Panasonic SA-PTX7P User manual

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OGENERAL
Power Supply:
A
C 120 V, 60 Hz
Power Consumption: 90 W
Power Consumption in Standby Mode:
Power-Save Mode (Shipping Condition) Approx. 0.5 W
Dimensions (W×H×D): 360×105.5×334 mm
(14-3/16”×4-3/16”×13-5/32”)
Mass:
A
pprox. 4.7 kg (10.5 Ibs)
Operating Temperature Range: +5°C to +40°C (+41°F to
+104°F)
Operating Humidity Range: 10% to 80% RH (no
condensation)
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OAMPLIFIER SECTION
RMS TTL Power Output: 300 W
At 1 kHz and total harmonic of 10%
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OFront Ch: 50 W / Channel (8 Ω)
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OCenter Ch: 50 W / Channel (8 Ω)
At 100 Hz and total harmonic of 10%
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OSubwoofer Ch: 100 W / Channel (4 Ω)
FTC TTL Power Output: 240 W
At 120 Hz - 20 kHz and total harmonic of 1%
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OFront Ch: 40 W / Channel (8 Ω)
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OCenter Ch: 40 W / Channel (8 Ω)
At 45 Hz - 120 Hz and total harmonic of 1%
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OSubwoofer Ch: 80 W / Channel (4Ω)
© 2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
SA-PTX7P
Colour
(K).......................Black Type
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OFM TUNER SECTION
Frequency range: 87.9-107.9 MHz
(200-kHz step)
87.5-108.0 MHz
(100-kHz step)
Antenna terminals: 75 Ω(unbalanced)
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OAM TUNER SECTION:
AM Frequency range: 520-1710 kHz (10-kHz step)
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OHDD SECTION:
Internal HDD Capacity: 80 GB
Recording Format: AAC/Linear PCM
MP3/WMA (LAN-PC)
Bit Rate (AAC): 128 kbps (XP)/96 kbps (SP)/
64 kbps (LP)
Channel: 2 channels (stereo)
Recording Time:
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OAAC: Approx. 2460 hours (LP mode)
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OLinear PCM: Approx. 104 hours
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ODIGITAL AUDIO OUTPUT:
Optical Digital Output: Optical terminal (up to 96 kHz)
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ODIGITAL AUDIO INPUT:
Optical Digital Input: Optical terminal (up to 48 kHz)
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ODISC SECTION
Playable discs [8 cm (3”) or 12 cm (5”)]:
DVD Home Theater Sound System
Specifications
ORDER NO. MD0704014CE
A6

(1) DVD [DVD-Video, DVD-Audio]
(2) DVD-RAM [DVD-VR, MP3 (*2, 5), JPEG (*4, 5)]
(3) DVD-R [DVD-VR, DVD-Video, MP3 (*2, 5), JPEG (*4, 5)]
(4) DVD-R DL [DVD-VR (*6), DVD-Video]
(5) DVD-RW [DVD-VR, DVD-Video, MP3 (*2, 5), JPEG (*4, 5)]
(6) +R/+RW (Video)
(7) +R DL (Video)
(8) CD, CD-R/RW [CD-DA, Video CD, SVCD (*1), MP3 (*2, 5),
WMA (*3, 5), JPEG (*4, 5), HighMAT Level 2 (Audio and
Image)]
*1 Conforming to IEC62107
*2 MPEG-1 Layer 3, MPEG-2 Layer 3
*3 Windows Media Audio Ver.9.0 L3
ONot compatible with Multiple Bit Rate (MBR)
*4 Exif Ver 2.1 JPEG Baseline files
OPicture resolution: between 160 x 120 and 6144 x 4096
pixels (Sub sampling is 4:2:2 or 4:2:0). Extremely long and
slender pictures may not be displayed.
*5 The total combined maximum number of recognizable audio
and picture contents and groups: 4000 audio and picture
contents and 400 groups.
*6 Discs recorded on DVD recorders or DVD cameras using
Version 1.2 of the Video Recording Format (a unified video
recording standard).
Pick Up:
Wavelength:
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OCD: 785 nm
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ODVD: 662 nm
Laser power:
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OCD / DVD: CLASS I / CLASS II
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OVIDEO SECTION
Video System: NTSC
Video Output:
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OOutput level: 1 Vp-p (75 Ω)
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OOutput Connector: Pin jack (1 system)
Component Video Output (480p/480i):
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OY output level: 1 Vp-p (75 Ω)
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OPBoutput level: 0.7 Vp-p (75 Ω)
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OPRoutput level: 0.7 Vp-p (75 Ω)
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OOutput Connector: Pin jack (Y: green, PB: blue,
PR: red) (1 system)
HDMI AV Output: HDMI 19 pin type A connector
This unit supports “HDAVI Control 2” function.
Note:
1. Specifications are subject to change without notice.
Mass and dimensions are approximate.
2. Total harmonic distortion is measured by the digital spectrum
analyzer.
Solder:
This model uses lead free solder (PbF).
Mechanism:
This model uses DL2S (Single tray) mechanism.
Refer to the respective original service manuals for *1, *2.
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SA-PTX7P

1 Safety Precautions 5
1.1. GENERAL GUIDELINES 5
1.2. Before Repair and Adjustment 5
1.3. Protection Circuitry 6
1.4. Safety Parts Information 6
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 8
3 Precaution of Laser Diode 9
4 About Lead Free Solder (PbF) 10
4.1. Service caution based on legal restrictions 10
5 Handling Precautions for Traverse Unit 11
5.1. Cautions to Be Taken in Handling the Optical Pickup Unit
11
5.2. Grounding for electrostatic breakdown prevention 11
6 HDD (Hard Disk Drive) Handling Care 13
7 Accessories 14
8 Operation Procedures 15
8.1. Remote Control Key Buttons Operations 15
8.2. Main Unit Key Buttons Operations 16
8.3. Using the EZ Sync HDAVI Control 17
8.4. Using the XM® Satellite Radio 19
8.5. Using the Music Port 20
8.6. Using the iPod 21
8.7. Wireless Surround 22
8.8. Disc Information 31
9 New Features 33
9.1. As a Music Jukebox (Using HDD) 33
9.2. Easy Location of HDD Recording Contents 39
9.3. Network Connections (LAN) 41
9.4. Operating iPod with this Unit 47
10 Self-Diagnosis and Special Mode Setting 49
10.1. Service Mode Summary Table 49
10.2. Service Mode Table (Main Unit) 49
10.3. DVD Self Diagnostic Function-Error Code 58
10.4. Sales Demonstration Lock Function 62
10.5. Service Precautions 63
11 Assembling and Disassembling 64
11.1. Disassembly Flow Chart 65
11.2. Main Components and P.C.B. Locations 66
11.3. Disassembly of Top Cover Assembly 67
11.4. Disassembly of Top Shield 67
11.5. Disassembly of Front Panel 67
11.6. Disassembly of Panel P.C.B., Tact-1 P.C.B. & Tact-2
P.C.B. 67
11.7. Dissassembly of Main P.C.B. 68
11.8. Disassembly of XM Module P.C.B. 70
11.9. Disassembly of Power P.C.B. 70
11.10. Replacement of Regulator IC (IC725) 71
11.11. Replacement of Regulator Diode (D725/D758) 71
11.12. Disassembly of Regulator P.C.B. 72
11.13. Disassembly of DVD Module P.C.B 72
11.14. Disassembly of Wireless Adapter P.C.B. 73
11.15. Disassembly of Audio P.C.B. 74
11.16. Replacement of Digital Amp IC (IC102) 74
11.17. Replacement of Regulator Transistor (Q113) 75
11.18. Disassembly of DVD Mechanism Unit 75
11.19. Disassembly of Relay P.C.B. 76
11.20. Disassembly of Rear Panel 76
11.21. Disassembly of D-Port P.C.B. 78
11.22. Disassembly of Digital P.C.B. 78
11.23. Disassembly of AC-Inlet P.C.B. 80
11.24. Disassembly of Hard Disk Drive (HDD) 80
12 Assembly and disassembly of DVD Mechanism Unit 81
12.1. Disassembly Procedure 81
13 Service Fixture and Tools 86
14 Service Positions 86
14.1. Checking & Repairing Main P.C.B. 86
14.2. Checking & Repairing XM Module P.C.B. 87
14.3. Checking & Repairing DVD Module P.C.B. 87
14.4. Checking & Repairing Audio P.C.B. 88
14.5. Checking & Repairing Regulator P.C.B. 89
14.6. Checking & Repairing Power P.C.B. 89
14.7. Checking & Repairing Panel P.C.B. 90
14.8. Checking & Repairing Digital P.C.B. 91
14.9. Checking & Repairing AC-Inlet P.C.B. 93
15 Measurements and Adjustments 95
15.1. Service Tools and Equipment 95
15.2. Important points in adjustment 95
15.3. Storing and handling of test discs 95
15.4. Optical adjustment 96
16 Abbreviations 98
17 Voltage and Waveform Chart 100
17.1. DVD Module P.C.B. 100
17.2. Digital P.C.B. 103
17.3. Tray Loading, XM Module, Panel, & Tact-2 P.C.B. 105
CONTENTS
Page Page
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SA-PTX7P

17.4. Main P.C.B. 106
17.5. AC-Inlet, Power & Regulator P.C.B. 108
17.6. Audio (D-Amp) P.C.B. 109
17.7. Audio (DSP) P.C.B. 110
17.8. Waveform Chart 112
18 Illustration of IC’s, Transistors and Diodes 115
19 Wiring Connection Diagram 117
20 Block Diagram 119
20.1. System Control 119
20.2. DVD (Servo) 120
20.3. DVD (Audio) 121
20.4. DVD (Video) 122
20.5. DVD (Interface) 123
20.6. AUDIO SELECTOR 124
20.7. AUDIO (DSP) 125
20.8. AUDIO DiGITAL AMP 126
20.9. DIGITAL 1 127
20.10. DIGITAL 2 128
20.11. POWER 129
21 Schematic Diagram Notes 131
22 Schematic Diagram 133
22.1. DVD Module (DV5/HDMI/FPGA/VIDEO DAC) Circuit 133
22.2. Digital & XM Module Circuit 141
22.3. Main, D-Port & Panel Circuit 148
22.4. Power, Audio (DSP/D-Amp), AC-Inlet & Regulator Circuit
153
22.5. Tact-1, Tact-2, Wireless Adapter, Relay, Tray Loading &
Optical Pickup Unit Circuit 161
23 Printed Circuit Board 163
23.1. DVD Module P.C.B. 163
23.2. Digital P.C.B. 164
23.3. XM, D-Port, Tact-1 & Tact -2 P.C.B. 165
23.4. Main P.C.B. 166
23.5. Panel & Wireless Adapter P.C.B. 168
23.6. Power P.C.B. 169
23.7. Audio (D-Amp/DSP) P.C.B. 170
23.8. AC-Inlet, Regulator, Relay & Tray Loading P.C.B. 171
24 Basic Troubleshooting Guide 173
24.1. Before Repairing 173
24.2. Precaution of Replacement of HDD (Hardisk) 173
24.3. Precaution of Repairing Digital P.C.B. 173
24.4. Troubleshooting Flowchart of HDD Unit, CD Drive Unit &
Main Micron (IC1502) 174
25 Terminal Function of ICs 175
25.1. IC501 (RFKWERE006PA): IC System Control 175
25.2. IC800 (C0HBB0000057): IC FL Display Driver 176
25.3. IC1101 (C1CB00002054): IC LAN (Ethermet Controller)
176
25.4. IC1200 (C1DB00001549): IC Link/Transaction Controller
177
25.5. IC1502 (C2GBC0000300): IC Microcomputer 178
25.6. IC1800 (MN677382FV): IC Sub Microprocessor 180
25.7. IC3201 (C1AB00002259): IC Video Encoder 181
26 Exploded Views 183
26.1. Cabinet Parts Location 185
26.2. Packaging 189
27 Replacement Parts List 190
27.1. Component Parts List 191
28 Schematic Diagram for printing with letter size 214
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SA-PTX7P

1 Safety Precautions
1.1. GENERAL GUIDELINES
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. LEAKAGE CURRENT COLD CHECK
1.Unplug the AC cord and connect a jumper between the two prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MΩand 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be
1.1.2. LEAKAGE CURRENT HOT CHECK
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6.The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to
the customer.
Figure 1
1.2. Before Repair and Adjustment
Disconnect AC power to discharge unit AC Capacitors as such C701, C702, C703, C704, C705, C706, C707, C748 through a 10
Ω, 10 W resistor to ground.
Caution:
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
Current consumption at AC 120 V, 60 Hz in NO SIGNAL mode volume minimal should be ~ 500 mA.
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SA-PTX7P

1.2.1. Caution for fuse replacement
1.3. Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
• • •
• No sound is heard when the power is turned on.
• • •
• Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
“shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1.Turn off the power.
2.Determine the cause of the problem and correct it.
3.Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
1.4. Safety Parts Information
Safety Parts List:
There are special components used in this equipment which are important for safety.
These parts are marked by in the Schematic Diagrams & Replacement Parts List. It is essential that these critical parts
should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the original design
without permission of manufacturer.
Table 1
Reference No. Part No. Part Name & Description Remarks
340 RAE2025Z-S TRAVERSE UNIT [M]
PC701 B3PBA0000402 PHOTO COUPLER [M]
PC721 B3PBA0000402 PHOTO COUPLER [M]
TH701 D4CAA5R10001 THERMISTOR [M]
TH721 D4CAA5R10001 THERMISTOR [M]
L701 ELF15N035AN LINE FILTER [M]
L702 ELF19H015A CHOKE COIL [M]
LB102 J0JKB0000020 EMI BEAD CORE [M]
LB103 J0JKB0000020 EMI BEAD CORE [M]
LB507 J0JBC0000015 CHIP INDUCTOR [M]
LB509 J0JBC0000015 CHIP INDUCTOR [M]
LB510 J0JBC0000015 CHIP INDUCTOR [M]
LB8701 J0JBC0000015 CHIP INDUCTOR [M]
T701 ETS19AB221AG TRANSFORMER [M]
T721 ETS35BC2HGAD TRANSFORMER [M]
T722 G4D1A0000117 SWITCHING TRANSFORMER [M]
Z701 ERZV10D471CS ZENER [M]
RY701 K6B1AEA00015 POWER RELAY [M]
F701 K5D402AQ0002 FUSE 4A [M]
IP701 K5H302100004 FUSE PROTECTOR [M]
IP702 K5H2022A0011 FUSE PROTECTOR [M]
IP703 K5H302100004 FUSE PROTECTOR [M]
IP722 K5H7512A0010 FUSE PROTECTOR [M]
P701 K2AB2B000007 JACK AC INLET [M]
A2 K2CB2CB00018 AC CORD [M]
C701 F1BAF471A013 470P [M]
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SA-PTX7P

Reference No. Part No. Part Name & Description Remarks
C702 F1BAF471A013 470P [M]
C703 ECQU2A104MLC 0.1µF [M]
C704 ECQU2A104MLC 0.1µF [M]
C705 F1BAF1020020 1000P [M]
C706 F1BAF1020020 1000P [M]
C707 F1BAF1020020 1000P [M]
C748 F1BAF471A013 470P [M]
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SA-PTX7P

2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
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SA-PTX7P

3 Precaution of Laser Diode
CAUTION:
This unit utilizes a Class I (CD) / Class II (DVD) laser.
Invisible laser radiation is emitted from the optical pickup lens.
Wavelength: 662nm (DVD) / 785nm (CD).
Maximum output radiation power from pickup: 100µW/VDE
When the unit is turned on:
1.Do not look directly into the pick up lens.
2.Do not use optical instruments to look at the pick up lens.
3.Do not adjust the preset variable resistor on the pickup lens.
4.Do not disassemble the optical pick up unit.
5.If the optical pick up is replaced, use the manufacturer’s specified replacement pick up only.
6.Use of control or adjustments or performance of procedures other than those specified herein may result in hazardous
radiation exposure.
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SA-PTX7P

4 About Lead Free Solder (PbF)
4.1. Service caution based on legal restrictions
4.1.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
• • •
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
• • •
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• • •
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• • •
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt
the lead free solder.
• • •
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
degrees C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
• • •
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
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SA-PTX7P