Philips BDP3100/51 User manual

©Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or
transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without
the prior permission of Philips.
Blu-ray Disc Player
Version 1.2
CLASS 1
LASER PRODUCT
3141 785 35462GB
©
TABLE OF CONTENTS Page
Technical Specifications .......................................................1-2
Safety Instruction, Warning & Notes.....................................1-3
Mechanical and Dismantling Instructions................................2
Software Version & Upgrades, Region Code Change.............3
Trouble Shooting Chart ...........................................................4
Set Wiring Diagram .................................................................5
Electrical Diagrams and PCB layouts......................................6
Set Mechanical Exploded view & Parts List ............................7
Revision List............................................................................8
BDP3100/12/05/51/55/79/93/96/98/X78
Second Generation
This service manual is for BDP3100 & BDP3080
Second Generation model, which is different from the
For Second Generation model, the serial number begins
with KX 2A(B,C,...) xxxxxxxxxx.
( Chipset Type: MT8550FBAG)
PCBs Location, Version Variations.......................................1-7
BDP3080/98
previous generation model.

1. Technical Specifications, Directions for Use
Index of this chapter:
1.1 Technical Specifications
1.2 Directions for Use
Notes:
• Figures can deviate due to the different set executions.
• Specifications are indicative (subject to change).
1.1 Technical Specifications
For on-line product support please use the following website:
http://www.p4c.philips.com/cgi-bin/dcbint/cpproduct_selector.pl
Here is product information available, as well as getting started,
user manuals, frequently asked questions and software &
drivers.
1.2 Directions for Use
You can download this information from the following websites:
http://www.philips.com/support
http://www.p4c.philips.com
1 - 2

2. Safety Instructions, Warnings, Notes, and Abbreviation List
Index of this chapter:
2.1 Safety Instructions
2.2 Warnings
2.3 Notes
2.4 Abbreviation List
2.1 Safety Instructions
Safety regulations require the following during a repair:
• Connect the set to the Mains/AC Power via an isolation
transformer (> 800 VA).
• Replace safety components, indicated by the symbol ,
only by components identical to the original ones. Any
other component substitution (other than original type) may
increase risk of fire or electrical shock hazard.
Safety regulations require that after a repair, the set must be
returned in its original condition. Pay in particular attention to
the following points:
• Route the wire trees correctly and fix them with the
mounted cable clamps.
• Check the insulation of the Mains/AC Power lead for
external damage.
• Check the strain relief of the Mains/AC Power cord for
proper function.
• Check the electrical DC resistance between the Mains/AC
Power plug and the secondary side (only for sets that have
a Mains/AC Power isolated power supply):
1. Unplug the Mains/AC Power cord and connect a wire
between the two pins of the Mains/AC Power plug.
2. Set the Mains/AC Power switch to the “on” position
(keep the Mains/AC Power cord unplugged!).
3. Measure the resistance value between the pins of the
Mains/AC Power plug and the metal shielding of the
tuner or the aerial connection on the set. The reading
should be between 4.5 M:and 12 M:.
4. Switch “off” the set, and remove the wire between the
two pins of the Mains/AC Power plug.
• Check the cabinet for defects, to prevent touching of any
inner parts by the customer.
2.2 Warnings
• All ICs and many other semiconductors are susceptible to
electrostatic discharges (ESD ). Careless handling
during repair can reduce life drastically. Make sure that,
during repair, you are connected with the same potential as
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential.
• Be careful during measurements in the high voltage
section.
• Never replace modules or other components while the unit
is switched “on”.
• When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and the danger of a
circuit becoming unstable.
2.3 Notes
2.3.1 General
• Measure the voltages and waveforms with regard to the
chassis (= tuner) ground ( ), or hot ground ( ), depending
on the tested area of circuitry. The voltages and waveforms
shown in the diagrams are indicative. Measure them in the
Service Default Mode (see chapter 5) with a colour bar
signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated
otherwise) and picture carrier at 475.25 MHz for PAL, or
61.25 MHz for NTSC (channel 3).
• Where necessary, measure the waveforms and voltages
with ( ) and without ( ) aerial signal. Measure the
voltages in the power supply section both in normal
operation ( ) and in stand-by ( ). These values are
indicated by means of the appropriate symbols.
2.3.2 Schematic Notes
• All resistor values are in ohms, and the value multiplier is
often used to indicate the decimal point location (e.g. 2K2
indicates 2.2 k:).
• Resistor values with no multiplier may be indicated with
either an “E” or an “R” (e.g. 220E or 220R indicates 220 :).
• All capacitor values are given in micro-farads (P u10-6),
nano-farads (n u10-9), or pico-farads (p u10-12).
• Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
• An “asterisk” (*) indicates component usage varies. Refer
to the diversity tables for the correct values.
• The correct component values are listed in the Spare Parts
List. Therefore, always check this list when there is any
doubt.
2.3.3 BGA (Ball Grid Array) ICs
Introduction
For more information on how to handle BGA devices, visit this
URL: www.atyourservice.ce.philips.com (needs subscription,
not available for all regions). After login, select “Magazine”,
then go to “Repair downloads”. Here you will find Information
on how to deal with BGA-ICs.
BGA Temperature Profiles
For BGA-ICs, you must use the correct temperature-profile,
which is coupled to the 12NC. For an overview of these profiles,
visit the website www.atyourservice.ce.philips.com (needs
subscription, but is not available for all regions)
You will find this and more technical information within the
“Magazine”, chapter “Repair downloads”.
For additional questions please contact your local repair help
desk.
2.3.4 Lead-free Soldering
Due to lead-free technology some rules have to be respected
by the workshop during a repair:
• Use only lead-free soldering tin Philips SAC305 with order
code 0622 149 00106. If lead-free solder paste is required,
please contact the manufacturer of your soldering
equipment. In general, use of solder paste within
workshops should be avoided because paste is not easy to
store and to handle.
• Use only adequate solder tools applicable for lead-free
soldering tin. The solder tool must be able:
– To reach a solder-tip temperature of at least 400°C.
– To stabilize the adjusted temperature at the solder-tip.
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature of around
360°C - 380°C is reached and stabilized at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C, otherwise wear-out of
tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or
reduce heat.
• Mix of lead-free soldering tin/parts with leaded soldering
tin/parts is possible but PHILIPS recommends strongly to
avoid mixed regimes. If this cannot be avoided, carefully
clear the solder-joint from old tin and re-solder with new tin.
1 - 3

Safety Instructions, Warnings, Notes, and Abbreviation List
2.3.5 Alternative BOM identification
It should be noted that on the European Service website,
“Alternative BOM” is referred to as “Design variant”.
The third digit in the serial number (example:
KX2B0835000001) indicates the number of the alternative
B.O.M. (Bill Of Materials) that has been used for producing the
specific AV set. In general, it is possible that the same AV
model on the market is produced with e.g. two different types
of display, coming from two different suppliers. This
will then result in sets which have the same CTN (Commercial
Type Number; e.g. MCM394/12) but which have a different
B.O.M. number.
Also, it is possible that same model on the market is produced
with two production centers, however their partslist is the same.
In such case, no alternative B.O.M. will be created.
By looking at the third digit of the serial number, one can
identify which B.O.M. is used for the set he is working with.
If the third digit of the serial number contains the number “1”
(example: KX1B033500001), then the set has been
manufactured according to B.O.M. number 1. If the third digit is
a “2” (example: KX2B0335000001), then the set has been
produced according to B.O.M. no. 2. This is important for
ordering the correct spare parts!
For the third digit, the numbers 1...9 and the characters A...Z
can be used, so in total: 9 plus 26= 35 different B.O.M.s can be
indicated by the third digit of the serial number.
Identification: The bottom line of a type plate gives a 14-digit
serial number. Digits 1 and 2 refer to the production centre (e.g.
LM is Arts), digit 3 refers to the B.O.M. code, digit 4 refers
to the Service version change code, digits 5 and 6 refer to the
production year, and digits 7 and 8 refer to production week (in
example below it is 2008 week 50). The 6 last digits contain the
serial number.
Figure 2-1 Serial number (example)
2.3.6 Module Level Repair (MLR) or Component Level Repair
(CLR)
If a board is defective, consult your repair procedure to decide
if the board has to be exchanged or if it should be repaired on
component level.
If your repair procedure says the board should be exchanged
completely, do not solder on the defective board. Otherwise, it
cannot be returned to the O.E.M. supplier for back charging!
2.3.7 Practical Service Precautions
•It makes sense to avoid exposure to electrical shock.
While some sources are expected to have a possible
dangerous impact, others of quite high potential are of
limited current and are sometimes held in less regard.
•Always respect voltages. While some may not be
dangerous in themselves, they can cause unexpected
reactions that are best avoided. Before reaching into a
powered TV set, it is best to test the high voltage insulation.
It is easy to do, and is a good service precaution.
2.4 Abbreviation List
0/6/12 SCART switch control signal on A/V
board. 0 = loop through (AUX to TV),
6 = play 16 : 9 format, 12 = play 4 : 3
format
2DNR Spatial (2D) Noise Reduction
3DNR Temporal (3D) Noise Reduction
AARA Automatic Aspect Ratio Adaptation:
algorithm that adapts aspect ratio to
remove horizontal black bars; keeps
the original aspect ratio
ACI Automatic Channel Installation:
algorithm that installs TV channels
directly from a cable network by
means of a predefined TXT page
ADC Analogue to Digital Converter
AFC Automatic Frequency Control: control
signal used to tune to the correct
frequency
AGC Automatic Gain Control: algorithm that
controls the video input of the feature
box
AM Amplitude Modulation
ANR Automatic Noise Reduction: one of the
algorithms of Auto TV
AP Asia Pacific
AR Aspect Ratio: 4 by 3 or 16 by 9
ASF Auto Screen Fit: algorithm that adapts
aspect ratio to remove horizontal black
bars without discarding video
information
ATSC Advanced Television Systems
Committee, the digital TV standard in
the USA
ATV See Auto TV
Auto TV A hardware and software control
system that measures picture content,
and adapts image parameters in a
dynamic way
AV External Audio Video
AVC Audio Video Controller
AVIP Audio Video Input Processor
B/G Monochrome TV system. Sound
carrier distance is 5.5 MHz
BLR Board-Level Repair
BTSC Broadcast Television Standard
Committee. Multiplex FM stereo sound
system, originating from the USA and
used e.g. in LATAM and AP-NTSC
countries
B-TXT Blue TeleteXT
C Centre channel (audio)
CEC Consumer Electronics Control bus:
remote control bus on HDMI
connections
CL Constant Level: audio output to
connect with an external amplifier
CLR Component Level Repair
COLUMBUS COlor LUMinance Baseband
Universal Sub-system
ComPair Computer aided rePair
CP Connected Planet / Copy Protection
CSM Customer Service Mode
CTI Color Transient Improvement:
manipulates steepness of chroma
transients
CVBS Composite Video Blanking and
Synchronization
DAC Digital to Analogue Converter
DBE Dynamic Bass Enhancement: extra
low frequency amplification
DDC See “E-DDC”
Model FWM572/12
220-230 50Hz 60W
FWM572/12
LM1A0850005644
1 - 4

Safety Instructions, Warnings, Notes, and Abbreviation List
D/K Monochrome TV system. Sound
carrier distance is 6.5 MHz
DFI Dynamic Frame Insertion
DFU Directions For Use: owner's manual
DMR Digital Media Reader: card reader
DMSD Digital Multi Standard Decoding
DNM Digital Natural Motion
DNR Digital Noise Reduction: noise
reduction feature of the set
DRAM Dynamic RAM
DRM Digital Rights Management
DSP Digital Signal Processing
DST Dealer Service Tool: special remote
control designed for service
technicians
DTCP Digital Transmission Content
Protection; A protocol for protecting
digital audio/video content that is
traversing a high speed serial bus,
such as IEEE-1394
DVB-C Digital Video Broadcast - Cable
DVB-T Digital Video Broadcast - Terrestrial
DVD Digital Versatile Disc
DVI(-d) Digital Visual Interface (d= digital only)
E-DDC Enhanced Display Data Channel
(VESA standard for communication
channel and display). Using E-DDC,
the video source can read the EDID
information form the display.
EDID Extended Display Identification Data
(VESA standard)
EEPROM Electrically Erasable and
Programmable Read Only Memory
EMI Electro Magnetic Interference
EPLD Erasable Programmable Logic Device
EU Europe
EXT EXTernal (source), entering the set by
SCART or by cinches (jacks)
FBL Fast BLanking: DC signal
accompanying RGB signals
FDS Full Dual Screen (same as FDW)
FDW Full Dual Window (same as FDS)
FLASH FLASH memory
FM Field Memory or Frequency
Modulation
FPGA Field-Programmable Gate Array
FTV Flat TeleVision
Gb/s Giga bits per second
G-TXT Green TeleteXT
H H_sync to the module
HD High Definition
HDD Hard Disk Drive
HDCP High-bandwidth Digital Content
Protection: A “key” encoded into the
HDMI/DVI signal that prevents video
data piracy. If a source is HDCP coded
and connected via HDMI/DVI without
the proper HDCP decoding, the
picture is put into a “snow vision” mode
or changed to a low resolution. For
normal content distribution the source
and the display device must be
enabled for HDCP “software key”
decoding.
HDMI High Definition Multimedia Interface
HP HeadPhone
dnuoS.metsysVTemorhconoMI
carrier distance is 6.0 MHz
I2C Inter IC bus
I2D Inter IC Data bus
I2S Inter IC Sound bus
IF Intermediate Frequency
Interlaced Scan mode where two fields are used
to form one frame. Each field contains
half the number of the total amount of
lines. The fields are written in “pairs”,
causing line flicker.
IR Infra Red
IRQ Interrupt Request
ITU-656 The ITU Radio communication Sector
(ITU-R) is a standards body
subcommittee of the International
Telecommunication Union relating to
radio communication. ITU-656 (a.k.a.
SDI), is a digitized video format used
for broadcast grade video.
Uncompressed digital component or
digital composite signals can be used.
The SDI signal is self-synchronizing,
uses 8 bit or 10 bit data words, and has
a maximum data rate of 270 Mbit/s,
with a minimum bandwidth of 135
MHz.
ITV Institutional TeleVision; TV sets for
hotels, hospitals etc.
JOP Jaguar Output Processor
LS Last Status; The settings last chosen
by the customer and read and stored
in RAM or in the NVM. They are called
at start-up of the set to configure it
according to the customer's
preferences
LATAM Latin America
LCD Liquid Crystal Display
LED Light Emitting Diode
L/L' Monochrome TV system. Sound
carrier distance is 6.5 MHz. L' is Band
I, L is all bands except for Band I
LORE LOcal REgression approximation
noise reduction
LPL LG.Philips LCD (supplier)
LS Loudspeaker
LVDS Low Voltage Differential Signalling
Mbps Mega bits per second
M/N Monochrome TV system. Sound
carrier distance is 4.5 MHz
MIPS Microprocessor without Interlocked
Pipeline-Stages; A RISC-based
microprocessor
MOP Matrix Output Processor
MOSFET Metal Oxide Silicon Field Effect
Transistor, switching device
MPEG Motion Pictures Experts Group
MPIF Multi Platform InterFace
MUTE MUTE Line
NC Not Connected
NICAM Near Instantaneous Compounded
Audio Multiplexing. This is a digital
sound system, mainly used in Europe.
NTC Negative Temperature Coefficient,
non-linear resistor
NTSC National Television Standard
Committee. Color system mainly used
in North America and Japan. Color
carrier NTSC M/N= 3.579545 MHz,
NTSC 4.43= 4.433619 MHz (this is a
VCR norm, it is not transmitted off-air)
NVM Non-Volatile Memory: IC containing
TV related data such as alignments
O/C Open Circuit
OSD On Screen Display
OTC On screen display Teletext and
Control; also called Artistic (SAA5800)
P50 Project 50: communication protocol
between TV and peripherals
PAL Phase Alternating Line. Color system
mainly used in West Europe (color
carrier= 4.433619 MHz) and South
America (color carrier PAL M=
1 - 5

Safety Instructions, Warnings, Notes, and Abbreviation List
3.575612 MHz and PAL N= 3.582056
MHz)
PCB Printed Circuit Board (same as “PWB”)
PCM Pulse Code Modulation
PDP Plasma Display Panel
PFC Power Factor Corrector (or Pre-
conditioner)
PIP Picture In Picture
PLL Phase Locked Loop. Used for e.g.
FST tuning systems. The customer
can give directly the desired frequency
POR Power On Reset, signal to reset the uP
Progressive Scan Scan mode where all scan lines are
displayed in one frame at the same
time, creating a double vertical
resolution.
PTC Positive Temperature Coefficient,
non-linear resistor
PWB Printed Wiring Board (same as “PCB”)
PWM Pulse Width Modulation
QRC Quasi Resonant Converter
QTNR Quality Temporal Noise Reduction
QVCP Quality Video Composition Processor
RAM Random Access Memory
RGB Red, Green, and Blue. The primary
color signals for TV. By mixing levels
of R, G, and B, all colors (Y/C) are
reproduced.
RC Remote Control
RC5 / RC6 Signal protocol from the remote
control receiver
RESET RESET signal
ROM Read Only Memory
R-TXT Red TeleteXT
SAM Service Alignment Mode
S/C Short Circuit
SCART Syndicat des Constructeurs
d'Appareils Radiorécepteurs et
Téléviseurs
SCL Serial Clock I2C
SCL-F CLock Signal on Fast I2C bus
SD Standard Definition
SDA Serial Data I2C
SDA-F DAta Signal on Fast I2C bus
SDI Serial Digital Interface, see “ITU-656”
SDRAM Synchronous DRAM
SECAM SEequence Couleur Avec Mémoire.
Color system mainly used in France
and East Europe. Color carriers=
4.406250 MHz and 4.250000 MHz
SIF Sound Intermediate Frequency
SMPS Switched Mode Power Supply
SoC System on Chip
SOG Sync On Green
SOPS Self Oscillating Power Supply
S/PDIF Sony Philips Digital InterFace
SRAM Static RAM
SRP Service Reference Protocol
SSB Small Signal Board
STBY STand-BY
SVGA 800x600 (4:3)
SVHS Super Video Home System
SW Software
SWAN Spatial temporal Weighted Averaging
Noise reduction
SXGA 1280x1024
TFT Thin Film Transistor
THD Total Harmonic Distortion
TMDS Transmission Minimized Differential
Signalling
TXT TeleteXT
TXT-DW Dual Window with TeleteXT
UI User Interface
uP Microprocessor
UXGA 1600x1200 (4:3)
V V-sync to the module
VCR Video Cassette Recorder
VESA Video Electronics Standards
Association
VGA 640x480 (4:3)
VL Variable Level out: processed audio
output toward external amplifier
VSB Vestigial Side Band; modulation
method
WYSIWYR What You See Is What You Record:
record selection that follows main
picture and sound
WXGA 1280x768 (15:9)
XTAL Quartz crystal
XGA 1024x768 (4:3)
Y Luminance signal
Y/C Luminance (Y) and Chrominance (C)
signal
YPbPr Component video. Luminance and
scaled color difference signals (B-Y
and R-Y)
YUV Component video
1 - 6

PCBS LOCATION
SWITCH BOARD
FRONT CONTROL BOARD
MAIN BOARD
POWER BOARD
Service policy
Type / Versions
VERSION VARIATIONS
1-7
BDP3080
Board in used
* TIPS: C -- Component Lever Repair.
M -- Module Lever Repair
X -- Used
BDP3100
/98
AV BOARD

Mechanical and Dismantling Instructions
Dismantling Instruction
The following guidelines show how to dismantle the player.
Step1: Remove 6 screws around the Top Cover, and then remove the Top Cover (Figure 1).
Figure 1
Step2: If it is necessary to dismantle Loader or Front Panel, the Front door should be removed first. (Figure 2)
Note: Make sure to operate gently otherwise the guider would be damaged.
Figure 2
2-1
Please kindly note that dismantle the front door
assembly carefully to avoid damage tray and the front door.
Detailed information please refer to the model set.

Mechanical and Dismantling Instructions
Dismantling Instruction
Step3: If the tray can’t open in normal way, you can make it through the instruction as below (Figure 3).
Note: Make sure to operate gently otherwise the guider would be damaged.
Figure 3
Step4: Dismantling Front Panel, disconnect the connectors(J3, CN502), need release 3snaps of Front Panel
and 2 snaps of bottom cabinet , then gently pull the Panel out from the set. (Figure 4 - Figure 6)
Figure 4
2-2
Detailed information please refer to the model set.
XP6
XP3
XP4
J3
XP2

2-3
Mechanical and Dismantling Instructions
Dismantling Instruction
Figure 5
Figure 6
Detailed information please refer to the model set.
Step6: Dismantling Main Board, first disconnect the connector (XP2), and then remove 6screws. (Figure 6)
Step7: Disconnect connector (CN504, CN502) and remove 6screws on Power Board to dismantle the Power Board. (Figure 6)
Step5: Dismantling Loader, disconnect the 3connectors(XP6, XP3, XP4) aiming in the below figure, and remove 4screwsthat
connects the loader and the bottom cabinet. (Figure 4-5)