Panasonic Viera TH-50PZ77U User manual

©2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
GP10DHU Chassis
High Definition Plasma Television
Specifications
Powe
r
Source
A
C 120 V, 60 Hz
Powe
r
Consumption
Maximum 693 W
Standby condition 0.2 W
Plasma Displa
y
panel
Drive method
A
C type
Aspect Ratio 16 : 9
V
isible screen size
(W × H × Diagonal)
(No. of pixels)
50” (Diagonal)
43.5 ” × 24.4 ” × 49.9 ” (1,106 mm × 622 mm × 1,269 mm)
2,073,600 (1,920 (W) × 1,080 (H)) [5,760 × 1,080 dots]
Sound
Audio Output 20 W [ 10 W + 10 W ] ( 10 % THD )
Channel Capability (Digital/Analog) VHF/UHF: 2 - 69, CATV: 1 - 135
Operating Conditions Temperatu
r
e: 32 °F - 104 °F (0 °C - 40 °C)
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
INPUT 1-3 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
S-VIDEO: Mini DIN 4-pin Y: 1.0 V [p-p] (75 ohm) C: 0.286 V [p-p] (75 ohm)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
COMPONENT
V
IDEO
INPUT 1-2
Y: 1.0 V [p-p] (including synchronization)
PB,P
R: ± 0.35 V [p-p]
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
HDMI 1-2 AUDIO IN TYPE A Connecto
r
×2
lThis TV supports “HDAVI Cont
r
ol 2” function.
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
Card slot SD CARD slot × 1
A
V
PROG. OUT VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
DIGITAL AUDIO OUT PCM/Dolb
y
Digital, Fibe
r
Optic
ORDER NO.MTNC070829CE
B34 Canada: B07

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Plasma panel replacement method 9
6.1. Remove the Back cover 9
6.2. Remove the fan A/B/C 9
6.3. Remove the rear terminal cover 9
6.4. Remove the tuner unit 9
6.5. Remove the DG-Board 10
6.6. Remove the H-Board 10
6.7. Remove the P-Board 10
6.8. Remove the side AV unit and the side AV bracket. 11
6.9. Remove the G-Board and GS-Board 12
6.10. Remove the PB-Board 12
6.11. Remove the D-Board 13
6.12. Remove the SU-Board 13
6.13. Remove the SD-Board 13
6.14. Remove the SC-Board 13
6.15. Remove the SS-Board 14
6.16. Remove the stand brackets 14
6.17. Remove the C1-Board 14
6.18. Remove the C2-Board 14
6.19. Remove the C3-Board 15
6.20. Remove the C4-Board 15
6.21. Remove the C5-Board 15
6.22. Remove the C6-Board 15
6.23. Remove the speaker L, R 16
6.24. Remove the Plasma panel section from the Cabinet assy
(glass) 16
6.25. Remove the K-Board and the S-Board 16
6.26. Replace the plasma panel (finished) 17
7 Caution statement 18
7.1. Caution statement. 18
8 Location of Lead Wiring 19
8.1. Lead of Wiring (1) 19
8.2. Lead of Wiring (2) 20
8.3. Lead of Wiring (3) 21
8.4. Lead of Wiring (4) 22
8.5. Lead of Wiring (5) 23
8.6. Lead of Wiring (6) 24
8.7. Lead of Wiring (7) 25
9 Self-check Function 26
9.1. Check of the IIC bus lines 26
9.2. Power LED Blinking timing chart 27
9.3. No Power 28
9.4. No Picture 29
9.5. Local screen failure 30
10 Service Mode 31
10.1. How to enter into Service Mode 31
10.2. Service tool mode 33
11 Adjustment Procedure 34
11.1. Driver Set-up 34
11.2. Initialization Pulse Adjust 35
11.3. P.C.B. (Printed Circuit Board) exchange 35
11.4. Adjustment Volume Location 36
11.5. Test Point Location 36
12 White Balance Adjustment 37
12.1. White balance adjustment 37
13 Hotel mode 39
14 Conductor Views 41
14.1. P(1)-Board 41
14.2. P(2)-Board 43
14.3. G,GS,K and S-Board 44
14.4. PB-Board 45
FEATURES 3D Y/C FILTER
CLOSED CAPTION V-Chip
Photo Viewer HDAVI Cont
r
ol 2
Dimensions (W × H × D)
Including pedestal 52.1 ” × 31.6 ” × 14.6 ” (1,323 mm × 802 mm × 369 mm)
TV Set only 52.1 ” × 29.7 ” × 3.92 ” (1,323 mm × 754 mm × 99.5 mm)
Mass
Including pedestal 111.3 lb. (50.5 kg)
TV Set only 94.8 lb. (43 kg)
Note:
· Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.
CONTENTS
Page Page
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14.5. H-Board 46
14.6. DG-Board 49
14.7. D-Board 52
14.8. C1-Board 54
14.9. C2-Board 55
14.10. C3-Board 56
14.11. C4-Board 57
14.12. C5-Board 58
14.13. C6-Board 59
14.14. SC-Board 60
14.15. SU-Board 63
14.16. SD-Board 64
14.17. SS-Board 65
15 Schematic and Block Diagram 69
15.1. Schematic Diagram Note 69
15.2. Main Block Diagram 70
15.3. P-Board Block Diagram 71
15.4. P-Board (1 of 2) Schematic Diagram 72
15.5. P-Board (2 of 2) Schematic Diagram 73
15.6. PB-Board Block and Schematic Diagram 74
15.7. G, GS, K and S-Board Block ans Schematic Diagram 75
15.8. H-Board (1 of 2) Block Diagram 76
15.9. H-Board (2 of 2) Block Diagram 77
15.10. H-Board (1 of 3) Schematic Diagram 78
15.11. H-Board (2 of 3) Schematic Diagram 79
15.12. H-Board (3 of 3) Schematic Diagram 80
15.13. DG-Board (1 of 4) Block Diagram 81
15.14. DG-Board (2 of 4) Block Diagram 82
15.15. DG-Board (3 of 4) Block Diagram 83
15.16. DG-Board (4 of 4) Block Diagram 84
15.17. DG-Board (1 of 14) Schematic Diagram 85
15.18. DG-Board (2 of 14) Schematic Diagram 86
15.19. DG-Board (3 of 14) Schematic Diagram 87
15.20. DG-Board (4 of 14) Schematic Diagram 88
15.21. DG-Board (5 of 14) Schematic Diagram 89
15.22. DG-Board (6 of 14) Schematic Diagram 90
15.23. DG-Board (7 of 14) Schematic Diagram 91
15.24. DG-Board (8 of 14) Schematic Diagram 92
15.25. DG-Board (9 of 14) Schematic Diagram 93
15.26. DG-Board (10 of 14) Schematic Diagram 94
15.27. DG-Board (11 of 14) Schematic Diagram 95
15.28. DG-Board (12 of 14) Schematic Diagram 96
15.29. DG-Board (13 of 14) Schematic Diagram 97
15.30. DG-Board (14 of 14) Schematic Diagram 98
15.31. D-Board (1 of 2) Block Diagram 99
15.32. D-Board (2 of 2) Block Diagram 100
15.33. D-Board (1 of 8) Schematic Diagram 101
15.34. D-Board (2 of 8) Schematic Diagram 102
15.35. D-Board (3 of 8) Schematic Diagram 103
15.36. D-Board (4 of 8) Schematic Diagram 104
15.37. D-Board (5 of 8) Schematic Diagram 105
15.38. D-Board (6 of 8) Schematic Diagram 106
15.39. D-Board (7 of 8) Schematic Diagram 107
15.40. D-Board (8 of 8) Schematic Diagram 108
15.41. C1,C2,C5 and C6-Board Block Diagram 109
15.42. C2,C3,C4 and C5-Board Block Diagram 110
15.43. C1-Board (1 of 2) Schematic Diagram 111
15.44. C1-Board (2 of 2) Schematic Diagram 112
15.45. C2-Board (1 of 2) Schematic Diagram 113
15.46. C2-Board (2 of 2) Schematic Diagram 114
15.47. C3-Board (1 of 2) Schematic Diagram 115
15.48. C3-Board (2 of 2) Schematic Diagram 116
15.49. C4-Board (1 of 2) Schematic Diagram 117
15.50. C4-Board (2 of 2) Schematic Diagram 118
15.51. C5-Board (1 of 2) Schematic Diagram 119
15.52. C5-Board (2 of 2) Schematic Diagram 120
15.53. C6-Board (1 of 2) Schematic Diagram 121
15.54. C6-Board (2 of 2) Schematic Diagram 122
15.55. SC-Board Block Diagram 123
15.56. SC-Board (1 of 2) Schematic Diagram 124
15.57. SC-Board (2 of 2) Schematic Diagram 125
15.58. SU and SD-Board Block Diagram 126
15.59. SU-Board (1 of 3) Schematic Diagram 127
15.60. SU-Board (2 of 3) Schematic Diagram 128
15.61. SU-Board (3 of 3) Schematic Diagram 129
15.62. SD-Board (1 of 3) Schematic Diagram 130
15.63. SD-Board (2 of 3) Schematic Diagram 131
15.64. SD-Board (3 of 3) Schematic Diagram 132
15.65. SS-Board Block Diagram 133
15.66. SS-Board Schematic Diagram 134
16 Exploded Views & Replacement Parts List 135
16.1. Exploded Views 135
16.2. Packing Exploded Views (Accessories) 136
16.3. Packing Explode Views (Stand) 137
16.4. Replacement Parts List Notes 138
16.5. Mechanical Replacement Parts List (PDP TV) 139
16.6. Mechanical Replacement Parts List (Stand) 140
16.7. Electrical Replacement Parts List 141
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1 Applicable signals
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2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1Mohm and 5.2Mohm.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15µF capacitors, between each exposed metallic part on
the set and a good earth ground such as a water pipe, as
shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires
have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight out.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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Remove the Rear Cover
5 Service Hint
Board Name Function Board Name Function
P Power Supply D Format Converter, Plasma AI, Sub-Field Processor
PB Fan control C1 Data Driver (Upper Right)
H Speaker out, Sound Processor
AV Terminal, AV Switch
C2 Data Driver (Upper Center)
C3 Data Driver (Upper Left)
DG DC-DC Converter
Digital Signal Processor, Microcomputer
HDMI Interface, Peaks Lite 2, Full HD
C4 Data Driver (Lower Left)
C5 Data Driver (Lower Center)
C6 Data Driver (Lower Right)
G Front terminal, Key Switch SC Scan Drive
K Remote receiver, Power LED SU Scan out (Upper)
S Power Switch SD Scan out (Lower)
GS SD Card Slot SS Sustain Drive
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6.1. Remove the Back cover
1. See Service Hint. (Section 5)
6.2. Remove the fan A/B/C
1. Unlock the cable clampers to free the cable.
2. Disconnect the relay connectors.
3. Remove the screws (×3 each) and remove the fan A.
4. Disconnect the relay connectors.
5. Remove the screws (×3 each) and remove the fan B/C.
6.3. Remove the rear terminal
cover
1. Remove the screws (×7 ,×6 ,×1 ,×2 ).
2. Remove the rear terminal cover.
6.4. Remove the tuner unit
1. Remove the screws (×3 ).
2. Remove the tuner unit mounting metal.
3. Unlock the cable clampers to free the cable.
4. Disconnect the connectors (DG1, DG5, DG35, DG52, H5,
H10, H11, H12, H30 and H51).
5. Remove the screws (×4 ) and remove the tuner unit.
6 Plasma panel replacement method
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6.5. Remove the DG-Board
1. Remove the tuner unit. (See section 6.4.)
2. Disconnect the flexible cable (DG3).
3. Disconnect the connector (DG2).
4. Remove the screws (×6 ) and remove the DG-Board.
5. Remove the screw (×1 ) and remove the tuner mounting
metal.
6.6. Remove the H-Board
1. Remove the tuner unit. (See section 6.4.)
2. Disconnect the flexible cable (H3).
3. Disconnect the connector (DG2).
4. Remove the screws (×7 ) and remove the H-Board.
6.7. Remove the P-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for
discharge from electrolysis capacitors.
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (P2, P5, P9, P10, P11, P12, P23
and P25).
3. Remove the screws (×7 ) and remove the P-Board unit.
4. Remove the screws (×21 ) on the back side.
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5. Disconnect the connectors (CN501-CN502, CN503-CN504
and CN601-CN602).
6. Remove the screws (×12 ).
7. Remove the molding props (×1 ).
8. Remove the P(Multi)-Board.
9. Remove the molding props (×9 ).
10. Remove the P(Sus)-Board.
Note:
When assembling the P(Multi)-Board and the P(Sus)-
Board, the position of each hole of the insulation sheets(A,
B, C) is set to the position of each hole of the P(Multi)-Board
and the P(Sus)-Board and then assemble them. ( marks
indicate setting positions.)
6.8. Remove the side AV unit and
the side AV bracket.
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (G51 and GS52) and relay
connector.
3. Remove the screws (×4 ).
4. Remove the side AV unit.
5. Remove the screw (×1 ).
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6. Remove the tabs (×4 ) and Remove the side AV bracket.
6.9. Remove the G-Board and GS-
Board
1. Remove the side AV unit and the side AV bracket. (See
section 6.8.)
2. Remove the screws (×2 ).
3. Remove the screws (×6 ) and remove the side AV unit
shield cover and the control button.
4. Remove the screws (×4 ) and remove the G-Board and
GS-Board.
6.10. Remove the PB-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (PB30, PB31, PB32, PB34 and
PB37).
3. Remove the screw (×2 ) and remove the PB-Board.
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6.11. Remove the D-Board
1. Remove the tuner unit. (See section 6.4.)
2. Disconnect the connectors (D3, D5, D20 and D25).
3. Disconnect the flexible cables (D31, D32, D33, D34, D35
and D36).
4. Remove the screws (×4 ) and remove the D-Board.
6.12. Remove the SU-Board
1. Remove the screws (×2 ).
2. Remove the flexible cables (SU1, SU2, SU3, SU4 and SU5)
connected to the SU-Board and remove the connectors
(SC45-SU45).
3. Slide the SU-Board to the left to disconnect from
connectors (SC41-SU41 and SC42-SU42) on the SC-Board
and remove the SU-Board.
6.13. Remove the SD-Board
1. Remove the screws (×2 ).
2. Remove the flexible cables (SD1, SD2, SD3, SD4 and SD5)
connected to the SD-Board and remove the connector
(SC46-SD46).
3. Slide the SD-Board to the left to disconnect from
connectors (SC43-SD43 and SC44-SD44) on the SC-Board
and remove the SD-Board.
6.14. Remove the SC-Board
1. Unlock the cable clampers to free the cable.
2. Remove the SU-Board and SD-Board. (See section 6.12.
and 6.13.)
3. Unlock the cable clampers to free the cable.
4. Disconnect the connectors (SC2, SC20 and SC23).
5. Remove the screws (×9 ) and remove the SC-Board.
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6.15. Remove the SS-Board
1. Disconnect the connectors (SS11, SS12, SS35, SS42 and
SS44).
2. Disconnect the flexible cables (SS51, SS52, SS53, SS54,
SS55 and SS56).
3. Remove the screws (×7 ) and remove the SS-Board.
6.16. Remove the stand brackets
1. Remove the plasma panel section from the servicing stand
and lay on a flat surface such as a table (covered) with the
plasma panel surface facing downward.
2. Remove the stand brackets (left, right) fastening screws (×5
each) and remove the stand brackets (left, right).
6.17. Remove the C1-Board
1. Remove the fan A. (See section 6.2.)
2. Remove the flexible cables holder fastening screws (×10
).
3. Disconnect the flexible cables (CA1, CA2, CA3, CA4, and
CA5).
4. Disconnect the flexible cables (C10 and C11).
5. Remove the screws (×5 ) and remove the C1-Board.
6.18. Remove the C2-Board
1. Remove the fan B. (See section 6.2.)
2. Remove the flexible cables holder fastening screws (×10
).
3. Disconnect the flexible cables (CA6, CA7, CA8, CA9 and
CA10).
4. Disconnect the flexible cables (C21, C22, C24 and C25).
5. Remove the screws (×5 ) and remove the C2-Board.
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6.19. Remove the C3-Board
1. Remove the fan C. (See section 6.2.)
2. Remove the flexible cables holder fastening screws (×10
).
3. Disconnect the flexible cables (CA11, CA12, CA13, CA14
and CA15).
4. Disconnect the flexible cable (C31).
5. Disconnect the connector (C35).
6. Remove the screws (×5 ) and remove the C3-Board.
6.20. Remove the C4-Board
1. Remove the stand bracket left. (See section 6.16.)
2. Remove the flexible cables holder fastening screws (×10
).
3. Disconnect the flexible cables (CB11, CB12, CB13, CB14
and CB15).
4. Disconnect the flexible cable (C41).
5. Disconnect the connectors (C42 and C44).
6. Remove the screws (×5 ) and remove the C4-Board.
6.21. Remove the C5-Board
1. Remove the tuner unit. (See section 6.4.)
2. Remove the flexible cables holder fastening screws (×10
).
3. Disconnect the flexible cables (CB6, CB7, CB8, CB9 and
CB10).
4. Disconnect the flexible cables (C51, C52, C54 and C55).
5. Remove the screws (×5 ) and remove the C5-Board.
6.22. Remove the C6-Board
1. Remove the stand bracket right. (See section 6.16.)
2. Remove the flexible cables holder fastening screws (×10
).
3. Disconnect the flexible cables (CB1, CB2, CB3, CB4 and
CB5).
4. Disconnect the flexible cables (C60 and C61).
5. Remove the screws (×5 ) and remove the C6-Board.
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6.23. Remove the speaker L, R
1. Disconnect the relay connector .
2. Remove the screws (×4 each) and remove the speaker
holder.
3. Remove the speaker L, R.
6.24. Remove the Plasma panel
section from the Cabinet assy
(glass)
1. Remove the stand brackets (left, right) fastening screw (×1
each).
2. Remove the cabinet assy and the plasma panel fastening
screws (×13 ).
3. For leaving the plasma panel from the cabinet assy, pull the
bottom of the front frame forward, lift, and remove.
6.25. Remove the K-Board and the
S-Board
1. Remove the cabinet assy. (See section 6.24.)
2. Remove the screws (×13 ) and remove the glass holder
bottom.
3. Unlock the cable clampers to free the cable.
4. Remove the screws (×2 ) and remove the front P.C.B.
metal.
5. Remove the screws (×2 ).
6. Disconnect the connector (S1) and Remove the S-Board.
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7. Remove the screws (×2 ).
8. Disconnect the connectors (K1) and remove the K-Board.
6.26. Replace the plasma panel
(finished)
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2. Attach the C1, C2, C3,C4,C5-Board and the C6-Board,
connect the flexible cables (×30) from the Plasma panel to
the C1, C2, C3,C4,C5-Board and the C6-Board, and fit the
flexible cable holders.
3. Attach the Hooks (left, right) and fit the Reinforcement
Angles (L, R) and the Connection Plate (A, B, C, D) to the
new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the cabinet assy and each P.C.Board and so on, to
the new plasma panel.
* When fitting the cabinet assy, be careful not to allow
any debris, dust or handling residue to remain between
the front glass and plasma panel.
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7 Caution statement
7.1. Caution statement.
Caution:
Please confirm that all flexible cables are assembled correctly.
Also make sure that they are locked in the connectors.
Verify by giving the flexible cables a very slight pull.
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8 Location of Lead Wiring
8.1. Lead of Wiring (1)
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8.2. Lead of Wiring (2)
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