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Transistors
1
Publication date: January 2003 SJC00208BED
2SD1149
Silicon NPN epitaxial planar type
For low-frequency amplification
■Features
•High forward current transfer ratio hFE
•Low collector-emitter saturation voltage VCE(sat)
•High emitter-base voltage (Collector open) VEBO
•Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing and the magazine
packing
■Absolute Maximum Ratings Ta=25°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO 100 V
Collector-emitter voltage (Base open) VCEO 100 V
Emitter-base voltage (Collector open) VEBO 15 V
Collector current IC20 mA
Peak collector current ICP 50 mA
Collector power dissipation PC200 mW
Junction temperature Tj150 °C
Storage temperature Tstg −55 to +150 °C
Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) VCBO IC=10 µA, IE=0 100 V
Collector-emitter voltage (Base open) VCEO IC=1 mA, IB=0 100 V
Emitter-base voltage (Collector open) VEBO IE=10 µA, IC=015V
Collector-base cutoff current (Emitter open)
ICBO VCB =60 V, IE=0 0.1 µA
Collector-emitter cutoff current (Base open)
ICEO VCE =60 V, IB=0 1.0 µA
Forward current transfer ratio *hFE VCE = 10 V, IC= 2 mA 400 1
200 
Collector-emitter saturation voltage VCE(sat) IC=10 mA, IB=1 mA 0.05 0.20 V
Transition frequency fTVCB =10 V, IE=−2 mA, f =200 MHz 100 MHz
■Electrical Characteristics Ta=25°C ±3°C
Unit: mm
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
0.40
+0.10
–0.05
(0.65) 1.50
+0.25
–0.05
2.8
+0.2
–0.3
2
1
3
(0.95) (0.95)
1.9
±0.1
2.90
+0.20
–0.05
0.16
+0.10
–0.06
0.4
±0.2
5˚
10˚
0 to 0.1 1.1
+0.2
–0.1
1.1
+0.3
–0.1
1 : Base
2 : Emitter
3 : Collector
EIAJ : SC-59
Mini3-G1 Package
Rank R S
hFE 400 to 800 600 to 1
200
Marking symbol:1V
This product complies with the RoHS Directive (EU 2002/95/EC).
2SD1149
2SJC00208BED
VCE(sat) IChFE ICfTIE
PCTaICVCE ICVBE
Cob VCB NV ICNV VCE
0 16040 12080
0
240
200
160
120
80
40
Collector power dissipation PC(mW)
Ambient temperature Ta(°C)
012108264
0
80
60
20
40
T
a
=25°C
20 µA
30 µA
40 µA
50 µA
60 µA
80 µA
10 µA
I
B
=100 µA
Collector current IC(mA)
Collector-emitter voltage VCE (V)
0 2.01.60.4 1.20.8
0
60
50
40
30
20
10
V
CE
=10 V
T
a
=75°C−25°C
25°C
Base-emitter voltage V
BE
(V)
Collector current I
C
(mA)
0.1 1 10 100
0.01
0.1
1
10
100 I
C
/ I
B
=10
25°C
−25°C
T
a
=75°C
Collector-emitter saturation voltage V
CE(sat)
(V)
Collector current I
C
(mA)
0.1 1 10 100
0
1 800
1 500
1 200
900
600
300
V
CE
=10 V
T
a
=75°C
25°C
−25°C
Forward current transfer ratio h
FE
Collector current I
C
(mA)
−0.1 −1−10 −100
0
200
160
120
80
40
V
CB
=10 V
T
a
=25°C
Transition frequency f
T
(MHz)
Emitter current I
E
(mA)
1 10 100
0
6
5
4
3
2
1
IE=0
f =1 MHz
Ta=25°C
Collector-base voltage VCB (V)
Collector output capacitance
(Common base, input open circuited) Cob (pF)
0.01 0.1 1
0
100
80
60
40
20
V
CE
=10 V
G
V
=80 dB
Function =FLAT
T
a
=25°C
5 kΩ
R
g
=100 kΩ
22 kΩ
Noise voltage NV (mV)
Collector current I
C
(mA)
1 10 100
0
100
80
60
40
20 I
C
=1 mA
G
V
=80 dB
Function =FLAT
T
a
=25°C
5 kΩ
R
g
=100 kΩ
22 kΩ
Noise voltage NV (mV)
Collector-emitter voltage V
CE
(V)
This product complies with the RoHS Directive (EU 2002/95/EC).
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.