Philips Cdi 220/00 User manual

Compact disc interactive player

~®[TWO©®

Service

CONTENTS

illiiillllll~--

krlterac:thre

!'si1edi.a

Manual information

2 Product information

3 Service information

4 Mechanical drawings

and

partslist

5 Descriptions

6 Electrical drawings

and

partslist

7 Diagnostics, measurements and adjustments

Safety regulations require that the set

be

restored to its original

cond1t1on

and that parts which are

1dent1cal

with

those

spec1f1ed

be

used

·Pour

votre

securitl!,

ce.s

documents

.so111ent

etre

u1mses

par

des

spec1a-

li:s1es

a.gr~e5.

seul:s

habil11es

a

reparer

votre

appare11

eri

panna~

CDI

220/oo

CLASS

1

LASER

PRODUCT

31.2211003&20

Published by Service & Support Interactive Media Systems Printed in The Netherlands ©Copyright reserved Subject to modification 4822 725 24137

e PHILIPS

SECTION

CONTENTS

1

DETAILLED

TABLE

OF

CONTENTS

6

ELECTRICAL

DRAWINGS

6.1

WIRING

DIAGRAM

2

PRODUCT

INFORMATION

6.2 BLOCK

DIAGRAM

2.1

TECHNICAL

SPECIFICATION 6.2.1

Alphabetical

list

of

abbreviations

2.2

CONNECTIONS

AND

CONTROLS 6.3 POWER SUPPLY PANEL

1006

6.3.1 PCB

Lay-outs

3

SERVICE

INFORMATION

6.3.2

Circuit

diagram

3.1

SAFETY

INSTRUCTIONS

6.3.3

List

of

electrical

parts

3.2

SERVICING

OF

SMDs

(SURFACE

MOUNTED

6.4 CD PANEL

1004

DEVICES) 6.4.1

Circuit

diagram

CD

part

1

3.2.1

General

cautions

on

handling

and

storage

6.4.2

List

of

electrical

parts

3.2.2

Removal

of

SMDs

6.4.3 PCB

Lay-outs

3.2.2.1

Caution

on

removal

6.4.4.

Circuit

diagram

CD

part

2

3.2.3

Attachment

of

SMDs

6.4.5.

Circuit

diagram

turntablemotor

part

3.2.3.1

Caution

on

attachment

6.5

AUDIO

PROCESSING

UNIT

1002

3.3

HANDLING

ESD SENSETIVE

COMPONENTS

6.5.1

Circuit

diagram

3.3.1

Personal

safety

6.5.2 PCB

lay-outs

3.3.2

Storage

and

transport

6.5.3

List

of

electrical

parts

3.3.3

Testing

or

handling

6.6 VIDEO ENCODER

UNIT

1003

3.3.4

Mounting

ESD

sensetive

components

6.6.1 PCB

lay-outs

3.3.5

Soldering

6.6.2

List

of

electrical

parts

3.3.6

Electrostatic

charges

6.6.3

Circuit

diagram

3.3.7

Transients

(switch-on

phenomena)

6.7

MMC

PANEL 1001

3.3.8

Working

environment

6.7.1 PCB

lay-out

3.3.9

Replacement

of

the

Flat

Pack ICs 6.7.2 F.M.V.

interface

circuit

diagram

3.4

CODENUMBERS

FOR STANDARDIZED 6.8 DISPLAY

AND

HEADPHONE

PANEL 1005

RESISTORS 6.8.1 PCB

lay-out

3.5 SERVICE

TOOLS

6.8.2

List

of

electrical

parts

3.5.1

Service

PCB 6.8.3 PCB

layout

Headphone

panel

3.5.1.1

Circuit

diagram

6.8.4

Circuit

diagram

3.5.1.2

Layout

3.5.1.3

Parts

list

7

DIAGNOSTICS

3.5.2 Test

discs

7.1

TROUBLESHOOTING

AND

REPAIR

3.5.3

Extension

connectors

7.1.1

Troubleshooting

the

Power

Supply

3.5.4

Measurement

equipment

7.1.2

Troubleshooting

and

Service

the

MMC

panel

3.5.5

Pointing

devices

7.1.3

CO-part

and

Audio

Section

Troubleshooting

3.5.6

(de)Mounting

tool

7.1.4

Video

Section

Troubleshooting

3.6 THE

MMC

CENTRAL

REPAIR PROCEDURE 7.2

MEASUREMENTS

AND

ADJUSTMENTS

7.2.1

Power

supply

panel

1006

4

MECHANICAL

DRAWINGS

AND

PARTS

7.2.1.1

Checkspoints

LIST

7.2.1.2

Adjustment

4.1

DEMOUNTING

INSTRUCTIONS

OF

CABINET

7.2.2

CD

panel

1004

4.1.1 Top

Cover

Removal

7.2.2.1

Laser

current

4.1.2

Front

Assembly

Removal

7.2.2.2 Focus

signal

4.1.3

Display

Panel

Removal

7.2.2.3

Starting

signal

4.1.4

Power

Supply

Panel

Removal

7.2.2.4

Motor

control

signals

4.1.5

APU

panel

&

Encoder

Panel 7.2.2.5 Radial

error

circuit

signals

4.1.6

CDM

Loader

Assembly

Removal

7.2.2.6

Clock

signal

(LP

IC7201

4.1.7

CDM

Loader

Disassembly.

7.2.2.7

Decoder

signals

4.1.7.1 Tray

Removal.

7.2.2.8

Video

signals

4.1.7.2

CDM

Assembly

Removal

7.2.3

Audio

processing

unit

1002

4.1.8

Exploded

view

of

the

cabinet_

7.2.3.1

Slave

processor

data

4.1.8.1

Parts

list

of

cabinet

7.2.3.2 1

2S

signals

4.2 EXPLODED

VIEW

OF LOADER 7.2.3.3 X;n

clock

signal

4.2.1

Parts

list

of

LOADER 7.2.3.4 DEEMP

signal

7.2.3.5 FILTERN

signal

5

SERVICE

SOFTWARE

7.2.3.6 KIii

signal

5.1

THE

LOW

LEVEL

MMC

TEST 7.2.3.7

Performance

check

5.1.1

Tools

7.2.4

Video

encoder

unit

1003

5.1.2 Test

sequence

7.2.4.1

Check

and

adjustment

PAL

sub

carrier

5.1.3

Low

level

test

implementation

7.2.4.2

SW

control

signal

5.1.4

How

to

start

up

the

low

level

test

7.2.4.3

Check

of

RGB

input

signals

5.1.5 PCB

low

level

test

7.2.5

Multi

media

controller(

MMC

Panel) 1001

5.1.6

Terminal

low

level

test

7.2.5.1

Supply

voltages

5.1.7

Error

codes

7.2.5.2

Clock

signals

5.1.8

Release

number,

position

and

checksum

7.2.5.3

12S

interface

storage

7.2.5.4

Reset

circuitry

5.1.9

How

is

the

checksum

calculated

? 7.2.5.5

Main

(LP

68070

5.2 THE SERVICE SHELL 7.2.5.6

Low

Level

test

5.2.1

Starting

the

service

shell

5.2.2

Layout

info

5.2.3

Subject

dependent

information

PCS

66

312

2

PRODUCT

INFORMATION

2.1

TECHNICAL SPECIFICATION

Physical

Dimensions

(w

x h x

d)

420 x 90 x 400

mm

(16.5

x 3.5 x

15.

7 inch)

Weight

(approx.)

7

kg

(15.4 lbs)

Power supply

220/240 V ; 50-60Hz

220V range 198V

to

264V

Power consumption

Approx.

35W

Approvals

FCC,

UL

Conforms

with

VDE, FTZ, CSA,

Nordic,

US and GERMAN

laser

safety

regulations

Audio

L+R:

Connector

Type Cinch

connector

gold

plated 2x

Colour

Left:

white

Right red

Output

quality

in case

of

CD-DA

Measurements

acc.

to

IEC

TC

60 Subcan.

60A

Output

level :

2Vrms

+!-

3 dB

Frequency range : 20 HZ

to

20

kHz

Frequency

linearity

:

+0.2

dB/

-0.2

dB

Cross

talk

(1

kHz)

: - 86 dB

Harmonic

dist.

+ noise at 1

kHz

SIN

ratio

Dynamic

range

: -

86

dB

: 87 dB

(typ

>90)

: 86 dB

Output

quality

in case

of

ADPCM

to

be specified

Headphone output:

Connector

type

Output

control : Phone socket

:

Manual

volume

control

Output

quality

in case

of

CD-DA

Load

impedance

range

Output

power

Frequency range

Harmonic

distortion

(1

kHz)

S/N

ratio

Dynamic

range

Cross taIke Ri~600E

(1

kHz)

PCS 61848

: 8

Ohm

- 2 kOhm

: 30

mW

at 1

kHz,

32 Ohm

: 20

Hz

-20 kHz

+!-

3 dB

: - 83 dB

: 84

dB

: 83

dB

: - 75 dB

Video specifications

625 lines:

RGB

(PAL, SECAM)

for

/00/05

Connector

type

Pinning:

No. Function

:

Euroconnector

(SCART)

1.

Audio

R (analogue)

2.

NC

3.

Audio

L (analogue)

4.

Audio

ground

5.

Blue

ground

6.

NC

7.

Blue

8.

Slow

switching(

o~

TV,

1

~Euroconn.)

9.

Green

ground

10.

NC

11. Green

12.

NC

13. Red

ground

14.

NC

15. Red

16. Fast

switching

(RGB/CVBS)

17. CVBS

ground

18. Fast

switching

ground

19. CVBS/RGB sync

20.

NC

21

Shield

Video interface

General

information:

TABEL 1 Encoded

RGB

General

information

Resolution

normal

H*V

Line period

Active line

period

VSC

clock

Display

format

non-interlace

interlace

(2

different

frames)

interleaved

(2

identical frames)

PAL

Amplitude

Line time

Sync.

output

S/N

on

RGB

output

S/N

on

RGB

output

Bandwidth

on

RGB

out

CVBS output:

Connector

PAL

Amplitude

White

bar

Sync

amplitude

Burst

amplitude

S/N

lum. (40Hz-10MHz)

SIN

chrom. in red

Video

bandwidth

Chroma subc. freq.

: PAL

Environment

: 384*280

384*560

: 64.00 us

: 51.20 us

: 30.0000 MHz

: 312 lines

: 625 lines

:

700mVpp

+!-

10%

(max.

white

level)

: 64.

us

: 300

mVpp

+!-

0.1V

into

75

Ohm

: >

50

dB (40

Hz

- 5 MHz)

: > 45 dB (40

Hz

- 10 MHz)

: - 3 dB at 7.5 MHz

: Cinch

connector,

colour

Yellow

:

1Vpp

+15%/-10%

: 700

mVpp

+110

mV/-70

mV

: 300

mVpp

+/-40

mV

: 300

mV

+l-30

mV

: fsc notch

>45dB

:

AM

(*) > 48 dB

PM

(**)

> 43 dB

: 4.5 MHz

(-6dB)

:

~

4.433661 MHz

X-tal locked

+!-50Hz

"

AM

noise :

output

of

measured value in dB referred

to

the average

amplitude

of

the

colour

subcar-

rier

burst

applied

**

PM

noise

:

output

of

measured value in dB referred

to

the

constant

phase

of

a reference

oscillator

V

/C

(S-Video) output:

Type

of

connector

Pinning:

No. Function

1. Gnd Y

2.

Gnd C

3. y

4. C

PAL

:

Mini-Din

4 (female)

amplitude

:

Y~

1Vpp

+15%/-10%

into

75

Ohm

amplitude

bandwidth

Y

bandwidth

C

S/N

on

Y

output

(10KHz-5MHz)

:c~ 300

mVpp

+!-

10% (burst)

:

~

5 MHz

(-3dB)

(10KHz-1 0MHz)

S/N

on

C

output

:

~

1.6 MHz

: > 48 dB

: > 45 dB

:

AM(*)>

55 dB

PM

(**)>

50

dB

*

AM

noise :

output

of

measured

value in dB referred

to

the average

amplitude

of

the

colour

subcar-

rier

burst

applied

**

PM

noise :

output

of

measured

value in dB referred

to

the

constant

phase

of

a reference

oscillator

Laser Detector Grating

Unit

(LDGU)

Laser

type

:

semi

conductor

AIGaAs

Wave length : 780

nm

Output

power

: 3.3

mW

typical

RS232-1 (port 1I communication:

Connector

type

: 8

pins

miniDIN (female)

Location

:

front

Internal device :

MMC

slave proc.

(68HC05,

SCl+ports)

Baudrates : 1200 and 9600

Dataformat

: 1

startbit

7

databits

2

stopbits

no

parity

Handshake :

hardware:

only

RTS

software:

not

available

Signals & Pinning:

pin signal

description

lnp/Outp

1 n.c.

Not

Connected

2 RXD Received Data

Input

3 TXD

Transmitted

Data

Output

4

DTR

(*) Data Terminal Ready

Output

5 GND Signal Ground

6 n.c.

Not

Connected

7

RTS

Request

To

Send

Output

8

+5V

Power

supply

for

the device

RS232-2

(port

2)

communication:

Connector

type

: 8 pins

miniDIN

(female)

Location : rear

Internal

device

:

on

chip UART (SCC68070)

Baudrates : 75, 150, 300, 1200, 2400,

Dataformat

stopbit

length

parity

Handshake

software

Signals & Pinning:

signal

1 n.c.

2 RXD

3

TXD

4 DTR

(*)

5 GND

6 CTS

7 RTS

8

+5V

4800, 9600 and 19200

: character

length:

7

or

8 bits

: 1

or

2 bits

:

odd,

even

or

no

:

hardware:

2

control

lines;

RTS

and

CTS.

: XON/XOFF.

description

lnp/Outp

Not

Connected

Received Data

Input

Transmitted

Data

Output

Data Terminal Ready

Output

Signal Ground

Clear

To

send

Input

Request

To

Send

Output

Power

supply

for

the

device

Input

:

this

is an

input

signal

for

the CD-I

player

Output:

this is an

output

signal

for

the

CD-I player.

(*)

DTR

is

not

an active handshake signal. It serves

as

a

power

supply

for

some

input

devices.

All signal levels

and

current

ratings,

except

+5V

and

DTR

are

according

EIA RS-232-C standard.

RATINGS :

+5V

+/-10%

max.

200mA

DTR

:

+12V

+/-10%

max.

10mA

(Ri

~

1kQ)

IR

interface:

The

IR

(infra red) receiver

for

use

with

the

CD-I remote

control.

Specification

according

UAW-0422

characteristics

Data

format

Distance

Sampling

time

Receive angle

Infrared receiver

control

Device

Mains

socket:

Connector

:

RC-5

extended

format

infrared

transmission

data.

: 20 -800 cm.

:

~<

50

ms

: 45 degree

out

of

the

centre

line

:

GP1

U501 X SHARP

: 2-pol.

The

player

has

to

be Class I

equipment.

Modifications

without

notice

2.2 CONNECTIONS AND CONTROLS

Front

panel

control

functions

and

rear

connections

COi

front

panel

controls

1.

Disc

loading

tray

2.

Open/close

key

3.

"Previous"

key

for

instant

track

skip

4.

"Next"

key

for

instant

track

skip

5.

"Play"

key

6.

1/0

port

for

CD-I

pointing

devices

or

keyboard

7.

Headphone

socket

8.

Headphone

volume

control

9.

Pause

key

10.

Stop

key

11.

Power

"On/Off'

key

12.

Soft

tone

multifunction

dis

play

with

infra-red

remote

control

receiver

The

control

sits

conveniently

in

the

hand,

and

the

thumbstick

and

action

keys,

which

are

by

far

the

most-used

controls,

are

easily

operated

one-handed.

COi

rear

panel

connections

13.

Power

input

socket

14.

1/0

port

for

CD-I

pointing

devices,

keyboard

or

other

RS232

connection

15.

Antenna

in'

16.

Euroconnector

17.

Channel

selector'

18.

Antenna

our

19.

Y/C(S-video)output

20.

Audio

output

L

21.

CVBS

{video)

output

22.

Remote

control

in

23.

Audio

output

R

24.

Extension

socket

(for

22ER9141

Digital

Audio,Nideo

module)

•depending

on

version

22ER9051

Infra

red

remote

control

The

"Thumbstick"

remote

control

The

shape

and

layout

of

the

"Thumbstick"

control

were

the

subject

of

careful

ergonomic

studies

to

ensure

that

it

can

be

used

left-handed

or

right-handed,

in

big

or

small

hands.

1/3.

Action

keys

2.

Thumbstick

4.

"Play"

key

5.

"Pause"

key

6.

"Previous"

key

for

instant

track

skip

7.

Mute

or

TV

/COi

selector

key'

8.

Volume

control

down

key

9.

Volume

control

up

key

10.

"Next"

key

for

instant

track

skip

11.

"Stop"

key

'depending

on

version

The

user

shell

With

just

the

one

"point

and

click"

operation,

player

functions

can

be

controlled

so

easily

that

the

actions

become

intuitive.

This

is

because

of

the

player's

specially

designed

"user

shell"

program.

which

presents

a

series

of

screen

displays

that

not

only

allow

you

a

complete

choice

of

play

functions,

but

also

guide

you

in

selecting

them.

User

shell

screen

When

the

player

is

switched

on,

the

first

"user

she

I

I"

screen

invites

you

to

load

a

disc.

Playing

a

CD-I

disc

is

a

simple

matter

of

loading

the

disc

and

selecting

"Start"

on

the

"CO-I

start"

screen

which

then

automatically

appears.

The

CD-I

program

starts

to

run,

and

you

select

options

from

the

screen

according

to

choice.

For

CO-Digital

Audio

discs,

the

"user

shell"

presents

a

play

control

screen.

This

offers

more

than

just

the

functions

fitted

as

standard

on

CD

players

(and

also

provided

on

the

front

panel

and

remote

control).

It

offers

all

the

features

found

only

on

top-of-the-range

players.

These

include

Program,

Favorite

Track

Selection,

Title,

Shuffle,

Repeat,

Play

and

Scan.

Another

"user

shell"

screen

offers

"Personal

Preference"

settings.

These

include

date

and

time

display,

Scan

time.

Auto

Shuffle,

and

Repeat.

When

"Personal

Preference"

settings

have

been

made,

the

player

automatically

adopts

them

whe1

1

starting

up.

Further

"user

shell"

screens

provide

info1

mation.

CD-DA

programming

(FTS)

facil-

ities,

a

list

of

stored

programs

and

other

information.

and

control

for

CD

Graphics.

User

Shell

Functions

General

screens:

•

"Personal

Preference"

settings

screen:

Auto

Shuffle,

Auto

FTS,

Display

Time/Date,

Scan

Time,

Repeat

(Disc

or

Track).

•

Open/Close

(on

player

start-up

screen).

•

Info

screens

(depending

on

version

with

language

choice).

•

Memory

screen

(manages

CD-I

stored

data.

as

well

as

FTS

programs

and

titles).

•

Dim

Screen

(adjusts

screen

brightness).

Soft-tone

fluorescent

tube

display

(FTDI

The

multifunction

FTD

supplies

complete

and

continuously

up-dated

information

on

the

player

status.

1.

Disc

playing

2.

Track

3.

Minutes

and

seconds.

4.

Type

of

disc:

Compact

Disc

Interactive,

Compact

Disc

Digital

Audio,

Compact

Disc

Digital

Audio

with

Graphics

5.

Time

indicators:

show

that

the

time

displayed

is

Track

Time,

Total

Time,

Remaining

Track

Time,

or

Remain.

6.

Scan

active

7.

Repeat

active

CD-I

start-up

screen:

•

Start

CD-I

(starts

CD-I

application).

8.

Shuffle

active

or

Photo-CO

9.

FTS

active

10.

Mute·

11.

Pause

active

CD-Digital

Audio

screen:

12.

Remote

activity

indicator

•

While

Playing

:

Play,

Stop

and

Pause.

'depending

on

version

•

Play

Modes:

Scan,

Shuffle,

Repeat

and

FTS.

•

Control:

Fast

Forward,

Fast

Rewind,

(directly

selectable),

(directly

selectable).

Program

(programming

of

selected

tracks

in

any

order),

Save

(stores

your

favorite

track

programme

and

allows

manual

input

of

titles

discs

or

FTS

programs).

Input

Port

Signal

Function

1/0

1

NC

Not

connected

z

RXD

Received

Data

I

3

TX

•

Transmitted

Data

0

4

DTR

Data

Terminal

Ready

0

5

GND

Signal

Ground

6

CTS

Clear

to

Send

I

7

ATS

Request

to

Send

D

8

+5V

Power

supply

to

device

AN

Connections

CVBS

output

lcinch)

Audio

output

12

x

cinch}

Remote

in

(cinch).

Antenna

input:

1

Vpp

into

75

Ohm

2

Vrms

into

75

Ohm

Z

Vpp

at

2.2

kOhm

75

Ohm'

RF

output:

75

Ohm'

Headphone

(6.3

mm

socket}

8

Ohm

Z

kOhm

V/C

IS-Video)

Connector

Function

1

Ground

Y

2

Ground

C

3 y

4 C

Euroconnector

•

Function

1

Audio

R

(analogue)

2

NC

3

4

5

6

Audio

L

(analogue)

Audio

ground

Blue

ground

NC

7

Blue

8

Slow

switching

(0

=

TV,

1=

Euroconnector)

9

Green

ground

10

NC

11

12

13

14

15

16

17

18

19

20

21

Green

NC

Red

ground

NC

Red

Fast

switching

(RGB/CVBS)

CVBS

ground

Fast

switching

ground

CVBS/RGB

sync

NC

Shield

'depending

on

version

PCS

66 313

3.1

SAFETY INSTRUCTIONS

-Safety regulations demand that the set be restored

to

its original condition and that

components

identical

with the original types be used.

Safety components are marked by the symbol A.

-

ESD

JA

~

All IC's and many

other

semi-conductors are

susceptible

to

electrostatic discharges (ESD).

Careless handling during repair can reduce life

drastically.

When repairing, make sure that you are connected

with the same potential as the

mass

of

the set via a

wrist wrap with resistance.

Keep components and tools also at this potential.

For detailed information see "Handling ESD-sensitive

components".

- A set to be repaired should always be connected to

the mains via a suitable isolating transformer.

-never replace any modules

or

any

other

parts while

the set

is

switched on.

-Use plastic instead

of

metal alignment tools. This

in

order

to

prelude short-circuit

or

to prevent a specific

circuit form being rendered unstable.

3.2 SERVICING OF SMDs (Surface Mounted Devices)

3.2.1 General cautions

on

handling and storage

a.

Oxidation on the

SMDs

terminals results in

poor

soldering. Do not handle SMDs with bare hand.

b.

Avoid for storage places that are sensitive to

oxidation such as places with

sulfur

or

chlorine gas,

direct sunlight, high temperatures

or

a high degree

of

humidity.

As a result the capacitance

or

resistance value

of

the

SMDs may be affected.

c.

Rough handling

of

circuit boards containing SMDs

may cause damage

to

the

components

as well as the

circuit boards. Circuit boards containing

SMDs

should

never be bent

or

flexed. Different circuit board

materials expand and contract

at

different rates when

heated

or

cooled and the

components

and/or

solder

connections may be damaged due to the stress.

Never rub or scrape chip

components

as this may

cause the value

of

the

component

to

change. Similary,

do not slide the circuit board

across

any surface.

3.2.2 Removal of SMDs

a.

Heat the solder (for 2-3 seconds)

at

each terminal

of

the chip. Small components can, by means

of

litz wire

and a limited horizontal force, be removed with the

soldering iron. They can also be removed with a

solder sucker (see Fig. 1

a)

or

b.

While holding the SMD with a pair

of

tweezers take it

off gently using th soldering

iron's

heat applied to

each terminal (see Fig. 1b).

c.

Remove the excess solder on the solder lands by

means

of

litz wire

or

a solder

sucker

(see Fig. 1

c).

3.2.2.1 Caution

on

removal:

a.

When handling the soldering iron, use suitable

pressure and be careful.

b.

When removing the chip,

do

not

use undue force with

the pair

of

tweezers.

c.

The soldering iron to be used (approx. 30

W),

must

preferably

be

provided with a thermal control

(soldering temperature about 225

to

250°C).

d The chip, once removed,

must

never be used again.

PCS 61850

DlSMOIJNTING

HEATING

>,l

OR

A

a

HEATING

',.,

SOLrJf.RlNG

moN

\ \

SOil..DER

WlCKa;.t-n..

"~\

CLEANING

µ C

Fig. 1

3.2.3 Attachment of SMDs

43

161

A.11

a.

Locate the SMD on the

solder

lands by means

of

tweezers and

solder

the

component

at one side.

Ensure

that

the

component

is positioned well on the

solder lands (see Fig. 2a).

b.

Next complete te soldering

of

the terminals

of

the

component (see Fig. 2b).

MOUl'ITII\IG

Fig. 2

"t.,_OfRlt•H3

,,.,.,..!RON

3.2.3.1 Caution

on

attachment:

Fig. 3

a.

When soldering the SMD terminals,

do

not

touch them

directly with the soldering iron. The soldering

must

be

as quick as possible; care

must

be taken

to

avoid

damage to the terminals and the body itself.

b. Keep the

SMD's

body in

contact

with the printed

board when soldering.

c.

The soldering iron

to

be used (approx. 30

W)

must

preferably be provided

with

a thermal

control

(soldering temperature

about

225 to 250°C).

d. Soldering should

not

be

done

outside the solder land.

e. Soldering flux (of rosin) may be used but should

not

be acidic.

f. After soldering, let the SMD cool

down

gradually at

room temperature.

g. The quantity

of

solder

must

be proportional with the

size

of

the solder land. If the quantity is

too

great, the

SMD might crack

or

the

solder

lands might be torn

loose from the printed board (see Fig. 3).

TOOLS

TO

BE

USED

ANTISTATIC

MAT

MAGNIFYING

GLASS

CUTTING

THE

LEADS

HAIR ORYER

-------•···•··•"--

METAL

BRUSH

DISMOUNTING

CLEANING

THE

TRACKS

WRONG

TRACKSWlLL

BE

DA.MAGED

ALIGNING THE LEADS

RIGHT WRONG WRONG

4822 390 50025 W

~FLUX

BRUSH ' ,,,,;, 4822

321

40042

OESOLDEA BRAIO

SOLDERING

IRON

WELLER TCP

50

00,S-0,8 MM

FIXING

IC

AT

THE CORNERS

RIGHT

MOUNTING

DRYING

SOLDER TIP

WELLER PT-CC7

4822 310 50081

,,

"''""'

:::

KNIFE

APPLYING

FLUX

SOLDERING

WRONG WRONG

3.3 HANDLING ESD-SENSITIVE COMPONENTS

3.3.1 Personal safety

The testing, handling and replacing

of

ESD-sensitve

components requires special attention

for

personal

safety. A person dealing with ESD-sensitive

components should, normally speaking. be connected

via a resistance to the same potential as the chassis

of

the set to protect him against direct contact with

the supply voltage.

This resistance is often applied

in

the connection lead

of

wrist wraps. If necessary, make use

of

an isolating

transformer.

3.3.2 Storage and transport

Transport and store the circuits and PCBs

in

their

original packages.

As

an

alternative to the original package one may use

a conductive material

or

special

IC

package which

short-circuits all the pins

of

the

component

with one

another. ·

Always discharge the package before opening

it

3.3.3 Testing or handling

Work on a conductive surface when testing loose

circuits and components

or

when transferring

components and circuits from one package

to

another.

Use a conductive

wrist

wrap

with lead

to

make an

electrical connection between the conductive surface

and yourself via a resistance

in

the connection lead

of

the wrist wrap.

Connect equipment and tools also with this conductive

surface.

Do not connect any signals to inputs as long

as

the

power supply

of

the set to be tested is off.

All the inputs that are not used should

be

connected

either to ground or to the supply voltage. When

testing, do not use any freon sprays

for

under-cooling

of

sensitive components.

3.3.4 Mounting ESD-sensitive components

Mount ESD-sensitive components only

after

all

other

components have been mounted.

Make sure that the components themselves, the metal

parts

of

the PCB, mounting equipment and mounting

operator are at the same potential level as the chassis

of the set.

If it is impossible to ground the PCB, the mounting

operator should pick the PCB up before bringing it

into contact with the components

to

be replaced.

Conductive sheet

Soldering iron

Bit

3.3.5 Soldering

Soldering iron tips, also

those

of

low-voltage soldering

stations, should be

kept

at

the same potential

as

the

components

and the PCB.

It is

better

to

use solder-removing braid than solder

suckers.

3.3.6 Electrostatic charges

One should stick to the precautionary measures also

after the ESD-sensitive

components

have been

mounted on the PCB. Until the sub-PCBs have been

incorporated into a complete system on which the

correct

supply voltages are connected, the PCB is

nothing more than an extension

of

the

conductors

of

the

components

on this PCB. To prevent electrostatic

discharges from passing to the

components

via the

terminals, we recommend

that

you apply conductive

clips

or

conductive tape on the terminals

of

the PCB.

3.3.7 Transients (switch-on phenomena)

To prevent permanent

damages

as a

result

of

switch-on phenomena, no ESD-sensitive components,

or

PCBs populated with these components, should be

inserted

in

or

removed

from

test-sockets

or

systems

with the supply voltage on.

Prevent switching

peeks

on the mains as a

consequence

of

switching electric equipment, relay

and DC lines on and off.

3.3.8 Working environment

The

work

bench

for

the service technician should look

like the one shown

in

the figure.

3.3.9 Replacement of the Flat Pack IC's

For replacing a

component

see Fig. 6 Dismounting

and Mounting. Also a

number

of

precautions and

examples is given.

When replacing a flat pack, rosin flux applied to the

device leads will ensure a

good

soldered joint.

Since rosin flux, when

not

properly heated by the

soldering process, is sticky, it will attract

dust

which

will result

in

component

degeneration

over

a period

of

time.

The removal

of

excess flux with a cleaner will not

solve this problem because the flux

is

then even

spread

over

a greater area by the cleaner. Drying

of

the flux can be accomplished by blowing the area with

a

common

hair dryer

for

1

or

2 minutes

at

a distance'

of

approx. 1

O

centimeters.

I•

Safety isolating transformer

Plug/socket

Wrist wrap

Special attention should be paid

in

regions having a

dry atmosphere and when the floor is covered with a

nylon carpet or such.

3.4 CODENUMBERS FOR STANDARDIZED RESISTORS

Unless otherwise specified, all defective resistors

in

the

circuits

of

the set can be replaced

by

standardizes types,

mentioned

in

this chapter.

VR25, VR37 high-ohmic/high -voltage resistors

type

Dmax

L1

max

L2

max

d

VR25 2.5 6.5 7,5 0,6

type

Dmax:

Li

max

L2max

d

VR37 I 3.7 I

9.0

100

I 0.7

Range VR25 : 100

KQ

to

22

MQ

Range VR37 : 100 KQ

to

33

MQ

Composition of the service number

for

the VR25 and VR37

Main subgroup: 4822 053 20

...

and 4822 053

21

...

The codenumber above is completed by inserting the

first two figures (resistance code) followed by the

multipHer.

4 for R = 100K to 910

Kn

5forR=

1M

to9.1

MQ

6 for R =or > 10M

Example's:

The serv.nbr. for a VR25 resistor

of

100

Kn

is

4822 053 20104

The serv.nbr. for a VR37 resistor

of

33

MQ

is 4822 053 21336

PR01, PR02 and PR03 power metal film resistors

itiDmaK

L1

L2ma:a.

-,,d

2.5 6.5 8,0 0.6

K I

L2-

fl •

¢-Dm.ax

L1

max

L2max

-¢d

3.9 10

11

0.8

tJ!Dmax

L

lmax

L2m.ax ¢

5.2 16.7 17.9 0,8

1•-u7

l

==~1~

7:JE)::::t==l==

~L2-l

01

0

t0d

Rated dissipation at T(amb) = 70 degrees :

PR01

= 1 Watt, PR02 = 2 Watt, PR03 = 3Watt

Composition of the service number

for

the PR01, PR02

and PR03

Main subgroup: 4822 053 10

...

; 4822 053

11

...

and 4822

053 12

...

The codenumber above is completed by inserting the

first

two

figures (resistance code)followed

by

the

multiplier.

8

for

R= 1 to 9,1 n

9

for

R= 10 to

91

n

1forR=

100

to910n

2 for R= 1

to

9,1

KU

3

for

R= 10 to

91

KU

4

for

R= 100 to 910

Kn

5

for

R=

or

> 1

Mn

Example:

The serv.nbr.

of

a

PR01

resistor

of

47 U

is: 4822 053 10479

The serv.nbr.

of

a PR03 resistor

of

1

Mn

is: 4822 053 12105

NFR25 fusible resistors A

L-

Ln,a,x

2.5

6.s

I

o.6

..;1

00

Composition

of

the service number

for

the NFR25

Main subgroup: 4822 052 10

...

The codenumber above is completed by inserting the

first

two

figures (resistance code)followed by the

multiplier.

8

for

R=

9

for

R=

1

for

R=

2

for

R=

3

tor

R=

Example:

1

to9,1

u

10

to91

u

100 to 910 n

1

to9,1Kn

10to91Kn

The service number

of

a resistor

of

47 U

is: 4822 052 10479

NFR25H fusible resistors A

2,5 6,5 0,6

..;

1

Composition of the service number

tor

the NFR25H

Main subgroup: 4822 052

11

...

The codenumber above is completed by inserting the

first

two

figures (resistance code)followed by the

multiplier.

8 for

R=

9 for

R=

1 for R=

2 for R=

3 for R=

Example:

1

to

9,1

n

10

to

91

u

100

to910n

1

to9,1Kn

10

to

91

Kn

The service number

of

a resistor

of

47 n

is:

4822 052 11479

RC-01, RC-11 AND

RC-21

chip resistors

I

1.25

.±.

0.15

>-----

3.2~~-.~~------

All

dimensions

in

mm

I

>-----

20!.015

-~-1

/

>-----

L6±o.,o--~

Absolute max. dissipation :

protect1;,e

c-o.i,t

A•)=

0.25:!0.15forstyle1

or

0.40

:!:

0.20 for style 2

RC-01

: 0,25

W,

RC-11 : 0,10

W,

RC-21 :0,062

W.

Range:

RC-01

0 Q TO 10 MQ

RC-11

0 Q TO 10 MQ

RC-21

0 Q TO 6,8 MQ

Composition

of

the service number

for

the RC-01,RC-11

and RC-21

Main subgroup: 4822

051

10

...

, 4822

051

20

..

and

4822

051

30

...

The codenumber above is completed by inserting the

first

two

figures (resistance code) followed by the

multiplier.

8 for

R=

9 for

R=

1 for

R=

2 for

R=

3 for

R=

4 for

R=

5 for

R=

6 for

R=

or>

Example's:

o

to9.1

n

10 to

91

n

1

oo

to

91

on

1

to9.1

Kn

10 to

91

Kn

100 to 910

KQ

1

to9.1

MQ

10

Mn

The serv.nbr. for a

RC-01

resistor

of

on

is

4822

051

10008

The serv.nbr. for a RC-11 resistor of

on

is

4822

051

20008

The serv.nbr. for a RC-21 resistor

of

o n is 4822

051

30008

The serv.nbr. for a RC-01 resistor

of

10 n is 4822

051

101

09

The serv.nbr. for a RC-11 resistor

of

10 n is 4822

051

20109

The serv.nbr. for a RC-21 resistor

of

10 n is 4822

051

30109

MRS16T metal film resistors with low-inductance

.~u-1

~Od

D

'

'~L2-

0D

L2

ma,:,;.

3,7

0,5

-0,04

Composition of the service number for the MRS16T

Main subgroup: 4822 050 1....

The codenumber above

is

completed by inserting the

first three figures (resistance code)followed by the

multiplier.

8 for R= 4,99 to 9,76 n

9 for

R=

10 to 97,6 u

1 for

R=

100 to 976 u

2 for R= 1 to 9,76 KQ

3 for R= 10 to 97,6

Kn

4 for R= 100 to 976

Kn

5 for R=

or>

1

Mn

Example:

The service number of a resistor

of

487 n is:

4822 050 14871

MRS25 metal film resistors (0,5%)

D

L1

L2

max

2.5

6.5 7,0 0.6 ± 0,03

Composition

of

the service number for the MRS25

Main subgroup: 4822 050 2....

The codenumber above is completed by inserting the

first three figures (resistance code)followed by the

multiplier.

8

for

R= 1 to 9,76 n

9 for R= 10 to 97,6 n

1 for R= 100 to 976 n

2 for R= 1 to 9,76 Kn.

3 for R= 10 to 97,6

Kn

4 for R= 100 to 976

Kn

5 for R= 1 to 9,76

Mn

6 for

R=

or

> 1o

Mn

Example:

The service number of a resistor of 976 n is:

4822 050 29761

PCS 61851

3.5 SERVICE TOOLS

3.5.1 Service

PCB

3.5.1.1

Circuit diagram

!ii!

~

l

1002

H

l

1201

E

5

l!ll

:l

JOll

G

2

3014

H 2

im

ii 1m[i

3011

D8 6

00

4

G

6

6001

E

1

60

01

F

1

6

00

8 E l Sl

1000

D 4 Sl

1001

I 2 Sl

100

2 I 6 Sl

U !l

G 8 Sl

F

8

Sl

n

D

8

C

8

,-------------------------1

+s

v

1

PCS

61852

SERVICE

PCB

CIRCUIT

DIAGRAM

2002

2001

,t.

I

56n

I

33u

/

16V

I

~

~-

___

__

+_sv_ 8 Sl

+SV

+5

V

~

"'~

0

~

~~

RESET

IRQ

2006

)

lu/16V I NC

VPP

11

PAO

6008

PA

!

BZX55C

4

V9

PA2

PA)

PA4

+5V

PA5

PA6

PAJ

TE

ST

~

"'

.r-<:

~

oo

PBO

+5V

PB!

PB2

"'

YES

~

PBS

.r-<:

~

01

PB6

+

SV

PBJ

"'

NO

~

.r-<:

~

02

NC NC NC

MSH

l~~lA

D!Sl

8 9

10

+SV

7000

40

680

5

C4

VDD

DSC!

OSC2

P

Dl

TOO

/

PD6

SS

/

PD5

SCK

/

PD4

i,()SJ

/ P

D)

HI

SO

/

PD2

TOO

/

PD

!

ROI

/

PD

O

PCO

PC!

PC2

PC)

PC

4

PCS

PC6

PC

J

VS

S

TCAP

20

NC

11

12

BBBB

l 2 3

4

6

J

+SV

DEi

CLK

DAT

A.

39

38

36

35

NC

2003

34 NC

41p

I

JJ

NC

32

NC

JI

NC

JO

NC

29

)J

NC

+5V

"'

~

CERA.~

.

RESON

A

TO

R

+5V

+sv

+5V

+

SV

~!:!

~

"'

0

~~

NC

Nc

8

J

0

jj

02

A

om

B

910

t

5V

NC NC

11

12

BBBB

l 2 l 4 6 7

+sv

D

E2

CLK

D

ATA

I

RTS

IJ Sl

+5V

I

·U

..

,

J-

5S

1

NC

~

4 Sl

I

RXD

2S1

TXD

l

Sl

I

NC L

l Sl

L

_________________________

_l

3.5.1

.2 Layout

3.5.1.3 Parts list

ITEM

1000

1001

1002

1201

2001

2002

2003

2004

2005

2006

3001

3002

3003

3004

3005

3006

3007

3008

3009

G4

LJ

G3

OBb

D004 I

coos

I

ROOS

I

I D007

~

'" I R001 I

I

R006

I

rn

n

;,

l

D001

11

ROOS

I

10

01

~

1002

c:,

a:

L... L...

I

R012

I

~~

~

g

I

ROH

I

.JDDi

ii

R007 I I

R009

I

-,

co

04

c::::::::J

I R010 I

I

R003

I

CE:SCJ

201

I~

~~~l

1000

B b

D008

I

iswoo

I

~~~

lswo2 1

l

swo

1

I

YES

TEST

NO

G1

G2

DE

SC

RIPTION CODENUMBER ITEM DESCRIPTION CODENUMBER

Tact

switch

4822 276 10974 3010 22

KQ

Tact

switch

4822 276 10974

3011

22

KQ

Tact

switch

4822 276 10974 3012 22

KQ

3013 22

KQ

Ceram.

resonator

4822 242 72527 3014 22

KQ

3015 22

KQ

33

IF

/16V 4822 124 20688 3016 22

KQ

56 nF 4822

121

41154 3017 100 Q

47

pF 4822

122

31072

47

pF 4822

122

31072

6001

1N4148 4822 130 30621

100 IF/25V 4822 124 20701 6002 BC558B 4822

130

44197

1

IF

/63V 4822 124 20722 6003 BC548B 4822

130

40937

6004 1N1448 4822 130 30621

4,7 Q See standardized

list

6005

BZX55

C4V7 4822 130 34174

22

KQ

chapter

3.4 6006 BAT85 4822 130 31983

220

KQ

6007 1N1448 4822

130

30621

10

KQ

100 Q 7000 MC68HC705C4 4822 900 10272

22

KQ

7001

MSM

4202A

4822

130

90474

4,7

KQ

7002

MSM

4202A

4822

130

90474

10

KQ

22

KQ

S1

miniDIN

Spins 4822 267 31289

3.5.2 Test discs

CODE-

NUMBER

4822 397 30096

4822 397 30155

4822 397 30184

4822

701

11922

4822

701

11923

NAME/

DESCRIPTION

Testdisc 5

(music)

Testdisc 5A

(music+

dropouts

and fingerprints)

test disc

with

1

KHz

continous

signal, 70 minutes.

Audio

signals

Skew

disc 0,6

Excentricity disc

150

I

3.5.3 Extension connectors

CODE-

NUMBER

NAME/

DESCRIPTION

4822

321

22267

10

poles ext.

4822

321

22268 6 poles ext.

3.5.4 Measurement equipment

Electronic Digital

Multimeter

Digital oscilloscope

Analog oscilloscope

Timer/counter

3.5.5 Pointing devices

CODE-

NUMBER

NAME/

DESCRIPTION

4822

218

10401

RV6701

/00

4822

218

10438 RV6703/00

4822

691

30244

22EA9011

/00

3.5.6

(de)Mounting

tool

APPLICATION

Reference disc

for

playability and

adjustments

of

CDM

life test in case

of

intermittent

faults

Measure specs.

Reference disc

for

playability

Reference disc

for

playability

APPLICATION

For measuring

Encoder panel

For measuring

APU panel

APPLICATION

Remotecntrl.

/05

Remotecntrl. /00

Mouse

Torx

screw

drivers 4822 395

50145

3.6 THE

MMC

CENTRAL

REPAIR

PROCEDURE

In

case

of

a

defect

on the

MMC

part, the complete panel

must

be sent back

to

PCS

for

repair.

Below

a

brief

description is given, a more detailed proce-

dure is available at

P.C.S

Logistics Management, systems

and Procedure Office.

CODENUMBER

MMC:

Version

/00,/05

/11

/17P

/17T

Codenumber

4822

214

51981

4822

214

51979

4822

214

51933

4822

214

51938

NSO

or

Customer: send telex

or

on-line MSH system

info to

PCS

customer

relations

officer

with

indicated

number(s) and service

12NC

for

a repair reference num-

ber.

PCS:

send telex or MSH

info

with

repair reference num-

ber and return invoice price. Also the same number(s)

of

new/repaired

items are sent

with

invoice.

NSO or customer: send defective item(s)

to

PCS

at

SDM1

by

standard address label

with

repair reference

number

and return invoice

to

PCS

-price center.

Remark: the difference

between

the invoice price and

return invoice price gives the 'repair price'

for

the NSO

PCS:

send defective item

to

factory

and stock.

Experience has learned

that

the status

of

the particular

products and packaging needs

your

local attention.

Products

will

be returned in case

of

unacceptable condi-

tions.

REPAIR

PROCEDURE CONDITIONS :

HANDLE WITH

CARE

IN

AN

ESD

PROTETECTED

ENVIRONMENT.

Defective

items

must

be sent back

to

PHILPS

CON-

SUMER

SERVICE

for

repair

forwarded

by

Address

sticker.

Put the address sticker

properly

on a free area

of

the

box.

Boards

must

not

be reworked

or

damaged.

Re-use original package

order

new

package in case

of

damages.

Remove additional stickers and labeling

if

re-using the

original box.

Service

codenumber

on sticker

must

be equal to code-

number

on

repairable item.

!!!

If

the above conditions are

not

fulfilled, hen boards

are not accepted and the return price

will

not

be

credited !!!

4

MECHANICAL

DRAWINGS

AND

PARTS

LIST

4.1

DEMOUNTING

INSTRUCTIONS

OF CABINET

NOTE:

Numbers

in

parenthesis()

refer to the

Exploded

View

reference

numbers.

4.1.1

Top Cover Removal {216}

Remove the

four

Top Cover

screws

on

both

sides

of

the

LIil

it.

4.1.2 Front Assembly Removal (202}

Remove the Top Cover, refer

to

section

4.1.1.

Remove the COM Tray Front

assembly

(203) by

opening

the COM

Drawer

anci

lifting

the CDM Tray

Front

Assembly

up. Remove the three

front

screws

on

the

top

of

the

Front

Assembly

anci

the three

front

screws

on the

bottom

of

the

front

assembly. Remove the

two

top

front

frame

corner

screws

located

directly

behind

the

FrontAssembly

tpo

corner

screws.

Note:

By removing

the

two

top

front

frame

corner

screws,

the

two

bottom

Front

assembly

clips

will

disen-

gage from

the

bottom

of

the

Front Frame Bracket (502}

Carefully angle the the

top

of

the Front

Assembly

and

slide

the Front

Assembly

Cover

off

of

the unit.

Remove

the

two

screws

of

the the

HP

Panel (1007)

mounting

bracket. Dis-

connect

the

two

connectors

on the Display panel (1005).

Note:

Connectors are removed from

connector

sockets

by

releasing

the

socket

connector

clips.

Remove the Power

Switch

Connector

Shaft

(522) by

pulling

it

forward

out

of

Front Frame Bracket (502).

4.1.3 Display Panel Removal (1005}

Remove the Top Cover, refer

to

section

4.1.1.

Remove the Front

Assembly,

refer

to

section

4.1.2.

Remove the seven

screws

attaching

the

Display

Panel

to

tile

Front

Assembly

(202)

4.1.4 Power

Supply

Panel Removal (1006)

Remove the Top Cover, refer

to

section

4.1.1.

Remove the Rear Textplate (513)

by

removing

the

four

screws. Remove the

two

Power

Supply

mounting

screws

on the Rear Frame Bracket (514).

Remove the

two

Power

Supply

mounting

screws

on the

Riyht

Frame Bracket

(518).

Note.

The

two

Power

Supply

screws secured

to

the

Right Frame Bracket

ate

mounted

to

a heatsink on

the

Power

Supply

Panel. Be careful!

not

to

damage

the

Power Supply Panel

when

disassembling

&r

assembling.

Remove the Power

Supply

mounting

screw

located

on

the

top

front

of

the Power

Supply

Brncket (517).

Remove

the

power

switch

connecting

cable

from

the Cord

Clamps

(504,

508).

Lift

the

front

of

the

Power

Supply

Panel

up

two

inches

and

remove

the

two

connectors.

Slide

the

power

Supply

Panel

out

toward

the

front

of

the unit.

Disconnect

the

remaining

connector.

4.1.5 APU panel & Encoder Panel (1002, 1003).

Remove the Top Cover, refer

to

section

4.1.1.

Note:

The

APU Panel and Encoder Panel are

attached

to

the

CD Panel (1004)

by

two

PCB connectors for each

Panel. Both panels are also secured

in

place

by

guides

that

protude from

both

the

Left

Frame Bracket (506).

Remove all

wire

connectors

attached

to

the Panels and

carefully

lift each panel

up

out

of

the

PCB

connectors.

4.1.6 COM Loader Assembly Removal (212)

Note:

The

laser diode

is

extremely

sensitive

to

static

electricity.

Before Removing the COM Loader Assembly, properly

ground yourself using a

Wrist

Grounding Strap.

Remove the Top Cover,

refe1

to

section

4.ll

Remove the Front

Assembly,

refer

to

section 4.1.2.

Oµen the CDM

Drawer

and

rernove the

two

front

mounting

screws.

Remove

the

rear

mounting

screw. Lift the

front

of

the CDM

Loader

Assembly

one inch

and

locate the CDM

flat

cable and

flat

cable

socket.

Lift

the

top

of

the

socket

to

release the cable, pull the cable

up

from

the

connector

and

immediately

attach

a

paper

clip

to

the

bare

ends

of

the

flat

cable.

This

procedure

will

insure against static

electicity

damage.

Remove

the

two

remaining

connectors.

Note:

The

following

numbers

in parenthesis

()

refer

to

the

reference

numbers

of

the

Loader Exploded

View.

4.1.7 COM

Loader

Disassembly.

Refer

to

detail

1

of

the

Loader

Exploded

View.

Note:

The

laser

diode

is

extremely

sensitive

to

static

electricity.

Before removing

the

COM, properly ground yourself

using a

Wrist

Grounding Strap.

4.1.7.1

Tray Removal.

Refer

to

Detail 2 on the

Loader

Exploded

View.

Remove the Top Cover, refer

to

section

4.1.2

Remove

the

Front

Assembly,

refer

to

section

4.1.6

Position the COM

Loader

Assembly

(1)

upside

down

with

the

front

of

the Tray

(2)

facing

you.

Pull the Tray

(2)

out

of

its full

extension.

Locate the

Cover

(4)

and

the tab

protruding

from

the CDM

Loader

Assembly

(1). Carefully press the Cover

(4)

down

so

that

the lip

on

the Cover slides

beneath

the

tab

protrud-

ing

from

the

Chassis

Assembly.

Slide the

Cover

(4)

away

from

the tab.

Position the COM

Loader

Chassis

Assembly

face up

with

the

front

of

the

Tray

(2)

facing

you. Locate the clip

and

tab

on the COM

Loader

Chassis

Assembly

(1).

With

a

small

flat

screwdriver,

gently

press the clip

away

frorn the tab pro-

truding

from

the COM

Loader

Tray (2). Pull the Tray (2f

out

of

the CDM

Loader

Chassis

Assembly.

4.1.7.2

CDM

Assembly

Removal (20)

Remove

the

Top Cover, refer

to

section

4.1.1

Remove the

Front

Assembly,

refer

to

section

4.1.2

Remove the COM Loader

Assembly,

refer

to

section

4.1.6

Remove the Tray,

refer

to

section 4.1.7.1

Position

the

COM

Loader

Chassis

Assembly

(1)

with

the

Motor

Assembly

(11)

facing

away

from

you.

Note:

The

COM

Assembly (20)

is

positioned

within

the

COM Loader Assembly (1) on slide tracks.

Pull the COM

Assembly

(20)

toward

you until it reaches its

slide stops.

Gently

lift the CDM

Assembly

until

the slide tab

1s

out

of

the

slide

and

pull the CDM

Assembly

out.

4.1.8

EXPLODED

VIEW

OF

THE

CABINET

BOTTOMPLATE

COVER

CD

9

SCREWS

05

SCRcWS

--I Ij

CDM9

TEXTPLATE

LOADER

G)

3

SCREWS

03

SCREW

PO

WERSUPPL

Y

PLATE

06

SCREWS

~

FROf\T

SUPP·O~T

'v1MC

(:)

3

SCREWS

BRACKET

fOANEL

0I

SCREW

03

SCR[WS

I I

APU

ENCODER

PANEL

I

CD

::i

ANC::L

03

SCREWS

HEADPHONE

DISF'l_AY

PANEL

PMff_

~)

2

SCREWS

@6

SCREWS

~--202

209-~

--

534

PCS

66

314

I

TRAY

LOADING

GUIDING

L

GUIDING

R

PR

I

NT

BR

AC

KET

EXPENS

ON

02

SCREWS

i

I

I -

-

I

J

l.

rr

~-=-

I

LJ____

~~

'--..____

I

PANEL

~----

21:l

~-----

208

@

BU-

7

/BL-I0

ENCODC::R

PANEL

1003

~:i:l1

509

COVER

GUIDING

L

.._____

528

POWER

SUPPLY

1006

BU-I

HAS.CDl220/00

4.1.8.1

PARTS

LIST

OF

CABINET

Item

Code

Codenummer

201

4822

410

62316

POWER

KNOB

202

4822

444

40608

FRONT

ASSY

203

4822

444

40607

TRAYFRONT

208

4822

413

51434

VOLUME

KNOB

214

4822

462

41971

FOOT

216

4822

443

63757

COVERASSY

219

4822

462

40683

PLATE

FOR

FOOT

4822

321

10844

MAINS

CORSET

/00

RC

4822

218

10401

REMOTE

CONTROL

FOR

/05

RC

4822

218

10438

REMOTE

CONTROL

FOR

/00

SK1

4822

276

11309

MAINS

POWER

SWITCH

BU-2

4822

267

31289

PORT2

SOCKET

BU-6

4822

267

40857

MINIDIN

VIDEO

SOCKET

BU-7/BU-10

4822

267

20414

4P

CINCH

SOCKET

BU-11

4822

267

31289

PORT1

SOCKET

BU-12

4822

267

30743

HEADPHONE

SOCKET

1007

4822

214

51994

FMV

EXPANSION

INTERFACE-PANEL

4822

736

21575

DIRECTION

FOR

USE

POINTINGDEVICES;

4822

691

30293

ROLLER

CONTROLLER

4822

691

30297

BLACK

MOUSE

4822

691

30298

TRACKER

BALL

4822

691

30299

JOY

STICK

4.2

EXPLODED

VIEW

OF

LOADER

501

506

502

2

Detail

1

106

-------+------------~-

109

-------+---------------

M2

x

4

107

B

108

-------+-----fd'l

B

503

504

0

+

r------------------------------~

I

• I

I

----

101

•_

____,_

__

~

103

~f-----------+-----

509

I

~------------------------~~----~

-~----------------

111

104

Detail

2

1

4.2.1

Parts

list

of

LOADER

103

106

104

506

507

102

512

108

107

109

101

4822

466

93065

4822

276

13222

482236121492

4822

528

81465

4822

528

81464

4822

358

31168

4822

466

62109

4822

462

41902

4822

325

80491

4822

325

60379

4822

325

60379

4822

691

30277

SUSPENSION

SWITCH

ASSY

MOTOR

ASSY

PULLEY

DRIVE

PULLEY

DRIVE

BELT

TRANSPORT

PROTECTION

ORNAMENTAL

TULE

DAMPING

GROMMET

DAMPING

GROMMET

CDM9

ON

MOUNT.CHASSY

PCS

66

315

5

SERVICE

SOFTWARE

5.1

THE

LOW

LEVEL

MMC

TEST

Scope

This

test

is

standard

implemented

in

the

boot

software

of

CD-RTOS.

It

doesn't

need

a

lot

of

hardware

to

run.

When

debugging

or

servicing

an

MMC

panel

this

test

is

very

use-

ful.

General

This

test

is

developed

for

service

and

low

level

hardware

debugging

purposes

only.

It

is

meant

to

be

used

with

the

service

pcb

as

described

in

TOOLS

(please

refer

to

section

3.5

SERVICE

TOOLS).

The

test

executed

with

the

service

pcb

is

called

the

"pcb

low

level

test".

The

test

executed

with

the

VT100

terminal

is

called

the

"terminal

low

level

test".

Since

this

service

pcb

display

has

just

8

digits,

only

the

most

important

information

will

be

displayed

to

the

user.

For

the

VT100

terminal

this

is

never

a

problem.

This

test

consists

out

of

the

following

items:

a.

Display

header

and

release

number.

b.

VSC

c.

ROM

d.

NVRAM

e.

DRAM

f.

CDIC

g.

SLAVE

processor

(68HC05)

5.1.1

Tools

In

this

test

the

service

pcb

acts

as

some

kind

of

a

'micro

terminal'.

This

means

that

the

service

pcb

is

able

to

display

some

alphabetical

and

numerical

characters.

Some

charac-

ters

because

it

uses

7-segment

displays

The

three

keys

available

are:

TEST

;

test

all

display

!eds.

Yes

;

Send

an

ASCII

'Y'.

No

;

Send

an

ASCII

'N'.

The

communication

parameters

are

fixed

at:

9600

baud

8

data

bits

1

stopbit

no

parity

The

microcontroller

is

programmed

with

software

available

at

IMS

CDI

software

group.

The

circuit

diagram

is

on

section

3.5.1.1

5.1.2

Testsquence

Table

1

below

shows

all

the

steps

of

the

testprogram

and

what

kind

of

tests

are

performed.

STEP

ACTION/TEST

PERFORMED

00

VSC

master/slave

init

01

ROM

05

NVRAM

06

DRAM

BANKO

&

BANK1

07

DRAM

BANKO

08

DRAM

BANK1

09

CDIC

10

SLAVE

11

CLOCK

CALIBRATION

Table

1:

teststeps

low

level

test

5.1.3

Low

level

test

implementation

The

low

level

test

(short:

lltest)

is

implemented

in

the

boot

part

of

the

CD-RTOS

software.

The

whole

test

occupies

about

10k

of

ROM

memory

and

is

written

in

assembler.

PCS

61856

The

test

runs

without

the

use

of

any

external

RAM.

It

only

uses

internal

CPU

registers.

As

communication

channel

the

68070's

UART

is

used.

Before

starting

the

normal

player

boot

the

following

sequence

is

executed:

1.

Initialize

the

68070's

UART

:

9600

baud

1

startbit

8

databits

1

stopbit

no

parity

no

handshake

1

2.

Clear

the

RXD

buffer.

3.

Wait

5

ms.

4.

Read

the

RXD

buffer.

5.

If

the

character

received

was

an

ACK

($06)

the

start

the

pcb

lltest

The

UART

is

connected

to

1/0

port

2

5.1.4

How

to

start

up

the

low

level

test

With

service

pcb

To

startup

the

pcb

low

level

testsoftware

the

should

be

followed:

-

Switch

off

the

player.

-

Connect

service

pcb

to

port

2

at

the

rear

of

the

player.

-

Switch

on

the

player.

-

The

service

pcb

display

should

now

show

'COi

RLxx'.

(with

xx

the

release

number)

-

The

pcb

lltest

is

now

ready

to

go.

With

VT100

terminal

To

startup

the

terminal

low

level

testsoftware

one

should

follow

the

-

Switch

off

the

player.

-

Connect

the

terminal

to

the

68070's

UART

of

the

player.

-

Switch

on

the

player

while

pressing

the

SPACE-bar

of

the

terminal.

-

The

terminal

should

now

show

the

title

of

the

terminal

lltest.

5.1.5

PCB

low

level

test

If

the

service

pcb

is

connected

to

port

2

the

pcb

low

level

test

is

executed

after

power

on.

In

table

1a

survey

is

given

for

all

tests

executed.

Display

lltest

release

number:

When

this

lltest

is

entered,

first

the

release

number

of

the

pcb

lltest

will

be

displayed.

Example:

COi

RLxx

(RL

stands

for

RELEASE,

xx

stands

for

release

x.x).

The

lltest

is

now

waiting

for

an

action

from

the

user.

The

user

should

now

press

either

the'Y'

or

'N'

button

to

con-

tinue

the

test.

STEP

0:

VSC

STEP

OA:

VSC

MASTER

display:

OA

In

this

step

some

registers

of

the

VSC

MASTER

are

initialized.

These

registers

are

:

DCR2

register(set

to

independant

DCR

register

(disable

display)

CSR

register

(set

DTACK

delay

and

DRAM

type)

STEP

OB:

VSC

SLAVE

display:

OB

In

this

step

some

registers

of

the

VSC

SLAVE

are

initialized.

These

registers

are:

DCR2

register(set

to

independant

DCA)

DCR

register

(disable

display)

CSR

register

(set

DTACK

delay

and

DRAM

type)

STEP

1:

ROM

In

this

step

the

contents

of

the

ROM

is

checked.

Following

tests

are

done

on

the

ROM:

1.

Display

release

number

of

this

ROM.

(test

A)

3.

Check

if

the

parity

of

the

ROM

is

OK.

(test

C)

Address

range:

-

The

ROM

chips

used

for

this

memory

map

are

:

1X

4Mbit.

On

the

MINI

MMC

the

clock

and

calendar

chip

used

is

the

SGS-Thomson

MK48T08B.

It

is

visible

in

the

memory

map.

Nr.of

UPPER

Bytes

-

--

MAPPED

ADDRESS

Words

LOWER

SPACE

512kB

UP&LO

00

0000

-

07

FFFF

512kB

UP&LO

08

0000

-

OF

FFFF

512kB

UNDEF

10

0000

-

17

FFFF

512kB

UP&LO

18

0000

-

1F

FBFF

16B

LO

1F

FC00-1F

FFBF

16B*

UP&LO

1F

FFCO

-1F

FFDF

16B*

UP&LO

1F

FFEO

-1F

FFFF

4B

LO

20

0000

-

20

7FFF

500kB

UNDEF

20

8000

-

27

FFFF

64kB

LO

28

0000

-

28

FFFF

460kB

UNDEF

28

0000

-

2F

FFFF

8kW

UP&LO

30

0000

-

30

FFFF

910kB

UNDEF

31

0000

-

3E

FFFF

2B

LO

3F

0000

-

3F

7FFF

8kB-8

UP

3F

8000

-

3F

FBFF

8B

UP

3F

BFFO

-

3F

FBFF

1kB

UNDEF

3F

FCOO

-

3F

FFFF

13MB

UNDEF

40

0000

-

FF

FFFF

UNMAPPED

ADDRESS

SPACE

00

0000

-

07

FFFF

08

0000

-

OF

FFFF

10

0000

-

17

FFFF

18

0000

-1F

FBFF

1F

FC01

-1F

FC1F

1F

FFCO

-1F

FFDF

1F

FFEO

-1F

FFFF

20

0001

-

20

0007

20

8000

-

27

FFFF

28

0001

-

28

FFFF

28

0000

-

2F

FFFF

30

0000

-

30

3FFE

31

0000

-

3E

FFFF

3F

0001

-

3F

0003

3F

8000

-

3F

BFEE

3F

BFFO

-

3F

BFFE

3F

FCOO

-

3F

FFFF

40

0000

-

FF

FFFF

Table

of

the

memory

map

(1)

The

effective

memory

space

for

SYSTEM

ROM

is

512kB-1

k.

(2)

The

maximum

available

NVRAM

space

in

this

configuration

is

31

kByte.

(3)

This

part

of

the

memory

map

should

not

be

accessed.

The

VSC

registers

are

mapped

here.

(4)

When

used.

I..

Explanation

of

items

in

tables

Nbr.

of

Bytes/Words

:

The

total

available

bytes

or

words.

Words

in

this

case

means

the

part

of

the

memory

map

is

only

accessable

as

a

word.

kB

B

B*

kW

=

kilobytes

=

bytes

=

bytes,

but

some

addresses

are

only

accessible

as

words.

=

kilowords,

only

accessible

as

a

word!

FUNCTION

DRAM

BANK1

DRAM

BANK2

RESERVED

SYSTEM

ROM

DUART

(4)

VCS

REGS

SLAVE

VSC

REGS

MASTER

SLAVE

FREE

SPACE

FLOPPY

(4)

FREE

SPACE

COi

FREE

SPACE

KILLME/DMAMEM

NVRAM

(2)

CLOCK&CAL

REGS

DO

NOT

ACCESS(3)

EXTENSION

SPACE

UPPER

-

LOWER:

This

column

gives

an

indication

of

how

the

device

is

ac-

cessible.

UP

=

only

accessible

as

byte

via

the

UPPER

byte

of

the

databus.

(DATA8-DATA

15)

LO

=

only

accessible

as

byte

via

the

LOWER

byte

of

the

databus.

(DATAO-DATA7)

UP&LO

=

accessible

via

LOWER

as

well

as

UPPER

byte

of

the

databus.

(the

device

uses

the

complete

databus.

UNDEF

=

not

defined.

MAPPED

ADDRESS

SPACE:

This

column

gives

the

total

address

range

where

the

device

described

in

FUNCTION

is

accessible.

In

this

range

the

device

can

occu.r

several

times.

UNMAPPED

ADDRESS

SPACE:

Analogous

as

mapped

address

space,

only

the

device

can

occur

only

ONE

time.

FUNCTION:

This

column

describes

the

device

or

register

STEP

1:

ROM

10

STEP

1A:

ID

AND

RELEASE

NUMBER

DISPLAY

display:

1A

IDxxRLyy

In

this

step

the

release

number

of

this

ROM

is

displayed

for

a

moment.

(ID

stands

for

IDentification,

xx

is

the

id

number.

RL

stands

for

RELEASE,

yy

stands

for

y.y)

STEP

1

C:

CHECKSUM

display:

1C

In

this

step

the

checksum

of

this

ROM

is

calculated

as

described

in"

how

is

the

checksum

calculated

".

If

the

checksum

is

not

ok

an

error

will

be

displayed.

display:

1C

Er05

STEP

5:

NVRAM

The

nvram

test

is

a

non

destructive

test.

This

means

that

the

original

nvram

contents

is

restored

again.

Address

range:

Full

nvram

address

range

(see

product

spec)

display:

5

The

following

actions

take

place

in

the

nvram

test:

1.

read

byte

from

nvram

and

save

it

in

a

register

2.

write

a

pattern

(from

ROM)

to

nvram

3.

read

byte

from

nvram

and

compare

with

pattern

4.

if

byte

read

is

ok

then

continue

with

action

5

else

give

error

message

and

stop

testing

If

error,

display:

5

Er09

5.

write

inverted

pattern

to

nvram

6.

read

byte

from

nvram

and

compare

with

pattern

7.

if

byte

read

is

ok

then

restore

original

byte

else

give

error

message

and

stop

testing

If

error,

display:

5

Er10

8.

repeat

this

for

every

possible

nvram

address

STEP

6-8

:

DRAM

The

dram

test

is

always

a

destructive

test.

The

test

is

performed

for

both

ram

bankO

and

bank1

as

one

large

memory

followed

by

a

test

for

each

bank

separately.

On

the

displays

following,

the

'x'

is

a

memory

counter.

The

counter

is

incremented

every

128k.

So

for

the

full

range

it

counts

from

1

to

8.

Address

range:

full

address

range

(see

table)

BankO

=

lower

RAM

bank

Bank1

=

upper

RAM

bank

STEP

6A

:

TEST

THE

FULL

DRAM

MEMORY

The

following

actions

take

place

in

this

test:

1.

fill

the

memory

with

the

long

word

address

as

data.

display:

6Afx

2.

read

the

memory

contents

and

compare

with

the

address.

display:

6Arx

3.

if

the

long

word

read

is

ok

then

continue

else

give

error

message

and

stop

testing.

If

error,

display:

6ArxEr11

STEP

6B

:

TEST

THE

FULL

DRAM

MEMORY

WITH

INVERTED

DATA

The

following

actions

take

place

in

this

test:

1.

fill

the

memory

with

the

inverted

long

word

address

as

data.

display:

6Bfx

2.

read

the

memory

contents

and

compare

with

the

inverted

address.

display:

6Brx

3.

if

the

long

word

read

is

ok

then

continue

else

give

error

message

and

stop

testing.

If

error,

display:

6BrxEr12

STEP

7A

:

TEST

DRAM

BANKO

The

following

actions

take

place

in

this

test:

1.

fill

the

memory

with

the

long

word

address

as

data.

display:

7Afx

2.

read

the

memory

contents

and

compare

with

the

address.

display:

7Arx

3.

if

the

long

word

read

is

ok

then

continue

else

give

error

message

and

stop

testing.

If

error,

display:

7ArxEr13

STEP

7B

: TEST DRAM BANKO WITH INVERTED

DATA

The

following

actions take place in

this

test:

1.

fill the

memory

with

the

inverted

long

word

address

as

data.

display:

7Bfx

2.

read the

memory

contents

and

compare

with

the

inverted

address.

display: 7Brx

3.

if the long

word

read

is

ok

then

continue

else

give

error

message and

stop

testing.

If error,

display:

7BrxEr14

STEP

BA

: TEST DRAM BANK1

The

following

actions take place in

this

test:

1.

fill the

memory

with

the long

word

address

as

data.

display:

8Afx

2.

read the

memory

contents

and

compare

with

the

address.

display:

8Arx

3.

if the

long

word

read

is

ok

then

continue

else give error

message and stop testing.

If error,

display: 8ArxEr15

STEP 8B : TEST DRAM BANK1 WITH INVERTED

DATA

The

following

actions

take place in this test:

1.

fill the

memory

with

the

inverted

long

word

address

as

data.

display: 8Bfx

2.

read the

memory

contents

and

compare

with

the

inverted address.

display: 8Brx

3.

if

the

long

word

read

is

ok then

continue

else give

error

message and stop testing.

If error,

display: 8BrxEr16

STEP

9:

CDIC

This test

only

checks

part

of

the

CDIC

ram,

mainly

because

it is possible

that

during

the

test

the CDIC

destroys

part

of

the ram

contents.

address range:

CDIC

base

address+

$1400

to

CDIC base

address + $3C7F.

cdic register2: CDIC base

address+

$3FFA

register2

contents

after

reset: $C7FE

See table

for

base address.

STEP

9A

:CDIC RAM TEST WITH ADDRESS

AS

DATA

display:

9A

The

following

actions

take place in the CDIC RAM test:

1.

Fill the

memory

with

long

word

address as data.

2.

Read and

compare

the data

with

the

address.

3.

If the

long

word

read is ok then

continue

else give an

error and

stop

testing.

If error,

display:

9A

Er17

STEP

9B :CDIC RAM TEST WITH INVERTED ADDRESS

AS

DATA

display: 9B

The

following

actions take place in

the

CDIC

RAM

test:

l Fill the

memory

with

inverted

long

word

address as

data.

2.

Read and compare

the

data

with

the

inverted address.

3.

If the long

word

read

is

ok then

continue

else give an

error and stop

testing.

If error,

display:

9A

Er18

STEP

9C

:CDIC REGISTER 2 TEST

display:

9C

The

following

actions

take place

in

the

CDIC REGISTER

test:

1.

Read register 2 and

compare

with

fixed pattern.

(Register 2 has a

defined

pattern

after

reset.)

2.

If the register is ok then

continue

with

give an error and

stop

testing.

If error,

display:

9C

Er19

STEP

10

SLAVE

processor

(68HC05)

This

test

checks the

communication

with

the slave proces-

sor.

Additionally

it

displays

the slave and cd processor release

numbers. If the

communication

with

the cd

processor

via

SPI

does

not

function,

the cd release

number

will

give a

0.0.

Address range: Slave base address + 6 (See table).

STEP

10A : WRITE REQUEST BYTE TO

THE

SLAVE

display: 10A

In

this step a $F0 (request)

is

written

to

the slave.

STEP

10B

:

READ

ACKNOWLEDGE FROM

THE

SLAVE

display:

10B

In

this step the

following

actions

take place:

1.

wait

about

2 sec

to

give the slave the

time

to

acknowl-

edge.

2.

read the acknowledge.

3.

if the acknowledge

is

$FD

then

continue

else give

an

error

and stop testing.

If error,

display:

10B

Er20

STEP

10C

: READ

AND

DISPLAY SLAVE RELEASE NUMBER

display:

10C

In

this step the

following

actions take place:

1.

read the next

byte

from

the slave

2.

if

the byte «gd,

$00

then

continue

with

step 3 else

give

an error and

stop

testing.

If

error,

display:

10C

Er21

3.

wait

until a key is pressed.

4.

continue

with

PCS 61857

STEP

100 : READ AND DISPLAY

CD

RELEASE NUMBER

display:

10D

In

this step

the

following actions take place:

1.

read the

the

slave

2.

if

the

byte

<

>

$00 then continue

with

step 3 else give

an error and stop testing

If error,

display: 10D Er22

3.

wait

until a key is pressed.

4.

read the

dummy

read.

STEP

DESCRIPTION

0a

VSC

master initialization

Ob

VSC slave initialization

1a

ROM10 release

number

1c ROM10 checksum check

5

NVRAM test

with

rom data as data

6af DRAM fill bank0&bank1

with

address as data

6ar DRAM read and compare data

6bf

DRAM fill bank0&bank1

with

inverted add. as data

6br

DRAM read and compare data

7af DRAM fill bank0

with

address as data

7ar DRAM read and compare

7bf

DRAM fill bank0

with

inverted address

as

data

7br

DRAM

read and compare data

Bat DRAM fill bank1

with

address as data

Bar DRAM read and compare

Bbf DRAM fill bank1

with

inverted address as data

Bbr DRAM read and compare data

9a

CDIC RAM test

with

address

as

data

9b CDIC RAM test

with

inverted address as data

9c

CDIC

register test

10a

SLAVE test:

write

request

to

slave

10b SLAVE

test:

read echo

from

slave

10c SLAVE test: read SLAVE release

number

from

slave

10d SLAVE test: read

CD

release

number

from

slave

Table 1:

PCB

LL

TEST steps

overview

5.1.6

Terminal

low

level test

If a VT100

or

compatible

terminal is connected

to

the

68070's UART

of

the

CDI

player one is able

to

execute the

terminal

low

level test. Due

to

the

fact

that

almost

every

test is self

explanatory

only the

major

steps are described

below. ln this

test

it

is possible

to

skip

every

major

step.

Display lltest header and release number

STEP 0:

VSC

Both master and slave vsc are

low

level initialized sequen-

tially. This is done

the

same as in the pcb

low

level test.

STEP

0:

Writing

to

a user definable ram address

This

test

writes

the

powers

of

2

to

a (

word

) address. The

result is read again and will be displayed. The address can

be selected

by

the

user (

only

word

adresses

).

Pressing

'ESC' stops the test.

If

one

trys

to

write

to

unused space in

the

memory

map,

the

program

will

NOT generate an error message.

PCS 61858

STEP

01: ROM

For

the

ROM

the

following

information

is displayed and

checked:

-Display the identification code

for

this ROM (ROM

ID)

-Display the release

number

of

this ROM

-Display

the

checksum

of

this

ROM. The

upper

word

of

the checksum displayed is always '0000'.

If the checksum is

not

ok then a specific

error

will

be

displayed. This error is

the

same

as

in

the

pcb

low

level

test.

STEP

05:

NVRAM

For the

NVRAM

test three

different

tests can be selected:

-The first is a non destructive

nvram

test

as in the

pcb

low

level test.

-The second test is a destructive

nvram

test

with

ROM

data as test data.

-The third test is also a destructive

test

with

the address

as

data.

-The third test has also

some

hidden functions. Pressing: ·

w:

writes

continu

the

address as data to the nvram.

r:

reads continu the

complete

nvram

( no display

).

d: displays the

contents

of

421

succeeding ram loca-

tions. The start address is given

by

the user.

ESC

stops these functions.

Remark: The error message is

different

from

the pcb lltest.

See error table

for

more

information.

Address range: Full

nvram

address range (see table

of

memory

map)

STEP

06-08: DRAM

The dram test is always a destructive test. The test is

performed

for

both ram bank0 and bank1 as one large

memory

followed

by

a test

for

each bank separately.

The following actions take place in the

dram

test:

1.

fill the

memory

with

the

long

word

address

as

data.

2.

read the

memory

contents

and compare

with

the

address.

3.

if

the long

word

read is ok then continue else give error

message and

stop

testing.

4.

write

the

inverted long

word

address

as

data

to

memory.

5.

read

the

memory

contents

and compare

with

the

inverted address.

6.

if

the long

word

read is

ok

then

continue

else give error

message and stop testing.

This test has also

some

hidden

functions. Pressing:

w:

writes

continu

the long address as data

to

the

dram.

r: reads

continu

the

dram

(

no

display).

d: displays

the

contents

of

421

succeeding ram locations.

The start address is given

by

the user.

ESC

stops these functions.

Remark:

the

error message is

different

from

the pcb lltest.

See error table

for

more

information.

Address range: full address range (see

product

spec)

Banko

=

lower

RAM

bank

Bank1

=

upper

RAM

bank

STEP

09:

CDIC

cdic register2:

CDIC

base address + $3FFA ; register2 contents after

reset: $D7FE

See table

of

memory

map

for

base address.

The cdic

test

consists

out

of

three

main

parts:

1 test cdic ram

with

long

word

address as pattern

2 test cdic ram

with

inverted long

word

address

as

pattern

3 display cdic register and compare

If

in

one

of

these

tests

an

error

occurs

the

test

will

be

stopped

and

the

error

displayed.

This

test

has

also

some

hidden

functions.

Pressing:

w:

writes

continu

the

long

address

as

data

to

the

cdic.

r:

reads

continu

the

complete

cdic

{

no

display

).

d:

displays

the

contents

of

421

succeeding

ram

locations.

The

start

address

is

given

by

the

user.

ESC

stops

these

functions.

Address

range:

CDIC

base

address+

$1400

to

CDIC

base

address+

$3C80.

STEP

10:

SLAVE

processor

(68HC05)

This

lltest

for

the

slave

performs

following

actions:

1

Write

$FO

to

the

slave

processor.

2

Read

byte

from

same

address,

the

slave

should

respond

with

$FO.

3

If

data

is

not

$FO

then

stop

testing

and

display

error

code

else

continue

with

4

Read

the

this

byte

is

the

release

number

of

the

slave

processor

firmware.

Display

the

release

num-

ber.

If

the

release

number

is

$00

then

an

error

will

be

displayed.

5

Read

the

this

byte

is

the

release

number

of

the

CD

processor

firmware.

Display

the

release

number.

If

the

release

number

is

$00

then

an

error

will

be

dis-

played.

6

Read

the

this

is

a

dummy

read.

Address

range:

Slave

base

address+

what

is

read

in

6.

See

table

of

memory

map

for

base

address.

STEP

11:

CLOCK

CALIBRATION

This

step

is

not

really

a

test.

it

is

a

software

tool

that

can

be

used

to

trim

the

clock&calendar

chip

so

that

it

runs

within

1

minute

acc.

per

month.

If

calibration

is

not

needed,

this

step

should

be

executed

since

a

frequency

counter

is

needed

to

complete

this

test

successfully.

If

this

test

is

entered

accidently,

just

switch

off

the

power

and

restart

the

lltest.

The

clock

calibration

should

be

performed

with

an

external

frequency

counter.

-

Connect

the

probe

of

the

counter

to

pin21

of

IC7205

the

signalis

called

CSCDICN.

-

Start

the

test

with

the

gate

time

of

the

frequency

counter

set

to

minimum

5

sec.

-

The

counter

display

should

now

show

a

frequency

near

to

512

Hz.

If

not,

the

chek

if

everything

is

set

and

connected

properly.

(range

:

511,96724

to

512,03276)

Press

a

key

on

the

terminal

to

stop

the

measurement.

Now

fill

in

the

measured

value

of

the

frequency.

The

lltest

software

will

now

calculate

the

proper

value

to

be

filled

into

the

calibration

register

of

the

clock&calendar

IC.

The

value

of

the

frequency

at

pin21

of

IC7205

will

not

be

changed

or

influenced.

-

The

calibration

is

done

now.

5.1.7

Error

codes

When

during

a

test

an

error

occurs

the

user

should

be

aware

of

following

conventions:

For

the

pcb

low

level

test

the

error

is

displayed

on

the

outermost

righthand

side

of

the

display.

Example:

1

Er11

An

survey

for

all

error

codes

is

given

in

table

2.

For

the

terminal

low

level

test

the

error

is

displayed

on

the

outermost

lefthand

side

of

the

terminal.

In

some

cases

(memory

tests)

the

error

code

is

replaced

by

a

more

meaningful

error

output.

Example:

ADDRESS

DATA

READ

EXPECTED

ERROR:00080000

F0080000

00080000

RETURN

to

con-

tinue,ESC

to

STOP

Meaning:

(assuming

long

word

data

is

used);

On

address

$80000

the

data

was

$F0080000

and

not

$80000

as

it

should

be.

If

the

RETURN

button

is

pressed,

the

will

be

read

and

checked.

With

this

output

it

will

be

easier

to

debug

the

MMC

board

-

When

an

error

has

occurred

the

program

will

wait

for

a

user

intervention

with

following

question:

RESTART

the

test

Yes

or

No?

If

the

answer

was

'Y'

then

the

11test

software

is

executed

again

from

the

beginning.

If

the

answer

was

'N'

then

the

is

executed

as

if

nothing

happened.

ERROR

DESCRIPTION

DISPLAY

05

ROM

checksum

error

Er05

09

NVRAM

error

Er09

10

NVRAM

error

(for

inverted

data)

Er10

11

DRAM

error

(bankO

&

bank1)

Er11

12

DRAM

error

(bankO

&

bankl,

inverted

data)

Er12

13

DRAM

bankO

error

Er13

14

DRAM

bankO

error

(inverted

data)

Er14

15

DRAM

bank1

error

Er15

16

DRAM

bank1

error

(inverted

data)

Er16

17

CDIC

RAM

error

Er17

18

CDIC

RAM

error

(inverted

data)

Er18

19

CDIC

register

error

Er19

20

SLAVE

error

(wrong

echo

from

slave)

Er20

21

Invalid

release

number

from

slave

Er21

22

Invalid

release

number

from

cd

proc

Er22

Table

2.

Error

codes

overview

5.1.8

Release

number,

position

and

checksum

storage

The

release

number.ID

and

checksum

are

always

stored

in

the

CDI

ROM.

Step

1

of

the

pcb

lltest

as

well

as

the

termi-

nal

lltest

uses

all

this

information

to

check

if

the

ROM

is

ok.

Where

are

these

bytes

stored

in

the

ROM's,

where

in

the

memory?

(ROM

address

range

for

the

4Mb:

$00000-$7FBFF)

(MMC

address

range

for

the

1

Mb:

$180000-$1

FFBFF)

ROM

address

$7FBFF

$7FBFE

$7FBFD

LSByte

of

the

checksum

MSByte

of

the

checksum

Release

number

of

this

ROM

(BCD

coded)

$7FBFC

Player

ID

(BCD

coded)

MMC

address

$1

FFBFF

=

LSByte

of

the

checksum

of

the

ROM

$1

FFBFE

=

MS

Byte

of

the

checksum

of

the

ROM

$1

FFBFD

=

Release

number

of

the

ROM

(BCD

coded)

$1

FFBFC

=

Player

ID

(BCD

coded)

Remark:

The

total

ROM

space

is

512k

minus

1

k.

This

1k

can

never

be

accessed

in

the

MMC

address

space.

It

is

used

for

the

VSC's

registers

and

chip

selects.

5.1.9

How

is

the

checksum

calculated?

The

checksum

is

calculated

for

every

ROM

separately.

The

checksum

is

the

algebraic

sum

of

all

bytes

in

that

ROM

except

the

2

bytes

where

the

checksum

is

written.

Only

the

LSWord

of

the

sum

is

used.

To

calculate

the

real

checksum

of

the

ROM

just

add

these

2

bytes

to

the

LSWord

of

the

sum.

The

last

1024

bytes

are

always

assumed

to

be

all

$FF.

ROM

checksum

=

sum

of

all

bytes

of

the

address

range

$180000

to

$1

FFBFD

+

$FCOO

ROM

checksum

displayed

in

STEP

1=

ROM

checksum

+

(LSB

+

MSB)

of

this

checksum.

This

is

also

equal

to

the

checksum

of

the

complete

ROM.

5.2

THE

SERVICE

SHELL

Introduction.

For

service

purposes

the

CD-I

set

has

built-in

software

modules.

These

modules

can

be

activated

via

the

service

shell

by

menu.

The

modules

are

for

the

testing

of

:

-

Video

circuitry,

by

means

of

a

colorbar

testpatern

-

CDM

and

servo

circuitry

-

Input

/

Output

ports

-

Audio

circuitry

Testing

the

COM,

servo

and

audio

cicuitry

in

the

service

shell

is

only

possible

with

a

CD-DA

disc.

5.2.1

Starting

the

service

shell

The

service

shell

can

be

started

by

connecting

the

RXD

and

TXD

lines

of

port

1

lpin2

and

pin3)

during

start

up

(insert

testplug

before

power

on

or

reset).

5.2.2

Layout

info

SELECTABLE/NON

SELECTABLE

ITEMS

Each

menu

of

the

service

shell

consist

of

a

number

of

boxes

and

text

strings.

Some

of

these

boxes

can

be

selected

by

moving

the

screen

cursor

above

the

box

and

clicking

on

one

of

the

joystick

buttons.

Only

the

colored

boxes

can

be

selected.

Clicking

on

one

of

the

other

boxes

will

have

no

effect.

(ERROR)

MESSAGES

ON

THE

SCREEN

The

service

shell

will

provide

information

and

errors

in

a

box

at

the

top

of

the

screen.

To

remove

such

a

message

and

continue

with

the

test

a

button

must

be

clicked

on

the

remote

control

joystick.

MENU

STRUCTURE

When

the

service

shell

is

started,

the

main

menu

appears

with

a

number

of

boxes

on

it.

Selecting

some

boxes

will

result

in

a

submenu

being

displayed,

other

boxes

may

re-

sult

in

immediate

action.

Selecting

the

EXIT

box

will

stop

the

service

shell

and

restart

the

player.

Selecting

EXIT

in

a

submenu

will

return

you

to

the

5.2.3

Subject

dependent

information

MAIN

MENU

The

main

menu

contains

four

test

item

boxes

and

the

EXIT

box.

Selecting

TEST

IMAGE

will

give

immediate

action,

the

other

three

test

items

will

display

a

submenu.

CD

TEST

This

menu

has

two

information

boxes

at

the

top

of

the

screen.

Below

it

are

three

test

items

for

the

CD

player

and

below

these

are

three

buttons

that

can

be

selected

only

during

the

CD

drive

test.

When

the

menu

is

first

entered,

only

the

three

test

item

boxes

can

be

selected.

Subjects

of

the

CD

test

are

the

cd

drive

itself,

the

X

bus

and

a

test

on

Digital

Out.

When

this

menu

is

selected

in

the

main

menu,

the

com-

munication

channel

with

the

CD

processor

will

be

checked

first.

A

message

will

be

displayed

giving

the

result

of

this

check

(either

O.K.

or

No

response).

After

pressing

one

of

the

buttons

(to

remove

the

message)

the

cd

menu

will

be

displayed.

cd

status

test

mode

drive

test

X

bus

Dig

Out

Arm

in

Arm

out

EXIT

(error)

message

bar

fig

3.2

CD

test

menu

The

X

bus

test

will

result

in

immediate

action.

It

checks

the

communication

channel

between

the

CDIC

and

CD

proces-

sor

that

is

normally

used

to

send

commands

(seek,

read

etc)

to

the

CD

processor.

The

result

is

either

O.K

or

No

response.

The

Dig.

Out

test

will

also

give

immediate

action.

It's

pur-

pose

is

to

check

wether

the

CDIC

receives

a

Digital

Out

sig"

nal

or

not.

The

result

of

this

test

is

O.K.

or

No

Digital

Out.

The

CD

drive

test

uses

a

different

menu

and

will

therefore

be

described

in

a

separate

paragraph.

CD

DRIVE

TEST

The

CD

drive

test

will

perform

the

service

loop

as

im-

plemented

in

the

Philips

CD

audio

players.

A

disc

is

needed

for

this

test.

Results

of

this

test

will

be

displayed

on

the

screen

instead

of

a

display.

When

the

cd

drive

test

is

selected,

the

same

screen

will

appear,

but

with

other

buttons

highlighted.

You

cannot

select

the

X

bus

and

Dig

Out

test

anymore.

Selecting

the

EXIT

button

will

return

you

to

the

cd

menu.

(X

bus

and

Dig

Out

button

highlighted

again).

The

drive

test

consist

of

the

following

steps:

Mode

0

Software

release

number

of

the

CD

micro

processor

is

dis-

played

in

the

button

at

the

left

top

of

the

screen

(cd

status

button).Mode

O

is

displayed

in

the

button

at

the

right

top

of

the

screen

(mode

button).

During

the

cd

drive

test

this

button

will

display

the

current

mode.

In

mode

0,

the

ARM

IN

and

ARM

OUT

buttons

can

be

selected

to

move

the

cd

lense

inwards

and

outwards.

Selecting

will

bring

the

player

in

mode

1.

Mode

1

In

mode

1

the

cd

driveprocessor

will

try

to

focus.

If

it

man-

ages

to

do

so

(a

disc

must

be

present!),

the

message

IN

FOCUS

will

appear

in

the

status

button.

Otherwise,

the

message

NO

FOCUS

will

appear

in

the

status

button

after

the

cd

driveprocessor

has

tried

to

focus

16

times

!this

may

take

a

while).

In

that

case

(no

focus

found)

the

test

will

re-

turn

to

mode

0.

Selecting

will

bring

the

player

in

mode

2.

Mode

2

The

turntablemotor

is

rotating

and

controlled

by

the

rough

HF,

moving

the

cd

lense

outside

(by

hand)

will

slow

the

disc

down.

If

an

error

occurs,

the

test

will

return

to

mode

0.

Selecting

in

mode

2

will

bring

the

player

in

mode

3.

Mode

3

You

can

select

ARM

IN

and

ARM

OUT

to

make

the

cd

lense

jump

inside

-or

outside

(small

jumps).

The

laser

will

keep

jumping

while

a

button

is

pressed

on

the

remote

control.

If

an

error

occurs,

the

test

will

return

to

mode

0.

in

mode

3

will

bring

the

player

in

normal

play-

ing

mode.

Normal

playing

mode

The

player

shell

will

be

started

and

errors

sent

by

the

cd

processor

will

be

displayed

in

a

box

on

the

screen.

You

cannot

return

to

the

service

shell

otherwise

than

by

reset-

ting

the

player.

ERROR

MESSAGES

display:

A5

xxOOOO

xx

=2 :

focus

error

xx=

3:

radial

error

xx

=5:

off

error

(TL

stays

low

for

50

msec.)

xx=

6 :

jump

error

xx=

7 :

subcode

error,

no

valid

subcode

in

3

sec.

xx=

8 :

TOC

error:

out

of

lead-in

area

while

reading

the

TOC

xx

=

30

:

to

many

grooves

to

jump

xx=

31

:

search

time

out

xx=

32

:

bin.

search

error

xx

=

33

:

search

index

error

xx=

34

:

search

time

error

xx

=

37

:

selection

error

DUARTTEST

This

test

is

not

relevant

for

the

CDl205

APU/KEY

TEST

This

is

a

combined

menu,

the

attenuation

can

be

changed

via

this

menu

and

the

keys

on

remote

control

and

player

can

be

tested

with

it.

There

are

three

buttons

for

every

at-

tenuation

path

on

the

screen.

Two

of

them

can

be

selected

Ito

increment/decrement)

and

one

is

used

to

display

the

current

attenuation

value

for

the

path.

There

is

also

a

MONO/STEREO

button

on

the

screen.

In

STEREO,

two

at-

tenuation

paths

are

disabled

(left

to

right

and

right

to

left),

in

MONO

all

attenuation

paths

are

enabled.

Maximum

attenuation

is

reached

at

the

value

47

lno

sound).

A

CD

audio

disc

is

needed

for

the

attenuation

test.

The

test

routine

will

start

playing

the

disc

at

initializiation.

When

a

key

is

pressed,

a

text

will

appear

on

the

key

button

on

the

right

side

of

the

screen

describing

the

button

pressed.

The

text

will

disappear

when

the

key

is

released.

LEFT/LEFT

-

00

+

LEFT/RIGHT

-

00

+

STEREO/MONO

STEREO

EXIT

(error)

message

bar

fig

3.4

APU

test

menu

VIDEO

TEST

IMAGE

RIGHT/RIGHT

-

00

+

RIGHT/LEFT

-

00

+

LAST

KEY

A

colorbar

will

be

displayed

on

the

screen.

Pressing

a

but-

ton

after

the

screen

has

been

filled

completely

will

return

you

to

the

main

menu.

There

are

no

error

messages

for

this

test.

What

could

be

wrong

if

...

This

paragraph

will

describe

the

meaning

of

the

error

messages

given

by

the

service

shell

and

contains

sugges-

tions

about

possible

errors.

This

paragraph

must

be

up-

dated

with

new

information

from

testing

and

debugging

players.

Service

shell

cannot

be

started

with

the

testplug.

Connec-

tions

between

port

1

and

slave

may

be

bad.

Testplug

could

be

wrong.

Maybe

the

slave

processor

is

defect.

If

the

playershell

cannot

be

started

either,

try

the

low

level

test

first.

The

key

test

will

display

the

text

ERROR

if

an

unknown

key

code

is

received.

Disconnecting

the

clock

from

MMC

to

CD

processor

will

make

the

CD

player

turn

as

fast

as

it

can.

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PCS 61861

6.2.1

Alphabetical

signal

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A,B,C+

: > >

control signals

for

brushless

CSYN

: COMPOSITE SYNCHRONIZATION

input

IACKOUT22

:>>

RBOT

:

for

HPR

volume

control

DC-motor from the VSC's (active low) IACKOUT23

:>>

RCEYE

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REMOTE

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EYE

A,B,C-

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CTS1.

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4 :

CLEAR

TO

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:>>

RCLED

:

REMOTE

CONTROL

LED

ACK2N :

DMA

REQUEST ACKNOWLEDGE (active that the remote recieving device is IACKOUT52

:>>

RD

: READY signal.starting up procedure

low) (of channel

2)

ready

IDAC

:

1/2

bit

DAC finished

ACM :

output

AC-motor

CTS

2

:>>

IDTACKN : data transfer acknowledge

from

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RDYN

: READY (active low)

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DMA

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ADEN : (=ADENA) ADDRESS ENABLE

NOT.

CVBS

:

CVBS

output

IFDN2 : main channel word-flag to the

DSP

REDIG

: RADIAL

ERROR

DIGITAL

When low,the address ADENA coming

D1..4

:

fotodiode

currents INTENN

: > >

when

low,no extensions use the

RESETCD

:

when

low

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DAAB

: (DAA82) serial data

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interrupt

devices RESETINN :

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low

VSC

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to

CDIC

I

2

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RESETN

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ic's

AM

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DATA

0

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15

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DATA

LINES

INTENN2

:>>

REQ2N

: OMA-request

of

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ASN

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STROBE

(active low,tristate)

DATADAC

: Data

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to

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:>>

RSTOUT :

RESET

OUT

of

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:>>

when

high resetsequence

starts

the

bus for the system

DDTACK

:

DATA

TRANSFER ACKNOWLEDGE

to

IN21N

: (=IN2OUT)

> >

RTAP

: > >

for

HPR

volume

control

AUDL

: > >

AUDIO

LEFT

the 68070 bus

IN41N

: (=IN4UT)

> >

Decoder interrupt

RTOP

:>>

AUDIOL

:>>

DEEMP

: DEEMPHASIS

priority

inputs

RTSUART

: REQUEST

TO

SEND

from

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AUDR

: > >

AUDIO

RIGHT

DIG

OUT

: DIGITAL OUTPUT

IN51N

: (=IN5OUT)

> >

(active low) IN2IN has processor

to

the UART

of

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AUDIOR

:>>

DIRN

: DIRECTION CONTROL. lndecates the the lower processor

AVN

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of

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: > >

and IN5IN has the higher

priority

RTS1

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.4

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REQUEST

TO

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low),can be used by an extension transcievers IN4OUT

: > >

IN2IN = SLAVEPROCESSOR

RTS

1..2

:>>

80

..

3 :

input

control bits

for

off-, catch-, play

DISCLK

: DISPLAY

CLOCK

> >

(6805),IN4IN =

RWN

:

READ

-WRITE (low is write) signal

status and

DAC

output

current for radial

DISDAT

: DISPLAY

DATA

> >

only

for

CDI

2XX IN5OUT

: > >

CDIC

(IMS66490).IN5IN = DUART

RWN2

:

READ

-WRITE (low is write) signal

from

motor

DISEN : DISPLAY ENABE

> >

(68681)

CDIC

to the DSP

B,G,R,

:

Output

colours

of

the

VSR

DIV4 : DIVIDE

BY

4 signal IN4OUT2

:>>

RWRAM

:

READ

-WRITE signal

from

the

CDIC

to

BERRN

: > >

BUS

ERROR

(active low.open

DO

: DIGITAL OUT IN5OUT2

:>>

the S-RAM'S

drain)

DODS

: DROP-OUT

DETECTOR

SUPPRESSION IN2OUT3

:>>

RXD1..4

: > >

RECIEVE

DATA

RXD is data input

BERR

:>>

DONEN

:

DONE

(active low.open drain), operates

KILL

: to

mute

audio outputs by

power

on and

RXD

1..2

:>>

BLANI : (=BLAN1M) BLANKING OUTPUT (active in the OMA-mode

off

SI

: on -

off

control

for

laser supply and

low,tristate)of the

VSC

DOXN : serial data

output

of

the X-bus

LA1

: > >

control signals for brushless focus circuit

CADDYIN : high

when

reading data

DPSRWN

:

Read

(high)

or

write

(low) from

or

to

the DC-motor SLMA0

..

8

: VSC-slave

memory

address bus to the

CADDYSWITCH : control signal

for

position tray Digital Signal Processor

LB1

:>>

DRAM'S

CASN : COLUMN ADDRESS STROBE (active DSN2N :

DATA

STROBE (active low)

of

the

DSP

LC1

:>>

SLMD0

..

15

: VSC-slave

memory

data bus

to

the

low)

DTACKN

:

DATA

TRANSFER ACKNOWLEDGE

LADD1..23

: ADDRESS-BUS (active high.tristate) for DRAM'S

CBA,CBAA

: 68070 bus transiever latch (rising edge) asserted by a peripheral direct addressing

of

16

Mbyte

of

SOXENN : SERIAL OUTPUT ENABLE

FOR

THE

CDICDACKN

: (=ACK1N) OMA REQUEST DTACKSLAVEN :

DATA

TRANSFER ACKNOWLEDGE

of

memory

X-BUS (enabled

when

low)

ACKNOWLEDGE (active low) the

SLAVE

processor (68HC05) LBOT :

for

HPL

volume

control

SOXRQN

: SERIAL OUTPUT REQUEST

FOR

THE

CDICREQN

: (=REQ1

NJ

OMA REQUEST (active low)

DTCN

:

DATA

TRANSFER COMPLETE (active LDSN :

LOWER

DATA

STROBE

of

the bus X-BUS (when low)

CDTV

:

to

change by remote control between low, open drain) operates in the DMA-

LM

: LASER MONITOR diode

input

SOYENN2

: SERIAL OUTPUT ENABLE

FOR

THE

TV

or

COi

(only used by

CDI

2XX) mode

LO

:

LASER

amplifier current OUTPUT Y-BUS (when low)

GLAB

: (=CLAB2) bitclock

for

the SAA 7220 DUARTCSN

:•

UART

CHIP

SELECT.when

low

businfo

LRDN

:·when

low

select,the ROM'S

or

NVRAM SPICLK : SERIAL PERIPHERAL

INTERFACE

CLOCK

chip is coming

from

or

going

to

the DUART read the

lower

data byte

SPISS

: SERIAL PERIPHERAL

INTERFACE

SLAVE

CLK

:

CLOCK

(11,2896

Mc)

EFAB

:

ERROR

FLAG

LTAP

: > >

for

HPL

volume control SELECT

CLKDAC :

CLOCK

DAC,the clock used

to

send

FILTERN

: filter select

when

high:level

C,

when

LTOP

:>>

STANDARD : software chaise between

PAL

and

NTSC

serial data

to

the

volume

adjustment low:level A

LVIDOIN

..

STANDARDSW : handware chaise between

PAL

and

CLK1

:

the

clock on which the

DSP

operates

FOC-

: > >

focus

out

to CDM 9

..

LVID71N

: > >

8

bit

pixel-bus

for

channel 2

NTSC

(7,5264 Mc) FOC+

:>>

(VSC-SLAVE) SSM : START/STOP MOTOR

CAI

: COUNTER

RESET

INHIBIT (low during

GN

:>>

LVID0OUT.. SWAB : SUBCODING WORD

CLOCK

INPUT

a real trackloss

or

during excention

of

GNA

: > >

When

low:the

outputs and inputs

..

LVID7OUT

:>>

SYSCLK

: > >

SYSTEM

CLOCK

a

jump

command

of

the trancievers (646) are enabled MC : MOTOR CONTROL signal

SYSCLK1

:>>

coc

: COMMAND COMPLETED signal

GNB

:>>

MISO : MASTER

IN

SLAVE OUT TCAP :

input

capture feature

for

the on-chip

COXN : serial

output

clock

for

the X-bus HALTN : active low,open drain,biderectional.

If

MOSI : MASTER OUT

SLAVE

IN

timer

CPUASN :

the

address strobe

of

the 68070

low

together

whith

the resetn it causes MSMA0

..

8 : ADDRESS BUS between the DRAM'S

of

TCMP :

output

for

the

output

compare feature

microprocessor the 68070

to

enter

the reset state. the VSC' MASTER and the

VSC

of

the on chip

timer

CPULDSN :

the

lower

data strobe

of

the 68070 HFin :

HF

current

input

MASTER TMOUT : TRAY MOTOR OUT

microprocessor

HPL

: HEADPHONE

LEFT

MSMD0

..

15

:

DATA

BUS between the DRAM'S

of

the TXD1..4

:

>>

TRANSMIT

DATA

TX

•

is data

CPUUDSN :

the

upper data strobe

of

the 68070

HPR

: HEADPHONE

RIGHT

VSC' MASTER and the

VSC

MASTER

output

microprocessor HSYN : (active low) horfzontal synchronisation NRESET :

when

low

the video synthesizer

(VSR)

is TXD

1..2

:>>

cs : CHIP SELECT input from the

VSC

in reset UDSN :

UPPER

DATA

STROBE (active when low)

CSCDICN

:

CHIP

SELECT

CDIC

(active low) bus HSYNCOUT : (active low) horizontal synchronisation NVDS : digital

output

to

control

an

external URDN :

READ

UPPER

DATA

BYTE

(active

when

information

is intended for

or

coming

output

for

monitor

or tv switch

for

TV overlays (active low) low)

from

CDIC

HVID

0

IN.

PCLK1IN

: > >

PIXEL

CLOCK

for

channel 1 UWRMN : READ -WRITE (write

when

low)

UPPER

CSDAC1N : (-CSDAC2N) (if selected,low)

it

means

..

HVID

7

IN

: > >

8

bit

pixel bus

for

channel 1 PCLK1OUT

:>>

MEMORY

DATA

FROM DRAM'S

FROM

that

data

will

be adjusted on that HVID 0

OUT..

PCLK21N

: > >

PIXEL

CLOCK

for

channel 2 VSC-MASTER

channel .HVID 7 OUT

: > >

(VSC-master) PCLK2OUT

:>>

UWRN : WRITE

UPPER

DATA

BYTE

(active when

CSNVRAMN :

CHIP

SELECT

NVRAM (active low) bus IACKIN2N

:>>

PLOIN1

:

input

clock

for

CDIC

(22,5792 Mc) low)

information

is intended

for

or

coming IACKIN4N

: > >

Decoded interupt acknowledge PLOIN2 :

input

clock

for

CDIC

(19,3536 Mc) UWRSN :

READ

-WRITE (write

when

low)

UPPER

from

the NVRAM (active low).

QCL

: Q-channel

CLOCK

MEMORY

DATA

FROM

DRAM'S

FROM

CSROMN

:>>

IACKIN5N

: > >

Asserted during

an

interupt

QDA : Q-channel

DATA

VSC-SLAVE

CSROM1N :

CHIP

SELECT

ROM (active low) bus acknowledge ORA : Q-channel REQUEST INPUT/

vc

:

output

DC-motor

(VOLTAGE

CONTROL)

information

is

coming

from

the ROM'S IACKOUT2N

: > >

sequence

to

indicate

to

a ACKNOWLEDGE OUTPUT V-FLAG :

output

to

the

•

SP

CSROM2N

:>>

peripheral

that

022

:

output

to

PLL

(22,5792 Mc) devided

VS

CM-INTN :

when

low.interrupt

from

VSC

master to

CSSLAVEN :

CHIP

SELECT

SLAVES (active low) IACKOUT4N

: > >

this interupt request is being

by

14

68070 processor

CSON

: (=CSONA)

CHIP

SELECT (active low)

for

serviced 021 :

output

to

PLL

(19,3536 Mc) devided

VS

CS-I

NTN :

when

low,interrupt

from

VSC

slave to

the

8Kx8 SRAM'S IACKOUT5N

:>>

by

12

68070 processor

CSVSCMSN : CHIP SELECT

VSC

MASTER AND IACKOUT2

:>>

RAD+

: > >

RADIAL OUT to CDM 9 VSYN : (active

when

low) VERTICAL

SLAVE. When

low

the

coming

IACKOUT4

:>>

RAD-

:>>

SYNCHRONISATION INPUT

from

the

information

is intended

for

the VSC'S IACKOUT5

:>>

RASN : ROW ADDRESS

STROBE

(active low)

vsc

PCS 61862

WRPN1

IN

..

2

WRPN1

OUT.2

WSAB

WSAB2

XIN

XIN2

X-TAL2

XT2

XT4

XT41N

0AD

..

12AD

10ADA

..

12ADA

0D

..

15D

0DA

..

15DA

2BCLK

12A

..

15A

: > >

control

input

for

channel 1

or

2

(active low)

:>>

: > >

WORD SELECT

FOR

AB

CHIP

:>>

: > >

11,2896/9,6768/4,8384 symmetrical

clock

:>>

: the same

as

the system clock,coming

out

of

the VSC'S

: the system clock

devided

by

two

: > > the system clock devided by

four

:>>

: > > ADDRESS BUS,between

CDIC-

SRAM'S and SYSTEM ADDRESS BUS

BUFFERS

:>>

:

DATA

BUS

between

CDIC

and DSP

:

DATA

BUS

between

CDIC-SRAM'S and

SYSTEM DATA BUS TRANCIEVERS

:

CLOCK

for

the 2B-chip

: ADDRESS BUS between

CDIC

and

DSP

PCS 61863

Philips CDI 220/00 User manual

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