Panasonic AG-DVC30P User manual

ORDERNO. BSD04030090
D21
Digital VideoCameraRecorder/ XLRMicrophoneAdapter
AG-DVC30P/ AG-DVC30E/ AG-DVC32EN/ AG-DVC33MC/
AG-MYA30G
Please refer to theOperating Instructionsin theappendix
1

folder. / (Go to Appendix List)
2

3

4

SAFETYPRECAUTIONS
GENERALGUIDELINES
1. Whenservicing, observetheoriginal leaddress. Ifashort/ circuit
isfound, replace all parts, whichhavebeenover-heatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperly
installed.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrom being exposedtoshock hazards.
LEAKAGECURRENTCOLD CHECK
1. Unplug theACcord and connect ajumperbetweenthetwo
prongson theplug.
2. Measuretheresistance value, withanohm meter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Theresistance valuemust bemorethan5M .
Figure1
LEAKAGECURRENTHOTCHECK (See Figure 1)
1. Plug theACcord directlyintotheACoutlet. / Donotuse an
isolation transformerfor thischeck.
5

2. Connect a1.5k , 10Wresistor, inparallel witha0.15 F
capacitor, betweeneachexposedmetallicparton theset ana
good earthground suchas awaterpipe, as showninFigure1.
3. Use anACvoltmeter, with1000 ohms/voltor moresensitivity, to
measurethepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverses theACplug intheACoutlet repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.15 volts RMS. A
leakagecurrenttester(Simpson Model 229 equivalent) maybe
usedtomake thehotchecks, leakagecurrentmust notexceed
0.1milliamp. Incase ameasurementisoutsideofthelimits
specified, thereisapossibilityofashock hazard, and the
equipmentshouldberepairedand recheckedbeforeitisreturned
tothecustomer.
ABOUTLEAD FREE SOLDER (PbF)
Distinction of Pbf PCB:
PCBs (manufactured) using leadfree solderwill have a PbF indication on the PCB.
Caution:
1. Pbfree solderhas ahighermelting pointthanstandard solder;
Typicallythemelting pointis50-70°F(30-40°C) higher. Please use
ahigh temperaturesoldering iron. Incase ofthesoldering iron
withtemperaturecontrol, please set itto700±20°F(370±10°C).
2. Pbfree solderwill tend tosplashwhenheatedtoo high (about
1100°F/600°C).
ELECTROSTATICALLYSENSITIVE (ES)DEVICES
Some semiconductor(solidstate)devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallysensitive (ED)Devices. Examples of typical
6

ES devices are integratedcircuits and some field-effecttransistors and semiconductor“chip”
components. The following techniques shouldbe usedto helpreduce the incidence of
component damage causedbystatic electricity.
1. Immediatelybeforehandling anysemiconductor componentor
semiconductor-equippedassembly, drainoff anyelectrostatic
chargeon your bodybytouching aknownearthground. /
Alternatively, obtainand wearacommerciallyavailable
discharging wrist trapdevice, whichshouldberemovedfor
potential shock reasonsprior toapplying powertotheunitunder
test.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas aluminum
foil, topreventelectrostaticchargebuildup or exposureofthe
assembly.
3. Use onlyagroundedtipsoldering iron tosolderor unsolderES
devices.
4. Use onlyananti-staticsolderremoval device classifiedas “anti-
static”cangenerate electrical charges sufficienttodamageES
devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device from its protective
packageuntil immediatelybeforeyou arereadytoinstall it. /
(most replacementES devices arepackagewithleadselectrically
shortedtogetherbyconductivefoam, aluminum foil or
comparableconductivematerial).
7. Immediatelybeforeremoving theprotectivematerial from the
leadsofareplacementES device, touchtheprotectivematerial to
thechassisor circuitassemblyintowhichthedevice will be
installed. / CAUTION:Besureno powerisappliedtothechassis
or circuit, and observeall othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing
togetherofyour clothes fabricor thelifting ofyour footfrom a
carpetedfloor cangenerate staticelectricitysufficienttodamage
7

anES device).
X-RADIATION
WARNING
1. Thepotential source ofX-radiation inEVFsets istheHigh Voltage
section and thepicturetube.
2. Whenusing apicturetubetest jigfor service, ensurethat jigis
capableofhandling 10kV withoutcausing X-Radiation.
Note :
Itis important to use anaccurate periodicallycalibratedhigh voltage meter.
3. MeasuretheHigh Voltage. Themeter(electrictype) reading
shouldindicate 2.5kV, ±0.15kV. Ifthemeterindication isoutof
tolerance, immediate service and correction isrequiredtoprevent
thepossibilityofprematurecomponentfailure. TopreventanX-
Radiation possibility, itisessential touse thespecifiedpicture
tube.
8

9

1. Service Information
2. DisassemblyProcedures
3. Mechanical Adjustment
4. Electrical Adjustment
5. Block Diagrams
6. SchematicDiagrams
10