Panasonic Viera TH-42PX75U User manual

© 2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
GP10DHU Chassis
High Definition Plasma Television
Specifications
Powe
r
Source
A
C 120 V, 60 Hz
Powe
r
Consumption
Maximum 387 W
Standby condition 0.2 W
Plasma Displa
y
panel
Drive method
A
C type
Aspect Ratio 16 : 9
Contrast Ratio (max) 10000 : 1
V
isible screen size
(W × H × Diagonal)
(No. of pixels)
106 cm
36.3 ” × 20.4 ” × 41.6 ” (920 mm × 518 mm × 1,056 mm)
786,432 (1,024 (W) × 768 (H)) [3,072 × 768 dots]
Sound
Audio Output 20 W [10 W + 10 W] (10 % THD)
Channel Capability (Digital/Analog) VHF/UHF: 2 - 69, CATV: 1 - 135
Operating Conditions Temperatu
r
e: 32 °F - 104 °F (0 °C - 40 °C)
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
INPUT 1-2 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
S-VIDEO: Mini DIN 4-pin Y: 1.0 V [p-p] (75 ohm) C: 0.286 V [p-p] (75 ohm)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
COMPONENT
V
IDEO
INPUT 1-2
Y: 1.0 V [p-p] (including synchronization)
PB,P
R: ± 0.35 V [p-p]
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
HDMI 1-2 AUDIO IN TYPE A Connecto
r
×2
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
Card slot SD CARD slot × 1
A
V
PROG. OUT VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
ORDERNO.MTNC070202CE
B34 Canada: B07

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Plasma panel replacement method 9
6.1. Remove the rear cover 9
6.2. Remove the rear terminal cover 9
6.3. Remove the P-Board 9
6.4. Remove the Tuner unit 9
6.5. Remove the A-Board 9
6.6. Remove the D-Board 10
6.7. Remove the SU-Board 10
6.8. Remove the SD-Board 10
6.9. Remove the SC-Board 10
6.10. Remove the SS-Board 11
6.11. Remove the C1-Board 11
6.12. Remove the C2-Board 11
6.13. Remove the front bracket and the front shield case cover
11
6.14. Remove the GS-Board 11
6.15. Remove the speaker L, R 12
6.16. Remove the stand brackets 12
6.17. Remove the S-Board 12
6.18. Remove the K-Board 12
6.19. Remove the Plasma panel section from the Cabinet assy
(glass) 13
6.20. Replace the plasma panel (finished) 14
7 Caution statement 15
7.1. Caution statement. 15
8 Location of Lead Wiring 16
8.1. Lead of Wiring (1) 16
8.2. Lead of Wiring (2) 17
8.3. Lead of Wiring (3) 18
8.4. Lead of Wiring (4) 19
8.5. Lead of Wiring (5) 20
9 Self-check Function 21
9.1. Check of the IIC bus lines 21
9.2. Power LED Blinking timing chart 22
9.3. No Power 23
9.4. No Picture 24
9.5. Local screen failure 25
10 Service Mode 26
10.1. How to enter into Service Mode 26
10.2. Service tool mode 28
11 Adjustment Procedure 29
11.1. Driver Set-up 29
11.2. Initialization Pulse Adjust 30
11.3. P.C.B. (Printed Circuit Board) exchange 30
11.4. Adjustment Volume Location 31
11.5. Test Point Location 31
12 Adjustment 32
12.1. White balance adjustment 32
13 Hotel mode 34
14 Conductor Views 35
14.1. P-Board 35
14.2. GS, K and S-Board 38
14.3. A-Board 39
14.4. D-Board 42
14.5. C1-Board 44
14.6. C2-Board 45
14.7. SC-Board 46
14.8. SU-Board 49
14.9. SD-Board 50
DIGITAL AUDIO OUT PCM/Dolb
y
Digital, Fibe
r
Optic
FEATURES 3D Y/C FILTER
CLOSED CAPTION V-Chip
Photo Viewer HDAVI Cont
r
ol 2
Dimensions (W × H × D)
Including pedestal 40.2 ” × 28.6 ” × 13.0 ” (1,020 mm × 725 mm × 330 mm)
TV Set only 40.2 ” × 26.8 ” × 3.8 ” (1,020 mm × 680 mm × 97 mm)
Weight
Including pedestal 75.0 lb. (34 kg)
TV Set only 59.6 lb. (27 kg)
Note:
·
· ·
· Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.
CONTENTS
Page Page
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14.10. SS-Board 51
15 Schematic and Block Diagram 53
15.1. Schematic Diagram Note 53
15.2. Main Block Diagram 54
15.3. P-Board Block Diagram 55
15.4. P-Board (1 of 6) Schematic Diagram 56
15.5. P-Board (2 of 6) Schematic Diagram 57
15.6. P-Board (3 of 6) Schematic Diagram 58
15.7. P-Board (4 of 6) Schematic Diagram 59
15.8. P-Board (5 of 6) Schematic Diagram 60
15.9. P-Board (6 of 6) Schematic Diagram 61
15.10. GS, K and S-Board Block and Schematic Diagram 62
15.11. A-Board (1 of 5) Block Diagram 63
15.12. A-Board (2 of 5) Block Diagram 64
15.13. A-Board (3 of 5) Block Diagram 65
15.14. A-Board (4 of 5) Block Diagram 66
15.15. A-Board (5 of 5) Block Diagram 67
15.16. A-Board (1 of 12) Schematic Diagram 68
15.17. A-Board (2 of 12) Schematic Diagram 69
15.18. A-Board (3 of 12) Schematic Diagram 70
15.19. A-Board (4 of 12) Schematic Diagram 71
15.20. A-Board (5 of 12) Schematic Diagram 72
15.21. A-Board (6 of 12) Schematic Diagram 73
15.22. A-Board (7 of 12) Schematic Diagram 74
15.23. A-Board (8 of 12) Schematic Diagram 75
15.24. A-Board (9 of 12) Schematic Diagram 76
15.25. A-Board (10 of 12) Schematic Diagram 77
15.26. A-Board (11 of 12) Schematic Diagram 78
15.27. A-Board (12 of 12) Schematic Diagram 79
15.28. D-Board Block Diagram 80
15.29. D-Board (1 of 6) Schematic Diagram 81
15.30. D-Board (2 of 6) Schematic Diagram 82
15.31. D-Board (3 of 6) Schematic Diagram 83
15.32. D-Board (4 of 6) Schematic Diagram 84
15.33. D-Board (5 of 6) Schematic Diagram 85
15.34. D-Board (6 of 6) Schematic Diagram 86
15.35. C1 and C2-Board Block Diagram 87
15.36. C1-Board (1 of 2) Schematic Diagram 88
15.37. C1-Board (2 of 2) Schematic Diagram 89
15.38. C2-Board (1 of 2) Schematic Diagram 90
15.39. C2-Board (2 of 2) Schematic Diagram 91
15.40. SC, SU and SD-Board Block Diagram 92
15.41. SC-Board (1 of 2) Schematic Diagram 93
15.42. SC-Board (2 of 2) Schematic Diagram 94
15.43. SU-Board (1 of 2) Schematic Diagram 95
15.44. SU-Board (2 of 2) Schematic Diagram 96
15.45. SD-Board (1 of 2) Schematic Diagram 97
15.46. SD-Board (2 of 2) Schematic Diagram 98
15.47. SS-Board Block Diagram 99
15.48. SS-Board (1 of 2) Schematic Diagram 100
15.49. SS-Board (2 of 2) Schematic Diagram 101
16 Exploded Views & Replacement Parts List 103
16.1. Exploded Views 103
16.2. Packing Exploded Views (Accessories box) 104
16.3. Packing Exploded Views (Stand) 105
16.4. Replacement Parts List Notes 106
16.5. Mechanical Replacement Parts List (PDP TV) 107
16.6. Mechanical Replacement Parts List (Stand) 108
16.7. Electrical Replacement Parts List 109
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1 Applicable signals
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2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1Mohm and 5.2Mohm.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15µF capacitors, between each exposed metallic part on
the set and a good earth ground such as a water pipe, as
shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
·
· ·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· ·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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Remove the Rear Cover
5 Service Hint
Board Name Function Board Name Function
P Power Supply D Format Converter, Plasma AI, Sub-Field Processor
ADC-DC Converter
Speaker out, Sound Processor
AV Terminal, AV Switch
Digital Signal Processor, Microcomputer, HDMI
Interface
Peaks Lite 2
C1 Data Driver (Lower Right)
C2 Data Driver (Lower Left)
SC Scan Drive
SU Scan out (Upper)
SD Scan out (Lower)
K Remote receiver, Power LED SS Sustain Drive
S Power Switch GS SD Card Slot, Key Switch
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6.1. Remove the rear cover
1. See Service Hint (Section 5)
6.2. Remove the rear terminal
cover
1. Remove the screws (×8 ).
2. Remove the rear terminal cover.
6.3. Remove the P-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for
discharge from electrolysis capacitors.
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (P2, P6, P7, P9, P11, P12 and
P25).
3. Remove the screws (×8 ) and remove the P-Board.
6.4. Remove the Tuner unit
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (A1, A5, A6, A7, A12 and A52).
3. Remove the screws (×2 ) and remove the tuner cover.
4. Remove the screws (×4 ) and remove the tuner unit.
6.5. Remove the A-Board
1. Remove the tuner unit. (See section 6.4.)
2. Remove the screws (×6 ) and remove the A-Board.
6 Plasma panel replacement method
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6.6. Remove the D-Board
1. Remove the tuner unit. (See section 6.4.)
2. Disconnect the connectors (D5 and D25).
3. Disconnect the flexible cables (D20, D31 and D32).
4. Remove the screws (×4 ) and remove the D-Board.
6.7. Remove the SU-Board
1. Remove the screws (×2 ).
2. Remove the flexible cables (SU1, SU2, SU3 and SU4)
connected to the SU-Board and remove the bridge
connector (SC45-SU45).
3. Slide the SU-Board to the left to disconnect from a
connector (SC41-SU41) on the SC-Board and remove the
SU-Board.
6.8. Remove the SD-Board
1. Remove the screws (×2 ).
2. Remove the flexible cables (SD1, SD2, SD3 and SD4)
connected to the SD-Board and remove the bridge
connector (SC46-SD46).
3. Slide the SD-Board to the left to disconnect from a
connector (SC42-SD42) on the SC-Board and remove the
SD-Board.
6.9. Remove the SC-Board
1. Remove the SU-Board and SD-Board. (See section 6.7.
and 6.8.)
2. Unlock the cable clampers to free the cable.
3. Disconnect the connector (SC2).
4. Disconnect the flexible cable (SC20).
5. Remove the screws (×6 ) and remove the SC-Board.
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6.10. Remove the SS-Board
1. Disconnect the connectors (SS11, SS12 and SS23).
2. Disconnect the flexible cables (SS53A, SS54A, SS55A and
SS56A).
3. Remove the screws (×6 ) and remove the SS-Board.
6.11. Remove the C1-Board
1. Remove the tuner unit. (See section 6.4.)
2. Unlock the cable clampers to free the cable.
3. Remove the flexible cables holder fastening screws (×8
).
4. Disconnect the flexible cables (CB1, CB2, CB3 and CB4).
5. Disconnect the flexible cables (C10 and C11).
6. Remove the screws (×4 ) and remove the C1-Board.
6.12. Remove the C2-Board
1. Remove the tuner unit. (See section 6.4.)
2. Unlock the cable clampers to free the cable.
3. Remove the flexible cables holder fastening screws (×8
).
4. Disconnect the flexible cables (CB5, CB6, CB7 and CB8).
5. Disconnect the flexible cables (C20 and C21).
6. Disconnect the connector (C23).
7. Remove the screws (×4 ) and remove the C2-Board.
6.13. Remove the front bracket and
the front shield case cover
1. Disconnect the connector (A52). (See section 6.4.)
2. Remove the screws (×4 ) and remove the front bracket
and the front shield case cover.
6.14. Remove the GS-Board
1. Remove the front bracket and the front shield case cover.
(See section 6.13.)
2. Remove the screws (×2 ) and remove the front shield
top and the control button.
3. Remove the screws (×2 ) and disconnect the connector
(GS52).
4. Remove the GS-Board.
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6.15. Remove the speaker L, R
1. Disconnect the connector (A12). (See section 6.4.)
2. Remove the screws (×4 each) and remove the speaker
L, R.
6.16. Remove the stand brackets
1. Remove the plasma panel section from the servicing stand
and lay on a flat surface such as a table (covered) with the
plasma panel surface facing downward.
2. Remove the stand brackets (left, right) fastening screws (×6
each) and remove the stand brackets (left, right).
6.17. Remove the S-Board
1. Remove the screws (×2 ) and remove the S-Board metal
frame.
2. Disconnect the connector (S2).
3. Remove the screws (×2 ) and remove the S-Board.
6.18. Remove the K-Board
1. Remove the S-Board. (See section 6.17.)
2. Unlock the cable clampers to free the cable.
3. Disconnect the connectors (A1). (See section 6.4.)
4. Remove the screws (×2 ) and slide to the right to remove
the K-Board.
5. Disconnect the connectors (K1 and K2) and remove the K-
Board.
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6.19. Remove the Plasma panel
section from the Cabinet assy
(glass)
1. Remove the plasma panel section from the servicing stand
and lay on aflat surface such as atable (covered) with the
plasma panel surface facing downward.
2. Remove the stand brackets (left, right) fastening screws (×3
each).
3. Replace the servicing stand and stand the set.
4. Remove the cabinet assy and the plasma panel fastening
screws (×7 ).
5. For leaving the plasma panel from the cabinet assy, pull the
bottom of the front frame forward, lift, and remove.
6. Remove the spacers and spacer rings (×6 ).
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6.20. Replace the plasma panel
(finished)
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2. Attach the C1-Board and the C2-Board, connect the flexible
cables (×16) from the Plasma panel to the C1-Board and
the C2-Board, and fit the flexible cable holders.
3. Attach the Hooks (left, right) and fit the stand brackets (L,
R) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the cabinet assy and each P.C.Board and so on, to
the new plasma panel.
*When fitting the front frame, be careful to allow any
debris, dust or handling residue to remain between the
front glass and plasma panel.
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7 Caution statement
7.1. Caution statement.
Caution:
Please confirm that all flexible cables are assembled correctly.
Also make sure that they are locked in the connectors.
Verify by giving the flexible cables a very slight pull.
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8 Location of Lead Wiring
8.1. Lead of Wiring (1)
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8.2. Lead of Wiring (2)
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8.3. Lead of Wiring (3)
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8.4. Lead of Wiring (4)
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8.5. Lead of Wiring (5)
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