Panasonic TH-50PV70L User manual

©2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-50PV70L
GPH10DA Chassis
Plasma Television
Specifications
Power Source
A
C 110-220 V, 50 / 60 Hz
Power Consumption
Average use 519 W
Standby condition 0.5 W
Display panel
Aspect Ratio 16 : 9
Visible screen size 127 cm (diagonal)
1,106 mm (W) × 622 mm (H)
Number of pixels 1,049,088 (1,366 (W) × 768 (H))
[4,098 × 768 dots]
Sound
Speaker 120 mm × 60 mm × 2 pcs, 8 ohm
Audio Output 20 W [10 W + 10 W] (10 % THD)
Headphones M3 (3.5 mm) stereo mini Jack × 1
PC signals VGA, SVGA, XGA
SXGA ...... (compressed)
Horizontal scanning frequency 31 - 69 kHz
Vertical scanning frequency 59 - 86 Hz
Receiving Systems/Band name
Receiving Channels VHF BAND
2-13 (NTSC M USA)
UHF BAND
14-69 (NTSC M USA)
CATV
ORDER NO.ITD0705017CE

1 Applicable signals 5
2 Safety Precautions 6
2.1. General Guidelines 6
2.2. Touch-Current Check 6
3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 7
4 About lead free solder (PbF) 8
5 Service Hint 9
6 Plasma panel replacement method 10
6.1. Remove the rear cover 10
6.2. Remove the rear terminal cover 10
6.3. Remove the P-Board 10
6.4. Remove the PA-Board 11
6.5. Remove the Tuner unit 11
1-125 (USA CATV)
Aerial - Rear VHF / UHF
Operating Conditions Temperature: 0 °C - 40 °C
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
AV1 Input
AUDIO L - R RCA PIN Type × 2 0.5 V[rms]
VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 ohm)
S VIDEO Mini DIN 4-pin Y:1.0 V[p-p] (75 ohm) C:0.286 V[p-p] (75 ohm)
AV2 Input
AUDIO L - R RCA PIN Type × 2 0.5 V[rms]
VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 ohm)
COMPONENT Y 1.0 V[p-p] (including synchronization)
PB/CB, PR/CR, ± 0.35 V [p-p]
AV3 Input
AUDIO L - R RCA PIN Type × 2 0.5 V[rms]
VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 ohm)
COMPONENT Y 1.0 V[p-p] (including synchronization)
PB/CB, PR/CR, ± 0.35 V [p-p]
AV4 Input
AUDIO L - R RCA PIN Type × 2 0.5 V[rms]
VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 ohm)
S VIDEO Mini DIN 4-pin Y:1.0 V[p-p] (75 ohm) C:0.286 V[p-p] (75 ohm)
Others
HDMI 1/2 Input TYPE A Connectors
· This TV supports “HDAVI Control 2” function.
PC Input HIGH-DENSITY D-SUB 15PIN R,G,B/0.7 V [p-p] (75 ohm)
HD, VD/TTL Level 2.0 - 5.0 V [p-p] (high impedance)
Audio Input RCA PIN Type × 2 0.5 V[rms]
Card slot SD CARD slot × 1
Monitor Output
AUDIO L-R RCA PIN Type × 2 0.5 V [rms] (high impedance)
VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 ohm)
Dimensions (W × H × D) 1,210 mm × 818 mm × 94 mm (TV only)
1,210 mm × 864 mm × 370 mm (With Pedestal)
Mass 38.0 kg Net (TV only)
40.0 kg Net (With Pedestal)
Note:
· Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.
CONTENTS
Page Page
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6.6. Remove the DG-Board 11
6.7. Remove the H-Board 12
6.8. Remove the D-Board 12
6.9. Remove the SU-Board 12
6.10. Remove the SD-Board 12
6.11. Remove the SC-Board 13
6.12. Remove the SS2-Board 13
6.13. Remove the SS3-Board 13
6.14. Remove the SS-Board 13
6.15. Remove the stand brackets 14
6.16. Remove the C1-Board 14
6.17. Remove the C2-Board 14
6.18. Remove the C3-Board 14
6.19. Remove the front bracket 14
6.20. Remove the G-Board 15
6.21. Remove the speaker L, R 15
6.22. Remove the S-Board 15
6.23. Remove the K-Board 15
6.24. Remove the Plasma panel section from the Cabinet assy
(glass) 16
6.25. Replace the plasma panel (finished) 17
7 Caution statement 18
7.1. Caution statement. 18
8 Location of Lead Wiring 19
8.1. Lead of Wiring (1) 19
8.2. Lead of Wiring (2) 20
8.3. Lead of Wiring (3) 20
9 Self-check Function 21
9.1. Check of the IIC bus lines 21
9.2. Power LED Blinking timing chart 22
9.3. No Power 23
9.4. No Picture 24
9.5. Local screen failure 25
10 Service Mode 26
10.1. How to enter into Service Mode 26
10.2. Service tool mode 28
11 Adjustment Procedure 29
11.1. Driver Set-up 29
11.2. Initialization Pulse Adjust 30
11.3. P.C.B. (Printed Circuit Board) exchange 30
11.4. Adjustment Volume Location 31
11.5. Test Point Location 31
12 Adjustment 32
12.1. Sub-Contrast adjustment 32
12.2. PAL panel white balance adjustment 33
12.3. HD white balance adjustment 34
13 Hotel mode 35
14 Conductor Views 37
14.1. P-Board 37
14.2. PA-Board 40
14.3. H-Board 41
14.4. DG-Board 43
14.5. D-Board 46
14.6. C1-Board 48
14.7. C2-Board 49
14.8. C3-Board 50
14.9. SC-Board 51
14.10. SU-Board 54
14.11. SD-Board 55
14.12. SS-Board 56
14.13. SS2 and SS3-Board 58
14.14. GK, K, and S-Board 59
14.15. G-Board 60
15 Schematic and Block Diagram 61
15.1. Schematic Diagram Note 61
15.2. Main Block Diagram 62
15.3. P-Board Block Diagram 63
15.4. P-Board (1 of 2) Schematic Diagram 64
15.5. P-Board (2 of 2) Schematic Diagram 65
15.6. PA-Board Block Diagram 66
15.7. PA-Board Schematic Diagram 67
15.8. H-Board (1 of 2) Block Diagram 68
15.9. H-Board (2 of 2) Block Diagram 69
15.10. H-Board (1 of 5) Schematic Diagram 70
15.11. H-Board (2 of 5) Schematic Diagram 71
15.12. H-Board (3 of 5) Schematic Diagram 72
15.13. H-Board (4 of 5) Schematic Diagram 73
15.14. H-Board (5 of 5) Schematic Diagram 74
15.15. DG-Board (1 of 3) Block Diagram 75
15.16. DG-Board (2 of 3) Block Diagram 76
15.17. DG-Board (3 of 3) Block Diagram 77
15.18. DG-Board (1 of 9) Schematic Diagram 78
15.19. DG-Board (2 of 9) Schematic Diagram 79
15.20. DG-Board (3 of 9) Schematic Diagram 80
15.21. DG-Board (4 of 9) Schematic Diagram 81
15.22. DG-Board (5 of 9) Schematic Diagram 82
15.23. DG-Board (6 of 9) Schematic Diagram 83
15.24. DG-Board (7 of 9) Schematic Diagram 84
15.25. DG-Board (8 of 9) Schematic Diagram 85
15.26. DG-Board (9 of 9) Schematic Diagram 86
15.27. D-Board Block Diagram 87
15.28. D-Board (1 of 6) Schematic Diagram 88
15.29. D-Board (2 of 6) Schematic Diagram 89
15.30. D-Board (3 of 6) Schematic Diagram 90
15.31. D-Board (4 of 6) Schematic Diagram 91
15.32. D-Board (5 of 6) Schematic Diagram 92
15.33. D-Board (6 of 6) Schematic Diagram 93
15.34. C1, C2 and C3-Board Block Diagram 94
15.35. C1-Board (1 of 3) Schematic Diagram 95
15.36. C1-Board (2 of 3) Schematic Diagram 96
15.37. C1-Board (3 of 3) Schematic Diagram 97
15.38. C2-Board (1 of 2) Schematic Diagram 98
15.39. C2-Board (2 of 2) Schematic Diagram 99
15.40. C3-Board (1 of 2) Schematic Diagram 100
15.41. C3-Board (2 of 2) Schematic Diagram 101
15.42. SC, SU and SD-Board Block Diagram 102
15.43. SC-Board (1 of 3) Schematic Diagram 103
15.44. SC-Board (2 of 3) Schematic Diagram 104
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15.45. SC-Board (3 of 3) Schematic Diagram 105
15.46. SU-Board (1 of 2) Schematic Diagram 106
15.47. SU-Board (2 of 2) Schematic Diagram 107
15.48. SD-Board (1 of 2) Schematic Diagram 108
15.49. SD-Board (2 of 2) Schematic Diagram 109
15.50. SS, SS2 and SS3-Board Block Diagram 110
15.51. SS-Board (1 of 2) Schematic Diagram 111
15.52. SS-Board (2 of 2), SS2 and SS3-Board Schematic
Diagram 112
15.53. G, K and S-Board Block and Schematic Diagram 113
15.54. GS-Board Block and Schematic Diagram 114
16 Exploded Views & Replacement Parts List 115
16.1. Exploded Views 115
16.2. Packing Exploded Views (1) 116
16.3. Packing Exploded Views (2) 117
16.4. Packing Exploded Views (3) 118
16.5. Accessory 119
16.6. Replacement Parts List Notes 120
16.7. Mechanical Replacement Parts List 121
16.8. Electrical Replacement Parts List 122
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1 Applicable signals
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2 Safety Precautions
2.1. General Guidelines
1.When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2.When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires
have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3.When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight out.
4.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3.Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4.Check each exposed metallic part, and measure the voltage at each point.
5.Reserve the AC plug in the AC outlet and repeat each of the above measure.
6.The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7.In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1
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3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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Remove the Rear Cover
5 Service Hint
Board Name Function Board Name Function
P Power Supply D Format Converter, Plasma AI, Sub-Field Processor
DG Digital Signal Processor, Micon, HDMI Interface
Peaks Lite 2 C1 Data Driver (Lower Right)
C2 Data Driver (Lower center)
K Remote receiver, Power LED C3 Data Driver (Lower Left)
S Power Switch SC Scan Drive
H Speaker out, Sound Processor
AV Terminal, AV Switch SU Scan out (Upper)
SD Scan out (Lower)
PA DC-DC Converter SS Sustain Drive
G Key Switch, Front Terminal SS2 Sustain out (Upper)
GS SD Card slot SS3 Sustain out (Lower)
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6.1. Remove the rear cover
1.See Service Hint (Section 5)
6.2. Remove the rear terminal
cover
1.Remove the screws (×9 ,×4 ,×2 ,×2 ).
2.Remove the rear terminal cover.
6.3. Remove the P-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for
discharge from electrolysis capacitors.
1.Disconnect the connectors (P2, P6, P7, P9, P11, P12 and
P25).
2.Remove the screws (×6 ) and remove the P-Board unit.
3.Remove the screws (×20 ) on the back side.
4.Remove the screws (×5 ).
5.Remove the molding props (×9 ).
6.Remove the P-Board.
Note:
When assembling the P-Board, the position of each hole of
the insulation sheets (A and B) is set to the position of each
hole of the P-Board, then assemble them. ( marks
indicate setting positions.)
6 Plasma panel replacement method
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6.4. Remove the PA-Board
1.Unlock the cable clampers to free the cable.
2.Disconnect the connectors (PA3, PA4, PA6 and PA7).
3.Remove the screws (×3 ) and remove the PA-Board.
6.5. Remove the Tuner unit
1.Unlock the cable clampers to free the cable.
2.Disconnect the connectors (H3, H4, H12, H51, DG1, DS5
and DG52).
3.Remove the screws (×4 ) and remove the tuner unit.
6.6. Remove the DG-Board
1.Remove the tuner unit. (See section 6.5.)
2.Remove the screw (×1 ) and remove the SD card
bracket.
3.Disconnect the connectors (DG2 and DG6)
4.Remove the screws (×6 ) and remove the DG-Board.
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6.7. Remove the H-Board
1.Remove the tuner unit (See section 6.5.)
2.Remove the screw (×1 ) and remove the tuner fixing
metal.
3.Remove the screw (×7 ) and remove the H-Board.
6.8. Remove the D-Board
1.Remove the tuner unit. (See section 6.5.)
2.Disconnect the connectors (D5 and D25).
3.Disconnect the flexible cables (D20, D31 and D32).
4.Remove the screws (×4 ) and remove the D-Board.
6.9. Remove the SU-Board
1.Remove the screws (×3 ).
2.Remove the flexible cables (SU1, SU2, SU3 and SU4)
connected to the SU-Board and remove the connector
(SC45-SU45).
3.Slide the SU-Board to the left to disconnect from a
connector (SC41-SU41) on the SC-Board and remove the
SU-Board.
6.10. Remove the SD-Board
1.Remove the screws (×3 ).
2.Remove the flexible cables (SD1, SD2, SD3 and SD4)
connected to the SD-Board and remove the connector
(SC46-SD46).
3.Slide the SD-Board to the left to disconnect from a
connector (SC42-SD42) on the SC-Board and remove the
SD-Board.
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6.11. Remove the SC-Board
1.Remove the SU-Board and SD-Board. (See section 6.9.
and 6.10.)
2.Unlock the cable clampers to free the cable.
3.Disconnect the connector (SC2).
4.Disconnect the flexible cable (SC20).
5.Remove the screws (×9 ) and remove the SC-Board.
6.12. Remove the SS2-Board
1.Disconnect the connector (SS23) and disconnect the
flexible cable (SS52).
2.Remove the screws (×2 ) and remove the SS2-Board.
6.13. Remove the SS3-Board
1.Disconnect the connector (SS24) and disconnect the
flexible cable (SS57).
2.Remove the screws (×2 ) and remove the SS3-Board.
6.14. Remove the SS-Board
1.Disconnect the connectors (SS11, SS12 SS23, SS24,
SS33, SS34 and SS35).
2.Disconnect the flexible cables (SS54 and SS55).
3.Remove the screws (×7 ) and remove the SS-Board.
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6.15. Remove the stand brackets
1.Remove the plasma panel section from the servicing stand
and lay on a flat surface such as a table (covered) with the
plasma panel surface facing downward.
2.Remove the stand brackets (left, right) fastening screws (×5
each) and remove the stand brackets (left, right).
6.16. Remove the C1-Board
1.Remove the tuner unit. (See section 6.5.)
2.Remove the stand bracket (L). (See section 6.15.)
3.Remove the flexible cables holder fastening screws (×10
).
4.Disconnect the flexible cables (CB1, CB2, CB3, CB4 and
CB5).
5.Disconnect the flexible cables (C10 and C11).
6.Remove the screws (×5 ) and remove the C1-Board.
6.17. Remove the C2-Board
1.Remove the tuner unit. (See section 6.5.)
2.Remove the flexible cables holder fastening screws (×6
).
3.Disconnect the flexible cables (CB6, CB7 and CB8).
4.Disconnect the flexible cables (C20, C21 and C22).
5.Remove the screws (×4 ) and remove the C2-Board.
6.18. Remove the C3-Board
1.Remove the tuner unit. (See section 6.5.)
2.Remove the stand bracket (R). (See section 6.15.)
3.Remove the flexible cables holder fastening screws (×6
).
4.Disconnect the flexible cables (CB9, CB10 and CB11).
5.Disconnect the flexible cable (C32).
6.Disconnect the connectors (C33 and C35).
7.Remove the screws (×4 ) and remove the C3-Board.
6.19. Remove the front bracket
1.Disconnect the connector (H51). (See section 6.5.)
2.Remove the screws (×4 ) and remove the front bracket.
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6.20. Remove the G-Board
1.Remove the front bracket. (See section 6.19.)
2.Remove the screws (×4 ) and remove the front shield
case and the control button.
3.Remove the screws (×4 ) and disconnect the connector
(G51 and GS52).
4.Remove the G-Board and GS-Board.
6.21. Remove the speaker L, R
1.Disconnect the connector (H12). (See section 6.5.)
2.Remove the screws (×4 each) and remove the speaker
L, R.
6.22. Remove the S-Board
1.Remove the screws (×2 ) and remove the S-Board metal
frame.
2.Disconnect the connector (S1).
3.Remove the screws (×2 ) and remove the S-Board.
6.23. Remove the K-Board
1.Unlock the cable clampers to free the cable.
2.Disconnect the connector (DG1). (See section 6.5.)
3.Remove the screws (×2 ) and remove the K-Board.
4.Disconnect the connectors (K1) and remove the K-Board.
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6.24. Remove the Plasma panel
section from the Cabinet assy
(glass)
1.Remove the stand brackets (left, right) fastening screw (×1
each).
2.Remove the cabinet assy and the plasma panel fastening
screws (×6 ).
3.For leaving the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
4.Remove the spacers and spacer rings (×6 ).
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6.25. Replace the plasma panel
(finished)
1.Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2.Attach the C1-Board, C2-Board and the C3-Board, connect
the flexible cables (×22) from the plasma panel to the C1-
Board, C2-Board and the C3-Board, and fit the flexible
cable holders.
3.Attach the Hooks (left, right) and fit the stand brackets (L,
R) to the new plasma panel.
4.Place the plasma panel section on the servicing stand.
5.Attach the cabinet assy and each P.C.Board and so on, to
the new plasma panel.
*When fitting the front frame, be careful to allow any
debris, dust or handling residue to remain between the
front glass and plasma panel.
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7 Caution statement
7.1. Caution statement.
Caution:
Please confirm that all flexible cables are assembled correctly.
Also make sure that they are locked in the connectors.
Verify by giving the flexible cables a very slight pull.
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8 Location of Lead Wiring
8.1. Lead of Wiring (1)
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8.2. Lead of Wiring (2)
8.3. Lead of Wiring (3)
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