Panasonic KX-TG2338BXS User manual

© 2005 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TG2338BXS
KX-TGA236BXS
2.4 GHz Digital Cordless Phone
Silver Version
(for Asia, Middle Near East and Other Areas)
Telephone Equipment
ORDER NO. KM40506780CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4
1.1. Suggested PbF Solder 4
1.2. How to recognize that Pb Free solder is used 5
2 FOR SERVICE TECHNICIANS 6
3 CAUTION 6
4 BATTERY 7
4.1. Standard Battery Life 7
4.2. Battery Replacement 8
5 LOCATION OF CONTROLS 9
5.1. Base unit 9
5.2. Handset 10
6 DISPLAYS 11
6.1. Troubleshooting (Handset LCD) 11
7 SETTINGS 12
7.1. Connections 12
7.2. Connecting an Optional Headset 13
7.3. Function Menu Table 14
7.4. Date and Time 15
7.5. Dialing Mode 16
7.6. Line Mode 16
7.7. Voice Enhancer Technology 17
7.8. Ringer Tone 17
7.9. Direct Commands 19
8 OPERATION 20
8.1. Answering Calls 20
8.2. For Call Waiting Service Users 21
8.3. Using the PAUSE Key 21
8.4. Dial Lock 22
8.5. FLASH Button 24
8.6. Phone Book 25
9 TROUBLESHOOTING 30
10 DISASSEMBLY INSTRUCTIONS 33
10.1. Base Unit 33
10.2. Handset 34
11 ASSEMBLY INSTRUCTIONS 35
11.1. Fix the LCD to P.C. Board (Handset) 35
12 TROUBLESHOOTING GUIDE 36
12.1. Check Power 37
12.2. Error Message Table 37
12.3. Check Sp-phone Transmission 38
12.4. Check Sp-phone Reception 38
12.5. Check Battery Charge 39
12.6. Check Link 40
12.7. Check the RF Part 41
12.8. Check Handset Transmission 45
12.9. Check Handset Reception 45
12.10. Check Caller ID 45
13 TEST MODE 46
13.1. Test Mode Flow Chart for Base Unit 46
13.2. Test Mode Flow Chart for Handset 49
13.3. X801 (Base Unit), X201 (Handset) Check 53
13.4. Adjust Battery Low Detector Voltage (Handset) 53
13.5. Base Unit Reference Drawing 54
13.6. Handset Reference Drawing 56
13.7. FREQUENCY TABLE 57
13.8. How to Clear User Setting 58
14 DESCRIPTION 59
14.1. Frequency 59
14.2. FHSS (Frequency Hopping Spread Spectrum) 59
14.3. Signal Flowchart in the Whole System 61
15 EXPLANATION OF LINK DATA COMMUNICATION 62
15.1. Calling 62
15.2. To Terminate Communication 62
15.3. Ringing 62
16 BLOCK DIAGRAM (Base Unit) 63
17 CIRCUIT OPERATION (Base Unit) 64
17.1. DSP (Digital Speech/Signal Processing: IC501) 64
17.2. Flash Memory (IC701) 65
17.3. Power Supply Circuit 65
17.4. Reset Circuit 67
17.5. Locator/Intercom Mode 68
17.6. Telephone Line Interface 68
Note:
Because CONTENTS 4 to 9 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page Page
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KX-TG2338BXS / KX-TGA236BXS

17.7. Parallel Connection Detect Circuit 69
17.8. Calling Line Identification (Caller ID) 70
18 BLOCK DIAGRAM (Handset) 71
19 CIRCUIT OPERATION (Handset) 72
19.1. Construction 72
19.2. Power Supply Circuit 73
19.3. Charge Circuit 74
19.4. Ringer and Handset SP-Phone 74
19.5. Sending Signal 75
19.6. Reception Signal 75
20 SIGNAL ROUTE 76
21 CPU DATA (Base Unit) 77
21.1. IC501 77
22 CPU DATA (Handset) 78
22.1. IC201 78
23 EXPLANATION OF IC TERMINALS (RF Unit) 79
23.1. IC901 79
24 HOW TO REPLACE THE FLAT PACKAGE IC 80
24.1. PREPARATION 80
24.2. FLAT PACKAGE IC REMOVAL PROCEDURE 80
24.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 81
24.4. BRIDGE MODIFICATION PROCEDURE 81
25 CABINET AND ELECTRICAL PARTS (Base Unit) 82
26 CABINET AND ELECTRICAL PARTS (Handset) 83
27 ACCESSORIES AND PACKING MATERIALS 84
28 TERMINAL GUIDE OF THE IC´S, TRANSISTORS AND DIODES
85
28.1. Base Unit 85
28.2. Handset 85
29 REPLACEMENT PARTS LIST 86
29.1. Base Unit 86
29.2. Handset 88
29.3. Accessories and Packing Materials 90
30 FOR SCHEMATIC DIAGRAM 91
30.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit)) 91
30.2. Handset (SCHEMATIC DIAGRAM (Handset)) 91
31 SCHEMATIC DIAGRAM (Base Unit) 92
32 SCHEMATIC DIAGRAM (Handset) 94
33 SCHEMATIC DIAGRAM (RF PART) 96
34 CIRCUIT BOARD (Base Unit) 97
34.1. Component View 97
34.2. Flow Solder Side View 98
35 CIRCUIT BOARD (Handset) 99
35.1. Component View 99
35.2. Flow Solder Side View 100
3
KX-TG2338BXS / KX-TGA236BXS

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• • •
• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
• • •
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• • •
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
• • •
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TG2338BXS / KX-TGA236BXS

1.2. How to recognize that Pb Free solder is used
(Example: Handset P.C.B.)
IC901 IC201
IC202
PbF
Marked
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
5
KX-TG2338BXS / KX-TGA236BXS

2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
3 CAUTION
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the
manufacturer.
Dispose of used batteries according to the manufacture’s Instructions.
6
KX-TG2338BXS / KX-TGA236BXS

4 BATTERY
4.1. Standard Battery Life
4.1.1. Battery Charge
4.1.2. Battery Strength
4.1.3. Recharge
Note for service:
The battery strength may not be indicated correctly if the battery is disconnected and connected again, even after it is fully
charged. In that case, by recharging the battery as mentioned above, you will get a correct indication of the battery strength.
7
KX-TG2338BXS / KX-TGA236BXS

4.1.4. Battery Information
4.2. Battery Replacement
8
KX-TG2338BXS / KX-TGA236BXS

5 LOCATION OF CONTROLS
5.1. Base unit
9
KX-TG2338BXS / KX-TGA236BXS

5.2. Handset
10
KX-TG2338BXS / KX-TGA236BXS

6 DISPLAYS
6.1. Troubleshooting (Handset LCD)
The following will be displayed when the unit needs your attention.
11
KX-TG2338BXS / KX-TGA236BXS

7 SETTINGS
7.1. Connections
12
KX-TG2338BXS / KX-TGA236BXS

7.2. Connecting an Optional Headset
13
KX-TG2338BXS / KX-TGA236BXS

7.3. Function Menu Table
Cross Reference:
Direct Commands (P.19)
14
KX-TG2338BXS / KX-TGA236BXS

7.4. Date and Time
15
KX-TG2338BXS / KX-TGA236BXS

7.5. Dialing Mode
7.6. Line Mode
16
KX-TG2338BXS / KX-TGA236BXS

7.7. Voice Enhancer Technology
7.8. Ringer Tone
17
KX-TG2338BXS / KX-TGA236BXS

18
KX-TG2338BXS / KX-TGA236BXS

7.9. Direct Commands
19
KX-TG2338BXS / KX-TGA236BXS

8.1. Answering Calls
8 OPERATION
20
KX-TG2338BXS / KX-TGA236BXS