Paradise Datacom HPAC-100-RM User manual

HPAC-100/125/150/200/250-RM
Solid State Power Amplifier
Operations Manual
Paradise Datacom LLC Phone: [phone]
1012 East Boal Avenue Fax: [phone]
Boalsburg, PA 16827 Email: [email protected]
DrawingNo.:201081 RA/ECO No. : 697 Revision:- Date:01/10/02

Operations Manual: HPAC-100/125/150/200/250-RM SSPA i
Table of Contents
Section 1 - General Information
Introduction ..................................................................................................................... 1-1
Description....................................................................................................................... 1-1
Specifications .................................................................................................................. 1-2
Equipment Supplied........................................................................................................ 1-2
Safety Considerations..................................................................................................... 1-2
HighVoltageHazards .............................................................................................................................1-3
High Current Hazards ............................................................................................................................1-3
RF Transmission Hazards......................................................................................................................1-4
Electrical Discharge Hazards .................................................................................................................1-4
Section 2 - Installation
Introduction ..................................................................................................................... 2-1
Inspection......................................................................................................................... 2-1
Rack Mounting................................................................................................................. 2-1
Prime Power Connection ................................................................................................ 2-1
Cable Connections .......................................................................................................... 2-1
RF Connectors .......................................................................................................................................2-2
Input Sample Port ...................................................................................................................................2-3
OutputSample Port ................................................................................................................................2-3
Monitor and Control Connections .........................................................................................................2-3
Serial Connector (J3).......................................................................................................................2-3
Interface Connector (J4)..................................................................................................................2-3
Parallel Connector (J5) ....................................................................................................................2-3
Switch Connector (J6) .....................................................................................................................2-3
Shipment .......................................................................................................................... 2-4
Section 3 - Operation of Stand-Alone Unit
Introduction ..................................................................................................................... 3-1
Description of Controls, Indicators, and Connectors................................................... 3-1
Front Panel Features ..............................................................................................................................3-1
LCD ...................................................................................................................................................3-1
Pushbuttons .....................................................................................................................................3-1
LEDs .................................................................................................................................................3-2
Input Sample Port .............................................................................................................................3-2
OutputSample Port ..........................................................................................................................3-2
Rear Panel Features ...............................................................................................................................3-2
RF Input Port (J1) ............................................................................................................................3-3
RF Output Port (J2)..........................................................................................................................3-3
Serial Connector (J3).......................................................................................................................3-3
Interface Connector (J4)..................................................................................................................3-3
Parallel Connector (J5) ....................................................................................................................3-3
RF Switch Connector (J6) ...............................................................................................................3-4
Prime Power Connector (J7)...........................................................................................................3-4
Front Panel Operation .................................................................................................... 3-5
Cursor Control .......................................................................................................................................3-5
Down Arrow Key (
↓↓
↓↓
↓ )........................................................................................................................3-5
Left and Right Arrow Keys (
←←
←←
← and
→→
→→
→ )...........................................................................................3-5
Plus and Minus Keys (+ and -) ........................................................................................................3-5

ii Operations Manual: HPAC-100/125/150/200/250-RM SSPA
Table of Contents
Menus .....................................................................................................................................................3-5
Operations Menu..............................................................................................................................3-6
Status Menu .....................................................................................................................................3-7
Setup Menu ......................................................................................................................................3-7
Low RF Power ...........................................................................................................................3-8
High RF Power...........................................................................................................................3-8
HighTemperature ......................................................................................................................3-8
Auxiliary Input ............................................................................................................................3-8
High Reflected Power (optional)................................................................................................3-8
Default Menu Settings ......................................................................................................................3-9
Remote Operation ........................................................................................................... 3-9
Parallel Port Monitors and Controls ......................................................................................................3-9
Serial Port Monitors and Controls.......................................................................................................3-10
SystemConfiguration .................................................................................................................... 3-11
DIP Switches ............................................................................................................................ 3-11
User Configurable DIP Switches ......................................................................................3-12
Factory Configured DIP Switches ....................................................................................3-17
Communications Protocol .......................................................................................................3-17
SerialCommunications Format .....................................................................................................3-17
PacketFormat ..........................................................................................................................3-17
Commands......................................................................................................................................3-19
Set Configuration Mode...........................................................................................................3-20
Set RF Muting ..........................................................................................................................3-20
SetAttenuation ........................................................................................................................3-20
Set High Temperature Threshold ............................................................................................3-21
Enable High Temperature Fault ...............................................................................................3-21
Set Low RF Power Threshold .................................................................................................3-21
Enable Low RF Power Fault....................................................................................................3-22
Set High RF Power Threshold.................................................................................................3-22
Enable High RF Power Fault ...................................................................................................3-22
Set Reflected RF Power Threshold (Reflected power monitor option only) .........................3-23
Enable Reflected RF Power Fault (Reflected power monitor option only) ............................3-23
Enable Auxiliary Fault 1 Input .................................................................................................3-23
Set Control Mode.....................................................................................................................3-24
Queries ...........................................................................................................................................3-24
Report System Summary ........................................................................................................3-25
Report Unit Faults ....................................................................................................................3-25
Report Unit Status ...................................................................................................................3-25
ReportUnit Diagnostics...........................................................................................................3-25
Report Unit Setups...................................................................................................................3-26
Report Unit Software Revision Level ......................................................................................3-26
Responses ......................................................................................................................................3-26
Interpreting 2’scomplement data ............................................................................................3-26
Interpreting Binary Coded Decimal (BCD) values ..................................................................3-27
SystemSummary.....................................................................................................................3-28
UnitFaults ................................................................................................................................3-29
UnitStatus................................................................................................................................3-30
Unit Diagnostics .......................................................................................................................3-31
Unit Setups ...............................................................................................................................3-32
Software Revision Level ..........................................................................................................3-33
CommandAcknowledged (ACK) .............................................................................................3-33
CommandNot Acknowledged(NAK) ......................................................................................3-33

Operations Manual: HPAC-100/125/150/200/250-RM SSPA iii
Table of Contents
Section 4 - Theory of Operation
Introduction ..................................................................................................................... 4-1
Functional Block Diagram .............................................................................................. 4-1
Fault Analysis .................................................................................................................. 4-2
Section 5 - Performance Tests
Introduction ..................................................................................................................... 5-1
RF Specification Tests..................................................................................................... 5-1
Gain and Gain Flatness ..........................................................................................................................5-1
1 dB Gain Compression Point................................................................................................................5-1
Input and Output Return Loss ...............................................................................................................5-1
Spurious..................................................................................................................................................5-1
IntermodulationDistortion .....................................................................................................................5-2
RF Sample Port .......................................................................................................................................5-2
Front Panel Monitors and Controls ............................................................................... 5-2
Parallel Port Monitors and Controls.............................................................................. 5-3
Serial Port Monitors and Controls ................................................................................. 5-3
Section 6 - Maintenance Information
Introduction ..................................................................................................................... 6-1
Maintenance..................................................................................................................... 6-1
Cover Removal .......................................................................................................................................6-1
LCD Contrast ..........................................................................................................................................6-1
I/O Card Fuses........................................................................................................................................6-1
FanRemoval ...........................................................................................................................................6-2
Ordering Information ...................................................................................................... 6-2
Warranty Information...................................................................................................... 6-3
Appendix A - Product Literature
Appendix B - Operation of a 1:1 Redundant HPAC-100/125/150/200/250-RM
Introduction .....................................................................................................................B-1
Hardware ..........................................................................................................................B-2
HPAC-100/125/150/200/250-RM units ................................................................................................... B-2
Power Supply ......................................................................................................................................... B-2
RF Switch ............................................................................................................................................... B-2
Switch Connector .................................................................................................................................. B-2
Interface Connector .............................................................................................................................. B-3
Fuses...................................................................................................................................................... B-3
Installation .......................................................................................................................B-3
DIP Switch Selections .....................................................................................................B-5
System Architecture .............................................................................................................................. B-5
LocalAddress ........................................................................................................................................ B-5
Front Panel Operation ....................................................................................................B-5
Operations Menu ................................................................................................................................... B-5
SwitchVoltage ................................................................................................................................. B-5
Set Switching Mode ........................................................................................................................ B-5
Set Standby Amp ............................................................................................................................. B-5
Mute Status .....................................................................................................................................B-6

iv Operations Manual: HPAC-100/125/150/200/250-RM SSPA
Table of Contents
Status Menu...........................................................................................................................................B-6
Remote Operation ...........................................................................................................B-6
ParallelPort ...........................................................................................................................................B-6
Serial Port .............................................................................................................................................. B-6
CommunicationProtocol ................................................................................................................ B-7
Commands....................................................................................................................................... B-7
Set Switching Mode .................................................................................................................. B-7
SelectStandby Amp.................................................................................................................. B-7
Queries ............................................................................................................................................ B-7
Report System Status ............................................................................................................... B-8
Responses ....................................................................................................................................... B-8
SystemStatus ........................................................................................................................... B-9
Manual Switching.................................................................................................................................. B-9

Operations Manual: HPAC-100/125/150/200/250-RM SSPA v
List of Figures/Tables
List of Figures
Figure 1-1: Outline drawing of an HPAC-100/125/150/200/250-RM............................. 1-2
Figure 2-1: Front and rear panel view of the HPAC-100/125/150/200/250-RM. .......... 2-2
Figure 2-2: CPR137G waveguide flange........................................................................ 2-2
Figure 3-1: Front panel of the HPAC-100/125/150/200/250-RM. .................................. 3-1
Figure 3-2: Rear panel view of the HPAC-100/125/150/200/250-RM............................ 3-2
Figure 3-3: Prime Power connector (IEC)...................................................................... 3-4
Figure 3-4: HPA I/O card with attached microprocessor card. .................................. 3-11
Figure 3-5: Example of I/O card and processor card DIP switches........................... 3-12
Figure 3-6: Packet format and associated byte size for serial communications...... 3-17
Figure 3-7: Example of data field information in the packet. .................................... 3-18
Figure 3-8: BCD format.................................................................................................. 3-27
Figure 3-9: Representation of 24.36 in BCD format..................................................... 3-27
Figure 4-1: System block diagram. ................................................................................. 4-1
Figure 4-2: 2 RF module block diagram.......................................................................... 4-2
Figure 4-3: 3 RF module RF block diagram. ................................................................... 4-2
Figure 4-4: Fault monitor points for the 2 RF module unit. ........................................... 4-3
Figure 4-5: Fault monitor points for the 3 RF module unit. ........................................... 4-3
Figure 5-1: Depiction of two tone third order IMD products.......................................... 5-2
Figure 6-1: View of the front panel circuit card. .............................................................. 6-1
Figure 6-2: Removal of HPAC-100/125/150/200/250-RM fans....................................... 6-2
Figure B-1: Outline of the 1:1 redundant HPAC-100/125/150/200/250-RM rack mounted
system.........................................................................................................................B-2
Figure B-2: Rear view of the 1:1 redundant HPAC-100/125/150/200/250-RM rack
mounted system.........................................................................................................B-4
Figure B-3: Status Menu for a redundant system..........................................................B-6
List of Tables
Table 3-1: Front panel LED colors and functions......................................................... 3-2
Table 3-2: Serial connector (9 socket D connector)..................................................... 3-3
Table 3-3: Parallel connector (37 socket D connector). ............................................... 3-4
Table 3-4: Prime Power connector (IEC). ...................................................................... 3-5
Table 3-5: Initial factory menu settings. ........................................................................ 3-9
Table 3-6: DIP switch functions. .................................................................................. 3-12
Table 3-7: Default user configurable DIP switch settings.......................................... 3-13
Table 3-8: System address configuration.................................................................... 3-13
Table 3-9: System baud rate configuration. ................................................................ 3-14
Table 3-10: Frequency band configuration. ................................................................ 3-14
Table 3-11: RF module count configuration. ............................................................... 3-14
Table 3-12: Power rating configuration....................................................................... 3-15
Table 3-13: Redundancy configuration. ....................................................................... 3-15
Table 3-14: Unit address configuration. ....................................................................... 3-15
Table 3-15: Hot standby configuration ........................................................................ 3-15
Table 3-16: Parallel port enable configuration. ............................................................ 3-16

vi Operations Manual: HPAC-100/125/150/200/250-RM SSPA
List of Figures/Tables
Table 3-17: Calibration mode configuration. ................................................................ 3-16
Table 3-18: Systems options configuration. ................................................................ 3-16
Table 3-19: Parallel port configuration.......................................................................... 3-16
Table 3-20: Auxiliary power rating configuration. ........................................................ 3-16
Table 3-21: Valid M&C commands. ............................................................................... 3-19
Table 3-22: Valid M&C queries and associated responses. ........................................ 3-24
Table 3-23: Interpreting BCD format. ............................................................................ 3-27
Table B-1: Switch connector pin out. ............................................................................B-3
Table B-2: Switch connections. ......................................................................................B-3

Operations Manual: HPAC-100/125/150/200/250-RM SSPA 1-1
1 General Information
Introduction
Thissectionprovides the general information forthe ParadiseDatacomHPAC-100/
125/150/200/250-RM Solid State Power Amplifier (SSPA). This includes a description
ofthe unit andsafetyprecautions.
Description
Please refer to Appendix A for the appropriate product data sheet and specifications.
The indoor rack mounted unit contains an internal microprocessor which allows full
monitoring and control from the front panel’s 4x20 LCD display and pushbuttons or via
a remote serial (RS-232 or RS-485) or parallel controller. The microprocessor moni-
tors various voltages, currents, and temperatures within the unit for a full fault analy-
sis. The user also has the ability to select additional faults related to the RF output
level, reflected RF power level, and operating temperature.
An internal attenuator allows up to 20 dB of attenuation to be applied to the RF
signal. Temperature compensation limits the amplifier’s output response from vary-
ing significantly over the operating temperature. Also, the system contains input and
output sample ports.
The HPAC-100/125/150/200/250-RM can be paired with another unit in a one-for-one
redundant configuration. The interface port allows the two amplifiers to communi-
cate with each other while being controlled from either the front panel or serial inter-
face. An additional controller is not required.
The unit is 8.75 X 24 X 19 inches (222,3 X 609,6 X 482,6 mm). An outline drawing
of the chassis is shown in Figure 1-1.

1-2 Operations Manual: HPAC-100/125/150/200/250-RM SSPA
1 General Information
Figure1-1: Outline drawingofan HPAC-100/125/150/200/250-RM.
Specifications
Refertothe Specification sheet in appendix A for theHPAC-100/125/150/200/250-RM
Solid State Power Amplifier for complete specifications.
Equipment Supplied
Thefollowing equipment is supplied witheachunit:
HPAC-100/125/150/200/250-RM
Power Cord
Rack Slides
Rack Extensions
OperationsManual HPAC-100/125/150/200/250-RM Solid State Power Amplifier
Safety Considerations
Potential safety hazards exist unless proper precautions are observed when working
with this unit. To ensure safe operation, the user must follow the information, cau-
tions, and warnings provided in this manual as well as the warning labels placed on
and in the unit itself.

Operations Manual: HPAC-100/125/150/200/250-RM SSPA 1-3
1 General Information
High Voltage Hazards
Highvoltageforthepurposeofthisparagraph,isanyvoltageinexcessof30 volts.
Voltages above this value can be hazardous and even lethal under certain circum-
stances. Care should be taken when working with devices that operate at high
voltage.
1. All probes and tools that contact the equipment should be properly insulated to
prevent the operator from coming in contact with the voltage.
2. The work area should be secure and free of non-essential items.
3. Operators should never work alone on high voltage devices. There should al-
ways be another person present in the same work area to assist in the event of
an emergency.
4. Operators should be familiar with procedures to employ in the event of an emer-
gency, i.e., remove all power, CPR.
An AC powered unit will have 115 VAC or 230 VAC entering through the AC power
connector. Caution is required when working near this connector, the AC circuit
breaker, or the internal power supply.
High Current Hazards
Many high power devices are capable of producing large surges of current. This is
true at all voltages but needs to be emphasized for low voltage devices. Low volt-
age devices provide security from high voltage hazards, but they also require higher
current to provide the same power. High current can cause severe injury from burns
and explosion. The following precautions should be taken on devices capable of
discharging high current:
1. Remove all conductive personal items, i.e., rings, watches, and medals.
2. The work area should be secure and free of non-essential items.
3. Wear safety glasses and protective clothing.
4. Operators should never work alone on high risk devices. There should always
be another person present in the same work area to assist in the event of an
emergency.
5. Operators should be familiar with procedures to employ in the event of an emer-
gency, i.e., remove all power, CPR.
Large DC currents are generated to operate the RF Module inside of the enclosure.
EXTREME CAUTION IS REQUIRED WHEN THE ENCLOSURE IS OPEN AND
THE AMPLIFIER IS OPERATING. DO NOT TOUCH ANY OF THE CONNEC-
TIONS ON THE RF MODULES WHEN THE AMPLIFIER IS OPERATING. CUR-
RENTS IN EXCESS OF 60 AMPERES MAY EXIST ON ANY ONE CONNECTOR.

1-4 Operations Manual: HPAC-100/125/150/200/250-RM SSPA
1 General Information
RF Transmission Hazards
RFtransmissionsat high power levels may cause eyesight damage and skin burns.
Prolonged exposure to high levels of RF signals has been linked to cataracts. The
following precautions should be followed with high levels of RF transmission:
1. Always terminate the RF input and output connector prior to energizing the unit.
2. Never look directly into the RF output connector.
3. A suitable distance should be maintained from the source of the transmission
such that the power density is below recommended guidelines in ANSI/IEEE
C95.1. The power density specified in ANSI/IEEE C95.1-1992 is 10 mW/cm2.
These requirements adhere to OSHA Standard 1910.97
4. When the distance required in item 3 is not practical, RF shielding should be
employed to achieve the same result.
DO NOT OPERATE THE AMPLIFIER WITHOUT A CONNECTION ON THE RF
OUTPUT. HIGH RF POWER CAN CAUSE BURNS TO HUMANS, ESPECIALLY
SENSITIVE TISSUE SUCH AS THE EYES. DO NOT PLACE HANDS OR FACE
NEAR THE OUTPUT WHEN THE AMPLIFIER IS IN OPERATION!
Electrical Discharge Hazards
An electric spark can not only create ESD reliability problems, it can also cause
serious safety hazards. The following precautions should be followed when there is
a risk of electrical discharge.
1. Follow all ESD guidelines.
2. Remove all flammable material and solvents from the area.
3. All probes and tools that contact the equipment should be properly insulated to
prevent electrical discharge
4. The work area should be secure and free of non-essential items.
5. Operators should never work alone on hazardous equipment. There should
always be another person present in the same work area to assist in the event of
an emergency.
6. Operators should be familiar with procedures to employ in the event of an emer-
gency, i.e., remove all power, CPR.

Operations Manual: HPAC-100/125/150/200/250-RM SSPA 2-1
2 Installation
Introduction
Thissection provides information for theinitialinspection,installation,external connec-
tions, and shipment of the unit.
Inspection
When the unit is received, an initial inspection should be completed. First ensure that
the shipping container is not damaged. If it is, have a representative from the ship-
ping company present when the container is opened. After opening, perform a visual
inspection of the HPAC-100/125/150/200/250-RM to make sure that all items on the
packing list are enclosed. If any damage has occurred or if items are missing, con-
tact:
Paradise Datacom LLC Paradise Datacom Ltd
1012 East Boal Avenue 1 Wheaton Road
Boalsburg, PA 16827 USA Witham,Essex,CM83TDEngland
Phone: [phone] Phone: [phone]
Fax: [phone] Fax: [phone]
E-mail: [email protected] E-mail: [email protected]
Rack Mounting
The HPAC-100/125/150/200/250-RM is designed to fit in a standard 19” wide EIA
rack. The unit is 9 rack units high, 8.75 inches (222,3 mm).
Prime Power Connection
The prime power connector is a filtered IEC connector. The unit can be ordered with
an internal AC supply or an optional DC power converter. The configuration is
marked upon the unit. HPAC-100-RM or an HPAC-125-RM unit can operate from
110 VAC or 220 VAC, but the HPAC-150-RM, HPAC-200-RM and HPAC-250-RM
should only be operated from 220 VAC. Warning: The internal power supplies are
autoranging, therefore no changes in configuration are necessary when chang-
ing prime power from 110 to 220 VAC.
Cable Connections
Figure 2-1 shows a front and rear panel view of the unit. The connector locations can
be found in this figure.

2-2 Operations Manual: HPAC-100/125/150/200/250-RM SSPA
2 Installation
Figure2-1: Front andrear panelviewof theHPAC-100/125/150/200/250-RM.
RF Connectors
TheRF Input (J1) connector, a typeNfemale,islocatedinthe lower right corner of the
rearpanel. TheRF Output (J2) connector, a CPR137G waveguide flange, is located in
thecenter of the rear panel.Thefollowingdirectionsshould be followed while referring
to Figure 2-2.
Figure 2-2: CPR137G waveguide flange.

Operations Manual: HPAC-100/125/150/200/250-RM SSPA 2-3
2 Installation
1. Insertdowel pins in mountingholes7&8toalign waveguide with the mounting
surface.
2. Insert #10 screws into mounting holes 1 and 6. Hand tighten.
3. Tighten screws 1 through 6 to three inch-pounds of torque.
4. Remove dowel pins and insert #10 screws into holes 7 & 8. Tighten to three
inch-pounds of torque.
5. Tighten screws 1 through 8, in sequence, to 32 inch-pounds of torque for #10-32
screws and 23 inch-pounds for #10-24 screws.
Input Sample Port
The Input Sample Port connector is located on the far left of the front panel. It is a
type N female connector.
Output Sample Port
The Output Sample Port connector is located next to the Input Sample Port connec-
tor on the front panel. It is a type N female connector.
Monitor and Control Connections
Serial Connector (J3)
The serial connector is the female 9 pin D connector located on the rear panel. A
description of the socket functions is given in Section 3.
Interface Connector (J4)
The interface connector is the female 15 pin D connector located on the rear panel.
It is used for redundant configurations to connect the two amplifiers together. Only
factory supplied cables should be attached to this port.
Parallel Connector (J5)
The parallel connector is the female 37 pin D connector located on the rear panel. A
description of the pin functions is given in Section 3.
Switch Connector (J6)
The switch connector is the 6 pin circular connector located on the rear panel. When
properly configured, it allows the HPAC-100/125/150/200/250-RM to control an
external switch for auxiliary switching or redundancy.

2-4 Operations Manual: HPAC-100/125/150/200/250-RM SSPA
2 Installation
Shipment
To protect the HPAC-100/125/150/200/250-RM during shipment, use high quality
commercial packing methods. When possible, use the original shipping container and
its materials. Reliable commercial packing and shipping companies have the facilities
and materials to adequately repack the instrument.

Operations Manual: HPAC-100/125/150/200/250-RM SSPA 3-1
3 Operation of Stand-Alone Unit
Introduction
This section contains operating information including a description of the front panel
indicators and controls, and I/O connectors and their functions.
Description of Controls, Indicators, and Connectors
Front Panel Features
The front panel LCD, pushbuttons, and LEDs permit the user to operate the SSPA
locally. Figure 3-1 illustrates the front panel.
Figure 3-1: Front panel of the HPAC-100/125/150/200/250-RM.
LCD
A 4 line by 20 character LCD display allows the monitoring of unit temperature, output
power, voltages, currents, and faults. In addition, it is used for locally setting sum-
mary fault options, thresholds, attenuation values, and the RF mute state. The active
line is indicated by the cursor on the leftmost position of the display.
Pushbuttons
The menus on the LCD display are manipulated with 5 front panel keys: ↓, ←, →,
+ , - . The down arrow key moves the cursor between the four lines, selecting the
active line. The left and right arrows scroll within a line to view various options. The
plus and minus keys are used to toggle or increment/decrement the active value for
functions which require inputs.

3-2 Operations Manual: HPAC-100/125/150/200/250-RM SSPA
3 Operation of Stand-Alone Unit
LEDs
AsseeninFigure3-1,fiveLEDsarelocatedonthefrontpanel: RFOut,Mute, On-line,
Standby,and Fault. The first four are located below the LCD display while the Fault
LED is above the upper right corner of the LCD. Table 3-1 indicates the meaning of
theiron-state.
Table 3-1: Front panel LED colors and functions.
Input Sample Port
ThetypeN female connector on the far left of the front panel is used to sample the RF
inputleveltotheamplifier. A labelwith the coupler calibration data is located below the
connector.
Output Sample Port
Thetype N female connector to the right of theInputSamplePortconnectorisusedto
samplethe RF output level of the amplifier.Theactualsamplingvalue is indicated on
thecalibration label below theconnector.
Rear Panel Features
Figure3-2showsanillustration of the rear panel view of the HPAC-100/125/150/200/
250-RM.
Figure 3-2: Rear panel view of the HPAC-100/125/150/200/250-RM.
lebaLDELroloCDELnoitcnuFetatS-nODEL
tluaFdeRtluafyrammusasahreifilpmA
tuOFRneerGtesrewoPFRwoLehtevobasileveltuptuoFR dlohserht
etuMwolleYdetumsireifilpmA
enil-nOneerGdetumtonsireifilpmA:tinUenolA-dnatS tinuenil-noehtsireifilpmA:metsyStnadnudeR1:1
ybdnatSwolleYdesutoN:tinUenolA-dnatS tinuybdnatsehtsireifilpmA:metsystnadnudeR1:1

Operations Manual: HPAC-100/125/150/200/250-RM SSPA 3-3
3 Operation of Stand-Alone Unit
RF Input Port (J1)
ThetypeNfemaleconnectorontherightsideoftherearpanelisused as the RF input.
RF Output Port (J2)
TheWR137waveguideconnectorin the middle of the rear panel is used as theRF
output. Do not operate the amplifier without having a termination or mating
connection on the RF Output Port. RF Hazard warnings apply.
Serial Connector (J3)
The9socket D connector on the rear panel isused forthe serialinterface. Table 3-2
showsthesocketdesignations. TheRS-485 wires should be twisted pair for maximum
transmissiondistance.
Table 3-2: Serial connector (9 socket D connector).
Interface Connector (J4)
The15 socket D connectoris used to interfacetwo SSPAs together when ina one for
one(1:1) redundant configuration. Only afactorysuppliedcableshould be attached to
thisconnector.
Parallel Connector (J5)
The37socket D connector is used for the parallelport. Table3-3 shows the socket
designations.
tekcoSnoitcnuF
1CN
2)232-SR(timsnarT
3)232-SR(evieceR
4CN
5dnuorG
6)584-SR(-timsnarT
7)584-SR(+timsnarT
8)584-SR(+evieceR
9)584-SR(-evieceR

3-4 Operations Manual: HPAC-100/125/150/200/250-RM SSPA
3 Operation of Stand-Alone Unit
Table 3-3: Parallel connector (37 socket D connector).
RF Switch Connector (J6)
The6pincircularconnectorisusedtointerfaceanSSPAtoanexternalswitch. Onlya
factorysupplied cable should be attached to this connector.
Prime Power Connector (J7)
Theprimepower connector is a filtered IEC connector. Figure 3-3 and Table 3-4 con-
tainthe pin functions ofthisconnector.
Figure 3-3: Prime Power connector (IEC).
puorGlangiStekcoS
1mralAyrammuStluaFnodesolC nommoC tluaFnonepO 435133
2mralAyrammuStluaFnodesolC nommoC tluaFnonepO 412331
3mralAyrammuStluaFnodesolC nommoC tluaFnonepO 132103
mralAtuptuOFRtluaFnodesolC nommoC tluaFnonepO 82
9
72
sutatSetuMdetuMnehwdesolC nommoC detuMnehwnepO 019211
noitisoP1hctiwSFR1.soPnidesolC nommoC 2.soPnidesolC 8
62
7
noitisoP2hctiwSFR1.soPnidesolC nommoC 2.soPnidesolC 52
6
42
rotinoMrewoP+egatloV -egatloV 3
22
rotinoMerutarepmeTerutarepmeT DNG 1202
lortnoCnoitaunettAnoitaunettA DNG 4
1
stupnIlortnoCetumnU/etuM teseRtluaF DNG 5
3202
stupnIyrailixuA)nepo=tlF(tupnItluaF DNG 2
1
C
B
A