.27. SUB (SYSCON (2/4)) SCHEMATIC DIAGRAM 51
8.28. SUB (SYSCON (3/4)) SCHEMATIC DIAGRAM 52
8.29. SUB (SYSCON (4/4)) SCHEMATIC DIAGRAM 53
8.30. SUB (SUB SYSCON) SCHEMATIC DIAGRAM 56
8.31. SUB (CHARGE) SCHEMATIC DIAGRAM 57
8.32. SUB (POWER (1/4)) SCHEMATIC DIAGRAM 58
8.33. SUB (POWER (2/4)) SCHEMATIC DIAGRAM 59
8.34. SUB (POWER (3/4)) SCHEMATIC DIAGRAM 60
8.35. SUB (POWER (4/4)) SCHEMATIC DIAGRAM 61
9 Printed Circuit Board 63
9.1. MAIN P.C.B. (COMPONENT SIDE) 63
9.2. MAIN P.C.B. (FOIL SIDE) 64
9.3. MAIN P.C.B. ADDRESS INFORMATION 65
9.4. SUB P.C.B. (COMPONENT SIDE) 66
9.5. SUB P.C.B. (FOIL SIDE) 67
9.6. SUB P.C.B. ADDRESS INFORMATION 68
10 Appendix Information of Schematic Diagram 69
10.1. Checking Point Table of the CSP IC 69
10.2. Waveform Table of the CSP IC 85
10.3. Abbreviations 91
11 Parts and Exploded Views 96
11.1. Replacement Parts List 96
CONTENTS
Page Page
2
SDR-S26P

1 Safety Precaution
1.1. General Guidelines
1. IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by in the
Schematic Diagrams, Circuit Board Layout, Exploded Views and Replacement Parts List. It is essential that these critical parts
should be replaced with manufacturer’s specified parts to prevent X-RADIATION, shock fire, or other hazards. Do not modify
the original design without permission of manufacturer.
2. An Isolation Transformer should always be used during the servicing of AC Adaptor whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury
from electrical shocks. It will also protect AC Adaptor from being damaged by accidental shorting that may occur during
servicing.
3. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
4. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
5. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
3
SDR-S26P

2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
4
SDR-S26P

2.2. Service caution based on legal restrictions
2.2.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
· The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
· To put lead free solder, it should be well molten and mixed with the original lead free solder.
· Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
· Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt
the lead free solder.
· Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
degrees C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
· The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01KS-----------(0.3mm 100g Reel)
RFKZ06D01KS-----------(0.6mm 100g Reel)
RFKZ10D01KS-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
5
SDR-S26P

2.3. Caution for AC Cord
(For EB/GC9)
2.3.1. Information for your safety
IMPORTANT
Your attention is drawn to the fact that recording of pre-
recorded tapes or discs or other published or broadcast
material may infringe copyright laws.
WARNING
To reduce the risk of fire or shock hazard, do not expose
this equipment to rain or moisture.
CAUTION
To reduce the risk of fire or shock hazard and annoying
interference, use the recommended accessories only.
FOR YOUR SAFETY
DO NOT REMOVE THE OUTER COVER
To prevent electric shock, do not remove the cover. No user
serviceable parts inside. Refer servicing to qualified service
personnel.
2.3.2. Caution for AC mains lead
For your safety, please read the following text carefully.
This appliance is supplied with a moulded three-pin mains plug
for your safety and convenience.
A 5-ampere fuse is fitted in this plug.
Should the fuse need to be replaced please ensure that the
replacement fuse has a rating of 5 amperes and it is approved
by ASTA or BSI to BS1362
Check for the ASRA mark or the BSI mark on the body of the
fuse.
If the plug contains a removable fuse cover you must ensure
that it is refitted when the fuse is replaced.
If you lose the fuse cover, the plug must not be used until a
replacement cover is obtained.
A replacement fuse cover can be purchased from your local
Panasonic Dealer.
If the fitted moulded plug is unsuitable for the socket outlet in
your home then the fuse should be removed and the plug cut
off and disposed of safety.
There is a danger of severe electrical shock if the cut off plug
is inserted into any 13-ampere socket.
If a new plug is to be fitted please observe the wiring code as
shown below.
If in any doubt, please consult a qualified electrician.
2.3.2.1. Important
The wires in this mains lead are coloured in accordance with
the following code:
Blue Neutral
Brown Live
As the colours of the wires in the mains lead of this appliance
may not correspond with the coloured markings identifying the
terminals in your plug, proceed as follows:
The wire which is coloured BLUE must be connected to the
terminal in the plug which is marked with the letter N or
coloured BLACK.
The wire which is coloured BROWN must be connected to the
terminal in the plug which is marked with the letter L or coloured
RED.
Under no circumstances should either of these wires be
connected to the earth terminal of the three pin plug, marked
with the letter E or the Earth Symbol.
2.3.2.2. Before use
remove the Connector Cover as follows.
2.3.2.3. How to replace the Fuse
1. Remove the Fuse Cover with a screwdriver.
2. Replace the fuse and attach the Fuse cover.
6
SDR-S26P

3 Specifications
7
SDR-S26P

4 Service Mode
4.1. Service Menu
When abnormal detection contents are confirmed, do the following operation. Automatic diagnosis code will bedisplayed. (Service
Menu)
To enter the Service Menu
1. Turn the Power on and set the Mode Dial to [VIDEO RECORDING MODE].
2. Push the [OIS], [JOYSTICK CONTROL LEFT] and [iA] simultaneously for 3 seconds (with no SD Card inserted).
Note:
If a SD Card is inserted, the above operation will not work.
Fig. 1-1
Note:
Only perform items 2, 3, 4 and 9 in the Service Menu.
To select the Item of Service Menu
1. Press [JOYSTICK CONTROL UP/DOWN] to select item [2], [3], [4] and [9].
2. Press [JOYSTICK CONTROL RIGHT] to display [YES/NO] screen.
3. Press [JOYSTICK CONTROL UP/DOWN] to select [YES].
4. Press [JOYSTICK CONTROL CENTER] to enter.
<How to exit Service Menu>
Set Mode dial to [OFF] position.
8
SDR-S26P

Fig. 1-2
Fig. 1-3
9
SDR-S26P

4.2. About Default Setting
The data of Menu, Mode, Card and EEPROM setting, etc. is set to the default condition in factory.
4.2.1. How to set the Default Setting
1. Turn the Power on and set the Mode Dial to [VIDEO RECORDING MODE].
2. When pressing [OIS], [JOYSTICK CONTROL RIGHT] and [iA] for more than 3 minutes simultaneously (with no SD Card
inserted), the items below are set to the Default Setting.
1. Menu, Mode, Adjusted Value
2. Card format (when SD Card is in the SD Slot)
3. Reset of picture files and directory number (Set the picture record file number to 1)
4. Clear the information of Mechanism Lock
5. Set the time setting to no-setting
3. Default Setting was set and “END“ is displayed.
4. Set Mode dial to [OFF] position to exit from this mode.
10
SDR-S26P

5 Service Fixture & Tools
5.1. Service Tools and Equipment
11
SDR-S26P

6 Measurements and Adjustments
6.1. Service Positions
6.1.1. List of the extension cables
Use the following extension cables when checking or adjusting individual circuit boards except module Parts (Main P.C.B. and Sub
P.C.B.).
12
SDR-S26P

6.1.2. Checking and repairing individual circuit boards
How to use extension cables.
13
SDR-S26P

6.2.1. Main P.C.B.
6.2. Location for Connectors of the Main P.C.B. and Sub P.C.B.
14
SDR-S26P

6.2.2. Sub P.C.B.
15
SDR-S26P

6.3. Location for CSP IC’s of the Main P.C.B. and Sub P.C.B.
6.3.1. Main P.C.B.
Make sure to install CSP IC in the correct position of the Main P.C.B. as shown.
16
SDR-S26P

6.3.2. Sub P.C.B.
Make sure to install CSP IC in the correct position of the Sub P.C.B. as shown.
17
SDR-S26P

6.4.1. IC Temperature Profile (IC3202,
IC6001, IC3203)
6.4.2. IC Temperature Profile (IC302)
6.4.3. IC Temperature Profile (IC401)
6.4.4. IC Temperature Profile (IC501)
6.4.5. IC Temperature Profile (IC701)
6.4.6. IC Temperature Profile (IC3001)
6.4.7. IC Temperature Profile (IC3301)
6.4.8. IC Temperature Profile (IC3502)
6.4. Temperature Profile for Heat Resistance of CSP IC
When using equipment other than the Pre-Heater, refer to the temperature profile.
CSP ICs for Model of SDR-S26 have the following temperature profile.
18
SDR-S26P

7 Block Diagrams
7.1. POWER SUPPLY BLOCK DIAGRAM
H
Q1361,Q1362
P ON
POW RST
REF 1.5V
CAM 7.5V
CAM 12V
REG D1.8V
LCD 8.5V POWER
LCD BL 5V
CONTROL
POWER
IC1321
REGULATOR
+3.3V
A3V
REG D3V
AF 3V
SPK 3V
REG D1.2V
REG A5V
LIGHT REG
AF 5V
NOREG
IC1001
(DC-DC CONVERTER)
Q1002
Q1001
CONTROL
POWER
Q1081
TP1
TP117
TP114
TP108
TP104
TP110
TP118
TP101
TP3
TP93
TP10
RT
SCP
HX1
HX2
STB234
STB56
STB1
HS6H
PVCC5
C+L
C+H
VREGA
TP51
TP11
REGD 3.3V
TP21
PW +B
Q1003
HCCD ON
PW +B CH1
POW VREF
TP62
TP41
TP71
REG D1.9V
TP91
TP81
4
27
LX4
3HX4
14VOUT2
2OUT5
35VREF
44LX6
45HS6L
26
19
CCDSEQ
9
VDSEL4
12
VDSEL1
13
VBAT
31
CPOVT
33
29
32
18
CCD SEQ
8
10
48
11
46
34
1
36NON5
37INV6
7LX3
24INV3
20LX1
22INV1
23INV2
25INV4
SDR-S26
POWER SUPPLY BLOCK DIAGRAM
SDR-S26P
19

7.2. CAMERA DRIVE BLOCK DIAGRAM
SDR-S26
CAMERA DRIVE BLOCK DIAGRAM
CDS
CCD
IMAGE
SENSOR
B7
IC302 TG/AFE IC501
IC402
KAO DETECTOR
IC401 RESIZE
IC6001 SYSTEM CONTROL
IC3001 AUDIO/VIDEO
CCD UNIT
C9
C8
E8
F8
H10
C1
A1
B1
G8
E10
F9
RESIZE ADIN (0-9)
K9
J10
J6
D8
E9
D9
B8
D8
C7
B10
B9
J4
K4
L5
K5
J5
K6
L7
K7
K8
J7
M18
N18
L18
P17
N17
M17
L17
P16
M16
N16
A5
C4
B5
B6
C6
B7
C7
A8
A9
B8
B9
C9
B10
C10
D10
B11
Y7
AA7
W7
V7
AA8
Y8
W8
V8
Y9
AA9
W9
V9
AA10
Y10
V10
W10
FP601
1
FP601
15
FP601
14
FP601
17
FP601
18
FP601
6
FP601
5
FP601
4
FP601
3
FP601
2
FP31
18
FP31
4
FP31
5
FP31
2
FP31
1
FP601
12
FP31
7
B9001
108
B9002
108
FP31
13
FP31
14
FP31
15
FP31
16
FP31
17
SAB MAIN
FROM
SYSCON
RGA
RESIZE_FCK36
TG_VD
TG_HD
RESIZE_FCK
M18
N18
L18
P17
N17
M17
L17
P16
M16
N16
G7
H7
H6
G6
H5
G5
H4
G4
F3
G3
ELV_RE
ELV_WE
ELV_ALE
12MCLK
RESIZE_VD
RESIZE_HD
ELVIS_POR
ELVIS_CLKRST
ELVIS_CS
CPU_FINISH
G2
G1
H1
H2
J1
J2
K1
K2
L2
L1
M1
M2
N1
N2
P2
P1
RESIZE_FCK
RESIZE_VD
RESIZE_HD
XRE
XWEL
ALE
ELVIS_POR
ELVIS_CLKRST
ELVIS_CS
CPU_FINISH
12MCLK
DLL
12Bit
ADC
B6
FP31
10
FP601
9
CCD MAIN
CF001
CCD MAIN
B9001
55
B9002
55
MAIN SAB
MAIN SAB
MAIN SAB
K4
DRIVE
DRIVE
DRIVE
DRIVE
CCD RESET
RESIZE FCK
CAM_CG_CS
CGAFE_DTO
CGAFE_CLK
CGRST
VD
HD
H1
H2
TIMING
GENERATER
TIMING
GENERATER
A8
W5
B2
B3
B1
A6
A3
B3
RESIZE_CS
RESIZE_RST
CGAFE_DTO
B5
G1
CGAFE_CLK H2
AA6
R22
U20
U19
A8
N4
B9001
57
B9002
57
P4
B9001
58
B9002
58
U4
B9001
101
B9002
101
D2
B9001
99
B9002
99
C2
B9001
102
B9002
102
A4
B9001
100
B9002
100
F10
RESIZE_CS
RESIZE_RST
CAM_CG_CS
CGAFE_DT0
CGAFE_CLK
CGRST
B9001
103
B9002
103
F2
B9001
104
B9002
104
W6
B9001
19
B9002
19
B9001
20
B9002
20
E1
B9001
18
B9002
18
F1
B9001
21
B9002
21
D11
B9001
39 - 54
B9002
39 - 54
AB6
AB9
Y6
R2
Y5
C5
C4
B1
C4
C5
TG_VD
TG_HD
RESIZE_FCK36
L3
K3
G1
B8
ADM (0-15)
24
SAB
V6
V5
V4
V3
V2
V1
CCD OUT
CCD MAIN
SENS_TEMP_VREF
RESIZE ADIN 1
RESIZE ADIN 3
RESIZE ADIN 5
RESIZE ADIN 7
RESIZE ADIN 6
RESIZE ADIN 4
RESIZE ADIN 8
RESIZE ADIN 0
RESIZE ADIN 2
RESIZE ADIN 9
ADM (0-9)
ADM (0-9)
ADIN 4
ADIN 0
ADIN 1
ADIN 2
ADIN 3
ADIN 5
ADIN 6
ADIN 7
ADIN 8
ADIN 9
ADM 8
ADM 9
ADM 6
ADM 7
ADM 10
ADM 11
ADM 12
ADM 13
ADM 14
ADM 15
ADM 0
ADM 1
ADM 2
ADM 3
ADM 4
ADM 5
E2
ADM (0-15)
G2
RESIZE ADIN 1
RESIZE ADIN 3
RESIZE ADIN 5
RESIZE ADIN 7
RESIZE ADIN 6
RESIZE ADIN 4
RESIZE ADIN 8
RESIZE ADIN 0
RESIZE ADIN 2
RESIZE ADIN 9
ADM 8
ADM 9
ADM 6
ADM 7
ADM 10
ADM 11
ADM 12
ADM 13
ADM 14
ADM 15
ADM 0
ADM 1
ADM 2
ADM 3
ADM 4
ADM 5
ADIN 4
ADIN 0
ADIN 1
ADIN 2
ADIN 3
ADIN 5
ADIN 6
ADIN 7
ADIN 8
ADIN 9
RESIZE ADIN 1
RESIZE ADIN 3
RESIZE ADIN 5
RESIZE ADIN 7
RESIZE ADIN 6
RESIZE ADIN 4
RESIZE ADIN 8
RESIZE ADIN 0
RESIZE ADIN 2
RESIZE ADIN 9
ADM 8
ADM 9
ADM 6
ADM 7
ADM 10
ADM 11
ADM 12
ADM 13
ADM 14
ADM 15
ADM 0
ADM 1
ADM 2
ADM 3
ADM 4
ADM 5
RESIZE ADIN (0-9)
XRE
XWEL
ALE
SDR-S26P
20