Panasonic TH-42PA50A User manual

© 2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-42PA50A
TH-42PA50H
TH-42PA50M
TH-37PA50H
TH-37PA50M
GP8DA Chassis
Progressive Plasma Television
Specifications
Power Source
A
C 220-240 V, 50 / 60 Hz
Power Consumption
A
verage use : 245 W (37-inch)
A
verage use : 315 W (42-inch)
Standby condition : 0.3 W (37-inch)
Standby condition : 0.3 W (42-inch)
Plasma Display panel
Drive method
A
C type
Aspect Ratio 16:9
Contrast Ratio 4000:1
Screen size (No.of pixels) 818 mm (W) × 461 mm (H) × 939 mm (diagonal) (37-inch)
920 mm (W) × 518 mm (H) × 1,056 mm (diagonal) (42-inch)
408,960 (852 (W) × 480 (H)) [2,556 × 480 dots]
Sound
Speaker 12 cm × 6 cm × 2 pcs, 6 W
Audio Output 16 W (8 W + 8 W ), 10% THD
Applicable signals
Colour System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 480i(60Hz), 480p(60Hz), 576i(50Hz), 576p(50Hz), 720p(50Hz), 720p(60Hz), 1080i(50Hz), 1080i(60Hz),
1152i(50Hz) (42PA50A)
Receiving Systems
/ Band name (PA50H/M)
ORDER NO.ITD0506034CE

1 Applicable signals 5 2 Safety Precautions 5
Receiving Systems
/ Band name (PA50A)
Receiving Channels (PA50H/M) Regular TV
VHF BAND UHF BAND CATV
2-12 (PAL/SECAM B, K1) 21-69 (PAL G, H, I/SECAM G, K, K1) S1-S20 (OSCAR)
0-12 (PAL B AUST.) 28-69 (PAL B AUST.) 1-125 (USA CATV)
1-9 (PAL B N.Z.) 13-57 (PAL D, K) C13-C49 (JAPAN)
1-12 (PAL/SECAM D) 13-62 (NTSC M Japan) S21-S41 (HYPER)
1-12 (NTSC M Japan) 14-69 (NTSC M USA) Z1-Z37 (CHINA)
2-13 (NTSC M USA) 5A, 9A (AUST.)
Receiving Channels (PA50A) VHF 0 to 12 PAL B
UHF 21 to 69 PAL G
S’1 to S’3 HYPER TUNER
S1 to S41 (One tuner)
Aerial - Rear UHF / VHF
Operating Conditions Temperature : 0 °C - 40 °C
Humidity : 20 % - 80 % RH (non-condensing)
Connection Terminals
AV1 Input
AUDIO L - R RCA PIN Type × 2 0.5 Vrms
VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
S VIDEO MINI DIN 4-pin Y: 1.0 Vp-p (75 W) C: 0.286 Vp-p (75 W)
AV2 Input
AUDIO L - R RCA PIN Type × 2 0.5 Vrms
VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
COMPONENT Y
PB/CB/, PR/CR
1.0 Vp-p (including synchronization)
±0.35 Vp-p
AV3 Input
AUDIO L - R RCA PIN Type × 2 0.5 Vrms
VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
COMPONENT Y
PB/CB/, PR/CR
1.0 Vp-p (including synchronization)
±0.35 Vp-p
OUTPUT
AUDIO L - R RCA PIN Type × 2 0.5 Vrms (high impedance)
VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
Dimensions ( W × H × D ) 968 mm × 641 mm × 97 mm (37-inch)
1,068 mm × 701 mm × 97 mm (42-inch)
Weight 29.0 kg Net (37-inch)
33.0 kg Net (42-inch)
Notes:
·
· ·
· Design and Specifi cations are subject to change without notice. Weight and Dimensions shown are approximate.
CONTENTS
Page Page
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Plasma panel replacement method 9
6.1. Remove the Back cover. 9
6.2. Remove the P-Board. 9
6.3. Remove the PB-Board 9
6.4. Remove the D-Board 9
6.5. Remove the rear terminal cover 10
6.6. Remove the metal frame 10
6.7. Remove the DG-Board 10
6.8. Remove the H-Board and TA-Board 10
6.9. Remove the PA-Board 11
6.10. Remove the Z-Board 11
6.11. Remove the SU-Board 11
6.12. Remove the SD-Board 12
6.13. Remove the SC-Board 12
6.14. Remove the SS-Board 12
6.15. Remove the C1-Board 13
6.16. Remove the C2-Board 13
6.17. Remove the K-Board 13
6.18. Remove the S-Board 13
6.19. Remove the Speaker L, R 14
6.20. Remove the Plasma panel section from the Front frame
(glass) 14
6.21. Replace the plasma panel (finished). 15
7 Location of Lead Wiring 16
7.1. Lead of Wiring (1) 16
7.2. Lead of Wiring (2) 17
7.3. Lead of Wiring (3) 18
8 Self Check 19
8.1. Power LED Blinking timing chart 20
8.2. No Power 20
8.3. No Picture 21
8.4. Local screen failure 22
9 Service Mode Function 23
9.1. How to enter SERVICE 1 23
9.2. How to enter SERVICE 2 23
9.3. Option Description 25
9.4. Option Code Setting 27
10 Adjustment Procedure 28
10.1. Driver Set-up 28
10.2. Initialization Pulse Adjust 29
10.3. P.C.B. (Printed Circuit Board) exchange 30
10.4. Adjustment Volume Location 30
10.5. Test Point Location 30
11 Adjustment 31
11.1. PAL panel white balance adjustment 31
11.2. 1080i white balance adjustment 32
11.3. Sub bright adjustment 33
11.4. ABL adjustment 33
12 Hotel mode 34
13 Conductor View 35
13.1. P-Board 35
13.2. PA-Board 38
13.3. PB-Board 39
13.4. H-Board 40
13.5. DG-Board 42
13.6. TA-Board 44
13.7. TB-Board 45
13.8. Z-Board 46
13.9. D-Board 47
13.10. C1-Board (37 inch) 50
13.11. C1-Board (42 inch) 51
13.12. C2-Board (37 inch) 52
13.13. C2-Board (42 inch) 53
13.14. SC-Board 54
13.15. SU-Board (37 inch) 57
13.16. SU-Board (42 inch) 58
13.17. SD-Board (37 inch) 59
13.18. SD-Board (42 inch) 60
13.19. SS-Board 61
13.20. K and S-Board 63
14 Block and Schematic Diagram 65
14.1. Schematic Diagram Notes 65
14.2. Main Block Diagram 66
14.3. P-Board Block Diagram 67
14.4. P-Board (1 of 6) Schematic Diagram 68
14.5. P-Board (2 of 6) Schematic Diagram 69
14.6. P-Board (3 of 6) Schematic Diagram 70
14.7. P-Board (4 of 6) Schematic Diagram 71
14.8. P-Board (5 of 6) Schematic Diagram 72
14.9. P-Board (6 of 6) Schematic Diagram 73
14.10. PA and PB-Board Block Diagram 74
14.11. PA-Board Schematic Diagram 75
14.12. PB-Board Schematic Diagram 76
14.13. H, TA and TB-Board Block Diagram 77
14.14. K, S and Z-Board Block Diagram 78
14.15. H Board (1 of 3) Schematic Diagram 79
14.16. H-Board (2 of 3) Schematic Diagram 80
14.17. H-Board (3 of 3) Schematic Diagram 81
14.18. TA and TB-Board Schematic Diagram 82
14.19. K and S-Board Schematic Diagram 83
14.20. Z-Board Schematic Diagram 84
14.21. DG-Board (1 of 2) Block Diagram 85
14.22. DG-Board (2 of 2) Block Diagram 86
14.23. DG-Board (1 of 12) Schematic Diagram 87
14.24. DG-Board (2 of 12) Schematic Diagram 88
14.25. DG-Board (3 of 12) Schematic Diagram 89
14.26. DG-Board (4 of 12) Schematic Diagram 90
14.27. DG-Board (5 of 12) Schematic Diagram 91
14.28. DG-Board (6 of 12) Schematic Diagram 92
14.29. DG-Board (7 of 12) Schematic Diagram 93
14.30. DG-Board (8 of 12) Schematic Diagram 94
14.31. DG-Board (9 of 12) Schematic Diagram 95
14.32. DG-Board (10 of 12) Schematic Diagram 96
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

14.33. DG-Board (11 of 12) Schematic Diagram 97
14.34. DG-Board (12 of 12) Schematic Diagram 98
14.35. D-Board Block Diagram 99
14.36. D-Board (1 of 6) Schematic Diagram 100
14.37. D-Board (2 of 6) Schematic Diagram 101
14.38. D-Board (3 of 6) Schematic Diagram 102
14.39. D-Board (4 of 6) Schematic Diagram 103
14.40. D-Board (5 of 6) Schematic Diagram 104
14.41. D-Board (6 of 6) Schematic Diagram 105
14.42. C1 and C2-Board Block Diagram 106
14.43. C1-Board (1 of 2) Schematic Diagram (37 inch) 107
14.44. C1-Board (2 of 2) Schematic Diagram (37 inch) 108
14.45. C1-Board (1 of 2) Schematic Diagram (42 inch) 109
14.46. C1-Board (2 of 2) Schematic Diagram (42 inch) 110
14.47. C2-Board (1 of 2) Schematic Diagram (37 inch) 111
14.48. C2-Board (2 of 2) Schematic Diagram (37 inch) 112
14.49. C2-Board (1 of 2) Schematic Diagram (42 inch) 113
14.50. C2-Board (2 of 2) Schematic Diagram (42 inch) 114
14.51. SC-Board Block Diagram 115
14.52. SC-Board (1 of 2) Schematic Diagram 116
14.53. SC-Board (2 of 2) Schematic Diagram 117
14.54. SU-Board Block Diagram 118
14.55. SU-Board Schematic Diagram (37 inch) 119
14.56. SU-Board Schematic Diagram (42 inch) 120
14.57. SD-Board Block Diagram 121
14.58. SD-Board Schematic Diagram (37 inch) 122
14.59. SD-Board Schematic Diagram (42 inch) 123
14.60. SS-Board Block Diagram 124
14.61. SS-Board Schematic Diagram 125
15 Parts Location & Mechanical Replacement Parts List 127
15.1. Parts Location 127
15.2. Packing Exploded Views (1) 128
15.3. Packing Exploded Views (2) 129
15.4. Packing Exploded Views (3) 130
15.5. Mechanical Replacement Parts List 131
16 Electrical Replacement Parts List 132
16.1. Replacement Parts List Notes 132
16.2. Electrical Replacement Parts List (37inch) 133
16.3. Electrical Replacement Parts List (42inch) 157
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MWand 5.2MW.
When the exposed metal does not have a return path to the
chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
1 Applicable signals
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
·
· ·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· ·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

5 Service Hint
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Left)
PA DC-DC Converter, Power SOS C2 Data Driver (Right)
PB Audio Power SC Scan Drive
H AV Terminal, AV Switch, MSP SU Scan out (Upper)
TA (PA50A) Tuner SD Scan out (Lower)
TB (PA50H/M) Tuner SS Sustain Drive
DG Digital Signal Processor K Remote receiver, Keyscan
Z Speaker AMP S Power Switch
D Format Converter, Plasma AI Processor
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

6.1. Remove the Back cover.
1. See Service Hint (Section 5).
6.2. Remove the P-Board.
Caution:
To remove P.C.B., wait 1 minute after power was off for
discharge from electrolisis capacitors.
1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23
and P25).
2. Remove the screws (×5 ) and remove the P-Board.
6.3. Remove the PB-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PB5 and PB7).
3. Remove the screws (×3 ) and remove the PB-Board
metal frame.
4. Remove the screws (× 4 ) and remove the PB-Board.
6.4. Remove the D-Board
1. Remove the PB-Board.
2. Disconnect the couplers (D3, D5, D20 and D25) and
3. Disconnect the flexible cables (D33 and D34).
4. Remove the screws (×4 ) and remove the D-Board.
6 Plasma panel replacement method
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

6.5. Remove the rear terminal
cover
1. Remove the screws (×4 ), and rhe screw (×7 ).
2. Remove the rear terminal cover.
6.6. Remove the metal frame
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (D3, D5, H7, P10 and PB7) and
relay connector (SP-R, SP-L).
3. Remove the screws (×4 ) remove the metal frame.
6.7. Remove the DG-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (DG3 and DG5).
3. Disconnect the flexible cables (DG1, DG2 and DG20).
4. Remove the screws (×2 ) and remove the DG-Board.
6.8. Remove the H-Board and TA-
Board
1. Unlock the cable clampers to free the cable.
2. Remove the screws (×2 ) and remove the TA-Board.
3. Disconnect the coupler (H53).
4. Disconnect the flexible ables (H1, H2, H30 and H50).
5. Remove the screws (×3 ) and remove the H-Board.
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

6.9. Remove the PA-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PA7 and PA10).
3. Disconnect the flexible cables (PA20 and PA30).
4. Remove the screws (×4 ) and remove the PA-Board.
6.10. Remove the Z-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (Z2).
3. Disconnect the flexible cable (Z50).
4. Remove the screws (×2 ) and remove the Z-Board.
6.11. Remove the SU-Board
1. Remove the screws (×2 )
2. Slide the SU-Board to the left to disconnect from a coupler
(SC41 - SU41) on the SC-Board and disconnect a coupler
(SU45 or SC45).
3. Disconnect the flexible cables (SU1, SU2, SU3) connected
to the SU-Board, and remove the SU-Board.
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

6.12. Remove the SD-Board
1. Remove the screws (×2 )
2. Slide the SD-Board to the left to disconnect from a coupler
(SC42 - SD42) on the SC-Board and disconnect a coupler
(SD46 or SC46).
3. Disconnect the flexible cables (SD1, SD2 and SD3)
connected to the SU-Board, and remove the SD-Board.
6.13. Remove the SC-Board
1. Disconnect the couplers (SC2, SC20 and SC23).
2. Remove the screws (×6 ) and remove the SC-Board.
6.14. Remove the SS-Board
1. Disconnect the couplers (SS11, SS12, SS23 and SS34).
2. Disconnect the flexible cables (SS41, SS42, SS43 and
SS44).
3. Remove the screws (×6 ) and remove the SS-Board.
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

6.15. Remove the C1-Board
1. Remove the flexible cables holder fastening screws (×6
).
2. Disconnect the flexible cables (CB1, CB2 and CB3).
3. Disconnect the flexible cable (C11).
4. Disconnect the coupler (C12).
5. Remove the screws (×3 ) and remove the C1-Board.
6.16. Remove the C2-Board
1. Remove the flexible cables holder fastening screws (×8
).
2. Disconnect the flexible cables (CB4, CB5, CB6 and CB7).
3. Disconnect the flexible cable (C21).
4. Disconnect the couplers (C22 and C23).
5. Remove the screws (×3 ) and slide the C2-Board to the
left and remove the C2-Board.
6.17. Remove the K-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (H53 and SS34).
3. Remove the screws (×3 ) and remove the K-Board.
6.18. Remove the S-Board
1. Remove the screw (×2 ) and remove the S-Board unit.
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

2. Unlock the cable clampers to free the cable.
3. Disconnect the couplers (S1 and S2).
4. Remove the screws (×2 ) and remove the S-Board.
6.19. Remove the Speaker L, R
1. Remove the screw (×8 ) and remove the Speaker L, R.
6.20. Remove the Plasma panel
section from the Front frame
(glass)
1. Remove the front frame and the plasma panel fastening
screw (×8 ).
2. Remove the front frame and the stand brackets fastening
screw (×6 ).
3. For leaving the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

6.21. Replace the plasma panel
(finished).
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2. Attach the C1-Board and the C2-Board, connect the flexible
cables (×7) from the Plasma panel to the C1-Board and C2-
Board, and fix the flexible cable holders.
3. Attach the Hooks (left, right) and fit the stand brackets (left,
right) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the front frame and the each P.C.Board and so on,
to the new plasma panel.
* When fitting the front frame, be careful not to allow
any debris, dust or handling residues to remain
between the front glass and plasma panel.
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

7 Location of Lead Wiring
7.1. Lead of Wiring (1)
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

7.2. Lead of Wiring (2)
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

7.3. Lead of Wiring (3)
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

8 Self Check
1. Self-Check is used to automatically check the bus lines and hexadecimal code of the TV set.
2. To get into the Self -Check mode press the Down ( ) button on the customer controls at the front of the set, at the same
timepressingtheRecall buttonontheremotecontrol,andthescreenwillshow:
If the CCU ports have been checked and found to be incorrect or not located then “--” will appear in place of “O.K.”.
Display Ref.No Description P.C.B.
MEM IC1107 EEPROM DG-Board
GC3FS IC4013 Global Core for Sub DG-Board
GC4P IC4054 Global Core for Main DG-Board
HAD IC4012 OSD RGB A/D DG-Board
AVSW1 IC2105 Audio SW H-Board
AVSW2 IC3005 Video SW H-Board
Tun1 TU001 Tuner TA/TB-Board
Tun2 TU002 Tuner TB-Board
DAC1 IC1106 Ext. DAC DG-Board
DAC3 IC3006 Ext. I/O H-Board
DAC4 IC4016 Ext. I/O DG-Board
MSP IC2106 Multi Sound Processor H-Board
SOUND IC2300 Sound Control Z-Board
PANEL IC9003 Panel D-Board
ADV IC4005 10bit A/D DG-Board
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M

8.1. Power LED Blinking timing chart
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
8.2. No Power
First check point
There are following 3 states of No Power indication by power LED.
1. No lit
2. Green is lit then turns red blinking a few seconds later.
3. Only red is lit.
1. No lit
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TH-42PA50A / TH-42PA50H / TH-42PA50M / TH-37PA50H / TH-37PA50M