Panasonic SA-HT855E User manual

lGeneral
Power Source:
E/ EG areas:
A
C 230V, 50Hz
EB area:
A
C 230V-240V, 50Hz
Power consumption: 115 W
Dimensions (W×H×D): 430×60×354 mm
Mass: 3.35kg
lAmplifier section
RMS Output Power: Dolby Digital Mode
lTotal RMS Dolby Digital
mode Power: 850 W
At 1kHz and total harmonic of 10%
lFront: 110 W/ Channel (3Ω)
lCenter: 225 W/ Channel (6Ω)
lSurround: 90 W/ Channel (4Ω)
At 100Hz and total harmonic of 10%
lActive subwoofers: 225 W/ Channel (6Ω)
DIN Output Power: Dolby Digital Mode:
lTotal DIN Dolby Digital mode Power:
440 W
At 1kHz and total harmonic of 1%
©2006 Panasonic AVC Networks Singapore Pte.
Ltd. All rights reserved. Unauthorized copying and
distribution is a violation of law.
SA-HT855E
SA-HT855EB
SA-HT855EG
Colour
(S).......................Silver Type
lFront: 80 W/ Channel (3Ω)
lCenter: 75 W/ Channel (6Ω)
lSurround: 65 W/ Channel (4Ω)
At 100Hz and total harmonic of 1%
lSubwoofer: 75 W/ Channel (6Ω)
lFM tuner section
Preset Memory: FM 15 stations
AM/MW 15 stations
Frequency Range: 87.50-108.00MHz
(50kHz in step)
Sensitivity: 1.8µV (IHF)
S/N 26dB 1.4µV
Antenna Terminals: 75Ω(unbalanced)
lAM tuner section
Frequency Range: 522-1629kHz (9kHz in step)
AM Sensitivity S/N 20dB at
999kHz: 560µV/m
lDigital audio input:
Optical digital input: Optical terminal (1 system)
Sampling frequency: 32kHz, 44.1kHz, 48kHz
lPhone Jack:
DVD Home Theater Sound System
Specifications
ORDER NO.MD0603062C2

Terminal: Stereo 3.5 mm jack
lFront M. Port:
Sensitivity: 100mV (15kΩ)
Terminal: Stereo 3.5 mm jack
lDisc section
Discs played (8 cm or 12 cm):
(1) DVD [DVD-Video, DVD-Audio, DivX(*1,2)]
(2) DVD-RAM [DVD-VR, MP3(*2,6), JPEG(*2,3), MPEG4(*2,4),
DivX(*1,2)]
(3) DVD-R [DVD-Video, DVD-VR, MP3(*2,6), JPEG(*2,3),
MPEG4(*2,4), DivX(*1,2)]
(4) DVD-R DL [DVD-Video, DVD-VR]
(5) DVD-RW [DVD-Video, DVD-VR, MP3(*2,6), JPEG(*2,3),
MPEG4(*2,4), DivX(*1,2)]
(6) +R/+RW [Video]
(7) +R DL [Video]
(8) CD, CD-R/RW [CD-DA, Video CD, SVCD(*5), MP3(*2,6),
WMA(*2,7), JPEG(*2,3), MPEG4(*2,4), DivX (*1,2), HighMAT
Level 2 (Audio and Image)]
*1 Plays all versions of DivX® video (including DivX®6) with
standard playback of DivX® media files. Certified to the DivX
Home Theater Profile.
lGMC (Global Motion Compensation) is not supported.
*2 The total combined maximum number of recognizable audio,
picture and video contents and groups: 4000 audio, picture
and video contents and 400 groups.
*3 Exif Ver 2.1 JPEG Baseline files
lPicture resolution: between 160 x 120 and 6144 x 4096
pixels (Sub sampling is 4:0:0, 4:2:0, 4:2:2, 4:4:4). Extremely
long and narrow pictures may not be displayed.
*4 MPEG4 data recorded with Panasonic SD multi cameras or
DVD video recorders.
lConforming to SD VIDEO specifications (ASF standard)/
MPEG4 (Simple Profile) video system/G.726 audio system.
*5 Conforming to IEC62107
*6 MPEG-1 Layer 3, MPEG-2 Layer 3
*7 Windows Media Audio Ver.9.0 L3
lNot compatible with Multiple Bit Rate (MBR)
Pick up:
Wavelength:
lCD: 785nm
lDVD: 662nm
Laser power:
lCD: CLASS 1M
lDVD: CLASS 1
Audio output (DISC):
Number of channels: 5.1 ch (FL, FR, C, SL, SR,
SW)
Audio performance:
Frequency response:
DVD (linear audio): 4 Hz-22 kHz (48 kHz sampling)
4 Hz-44 kHz (96 kHz sampling)
DVD-Audio: 4 Hz-88 kHz (192 kHz
sampling)
CD-Audio: 4 Hz-20 kHz
S/N ratio:
CD-Audio: 105 dB
Dynamic range:
DVD (linear audio): 95 dB
CD-Audio: 95 dB
Total harmonic distortion:
CD-Audio: 0.005 %
lVideo section
V
ideo system:
Signal system: PAL 625/50, PAL 525/60,
NTSC
Composite video output:
Output level: 1 Vp-p (75 Ω)
Terminal: Pin jack (1 system)
Scart jack (1 system)
S-video output:
Y
output level: 1 Vp-p (75 Ω)
C output level: PAL; 0.3Vp-p (75Ω)
NTSC; 0.286 Vp-p (75 Ω)
Terminal S terminal (1 system)
Scart jack (1 system)
Component video output (NTSC: 480p/480i, PAL: 576p/576i):
Y
output level: 1 Vp-p (75 Ω)
PBoutput level: 0.7 Vp-p (75 Ω)
PRoutput level: 0.7 Vp-p (75 Ω)
Terminal: Pin jack (Y: green, PB: blue,
PR: red) (1 system)
RGB video output:
R output level: 0.7 Vp-p (75 Ω)
G output level: 0.7 Vp-p (75 Ω)
B output level: 0.7 Vp-p (75 Ω)
Terminal: Scart jack (1 system)
HDMI AV output: 19 pin type A connector, HDMI
Ver.1.2a (EDID Ver.1.3)
Power consumption in standby mode:
approx 0.5W
Note:
1. Specifications are subject to change without notice.
Mass and dimensions are approximate.
2. Total harmonic distortion is measured by the digital spectrum
analyzer.
Solder:
This model uses lead free solder (PbF).
Mechanism:
This model uses DL2SU (Single tray) mechanism.
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SA-HT855E / SA-HT855EB / SA-HT855EG

Refer to the original service manual for *1, *2, *3, *4.
1 Safety Precautions 5
1.1. GENERAL GUIDELINES 5
1.2. Before Repair and Adjustment 5
1.3. Protection Circuitry 5
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
3 Precaution of Laser Diode 7
4 About Lead Free Solder (PbF) 8
4.1. Service caution based on legal restrictions 8
5 Caution for AC Mains Lead 9
6 Handling Precautions for Traverse Unit 10
6.1. Cautions to Be Taken in Handling the Optical Pickup Unit
10
6.2. Grounding for electrostatic breakdown prevention 10
7 Accessories 12
8 Operation Procedures 13
8.1. Operating instructions 13
8.2. Main Unit Keys Operation 14
8.3. Connection Setup (HDMI/ Scart) 15
8.4. Use of HDAVI Control 17
8.5. Using of Music Port 18
8.6. Disc Information 19
8.7. About DivX VOD Content 21
9 New Features 22
9.1. About HDMI 22
10 Self-Diagnosis and special mode setting 24
CONTENTS
Page Page
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10.1. Service Mode Summary Table 24
10.2. Service Mode Table 1 24
10.3. DVD Self Diagnostic Function-Error Code 29
10.4. Sales Demonstration Lock Function 31
10.5. Service Precautions 32
11 Assembling and Disassembling 33
11.1. Disassembly Flow Chart 34
11.2. Main Components and P.C.B. Locations 35
11.3. Disassembly of Top Cabinet 36
11.4. Disassembly of the DVD Lid (When taking out disc
manually) 36
11.5. Disassembly of Front Panel Assembly 36
11.6. Disassembly of Music Port P.C.B, FL P.C.B. & Top
Button P.C.B. 37
11.7. Disassembly of DVD Mechanism Unit 37
11.8. Disassembly of HDMI Module P.C.B. 38
11.9. Disassembly of Rear panel 38
11.10. Disassembly of Scart P.C.B. 38
11.11. Disassembly of Relay P.C.B. 38
11.12. Disassembly of Main P.C.B., AC-Inlet P.C.B. & Tuner
Extent P.C.B. 39
11.13. Disassembly of Digital Amp IC 39
11.14. Disassembly of Digital Amp IC (IC5400) 39
11.15. Disassembly of Regulator IC 39
11.16. Disassembly of Switch Regulator IC (IC5701) 40
11.17. Service Position 40
12 Assembly and disassembly of Mechanism Unit 41
12.1. Disassembly Procedure 41
13 Measurements and Adjustments 47
13.1. Service Tools and Equipment 47
13.2. Important points in adjustment 47
13.3. Storing and handling of test discs 47
13.4. Optical adjustment 48
13.5. Abbreviations 49
14 Voltage and Waveform Chart 51
14.1. HDMI Module P.C.B. 51
14.2. Main P.C.B. 53
14.3. FL P.C.B., Scart P.C.B., Tray Loading P.B.C. 55
14.4. Waveform Chart 56
15 Illustration of IC's, Transistors and Diodes 57
16 Wiring Connection Diagram 59
17 Block Diagram 61
18 Schematic Diagram Notes 69
19 Schematic Diagram 71
19.1. (A) HDMI Module Circuit 71
19.2. (B) Main Circuit 77
19.3. (C) Main/Power Circuit 82
19.4. (D) FL, Scart, Tuner, Tray Loading, Relay Circuit 86
20 Printed Circuit Board 89
20.1. (A) HDMI Module P.C.B. 89
20.2. (B) Main P.C.B. 90
20.3. (C) Tuner extent, AC-inlet, FL, Music port & Top button
P.C.B. 91
20.4. (D) Scart, Tray motor & Relay P.C.B. 92
21 Basic Troubleshooting Guide 93
21.1. Basic Troubleshooting Guide for Traverse Unit (HDMI
Module P.C.B) 93
21.2. Basic Troubleshooting Guide for HDMI AV output 94
22 Overall Flow-Chart (HT855) 95
22.1. SC-HT855 DVD Unit Block Diagram 96
22.2. HT855 Block Diagram (Analog Signal : DVD 5.1ch Play
Back Mode) 97
22.3. HT855 Block Diagram (Analog Signal : 2ch Analog Input
Mode) 98
22.4. HT855 Power Supply Block Diagram 99
22.5. HT855 Power Block Diagram (SMPS) 100
23 Terminal Function of ICs 101
23.1. IC2018 (C2CBYY000196): Operation CPU 101
24 Exploded Views 102
24.1. Cabinet Parts Location 102
24.2. Packaging 104
25 Replacement Parts List 105
25.1. Component Parts List 106
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1 Safety Precautions
1.1. GENERAL GUIDELINES
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. LEAKAGE CURRENT COLD CHECK
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MΩand 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be .
Figure 1
1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to
the customer.
1.2. Before Repair and Adjustment
Disconnect AC power, discharge Power Supply Capacitors C5716, C5717, C5718 through a 10 Ω, 10 W resistor to ground.
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
Current consumption at AC 230 V, 50 Hz in NO SIGNAL mode volume minimal should be ~ 600 mA. (For E/ EG)
Current consumption at AC 230V~240 V, 50 Hz in NO SIGNAL mode volume minimal should be ~ 600 mA. (For EB)
1.3. Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
· No sound is heard when the power is turned on.
· Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
“shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
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SA-HT855E / SA-HT855EB / SA-HT855EG

If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
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SA-HT855E / SA-HT855EB / SA-HT855EG

3 Precaution of Laser Diode
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SA-HT855E / SA-HT855EB / SA-HT855EG

4 About Lead Free Solder (PbF)
4.1. Service caution based on legal restrictions
4.1.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
· The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
· To put lead free solder, it should be well molten and mixed with the original lead free solder.
· Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
· Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt
the lead free solder.
· Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
degrees C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
· The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
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SA-HT855E / SA-HT855EB / SA-HT855EG

5 Caution for AC Mains Lead
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6 Handling Precautions for Traverse Unit
The laser diode in the optical pickup unit may break down due to static electricity of clothes or human body. Special care must be
taken avoid caution to electrostatic breakdown when servicing and handling the laser diode.
6.1. Cautions to Be Taken in Handling the Optical Pickup Unit
The laser diode in the optical pickup unit may be damaged due to electrostatic discharge generating from clothes or human body.
Special care must be taken avoid caution to electrostatic discharge damage when servicing the laser diode.
1. Do not give a considerable shock to the optical pickup unit as it has an extremely high-precise structure.
2. To prevent the laser diode from the electrostatic discharge damage, the flexible cable of the optical pickup unit removed should
be short-circuited with a short pin or a clip.
3. The flexible cable may be cut off if an excessive force is applied to it. Use caution when handling the flexible cable.
4. The antistatic FPC is connected to the new optical pickup unit. After replacing the optical pickup unit and connecting the flexible
cable, cut off the antistatic FPC.
6.2. Grounding for electrostatic breakdown prevention
Some devices such as the DVD player use the optical pickup (laser diode) and the optical pickup will be damaged by static
electricity in the working environment. Proceed servicing works under the working environment where grounding works is
completed.
6.2.1. Worktable grounding
1. Put a conductive material (sheet) or iron sheet on the area where the optical pickup is placed, and ground the sheet.
6.2.2. Human body grounding
1. Use the anti-static wrist strap to discharge the static electricity form your body.
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SA-HT855E / SA-HT855EB / SA-HT855EG