Panasonic SA-PM33EE User manual

RMS OUTPUT POWER both channel driven simultaneously
10% total harmonic distortion 20 W per channel (6 Ω)
Input impedance
MUSIC PORT 250 mV 12 kΩ
Output impedance
HEADPHONE 16 to 32 Ω
Phone jack
Terminal Stereo, 3.5 mm
Music Port input jack
Terminal Stereo, 3.5 mm
nFM Tuner Section
Frequency range 87.50 to 108.00 MHz
(50 kHz step)
Sensitivity 3.8 µV (IHF)
S/N 26 dB 1.2 µV
A
ntenna terminals 75 Ω(unbalanced)
Preset station FM 15 stations
AM 15 stations
nAM Tuner Section
Frequency range 522 to 1629 kHz
(9 kHz steps)
520 to 1630 kHz
(10 kHz steps)
Sensitivity
©2006 Matsushita Electric Industrial Co. Ltd.. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
SA-PM33EE
Colour
(S)... Silver Type
S/N 20 dB (at 999 kHz) 1122 µV/m
nCassette Deck Section
Track system 4-track, 2-channel
Heads
Record/playback Solid permalloy head
Erasure Double gap ferrite head
Motor DC servo motor
Recording system AC bias 100 kHz
Erase system AC erase 100 kHz
Tape speed 4.8 cm/s
Overall frequency response (+3 dB, -6 dB) at DECK OUT
Normal 35 Hz to 14 kHz
S/N RATIO 47 dB (A weighted)
Wow and flutter 0.08% (WRMS)
Fast-forward and rewind time Approx. 120 seconds with C-60
cassette tape
nCD Section
Disc played [8 cm or 12 cm]
(1) CD-Audio (CD-DA)
(2) CD-R/RW (CD-DA, MP3 formatted disc)
(3) MP3
Sampling frequency
CD 44.1 kHz
MP3 32 kHz, 44.1 kHz, 48 kHz
CD Stereo System
Specification
ORDER NO. MD0603074C3

Bit rate
MP3 32 kbps to 384 kbps
Decoding 16/20/24 bit linear
Pickup
Beam source Semiconductor laser
Wavelength 785 nm
Laser power CLASS 1
A
udio output (Disc)
Number of channels 2 channel
Frequency response 20 Hz to 20 kHz (+1, -2dB)
Wow and flutter Below measurable limit
Digital filter 8fs
D/A converter MASH (1 bit DAC)
nGeneral
1 Safety Precautions 4
1.1. General Guidelines 4
1.2. Before Repair and Adjustment 5
1.3. Protection Circuitry 5
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
3 Precaution of Laser Diode 7
4 Handling Precautions For Traverse Deck 8
5 Handling the Lead-free Solder 9
5.1. About lead free solder (PbF) 9
6 Accessories 10
7 Operating Instructions Procedures 11
7.1. Main Unit & Remote Control Operation 11
7.2. Disc Information 12
8 Self diagnosis and special mode setting 13
8.1. Special Mode Table 13
8.2. Error Code Table 17
9 Assembling and Disassembling 19
9.1. Caution 19
9.2. Disassembly flow chart 20
9.3. Main Parts Location Diagram 21
9.4. Disassembly of Side Panel L & R 22
9.5. Disassembly of Top Cabinet Unit 22
9.6. Disassembly of Deck Mechanism and Tape Eject P.C.B.
23
9.7. Disassembly of Headphone P.C.B. 23
9.8. Disassembly of Front Panel 23
9.9. Disassembly of Panel P.C.B. 24
9.10. Disassembly of Rear Panel 25
9.11. Disassembly of Tuner Pack 25
Power supply AC 230 V, 50 Hz
Power consumption 63 W
Dimensions (W x H x D) 165 x 227 x 327 mm
Mass 3.5 kg
Operating temperature range +5 to +35°C
Operation humidity range 5 to 90% RH (no condensation)
Power consumption in standby
mode
0.8 W
Notes :
1. Specifications are subject to change without notices. Mass and
dimensions are approximate.
2. Total harmonic distortion is measured by the digital spectrum
analyzer.
nSystem : SC-PM33EE-S Music center: SA-PM33EE-S
Speaker: SB-PM33EG-M
9.12. Disassembly of Main P.C.B. 25
9.13. Disassembly of Power P.C.B. 26
9.14. Disassembly of Speaker Terminal P.C.B. 27
9.15. Disassembly of Transformer P.C.B. 27
9.16. Disassembly of CD Mechanism 27
9.17. Disassembly of Cassette Lid 28
9.18. Disassembly of Traverse Unit, Driving Gear, and Cam
Gear (CD Mechanism Unit) 29
9.19. Disassembly of Optical Pickup (CD Mechanism Unit) 32
9.20. Disassembly of Traverse Gear A and Traverse Gear B
(CD Mechanism Unit) 33
9.21. Disassembly of Pinch Roller and Head Block (Deck
Mechanism Unit) 34
9.22. Disassembly of Motor, Capstan Belt A, Capstan Belt B,
and Winding Belt (Deck Mechanism Unit) 34
9.23. Disassembly of Deck Mechanism P.C.B. 36
9.24. Handling of cassette tape jam 36
10 Service Fixture and Tools 37
11 Service Positions 37
11.1. Checking and Repairing of Deck, Deck Mechanism,
Headphone P.C.B. and Tape Eject P.C.B. 37
11.2. Checking and Repairing of Panel P.C.B. 38
11.3. Checking and Repairing of Tuner Pack P.C.B. 39
11.4. Checking and Repairing of Transformer P.C.B. 40
11.5. Checking and Repairing of Main P.C.B. 41
11.6. Checking and Repairing of CD Mechanism P.C.B. 42
11.7. Checking and Repairing of Speaker Terminal P.C.B. 43
11.8. Checking and Repairing of Power P.C.B. 44
CONTENTS
Page Page
2
SA-PM33EE

12 Procedure for Checking Operation of Individual Parts of Deck
Mechanism Unit 45
12.1. Operation Check with Cassette Tape 45
12.2. Operation Check without Cassette Tape 45
13 Measurement And Adjustments 47
13.1. Cassette Deck Section 47
14 Voltage Measurement and Waveform Chart 49
14.1. Voltage Measurement 49
14.2. Waveform 53
15 Wiring Connection Diagram 55
16 Block Diagram 57
17 Notes of Schematic Diagram 61
18 Schematic Diagram 63
18.1. CD Servo Circuit 63
18.2. Main Circuit and Tuner Extent Circuit 64
18.3. Panel Circuit 66
18.4. Deck Circuit, Deck Mechanism Circuit and Tape Eject
Circuit 67
18.5. Power Circuit 68
18.6. Transformer Circuit, Headphone Circuit and Speaker
Terminal Circuit 69
19 Printed Circuit Board 71
19.1. CD Servo P.C.B. 71
19.2. Main P.C.B and Tuner Extent P.C.B. 72
19.3. Panel P.C.B. 73
19.4. Deck P.C.B, Deck Mechanism P.C.B and Tape Eject
P.C.B. 74
19.5. Power P.C.B and Speaker Terminal P.C.B. 75
19.6. Transformer P.C.B and Headphone P.C.B. 76
20 Illustration of IC's, Transistors and Diodes 77
21 Terminal Function of IC's 78
21.1. IC7001 (MN6627954MA) IC SERVO
PROCESSOR/DIGITAL SIGNAL PROCESSOR/DIGITAL
FILTER D/A CONVERTER 78
21.2. IC7002 (BA5948FPE2) IC 4CH Drive 79
21.3. IC803 (MN101C49GHD) MICROPROCESSOR 79
22 Troubleshooting Flowchart (CD Section Circuit) 81
23 Exploded Views 83
23.1. Cabinet Parts Location 83
23.2. Cassette Deck (RAA4402-1S) & Traverse Deck Part
Location 84
23.3. Packaging 85
24 Replacement Parts List 87
3
SA-PM33EE

1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, ensure that all the protective devices such as insulation barriers, insulation papers shields are properly installed.
3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MΩand 5.2Ω.
When the exposed metal does not have a return path to the chassis, the reading must be .
Figure 1
1.1.2. Leakage Current Hot Check (See Figure 1)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. should the measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and re-checked before it is returned
to the customer.
4
SA-PM33EE

1.2. Before Repair and Adjustment
Disconnect AC power, discharge Power Supply Capacitors C501, C601, C839, C840, C844, C862, C868, C909, C910, C911 &
C923 through a 10Ω, 1W resistor to ground.
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
· Current consumption at AC 230 V, 50 Hz in NO SIGNAL mode should be ~150 mA.
1.3. Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
· No sound is heard when the power is turned on.
· Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
"shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
5
SA-PM33EE

2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium
foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize body motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
SA-PM33EE

This unit utilizes a class 1 laser.
Invisible laser radiation is emitted from the optical pickup lens.
When the unit is turned on:
3 Precaution of Laser Diode
CAUTION:
1. Do not look directly into the pick up lens.
2. Do not use optical instruments to look at the pick up lens.
3. Do not adjust the preset variable resistor on the pickup lens.
4. Do not disassemble the optical pick up unit.
5. If the optical pick up is replaced, use the manufacturer’s specified replacement pick up only.
6. Use of control or adjustments or performance of procedures other than those specified herein may result in hazardous radiation
exposure.
CAUTION!
THIS PRODUCT UTILIZES A LASER.
USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT
IN HAZARDOUS RADIATION EXPOSURE.
7
SA-PM33EE

The laser diode in the traverse deck (optical pickup) may break
down due to potential difference caused by static electricity of
clothes or human body.
So, be careful of electrostatic breakdown during repair of the
traverse deck (optical pickup).
lHandling of CD traverse deck (optical pickup)
1. Do not subject the traverse deck (optical pickup) to
static electricity as it is extremely sensitive to electrical
shock.
2. The short land between the No.4 (LD) and No.5 (GND)
pins on the flexible board (FFC) is shorted with a solder
build-up to prevent damage to the laser diode.
3. Take care not to apply excessive stress to the flexible
board (FFC board) (Fig 4.1).
4. Do not turn the variable resistor (laser power
adjustment). It has already been adjusted.
Fig 4.1
lGrounding for electrostatic breakdown prevention
1. Human body grounding (Fig 4.2)
Use the anti-static wrist strap to discharge the static
electricity from your body.
2. Work table grounding (Fig 4.2)
Put a conductive material (sheet) or steel sheet on the
area where the traverse deck (optical pickup) is placed,
and ground the sheet.
Caution :
The static electricity of your clothes will not be grounded
through the wrist strap. So, take care not to let your
clothes touch the traverse deck (optical pickup).
Fig 4.2
Caution when Replacing the Optical Pickup :
The traverse has a short point shorted with solder to protect
the laser diode against electrostatics breakdown. Be sure to
remove the solder from the short point before making
connections.
4 Handling Precautions For Traverse Deck
8
SA-PM33EE

5 Handling the Lead-free Solder
5.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.
Caution:
· Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70°F (30 - 40°C) higher. Please
use a high temperature soldering iron. In case of soldering iron with temperature control, please set it to 700 ± 20°F (370 ±
10°C).
· Pb free solder will tend to splash when heated too high (about 1100°F/600°C).
· When soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat the
soldering points with the Pb free solder until it melts enough.
9
SA-PM33EE

Remote control
AC cord
FM indoor
antenna
AM loop antenna
6 Accessories
Note : Refer to Packing Materials & Accessories (Section 24) for part number.
10
SA-PM33EE