Panasonic DMRE55P User manual

ORDERNO.DSD0401001C1
B24
DVDVideoRecorder
DMR-E55P/ DMR-E55PC
Colour
(K).......................Black Type
(S).......................SilverType
SPECIFICATIONS
2004 Matsushita ElectricIndustrial CO., Ltd. All rights reserved.
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Unauthorizedcopying and distribution isaviolation oflaw.
1. Safetyprecautions
1.1. General guidelines
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperlyinstalled.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrombeing exposedtoshock hazards.
1.1.1. Leakagecurrentcoldcheck
1. Unplug theACcordand connect ajumperbetweenthetwoprongs
on theplug.
2. Measuretheresistance value, withanohmmeter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Whentheexposedmetallicparthas areturnpathtothechassis,
thereading shouldbebetween1M and 5.2M . / Whenthe
exposedmetal does nothaveareturnpathtothechassis, the
reading must be . Figure1
1.1.2. Leakagecurrenthotcheck / (See Figure 1 .)
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1. Plug theACcorddirectlyintotheACoutlet. Donotuse an
isolation transformerforthischeck.
2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F
capacitors, betweeneachexposedmetallicparton theset and a
good earthground suchas awaterpipe, as shownin Figure1.
3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to
measurethepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverse theACplug intheACoutlet and repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A
leakagecurrenttester(Simpson Model 229 orequivalent) maybe
usedtomake thehotchecks, leakagecurrentmust notexceed1/2
milliampere. Incase ameasurementisoutsideofthelimits
specified, thereisapossibilityofashock hazard, and the
equipmentshouldberepairedand recheckedbeforeitisreturned
tothecustomer.
1.2. Caution forfuse replacement
2. Prevention of ElectrostaticDischarge (ESD) to
ElectrostaticSensitive(ES) Devices
Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such
componentscommonlyarecalledElectrostaticSensitive (ES)Devices. Examples oftypical ES
devices areintegratedcircuitsand somefield-effecttransistor-sandsemiconductor "chip"
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectrostaticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischarging ESDwrist strap,
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whichshouldberemovedforpotential shock reasonspriorto
applying powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas aluminum
foil, topreventelectrostaticchargebuildup orexposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderremoval device. Somesolder
removal devices notclassifiedas "anti-static(ESDprotected)"can
generate electrical chargesufficienttodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, aluminumfoil or
comparableconductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricitysufficienttodamage
anES device).
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3. Precaution of LaserDiode
4. Howtoreplace the LithiumBattery
REPLACEMENTPROCEDURE
1. RemovetheTop case and DVD-RAMdriveunitwithMainP.C.B. by
referring theDisassembling Procedure.
2. UnsoldertheLithiumBatteries:B7501 and thenreplace itintonew
one.
(Asshownin20.2.1. TheMainP.C.B. )
NOTE:
Thelithium batteryisacritical component. (TypeNo.:CR2354-1GUFManufacturedby
Panasonic. )
Itmustneverbesubjectedtoexcessive heator discharge.
Itmustthereforeonlybefittedinequipmentdesignedspecificallyfor itsuse.
Replacementbatteries mustbeofthesametypeand manufacture.
They mustbefittedinthesamemannerand location as theoriginal battery, withthecorrect
polaritycontactsobserved.
Donotattempttore-chargetheoldbatteryor re-use itfor anyotherpurpose.
Itshouldbedisposedofinwasteproductsdestinedfor burial ratherthanincineration.
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5. Handling the Lead-free Solder
5.1. Aboutleadfree solder(PbF)
Distinction ofPbF P.C.B.:
P.C.B.s(manufactured)using leadfree solderwill have aPbF stampon theP.C.B.
Caution:
-Pbfree solderhas ahighermelting pointthanstandardsolder;
Typicallythemelting pointis50 -70°F(30 -40°C)higher. Please
use ahigh temperaturesoldering iron. Incase ofthesoldering iron
withtemperaturecontrol,please set itto700 ±20°F(370 ±10°C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about
1100°F/600°C).
-Whensoldering orunsoldering, please completelyremoveall ofthe
solderon thepinsorsolderarea, and besuretoheat thesoldering
points withthePbfree solderuntil itmelts enough.
6. Each Buttons
7. NewFeatures
7.1. Function ofPowerCircuit(IC1150)
1. General
WeadoptedICmoduleas theSwitching PowerCircuitfor lowerpowerconsumption.
IC1150 isconstructedwithSwitching materialsand Control IC, and ispartial resonance module.
WerealizedSwitching Powerwithhigh efficiency, lownoise and lowpowerconsumption.
2. Equivalence CircuittoIC1150
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Pin
No. Symbol Description
1 Z/C Triggerinputterminal.
Zero detection voltage:0.25V
Itbecomes less than3V, themode
turnstostandby.
2F/B Bias currentfeedback inputterminal.
Switching ONtime(min.)~(max.)
1.5V ~4.5V / 0 sec. ~25 sec.
Instandbymode
Oscillation stops:less than0.8V
Oscillation starts:over1.8V
3GND GND terminal
4Vcc Powerterminal ofIC.
Oscillation starting voltage:Vcc =
and over14.5V
Oscillation stop voltage:Vcc =and
less than9.6V
Overvoltagelatching voltage:Vcc =
20V
5Drain Drainterminal for Mainswitching
material.
3. Startup Circuit
Whenpoweristurnedon, inputvoltageoftheSwitching TransformerissuppliedtoIC1150 as the
startup power.
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AfterIC1150 has started, thestartup currentiscutoff.
ThecurrentofStartup Circuitissuppliedas constantcurrentsource inIC1150 and as charge
currentfor thecapacitor connectedbetweenVcc terminal and GND outsideofIC1150 until Vcc
reaches 14.4V.
WhenVcc reaches 14.4V, theStartup Circuitiscutoff, thenoscillation starts.
Afterthen, powerofIC1150 issuppliedfrom control coil.
Incase, thepowerfailureor shortoutoftheload, whenVcc becomes 9.0V;theoscillation stops,
furthermoreVcc becomes 7.1V theStartup Circuitstartsup and Vcc startstorise.
Startup CircuitTiming Chart
Function ofZ/CTerminal
WhenvoltageofZ/Creaches 0.25V, Gatesignal isoutputand Draincurrentstartstoflow.
Function ofF/Bterminal
F/Bsignal decides Switching ONwidthinlowvoltagecontrolling.
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TheSwitching ONwidthrespondstochangeofF/BVoltage.
StandbyFunction
WhenZ/CVoltagebecomes less than3V, theunitchanges toStandbymode.
IC1150 Block Diagram
Signal name
PinNo. Name Symbol
1 Zero CurrentDet. Z/C
2Feedback F/B
3GND GND
4Vcc Vcc
5Drain Drain
8. Taking out the Disc fromRAM-DriveUnit when the
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Disc cannot be ejected byOPEN/CLOSE button
8.1. ForcibleDisc Eject
8.1.1. Whenthepowercanbeturnedoff.
1. Turnoff thepowerand press [STOP][CH UP]keyson thefront
panel simultaneouslyfor5seconds.
8.1.2. Whenthepowercannotbeturnedoff.
1. Press [POWER]keyon thefrontpanel forover10 secondstoturn
off thepowerforcibly, and press [STOP][CH UP]keyson thefront
panel simultaneouslyfor5seconds.
8.2. WhentheForcibleDisc Eject cannotbedone.
1. Turnoff thepowerand pull outACcord.
2. RemovetheTop Case.
3. RemovetheFrontPanel.
4. Remove4screwsand UpperBase UnitfromDVD-RAMDrive.
5. Take outthedisc and puttheOpenerRolleron fullyposition for
direction ofArrow.
6. PuttheUpperBase Unitsothat theOpenerRollerisinsertedinto
thegroove.
7. Check centerofOpenerRollerisseenthrough theOpener
position Checking Hole, and tighten4screws.
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