Panasonic TH50PZ750U - 50" Plasma TV User manual

© 2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
GP10DHU Chassis
High Definition Plasma Television
Specifications
Powe
r
Source
A
C 120 V, 60 Hz
Powe
r
Consumption
Maximum 705 W
Standby condition 0.2 W
Plasma Displa
y
panel
Drive method
A
C type
Aspect Ratio 16 : 9
V
isible screen size
(W × H × Diagonal)
(No. of pixels)
50” (Diagonal)
43.5 ” × 24.4 ” × 49.9 ” (1,106 mm × 622 mm × 1,269 mm)
2,073,600 (1,920 (W) × 1,080 (H)) [5,760 × 1,080 dots]
Sound
Audio Output Supe
r
Slim SP (2.5 W) × 2
Woofe
r
(13 W) × 2
PC signals VGA, SVGA, XGA, WXGA, SXGA
Horizontal scanning frequenc
y
31 - 69 kHz
Vertical scanning frequenc
y
59 - 86 Hz
Channel Capability (Digital/Analog) VHF/UHF: 2 - 69, CATV: 1 - 135
Operating Conditions Temperatu
r
e: 32 °F - 104 °F (0 °C - 40 °C)
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
INPUT 1-3 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
S-VIDEO: Mini DIN 4-pin Y: 1.0 V [p-p] (75 ohm) C: 0.286 V [p-p] (75 ohm)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
COMPONENT
V
IDEO
INPUT 1-2 Y: 1.0 V [p-p] (including synchronization)
PB,P
R: ± 0.35 V [p-p]
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
HDMI 1-3 AUDIO IN TYPE A Connecto
r
×3
lThis TV supports “HDAVI Cont
r
ol 2” function.
ORDER NO. MTNC070513CE
B34 Canada: B07

1 Applicable signals 5
2 Safety Precautions 6
2.1. General Guidelines 6
3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 7
4 About lead free solder (PbF) 8
5 Service Hint 9
6 Plasma panel replacement method 10
6.1. Remove the Back cover 10
6.2. Remove the fan 10
6.3. Remove the rear terminal cover 10
6.4. Remove the P-Board 10
6.5. Remove the tuner unit 12
6.6. Remove the DG-Board 12
6.7. Remove the H-Board 12
6.8. Remove the speaker box assy (left, right) 13
6.9. Remove the JG-Board 13
6.10. Remove the PB-Board 13
6.11. Remove the D-Board 14
6.12. Remove the SU-Board 14
6.13. Remove the SD-Board 14
6.14. Remove the SC-Board 15
6.15. Remove the SS-Board 15
6.16. Remove the stand brackets 15
6.17. Remove the C1-Board 16
6.18. Remove the C2-Board 16
6.19. Remove the C3-Board 16
6.20. Remove the C4-Board 16
6.21. Remove the C5-Board 16
6.22. Remove the C6-Board 17
6.23. Remove the front bracket 17
6.24. Remove the G-Board 17
6.25. Remove the GS-Board 17
6.26. Remove the S-Board 18
6.27. Remove the K-Board 18
6.28. Remove the Plasma panel section from the Cabinet assy
(glass) 18
6.29. Remove the squawker speaker 19
6.30. Replace the plasma panel (finished) 19
7 Caution statement 20
7.1. Caution statement. 20
8 Location of Lead Wiring 21
8.1. Lead of Wiring (1) 21
8.2. Lead of Wiring (2) 22
8.3. Lead of Wiring (3) 23
8.4. Lead of Wiring (4) 24
8.5. Lead of Wiring (5) 25
8.6. Lead of Wiring (6) 26
8.7. Lead of Wiring (7) 27
9 Self-check Function 28
9.1. Check of the IIC bus lines 28
9.2. Power LED Blinking timing chart 29
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
PC D-SUB 15PIN: R,G,B
/
0.7 V [p-p] (75 ohm)
HD,VD
/
1.0 - 5.0 V [p-p] (high impedance)
A
UDIO L-R: Stereo Mini Jack ( 3.5 mm) × 1
Card slot SD CARD slot × 1
A
V
PROG. OUT VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
DIGITAL AUDIO OUT PCM/Dolb
y
Digital, Fibe
r
Optic
FEATURES 3D Y/C FILTER CLOSED CAPTION
V-Chip Split-Screen BBE VIVA 3D
Photo Viewer Movie playe
r
HDAVI Cont
r
ol 2
Dimensions (W × H × D)
Including pedestal 49.9 ” × 33.5 ” × 14.6 ” (1,266 mm × 850 mm × 369 mm)
TV Set only 49.9 ” × 31.6 ” × 5.5 ” (1,266 mm × 802 mm × 138 mm)
Mass
Including pedestal 123.5 lb. (56 kg)
TV Set only 105.9 lb. (48 kg)
Note:
·
· ·
· Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.
CONTENTS
Page Page
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TH-50PZ750U

9.3. No Power 30
9.4. No Picture 31
9.5. Local screen failure 32
10 Service Mode 33
10.1. How to enter into Service Mode 33
10.2. Service tool mode 35
11 Adjustment Procedure 36
11.1. Driver Set-up 36
11.2. Initialization Pulse Adjust 37
11.3. P.C.B. (Printed Circuit Board) exchange 37
11.4. Adjustment Volume Location 38
11.5. Test Point Location 38
12 White Balance Adjustment 39
12.1. White balance adjustment 39
13 Hotel mode 41
14 Conductor Views 43
14.1. P(MULTI)-Board 43
14.2. P(SUS)-Board 46
14.3. G-Board 49
14.4. GH and GS-Board 50
14.5. K, PB and S-Board 51
14.6. H-Board 52
14.7. JG-Board 55
14.8. DG-Board 57
14.9. D-Board 60
14.10. C1-Board 62
14.11. C2-Board 63
14.12. C3-Board 64
14.13. C4-Board 65
14.14. C5-Board 66
14.15. C6-Board 67
14.16. SC-Board 68
14.17. SU-Board 71
14.18. SD-Board 72
14.19. SS-Board 73
15 Schematic and Block Diagram 77
15.1. Schematic Diagram Note 77
15.2. Main Block Diagram 78
15.3. P-Board (1 of 2) Block Diagram 79
15.4. P-Board (2 of 2) Block Diagram 80
15.5. P-Board (1 of 2) Schematic Diagram 81
15.6. P-Board (2 of 2) Schematic Diagram 82
15.7. PB-Board Block and Schematic Diagram 83
15.8. G, K and S-Board Block and Schematic Diagram 84
15.9. GH-Board Block and Schematic Diagram 85
15.10. GS-Board Block Diagram 86
15.11. GS-Board Schematic Diagram 87
15.12. H-Board (1 of 2) Block Diagram 88
15.13. H-Board (2 of 2) Block Diagram 89
15.14. H-Board (1 of 3) Schematic Diagram 90
15.15. H-Board (2 of 3) Schematic Diagram 91
15.16. H-Board (3 of 3) Schematic Diagram 92
15.17. JG-Board Block Diagram 93
15.18. JG-Board (1 of 5) Schematic Diagram 94
15.19. JG-Board (2 of 5) Schematic Diagram 95
15.20. JG-Board (3 of 5) Schematic Diagram 96
15.21. JG-Board (4 of 5) Schematic Diagram 97
15.22. JG-Board (5 of 5) Schematic Diagram 98
15.23. DG-Board (1 of 4) Block Diagram 99
15.24. DG-Board (2 of 4) Block Diagram 100
15.25. DG-Board (3 of 4) Block Diagram 101
15.26. DG-Board (4 of 4) Block Diagram 102
15.27. DG-Board (1 of 15) Schematic Diagram 103
15.28. DG-Board (2 of 15) Schematic Diagram 104
15.29. DG-Board (3 of 15) Schematic Diagram 105
15.30. DG-Board (4 of 15) Schematic Diagram 106
15.31. DG-Board (5 of 15) Schematic Diagram 107
15.32. DG-Board (6 of 15) Schematic Diagram 108
15.33. DG-Board (7 of 15) Schematic Diagram 109
15.34. DG-Board (8 of 15) Schematic Diagram 110
15.35. DG-Board (9 of 15) Schematic Diagram 111
15.36. DG-Board (10 of 15) Schematic Diagram 112
15.37. DG-Board (11 of 15) Schematic Diagram 113
15.38. DG-Board (12 of 15) Schematic Diagram 114
15.39. DG-Board (13 of 15) Schematic Diagram 115
15.40. DG-Board (14 of 15) Schematic Diagram 116
15.41. DG-Board (15 of 15) Schematic Diagram 117
15.42. D-Board (1 of 2) Block Diagram 118
15.43. D-Board (2 of 2) Block Diagram 119
15.44. D-Board (1 of 8) Schematic Diagram 120
15.45. D-Board (2 of 8) Schematic Diagram 121
15.46. D-Board (3 of 8) Schematic Diagram 122
15.47. D-Board (4 of 8) Schematic Diagram 123
15.48. D-Board (5 of 8) Schematic Diagram 124
15.49. D-Board (6 of 8) Schematic Diagram 125
15.50. D-Board (7 of 8) Schematic Diagram 126
15.51. D-Board (8 of 8) Schematic Diagram 127
15.52. C1, C2, C5 and C6 Block Diagram 128
15.53. C2, C3, C4 and C5-Board Block Diagram 129
15.54. C1-Board (1 of 2) Schematic Diagram 130
15.55. C1-Board (2 of 2) Schematic Diagram 131
15.56. C2-Board (1 of 2) Schematic Diagram 132
15.57. C2-Board (2 of 2) Schematic Diagram 133
15.58. C3-Board (1 of 2) Schematic Diagram 134
15.59. C3-Board (2 of 2) Schematic Diagram 135
15.60. C4-Board (1 of 2) Schematic Diagram 136
15.61. C4-Board (2 of 2) Schematic Diagram 137
15.62. C5-Board (1 of 2) Schematic Diagram 138
15.63. C5-Board (2 of 2) Schematic Diagram 139
15.64. C6-Board (1 of 2) Schematic Diagram 140
15.65. C6-Board (2 of 2) Schematic Diagram 141
15.66. SC-Board Block Diagram 142
15.67. SC-Board (1 of 2) Schematic Diagram 143
15.68. SC-Board (2 of 2) Schematic Diagram 144
15.69. SU and SD-Board Block Diagram 145
15.70. SU-Board (1 of 3) Schematic Diagram 146
15.71. SU-Board (2 of 3) Schematic Diagram 147
15.72. SU-Board (3 of 3) Schematic Diagram 148
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15.73. SD-Board (1 of 3) Schematic Diagram 149
15.74. SD-Board (2 of 3) Schematic Diagram 150
15.75. SD-Board (3 of 3) Schematic Diagram 151
15.76. SS-Board Block Diagram 152
15.77. SS-Board Schematic Diagram 153
16 Exploded Views & Replacement Parts List 155
16.1. Exploded Views 155
16.2. Packing Exploded Views (Accessories) 156
16.3. Packing Exploded Views (Stand) 157
16.4. Replacement Parts List Notes 158
16.5. Mechanical Replacement Parts List (PDP TV) 159
16.6. Mechanical Replacement Parts List (Stand) 160
16.7. Electrical Replacement Parts List 161
4
TH-50PZ750U

1 Applicable signals
5
TH-50PZ750U

2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1Mohm and 5.2Mohm.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15µF capacitors, between each exposed metallic part on
the set and a good earth ground such as a water pipe, as
shown in Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1.When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2.When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires
have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3.When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight out.
4.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
6
TH-50PZ750U

3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
TH-50PZ750U

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
·
· ·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· ·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
8
TH-50PZ750U

Remove the Rear Cover
5 Service Hint
Board Name Function Board Name Function
P Power Supply D Format Converter, Plasma AI, Sub-Field Processor
PB Fan control C1 Data Driver (Upper Right)
H Speaker out, Sound Processor
AV Terminal, AV Switch C2 Data Driver (Upper Center)
C3 Data Driver (Upper Left)
DG DC-DC Converter
Digital Signal Processor, Microcomputer
HDMI Interface, Peaks Lite 2, Full HD
C4 Data Driver (Lower Left)
C5 Data Driver (Lower Center)
C6 Data Driver (Lower Right)
JG H264 Decoder SC Scan Drive
G Front terminal, Key Switch SU Scan out (Upper)
K Remote receiver, Power LED SD Scan out (Lower)
S Power Switch SS Sustain Drive
GS SD Card Slot GH HDMI3 in
9
TH-50PZ750U

6.1. Remove the Back cover
1.See Service Hint. (Section 5)
6.2. Remove the fan
1.Disconnect the relay connectors.
2.Remove the screws (×3 each) and remove the fan unit.
6.3. Remove the rear terminal
cover
1.Remove the screws (×10 ,×5 ,×2 ,×2 ).
2.Remove the rear terminal cover.
6.4. Remove the P-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for
discharge from electrolysis capacitors.
1.Unlock the cable clampers to free the cable.
2.Disconnect the connectors (P2, P5, P9, P10, P11, P12, P23
and P25).
3.Remove the screws (×7 ) and remove the P-Board unit.
4.Remove the screws (×28 ) on the back side.
5.Disconnect the connectors (CN06-CN02, CN08-CN1602
and CN1702-CN1601).
6.Remove the screws (×10 ).
6 Plasma panel replacement method
10
TH-50PZ750U