Panasonic Viera th-p50v20a User manual

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ORDER NO.PAVCTH1004009CE

Plasma Television

Model No. TH-P50V20A

TH-P50V20Z

GPF13DA Chassis

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precautions

1.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the

wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight

out.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground

such as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:

For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);

For d. c.: U1= 1.0 V,

Note:

The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0

mA d. c.

The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the customer.

Figure 1

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically

Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient

to damage an ES device).

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-

der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-

ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

3 Service Navigation

3.1. PCB Layout

Board Name Function Board Name Function

P Power Supply C1 Data Driver (Lower Right)

C2 Data Driver (Lower Center)

A DC-DC Converter, Tuner

Speaker out, AV Terminal, HDMI in, SD Card, PC in

Digital Signal Processor, PEAKS

Format Converter, Plasma AI, Sub-Field Processor

Power Switch, Key Switch

C3 Data Driver (Lower Left)

SC Scan Drive

SS Sustain Drive

SS2 Sustain out (Lower)

SU Scan out (Upper)

Non serviceable.

SU-Board should be exchanged for service.

SD Scan out (Lower)

Non serviceable.

SD-Board should be exchanged for service.

K Remote receiver, Power LED, C.A.T.S sensor

3.2. Applicable signals

COMPONENT (Y, PB/CB, PR/CR), HDMI

* Mark: Applicable input signal

PC (from D-sub 15P)

Applicable input signal for PC is basically compatible to VESA standard timing.

PC (from HDMI terminal)

Applicable input signal for PC is basically compatible to HDMI standard timing.

Note

• Signals other than above may not be displayed properly.

• The above signals are reformatted for optimal viewing on your display.

• PC signal is magnified or compressed for display, so that it may not be possible to show fine detail with sufficient clarity.

Signal name COMPONENT HDMI

525 (480) / 60i * *

525 (480) / 60p * *

625 (576) / 50i * *

625 (576) / 50p * *

750 (720) / 60p * *

750 (720) / 50p * *

1,125 (1,080) / 60i * *

1,125 (1,080) / 50i * *

1,125 (1,080) / 60p *

1,125 (1,080) / 50p *

1,125 (1,080) / 24p *

Signal name Horizontal frequency (kHz) Vertical frequency (Hz)

640 ×400 @70 Hz 31.47 70.07

640 ×480 @60 Hz 31.47 59.94

640 ×480 @75 Hz 37.50 75.00

800 ×600 @60 Hz 37.88 60.32

800 ×600 @75 Hz 46.88 75.00

800 ×600 @85 Hz 53.67 85.06

852 ×480 @60 Hz 31.44 59.89

1,024 ×768 @60 Hz 48.36 60.00

1,024 ×768 @70 Hz 56.48 70.07

1,024 ×768 @75 Hz 60.02 75.03

1,024 ×768 @85 Hz 68.68 85.00

1,280 ×768 @60 Hz 47.70 60.00

1,280 ×1,024 @60 Hz 63.98 60.02

1,366 ×768 @60 Hz 48.39 60.04

Macintosh13” (640 ×480) 35.00 66.67

Macintosh16” (832 ×624) 49.73 74.55

Macintosh21” (1,152 ×870) 68.68 75.06

Signal name Horizontal frequency (kHz) Vertical frequency (Hz)

640 ×480 @60 Hz 31.47 60.00

750 (720) / 60p 45.00 60.00

1,125 (1,080) / 60p 67.50 60.00

4 Specifications

Power

Power rating AC 220-240 V, 50 / 60 Hz

Normal (Home) mode 154 W

Standby condition 0.4 W

Display panel

Aspect Ratio 16:9

Visible screen size 127 cm (diagonal)

1,105 mm (W) ×622 mm (H)

Number of pixels 2,073,600 (1,920 (W) ×1,080 (H)) [5,760 ×1,080 dots]

Sound

Speaker 160 mm ×40 mm ×2 pcs, 6 Ω

Audio Output 20 W ( 10 W + 10 W )

Headphones M3 (3.5 mm) stereo mini Jack ×1

PC signals VGA, SVGA, WVGA, XGA

SXGA, WXGA ...... (compressed)

Horizontal scanning frequency 31 - 69 kHz

Vertical scanning frequency 59 - 86 Hz

Receiving Systems / Band name

PAL B/G Reception of Off air broadcasts

DVB-T 7 MHz VHF / UHF (Australia) free-to-air TV broadcast reception

8 MHz UHF (New Zealand) free-to-air TV broadcast reception

PAL 60 Hz Playback of NTSC tape from some PAL Video recorders (VCR)

M. NTSC Playback from M. NTSC Video recorders (VCR)

NTSC Playback from NTSC Video recorders (VCR)

Aerial - Rear Standard Belling & Lee connector (A), VHF / UHF (Z)

Operating Conditions

Temperature: 0 °C - 35 °C

Humidity: 20 % - 80 % RH (non-condensing)

Connection Terminals

AV1 Input

AUDIO L - R RCA PIN Type ×2 0.5 V [rms]