Panasonic TH-50PV600AZ User manual

ORDER NO.ITD0604020CE
Service Manual
Plasma Television
TH-50PV600AZ
TH-50PV600H
TH-50PV600M
TH-50PV600MT
GP9DE hassis
Power Source
Power onsumption
Average use
Standby condition
Plasma Display panel
Drive method
Aspect Ratio
ontrast Ratio
Visible screen size
(No. of pixels)
Sound
Speaker
Audio Output
Headphones
P signals
Receiving Systems/
Band Name
(PV600AZ)
A 220-240 V, 50/60 Hz
448 W
0.3 W
A type
16:9
Max 10000:1
127 cmV
1,106 mm (W) x 622 mm (H) x 1,269 mm (diagonal)
1,049,088 (1,366 (W) x 768 (H)) [4,098 x 768 dots]
Woofer ( Ф 80 mm) x 2 pcs, Tweeter (23 mm x Ю0 mm) x 2pcs
31 W [15.5 W + 15.5 W] (10 % THD)
M3 (3.5 mm) Jack x 1
VGA, SVGA, XGA
SXGA .... (compressed)
Horizontal scanning frequency 31-69 kHz
Vertical scanning frequency 59-86 Hz
1. PAL B/G Reception of Off ir bro dc sts
2. NTSC 4.43
3. NTSC 3.58
4. PAL 60Hz
Pl yb ck from Video T pe Recorders
Pl yb ck from Speci l Video T pe Recorders nd Speci l Video Disc Pl yers
(Vi the AV Sockets) only.
Panasonic © 2006 Matsushita Electric Industrial o., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.

ITH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MTI
Receiving Systems /
Band name (PV600H/M/MT)
Receiving hannels
(PV600AZ)
Receiving hannels
(Regular TV) (PV600H/M/MT)
Aerial - Rear
Operating onditions
Temperature
Humidity
onnection Terminals
AV1 AUDIO L-R
Input
AV2
Input
AV3
Input
VIDEO
S VIDEO
AUDIO L-R
VIDEO
OMPONENT
AUDIO L-R
VIDEO
OMPONENT
AV4 AUDIO L-R
Input VIDEO
S VIDEO
Others HDMI1/2 Input
P Input
17 Systems Function
1 PAL B, G, H
Reception of bro dc st
tr nsmissions nd
Pl yb ck from Video
C ssette T pe Recorders
2 PALI
3 PAL D, К
4 SECAMB, G
5 SECAM D, К
6 SECAM K1
7NTSC M(NTSC
3.58/4.5 MHz)
Audio Input
ard slot
Monitor AUDIO L-R
Output VIDEO
Dimensions (W x H x D)
Weight
Note:
Design and Specifications are subject change without notice.
Weight and Dimensions shown are approximate.
17 Systems Function
8 NTSC 4.43/5.5 MHz
Pl yb ck from Speci l VCR's or DVD
9 NTSC 4.43/6.0 MHz
10 NTSC 4.43/6.5 MHz
11 NTSC 3.58/5.5 MHz
12 NTSC 3.58/6.0 MHz
13 NTSC 3.58/6.5 MHz
14 SECAM I
15 PAL 60 Hz/5.5 MHz Pl yb ck from Speci l Disc Pl yers
nd Speci l VCR's or DVD
16 PAL 60 Hz/6.0 MHz
17 PAL 60 Hz/6.5 MHz
VHF 0 to 12
UHF 21 to 69
S’1 to S’3
S1 to S41
VHF BAND
2-12(PAL/SE AM B,K1)
0-12(PAL BAUST.)
1-9(PAL B N.Z.)
1-12(PAL/SE AM D)
1-12(NTS M Japan)
2-13(NTS M USA)
VHF/UHF
0 ° -40 °
20% - 80 % RH (non-condensing)
R A PIN Type x 2
R A PIN Type x 1
Mini DIN 4-pin
R A PIN Type x 2
R A PIN Type x 1
Y
PB/ B, PR/ R
R A PIN Type x 2
R A PIN Type x 1
Y
PB/ B, PR/ R
R A PIN Type x 2
R A PIN Type x 1
Mini DIN 4-pin
TYPE A onnectors
HIGH-DENSITY D-SUB 15 PIN
PAL B
PAL G
HYPER TUNER
UHF BAND ATV
21-69(PAL,G,H,I/SE AM G,K,K1) S1-S20(0S AR)
28-69(PAL B AUST.)
13-57(PAL D,K)
13-62(NTS M Japan)
14-69(NTS M USA)
1-125(USA ATV)
13- 49(JAPAN)
S21-S41(HYPER)
Z1-Z37( HINA)
5A,9A(AUST.)
R A PIN Type x 2
SD ARD slot x 1
R A PIN Type x 2
R A PIN Type x 1
1,266 mm x 802 mm x 138 (panel
43.0 kg Net
0.5 V[rms]
1.0 V[p-p] (75 a)
Y: 1.0 V[p-p] (75 a) : 0.286 V[p-p] (75 a)
0.5 V[rms]
1.0 V[p-p] (75 a)
1.0 V[p-p] (including synchronization)
± 0.35 V[p-p]
0.5 V[rms]
1.0 V[p-p] (75 a)
1.0 V[p-p] (including synchronization)
± 0.35 V[p-p]
0.5 V[rms]
1.0 V[p-p] (75 a)
Y: 1.0 V[p-p] (75 a) : 0.286 V[p-p] (75 a)
R, G, B/0.7 V[p-p] (75 a)
HD, VD/TTL Level 2.0-5.0 V[p-p] (high impedance)
0.5 V[rms]
0.5 V[rms] (high impedance)
1.0 V[p-p] (75 a)
part: 95) mm
2

TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
A WARNING
This service inform tion is designed for experienced rep ir technici ns only nd is not designed for use by the gener l public.
It does not cont in w rnings or c utions to dvise non-technic l individu ls of potenti l d ngers in ttempting to service product.
Products powered by electricity should be serviced or rep ired only by experienced profession l technici ns. Any ttempt to service
or rep ir the product or products de lt with in this service inform tion by nyone else could result in serious injury or de th.
ONTENTS Page
1 Applicable signals..............................................................................5
2 Safety Precautions.............................................................................6
2.1. General Guidelines ..................................................................6
2.2. Touch- urrent heck.............................................................. 6
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices.......................................7
4 About lead free solder (PbF)............................................................8
5 Service Hint..........................................................................................9
6 Plasma panel replacement method..............................................10
6.1. Remove the Back cover....................................................10
6.2. Remove the fan................................................................. 10
6.3. Remove the Speaker box ass’y (left)..............................10
6.4. Remove the Speaker box ass’y (right)
........................... 10
6.5. Remove the rear terminal cover ...................................... 10
6.6. Remove the P-Board ......................................................... 11
6.7. Remove the PA-Board......................................................12
6.8. Remove the tuner unit......................................................12
6.9. Remove the DG-Board..................................................... 12
6.10. Remove the TA-Board........................................................12
6.11. Remove the H-Board...........................................................13
6.12. Remove the H -Board........................................................13
6.13. Remove the D-Board...........................................................13
6.14. Remove the SU-Board........................................................13
6.15. Remove the SD-Board........................................................14
6.16. Remove the S -Board........................................................14
6.17. Remove the SS2-Board......................................................14
6.18. Remove the SS3-Board......................................................14
6.19. Remove the SS-Board........................................................15
6.20. Remove the 1-Board........................................................ 15
6.21. Remove the 2-Board........................................................ 15
6.22. Remove the 3-Board........................................................ 15
6.23. Remove the stand brackets...............................................16
6.24. Remove the 4-Board........................................................ 16
6.25. Remove the 5-Board........................................................ 16
6.26. Remove the 6-Board........................................................ 16
6.27. Remove the front bracket...................................................17
6.28. Remove the G-Board, GK-Board and GS-Board
............ 17
6.29. Remove the S-Board...........................................................17
6.30. Remove the GS-Board and SD-Module ........................... 17
6.31. Remove the Plasma panel section from the Front frame
(glass)...................................................................................... 18
6.32. Remove the squawker speaker ......................................... 19
6.33. Remove the K-Board...........................................................19
6.34. Replace the plasma panel (finished) ................................ 20
7 Location of Lead Wiring..................................................................21
7.1. Lead of Wiring (1).................................................................21
3
Page
7.2. Lead of Wiring (2) .................................................................. 22
7.3. Lead of Wiring (3)..................................................................23
7.4. Lead of Wiring (4)..................................................................24
7.5. Lead of Wiring (5)..................................................................25
8 Self-check Function......................................................................... 26
8.1. Power LED Blinking timing chart..........................................27
8.2. No Power.................................................................................28
8.3. No Picture................................................................................29
8.4. Local screen failure................................................................30
9 Service Mode Function....................................................................31
9.1. Howto enter SERVI E 1 .....................................................31
9.2. How to enter SERVI E 2 .....................................................31
9.3. Option Description..................................................................33
10 Adjustment Procedure.....................................................................35
10.1. Driver Set-up...........................................................................35
10.2. Initialization Pulse Adjust.......................................................36
10.3. P. .B. (Printed ircuit Board) exchange.............................36
10.4. Adjustment Volume Location................................................37
10.5. Test Point Location................................................................37
11 Adjustment......................................................................................... 38
11.1. PAL panel white balance adjustment..................................38
11.2. HD white balance adjustment...............................................39
11.3. Sub bright adjustment............................................................40
11.4. ABL adjustment.......................................................................41
11.5. Sub- ontrast adjustment.......................................................42
11.6. Multi-window adjustment.......................................................43
12 Hotel mode.........................................................................................44
13 onductor Views..............................................................................45
13.1. P-Board....................................................................................45
13.2. PA-Board.................................................................................48
13.3. H, H and TA-Board..............................................................50
13.4. G-Board................................................................................... 52
13.5. GK, K and S-Board................................................................53
13.6. DG-Board.................................................................................54
13.7. D-Board....................................................................................56
13.8. 1-Board................................................................................. 58
13.9. 2-Board................................................................................. 59
13.10. 3-Board................................................................................. 60
13.11. 4-Board..................................................................................61
13.12. 5-Board................................................................................. 62
13.13. 6-Board................................................................................. 63
13.14. S -Board.................................................................................64
13.15. SU-Board.................................................................................67
13.16. SD-Board.................................................................................68
13.17. SS-Board.................................................................................69
13.18. SS-Board..................................................................................71

TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
13.19. GS-Board ................................................................................. 72
14 Block and Schematic Diagram......................................................73
14.1. Schematic Diagram Note...................................................... 73
14.2. Main Block Diagram...............................................................74
14.3. P-Board Block Diagram.........................................................75
14.4. P-Board (1 of 2) Schematic Diagram ................................... 76
14.5. P-Board (2 of 2) Schematic Diagram ................................... 77
14.6. PA-Board Block Diagram ...................................................... 78
14.7. PA-Board (1 of 3) Schematic Diagram ............................... 79
14.8. PA-Board (2 of 3) Schematic Diagram ............................... 80
14.9. PA-Board (3 of 3) Schematic Diagram................................81
14.10. H and TA-Board Block Diagram...........................................82
14.11. H-Board (1 of 3) Schematic Diagram ................................... 83
14.12. H-Board (2 of 3) Schematic Diagram ................................... 84
14.13. H-Board (3 of 3) Schematic Diagram ................................... 85
14.14. G, GK, H and K-Board Block Diagram .............................86
14.15. G, GKand K-Board Schematic Diagram ............................ 87
14.16. H and TA-Board Schematic Diagram ...............................88
14.17. DG-Board (1 of 3) Block Diagram ........................................ 89
14.18. DG-Board (2 of 3) Block Diagram ........................................ 90
14.19. DG-Board (3 of 3) Block Diagram .........................................91
14.20. DG-Board (1 of 8) Schematic Diagram...............................92
14.21. DG-Board (2 of 8) Schematic Diagram...............................93
14.22. DG-Board (3 of 8) Schematic Diagram...............................94
14.23. DG-Board (4 of 8) Schematic Diagram...............................95
14.24. DG-Board (5 of 8) Schematic Diagram...............................96
14.25. DG-Board (6 of 8) Schematic Diagram...............................97
14.26. DG-Board (7 of 8) Schematic Diagram...............................98
14.27. DG-Board (8 of 8) Schematic Diagram...............................99
14.28. D-Board (1 of 2) Block Diagram.........................................100
14.29. D-Board (2 of 2) Block Diagram..........................................101
14.30. D-Board (1 of 8) Schematic Diagram..................................102
14.31. D-Board (2 of 8) Schematic Diagram..................................103
14.32. D-Board (3 of 8) Schematic Diagram ................................. 104
14.33. D-Board (4 of 8) Schematic Diagram..................................105
14.34. D-Board (5 of 8) Schematic Diagram..................................106
14.35. D-Board (6 of 8) Schematic Diagram..................................107
14.36. D-Board (7 of 8) Schematic Diagram................................108
14.37. D-Board (8 of 8) Schematic Diagram................................109
14.38. 1, 2, 5 and 6-Block Diagram ....................................110
14.39. 3, 4, SS, SS2 and SS3-Board Block Diagram.............111
14.40. 1-Board (1 of 2) Schematic Diagram ............................ 112
14.41. 1 -Board (2 of 2) Schematic Diagram ............................ 113
14.42. 2-Board (1 of 3) Schematic Diagram ............................ 114
14.43. 2-Board (2 of 3) Schematic Diagram ............................ 115
14.44. 2-Board (3 of 3) Schematic Diagram ............................ 116
14.45. 3-Board (1 of 2) Schematic Diagram ............................ 117
14.46. 3-Board (2 of 2) Schematic Diagram ............................ 118
14.47. 4-Board (1 of 2) Schematic Diagram ............................ 119
14.48. 4-Board (2 of 2) Schematic Diagram ............................ 120
14.49. 5-Board (1 of 3) Schematic Diagram ............................. 121
14.50. 5-Board (2 of 3) Schematic Diagram ............................ 122
14.51. 5-Board (3 of 3) Schematic Diagram ............................ 123
14.52. 6-Board (1 of 2) Schematic Diagram ............................ 124
14.53. 6-Board (2 of 2) Schematic Diagram ............................ 125
14.54. SS, SS2 and SS3-Board Schematic Diagram ..................126
14.55. S , SU and SD-Board Block Diagram .............................. 127
14.56. S -Board (1 of 2) Schematic Diagram ............................ 128
14.57. S -Board (2 of 2) Schematic Diagram ............................ 129
14.58. SU-Board (1 of 2) Schematic Diagram ............................ 130
14.59. SU-Board (2 of 2) Schematic Diagram ............................. 131
14.60. SD-Board (1 of 2) Schematic Diagram ............................ 132
14.61. SD-Board (2 of 2) Schematic Diagram ............................ 133
14.62. GS-Board Block and Schematic Diagram ......................... 134
15 Parts Location & Mechanical Replacement Parts List ........ 135
15.1. Parts Location .......................................................................135
15.2. Packing Exploded Views (1)..............................................136
15.3. Packing Exploded Views (2)..............................................137
15.4. Packing Exploded Views..................................................... 138
15.5. Mechanical Replacement Parts List...................................139
16 Electrical Replacement Parts List...............................................140
16.1. Replacement Parts List Notes............................................140
16.2. Electrical Replacement Parts List ....................................... 141
4

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT I
1 Applicable signals
Input signal that can be displayed
: M rk: Applic ble input sign l for Component (Y, Pb/Cb, Pr/Cr), HDMI nd PC (D-sub 15P)
Signal name Horizontal
frequency (kHz) Vertical frequency (Hz) omponent HDMI P
480i (60 Hz) 15.73 59.94 * *
480p (60 Hz) 31.47 59.94 * *
576i (50 Hz) 15.63 50.00 **
576p (50 Hz) 31.25 50.00 **
720p (60 Hz) 45.00 60.00 * *
720p (50 Hz) 37.50 50.00 * *
1,080i (60 Hz) 33.75 60.00 * *
1,080i (50 Hz) 28.13 50.00 * *
1,080i (50 Hz)*1 31.25 50.00 * *
640 x 400 @70 Hz 31.46 70.07 *
640 x 480 @60 Hz 31.47 59.94 *
640 x 480 @75 Hz 37.50 75.00 *
800 x 600 @60 Hz 37.88 60.32 *
800 x 600 @75 Hz 46.88 75.00 *
800 x 600 @85 Hz 53.67 85.06 *
1,024x768 @60 Hz 48.36 60.00 *
1,024x768 @70 Hz 56.48 70.07 *
1,024x768 @75 Hz 60.02 75.03 *
1,024x768 @85 Hz 68.68 85.00 *
1,280 x 1,024 @60 Hz 63.98 60.02 *
M cintosh13” (640 x 480) 35.00 66.67 *
M cintosh16” (832 x 624) 49.72 74.54 *
M cintosh21” (1,152x 870) 68.68 75.06 *
С Note ) #Sign ls other th n bove m y not be displ yed properly.
#The bove sign ls re reform tted for optim l viewing on your displ y.
5

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT I
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the origin l le d dress. If short circuit is found, repl ce ll p rts which h ve been overhe ted or
d m ged by the short circuit.
2. After servicing, see to it th t ll the protective devices such s insul tion b rriers, insul tion p pers shields re properly
inst lled.
3. After servicing, m ke the following le k ge current checks to prevent the customer from being exposed to shock h z rds.
2.2. Touch- urrent heck
1. Plug the AC cord directly into the AC outlet. Do not use n isol tion tr nsformer for this check.
2. Connect me suring network for touch currents between e ch exposed met llic p rt on the set nd good e rth ground such
s w ter pipe, s shown in Figure 1.
3. Use Le k ge Current Tester (Simpson 228 or equiv lent) to me sure the potenti l cross the me suring network.
4. Check e ch exposed met llic p rt, nd me sure the volt ge t e ch point.
5. Reserve the AC plug in the AC outlet nd repe t e ch of the bove me sure.
6. The potenti l t ny point (TOUGH CURRENT) expressed s volt ge Ui nd U2, does not exceed the following v lues:
For . c.: Ui = 35 V (pe k) nd U2 = 0.35 V (pe k);
For d. c.: Ui = 1.0 V,
Note:
The limit v lue of U2 = 0.35 V (pe k) for . c. nd U1 = 1.0 V for d. c. correspond to the v lues 0.7 mA (pe k) . c. nd 2.0
mA d. c.
The limit v lue U1 = 35 V (pe k) for . c. correspond to the v lue 70 mA (pe k) . c. for frequencies gre ter th n 100 kHz.
7. In c se me surement is out of the limits specified, there is possibility of shock h z rd, nd the equipment should be
rep ired nd rechecked before it is returned to the customer.
Measuring network for TOU H URRENTS
COLD
WATER PIPE
(EARTH GROUND)
Rs= _L Cs
1500Q 0.22|jF10kQ
1 J 1 1
Ro=
----------------
J500Q Ui =
r
- 0.022|jF (V)
JQ LjJ U U U IZ U 1 —|— и.и^<фГ ^ V J | U2 (V)
APPLIANCES
EXPOSED
METAL PARTS
Resist nce v lues in ohms (Q)
V: Voltmeter or oscilloscope
(r.m.s. or pe k re ding)
Input resist nce: > 1 MQ
Input c p cit nce: < 200 pF
Frequency r nge: 15 Hz to 1 MHz nd d.c. respectively
NOTE - Appropri te me sures should be t ken to obt in the correct v lue in c se of non-sinusoid l w veforms.
Figure 1
6

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT I
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid st te) devices c n be d m ged e sily by st tic electricity. Such components commonly re c lled
Electrost tic lly Sensitive (ES) Devices. Ex mples of typic l ES devices re integr ted circuits nd some field-effect tr nsistors nd
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component d m ge
c used by electro st tic disch rge (ESD).
1. Immedi tely before h ndling ny semiconductor component or semiconductor-equipped ssembly, dr in off ny ESD on your
body by touching known e rth ground. Altern tively, obt in nd we r commerci lly v il ble disch rging ESD wrist str p,
which should be removed for potenti l shock re sons prior to pplying power to the unit under test.
2. After removing n electric l ssembly equipped with ES devices, pl ce the ssembly on conductive surf ce such s lminum
foil, to prevent electrost tic ch rge buildup or exposure of the ssembly.
3. Use only grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only n nti-st tic solder remov l device. Some solder remov l devices not cl ssified s " nti-st tic (ESD protected)" c n
gener te electric l ch rge sufficient to d m ge ES devices.
5. Do not use freon-propelled chemic ls. These c n gener te electric l ch rges sufficient to d m ge ES devices.
6. Do not remove repl cement ES device from its protective p ck ge until immedi tely before you re re dy to inst ll it. (Most
repl cement ES devices re p ck ged with le ds electric lly shorted together by conductive fo m, lminum foil or comp r ble
conductive m teri l).
7. Immedi tely before removing the protective m teri l from the le ds of repl cement ES device, touch the protective m teri l
to the ch ssis or circuit ssembly into which the device will be inst lled.
aution
Be sure no power is pplied to the ch ssis or circuit, nd observe ll other s fety prec utions.
8. Minimize bodily motions when h ndling unp ck ged repl cement ES devices. (Otherwise h mless motion such s the brushing
together of your clothes f bric or the lifting of your foot from c rpeted floor c n gener te st tic electricity (ESD) sufficient to
d m ge n ES device).
IMPORTANT SAFETY NOTI E
There re speci l components used in this equipment which re impor nt for s fety.
These p rts re m rked by Д in the schem tic di gr ms, Exploded Views nd repl cement p rts list. It is
essenti l th t these critic l p rts should be repl ced with m nuf cturer's specified p rts to prevent shock, fire, or
other h z rds. Do not modify the origin l design without permission of m nuf cturer.
7

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+ u).
That is Tin (Sn), Silver (Ag) and opper ( u) although other types are available.
This model uses Pb Free solder in it's m nuf cture due to environment l conserv tion issues. For service nd rep ir work, we'd
suggest the use of Pb free solder s well, lthough Pb solder m y be used.
PCBs m nuf ctured using le d free solder will h ve the PbF within le f Symbol st mped on the b ck of PCB.
aution
• Pb free solder h s higher melting point th n st nd rd solder. Typic lly the melting point is 50 ~ 70 °F (30~40 °C) higher.
Ple se use high temper ture soldering iron nd set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to spl sh when he ted too high ( bout 1100 °F or 600 °C).
If you must use Pb solder, ple se completely remove ll of the Pb free solder on the pins or solder re before pplying Pb
solder. If this is not pr ctic l, be sure to he t the Pb free solder until it melts, before pplying Pb solder.
• After pplying PbF solder to double l yered bo rds, ple se check the component side for excess solder which m y flow onto
the opposite side. (see figure below)
component component
remove ll of the ^1П\
excess solder
slice
\
solder
Suggested Pb free solder
There re sever l kinds of Pb free solder v il ble for purch se. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder c n lso be used.
8

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT I
5 Service Hint
Board Name Function Board Name Function
P Power Supply 1 Data Driver (Upper Right)
PA D -D onverter, Power SOS,
Speaker out, Audio AMP, Fan ontrol 2 Data Driver (Upper enter)
3 Data Driver (Upper Left)
H AV Terminal, AV Switch, MSP 4 Data Driver (Lower Left)
TA Tuner 5 Data Driver (Lower enter)
DG Digital Signal Processor, Micom, HDMI Interface 6 Data Driver (Lower Right)
D Format onverter, Plasma Ai, Sub-Field Processor S Scan Drive
H Jig onnection SU Scan out (Upper)
K Remote receiver, Power LED SD Scan out (Lower)
S Power Switch SS Sustain Drive
G Front Terminal SS2 Sustain onnector (Upper)
GK Key Switch SS3 Sustain onnector (Lower)
GS SD ard Slot SD-M SD Module (MPEG4/PHOTO view, SD recording)
None serviceable.
SD Module should be exchanged for service.
9

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
6 Plasma panel replacement method
6.1. Remove the Back cover
1. See Service Hint (Section 5)
6.2. Remove the fan
1. Disconnect the rel y couplers.
2. Remove the screws (* 3 ^ e ch) nd remove the f ns.
6.3. Remove the Speaker box ass’y
(left)
1. Unlock the c ble cl mpers to free the c ble.
2. Disconnect the rel y coupler.
3. Remove the Spe ker box ss'y (left).
6.4. Remove the Speaker box ass’y
(right)
1. Unlock the c ble cl mpers to free the c ble.
2. Disconnect the rel y coupler.
3. Remove the Spe ker box ss'y (right).
6.5. Remove the rear terminal
cover
1. Remove the screws (x8 ^ , x5 ■=>, x2 4 ) .
2. Remove the re r termin l cover.
10

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
aution:
To remove P.C.B. w it 1 minute fter power w s off for
disch rge from electrolysis c p citors.
1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23
nd P25).
2. Remove the screws (*6 ^ ) nd remove the P-Bo rd unit.
P25 P10 P23 P5 P11 P2
6.6. Remove the P-Board
3. Remove the screws (x9 ^ ) on the b ck side.
4. Remove the screws (*5 ^ ).
5. Remove the molding props (x8!=>).
6. Remove the P-Bo rd.
Note:
When ssembling the P-Bo rd, the position of e ch hole of
the insul tion sheets (A nd B) is set to the position of e ch
hole of the P-Bo rd, then ssemble them. ( ^ m rks
indic te setting positions.)
11

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
6.7. Remove the PA-Board 6.9. Remove the DG-Board
1. Unlock the c ble cl mpers to free the c ble.
2. Disconnect the couplers (PA1, PA2, PA5, PA10, PA31,
PA32, PA33, PA34 nd PA40).
3. Disconnect the flexible c ble (PA20).
4. Remove the screws ( *4 ^ ) nd remove the e rth c ble.
5. Remove the PA-Bo rd.
РАЗЗ PA31 PA32 РАЮ PA1 PA2 PA5
PA-Board
6.8. Remove the tuner unit
1. Unlock the c ble cl mpers to free the c ble.
2. Disconnect the couplers (DG5, G51, GS52, PA40 nd e rth
c ble).
3. Disconnect the flexible c bles (DG3 nd PA20).
4. Remove the screws (*4 ^ ) remove the tuner unit.
1. Disconnect the coupler (DG2).
2. Disconnect the flexible c bles (DG1, DG15 nd DG20).
3. Remove the screw (*7 ^ ) remove the DG-Bo rd.
DG3 DG5 DG22 DG20 DG1
DG2 DG-Board
6.10. Remove the TA-Board
1. Disconnect the tuner c ble.
2. Remove the screw (*1 nd remove the TA-Bo rd.
12

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
6.11. Remove the H-Board 6.13. Remove the D-Board
1. Unlock the c ble cl mpers to free the c ble.
2. Disconnect the couplers (H2, H40 nd H51).
3. Disconnect the flexible c ble (H1).
4. Remove the screws (*6^) nd remove the H-Bo rd.
6.12. Remove the H -Board
1. Disconnect the couple (HC06).
2. Disconnect the flexible c ble (HC15).
3. Remove the screws (*2^) nd remove the HC-Bo rd.
1. Remove the tuner unit. (See section 6.6.)
2. Disconnect the couplers (D5, D20 nd D25).
3. Disconnect the flexible c bles (D3, D31, D32, D33 nd
D34).
4. Remove the screws (x4 ^ ) nd remove the D-Bo rd.
D5 D20 D31 D32 D25
6.14. Remove the SU-Board
1. Remove the screws (*3 ^ ).
2. Remove the flexible c bles (SU1, SU2, SU3 nd SU4) nd
remove the bridge connector (SU45).
3. Slide the SU-Bo rd to the left to disconnect from coupler
(SC41-SU41) on the SC-Bo rd nd remove the SU-Bo rd.
13

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
6.15. Remove the SD-Board 6.17. Remove the SS2-Board
1. Remove the screws (*3 ^ ).
2. Remove the flexible c bles (SD1, SD2, SD3 nd SD4) nd
remove the bridge connector (SD46).
3. Slide the SD-Bo rd to the left to disconnect from coupler
(SC42-SD42) on the SC-Bo rd nd remove the SD-Bo rd.
6.16. Remove the S -Board
1. Unlock the c ble cl mpers to free the c ble.
2. Disconnect the couplers (SC2, SC20 nd SC23).
3. Remove the screws (x9 ^ ) nd remove the SC-Bo rd.
1. Disconnect the coupler (SS23) nd disconnect the flexible
c ble (SS55).
2. Remove the screws (*2 ^ ) nd remove the SS2-Bo rd.
6.18. Remove the SS3-Board
1. Disconnect the coupler (SS22) nd disconnect the flexible
c ble (SS56).
2. Remove the screws (*2 ^ ) nd remove the SS3-Bo rd.
14

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
6.19. Remove the SS-Board 6.21. Remove the 2-Board
1. Remove the SS2-Bo rd nd SS3-Bo rd. (See section 6.15.
nd 6.16)
2. Disconnect the couplers (SS11, SS12, SS33, SS43 nd
SS44).
3. Disconnect the flexible c bles (SS51, SS52, SS53 nd
SS54).
4. Remove the screws (*7 ^ ) nd remove the SS-Bo rd.
-Bo rd
6.20. Remove the 1-Board
1. Remove the flexible c bles holder f stening screws (*6
■=>)■
2. Disconnect the flexible c bles (CA1, CA2 nd CA3).
3. Disconnect the flexible c ble (C10).
4. Remove the screws (*5^) nd remove the C1-Bo rd.
1. Remove the flexible c bles holder f stening screws (*8
2. Disconnect the flexible c bles (CA4, CA5, CA6 nd CA7).
3. Disconnect the flexible c bles (C20, C21 nd C22).
4. Remove the screws (x5 ^ ) nd remove the C2-Bo rd.
C20 C2-Bo rd C21
6.22. Remove the 3-Board
1. Remove the flexible c bles holder f stening screws (*8
^>)-
2. Disconnect the flexible c bles (CA8, CA9, CA10 nd
CA11).
3. Disconnect the flexible c bles (C31 nd C32).
4. Disconnect the coupler (C33).
5. Remove the screws (x5 ^ ) nd remove the C3-Bo rd.
15

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
6.23. Remove the stand brackets 6.25. Remove the 5-Board
1. Remove the pl sm p nel section from the servicing st nd
nd l y on fi t surf ce such s t ble (covered) with the
pl sm p nel surf ce f cing downw rd.
2. Remove the st nd br ckets (left, right) f stening screws (*6
^ e ch) nd remove the st nd br ckets (left, right).
6.24. Remove the 4-Board
1. Remove the st nd br cket (left). (See section 6.20.)
2. Remove the flexible c bles holder f stening screws (*8
■=>)■
3. Disconnect the flexible c bles (CB8, CB9, CB10 nd
CB11).
4. Disconnect the flexible c bles (C41 nd C42).
5. Disconnect the couplers (C43 nd C44).
6. Remove the screws (x5 ^ ) nd remove the C4-Bo rd.
1. Remove the flexible c bles holder f stening screws (*8
2. Disconnect the flexible c bles (CB4, CB5, CB6 nd CB7).
3. Disconnect the flexible c bles (C50, C51 nd C52).
4. Remove the screws (*5 ^ ) nd remove the C5-Bo rd.
C50 C5-Bo rd C51 C52
B4 B5 B6 B7
6.26. Remove the 6-Board
1. Remove the st nd br cket (right). (See section 6.20.)
2. Remove the flexible c bles holder f stening screws (*6
3. Disconnect the flexible c bles (CB1, CB2 nd CB3).
4. Disconnect the flexible c ble (C60).
5. Remove the screws (* 5 ^) nd remove the C6-Bo rd.
16

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
6.27. Remove the front bracket 6.29. Remove the S-Board
1. Unlock the c ble cl mpers to free the c ble.
2. Disconnect the couplers (G1 nd G51).
3. Remove the screws (x5 ^ ) nd remove the front br cket.
Front br cket G51 G1
6.28. Remove the G-Board, GK-
Board and GS-Board
1. Remove the front br cket. (See section 6.28.)
2. Remove the screws (x3 nd remove the front side
met l fr me.
3. Remove the screws (* 3 ^) nd disconnect the couplers
(G3-GK3).
4. Remove the G-Bo rd nd GK-Bo rd.
1. Disconnect the coupler (S1).
2. Remove the screws (*2 ^ ) nd remove the S-Bo rd met l
fr me.
3. Remove the screws (x2 ^ ) nd remove the S-Bo rd.
6.30. Remove the GS-Board and SD-
Module
1. Remove the st nd br cket R. (See section 6.24.)
2. Unlock the c ble cl mpers to free the c ble.
3. Disconnect the coupler (G52).
4. Remove the screws (*3 ^ )■
5. Remove the SD c rd unit.
17

TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
6. Remove the screws (*3 ^ ) nd remove the SD c rd unit
cover.
7. Disconnect the flexible c ble (GS12).
8. Remove the screw (*1 ^ ).
9. Remove the GS-Bo rd nd SD-Module.
6.31. Remove the Plasma panel
section from the Front frame
(glass)
1. Remove the front fr me nd the pl sm p nel f stening
screws (x12 ^ ).
2. Remove the front fr me nd the st nd br ckets f stening
screws (x2 ).
3. For le ving the pl sm p nel from the front fr me, pull the
bottom of the front fr me forw rd, lift, nd remove.
18

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
6.32. Remove the squawker speaker 6.33. Remove the K-Board
1. Remove the front fr me. (See section 6.32.)
2. Remove the screws (*12 ^ ).
3. Remove the gl ss holder R nd L.
4. Remove the screws (*2 ^ ).
5. Remove the squ wker spe ker.
1. Remove the front fr me. (See section 6.32.)
2. Remove the gl ss holder R nd L. (See section 6.33.)
3. Remove the screws (хЗ )
4. Remove the bottom shield.
5. Remove the screws (*5 ^ )
6. Remove the gl ss holder bottom R nd L.
7. Remove the screws (x9 ^ )
8. Remove the gl ss holder bottom.
Gl ss holder R Gl ss holder bottom Gl ss holder L
9. Remove the screws (*2 ^ ).
10. Disconnect the couplers (K1).
11. Remove the K-bo rd.
19

I TH-50PV600AZ / TH-50PV600H / TH-50PV600M / TH-50PV600MT
6.34. Replace the plasma panel
(finished)
1. Pl ce the new pl sm p nel (finished) on the fl t surf ce of
the t ble (covered by soft cloth), with the pl sm p nel
surf ce f cing downw rd.
2. Att ch the C1, C2, C3, C4, C5 nd the C6-Bo rd, connect
the flexible c bles (x22) from the Pl sm p nel to the C1,
C2, C3, C4, C5 nd the C6-Bo rd, nd fit the flexible c ble
holders.
3. Att ch the Hooks (left, right) nd fit the st nd br ckets (L,
R) to the new pl sm p nel.
4. Pl ce the pl sm p nel section on the servicing st nd.
5. Att ch the front fr me nd e ch P.C.Bo rd nd so on, to
the new pl sm p nel.
* When fitting the front frame, be careful to allow any
debris, dust or handling residue to remain between the
front glass and plasma panel.
20