Philips HTS3510E/94 User manual

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©Copyright2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands
All rights reserved.No part of this publication may be reproduced, stored in a retrieval system or
transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise
without the prior permission of Philips.
Published by RY1005 Service Audio Printed in The Netherlands Subject to modification
DVD Home Theater System
Version 1.0
TABLE OF CONTENTS
Service Manual
Service
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3139 785 35290
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Chapter
LASER BEAM SAFETY PRECAUTIONS................................................................................................1-2
STANDARD NOTES FOR SERVICING........................................................................ ..................1-3
SAFETY AND IMPORTANT NOTICE......................................................................................................1-7
LOCATION OF PCB BOARDS＆VERSION VARIATION .....................................................................2-1
OPERATING CONTROLS AND FUNCTIONS ...................................................................................…..2-2
SPECIFICATIONS ......................................................................................................................................3-1
MEASUREMENT SETUP……………….......................................................................................................3-2 .
SYSTEM,REGION CODE,ETC..SETTING PRODURE.............................................................................3-3
RETURN UNIT TEST FLOW......................................................................................................................3-4
MAIN UNIT REPAIR CHART....................................................................……………................………3-5
DISASSEMBLY INSTRUCTIONS .............................................................................................................4
BLOCK WIRING DIAGRAM.....................................................................................................................5
AMPLIFIER BOARD
LED + KEY BOARD
DECODE BOARD
POWER BOARD.........................................................................................................................................9
MECHANICAL EXPLODE VIEW＆PART LIST......................................................................................10
REVISION LIST………………………………………………….....…..……………………....................11
...........
HTS3510E /9 4
...................................................................................................................................6
....................................................................................................................................7
.......................................................................................................................................8
For Evaluation Only.
Copyright (c) by Foxit Software Company, 2004 - 2007
Edited by Foxit PDF Editor

LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the laser beam
coming from the pickup or allow it to
strike against your skin.
The laser beam is emitted from the location shown in the figure. When checking the laser
diode, be sure to keep your eyes at least 30 cm away from the pickup lens when the diode is
turned on. Do not look directly at the laser beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified
herein, may result in hazardous radiation exposure.
CAUTION
LASER RADIATION
WHEN OPEN. DO NOT
STARE INTO BEAM.
Location: Top of DVD mechanism.
Page 1 of 51
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STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output
pin of the 3 pin Reg
u
lato
r ICs i
s
indicated a
s
shown.
2. For othe
r ICs, pin 1 a
n
d
every fifth pin are
indicated a
s
shown.
3. The 1st pin
of every male con
n
ec
tor i
s
indicated a
s
shown.
Instructions for Connectors
1. When you connect or disconnect the FFC
(Flexible Foil Connector) cable, be sure to first
disconnect the AC cord.
2. FFC (Flexible Foil Connector) cable should
be inserted parallel into the connector, not at
an angle.
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free
solder.
IDENTIFICATION:
Regardless of special logo (not always
indicated)
One must treat all sets from 1.1.2005
onwards, according next rules.
Important note: In fact also products a little
older can also be treated in this way as long as
you avoid mixing solder-alloys (leaded/
lead-free). So best to always use SAC305 and
the higher temperatures belong to this.
Due to lead-free technology some rules have
to be
respected by the workshop during a repair:
Use only lead-free solder alloy Philips
SAC305 with order code 0622 149 00106. If
lead-free solder paste is required, please
contact the manufacturer of your
solder-equipment. In general use of solder
paste within workshops should be avoided
because paste is not easy to store and to
handle.
Use only adequate solder tools applicable
for leadfree solder alloy. The solder tool must
be able
To reach at least a solder-temperature of
400°C,
To stabilize the adjusted temperature at
the solder-tip
To exchange solder-tips for different
applications.
Adjust your solder tool so that a temperature
around 360°C - 380°C is reached and
stabilized at the solder joint. Heating-time of
the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C otherwise
wear-out of tips will rise drastically and
flux-fluid will be destroyed. To avoid wear-out
of tips switch off un-used equipment, or
reduce heat.
Mix of lead-free solder alloy / parts with
leaded solder alloy / parts is possible but
PHILIPS recommends strongly to avoid mixed
solder alloy types (leaded and lead-free). If
one cannot avoid, clean carefully the
solder-joint from old solder alloy and re-solder
with new solder alloy (SAC305).
Use only original spare-parts listed in the
Service-Manuals. Not listed standard-material
(commodities) has to be purchased at external
companies.
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for
desoldering always use highest lead-free
Page 3 of 51
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temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in
so-called 'dry-packaging' (sealed pack
including a silica gel pack) to protect the IC
against moisture. After opening, dependent of
MSL-level seen on indicatorlabel in the bag,
the BGA-IC possibly still has to be
baked dry. This will be communicated via
AYS-website.
Do not re-use BGAs at all.
For sets produced before 1.1.2005,
containing leaded soldering-tin and
components, all needed spare-parts will be
available till the end of the service-period. For
repair of such sets nothing changes.
On our website
www.atyourservice.ce.Philips.com you find
more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs
used in Philips-sets.
You will find this and more technical
information within the “magazine”, chapter
“workshop news”.
For additional questions please contact your
local repair-helpdesk.
How to Remove / Install Flat
Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering
Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue
to the CBA; when removing entire flat pack-IC,
first apply soldering iron to center of the flat
pack-IC and heat up. Then remove (glue will
be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by
models. Use an appropriate hot-air flat
pack-IC desoldering machine, whose shape
matches that of the Flat Pack-IC.
2. Do not supply hot air to the chip parts
around the flat pack-IC for over 6 seconds
because damage to the chip parts may occur.
Put masking tape around the flat pack-IC to
protect other parts from damage. (Fig. S-1-2)
3. The flat pack-IC on the CBA is affixed with
glue, so be careful not to break or damage the
foil of each pin or the solder lands under the IC
when removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder
from all pins of the flat pack-IC. When you use
solder flux which is applied to all pins of the flat
pack-IC, you can remove it easily. (Fig. S-1-3)
2. Lift each lead of the flat pack-IC upward one
by one, using a sharp pin or wire to which
solder will not adhere (iron wire). When
heating the pins, use a fine tip soldering iron or
a hot air desoldering machine. (Fig. S-1-4)
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3. Bottom of the flat pack-IC is fixed with glue
to the CBA; when removing entire flat pack-IC,
first apply soldering iron to center of the flat
pack-IC and heat up. Then remove (glue will
be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
With Iron Wire:
1. Using desoldering braid, remove the solder
from all pins of the flat pack-IC. When you use
solder flux which is applied to all pins of the flat
pack-IC, you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid
mounting point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip
soldering iron or hot air blower, pull up the wire
as the solder melts so as to lift the IC leads
from the CBA contact pads as shown in
Fig.S-1-5.
4. Bottom of the flat pack-IC is fixed with glue
to the CBA; when removing entire flat pack-IC,
first apply soldering iron to center of the flat
pack-IC and heat up. Then remove (glue will
be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must
be taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
2. Installation
1. Using desoldering braid, remove the solder
from the foil of each pin of the flat pack-IC on
the CBA
so you can install a replacement flat pack-IC
more easily.
2. The “●” mark on the flat pack-IC indicates
pin 1. (See Fig. S-1-7.) Be sure this mark
matches the 1 on the PCB when positioning
for installation. Then presolder the four
corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure
that none of the pins have solder bridges.
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2. Ground for Workbench
Be sure to place a conductive sheet or copper
plate with proper grounding (1 M∧) on the
workbench or other surface, where the
semi-conductors are to be placed. Because
the static electricity charge on clothing will not
escape through the body grounding band, be
careful to avoid contacting semi-conductors
with your clothing.
Instructions for Handling
Semiconductors
Electrostatic breakdown of the
semi-conductors may occur due to a potential
difference caused by electrostatic charge
during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 M∧) that
is properly grounded to remove any static
electricity that may be charged on the body.
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Safety and important notice
Warning
• Risk of overheating! Never install the Home
Theater System in a confined space. Always
leave a space of at least 4 inches around the
Home Theater System for ventilation. Ensure
curtains or other objects never cover the
ventilation slots on the Home Theater System.
• Never place the Home Theater System,
remote control or batteries near naked flames
or other heat sources, including direct sunlight.
• Only use this Home Theater System indoors.
Keep this Home Theater System away from
water, moisture and liquid-filled objects.
• Never place this Home Theater System on
other electrical equipment.
• Keep away from this Home Theater System
during lightning storms.
• Where the mains plug or an appliance
coupler is used as the disconnect device,
the disconnect device shall remain readily
operable.
• Visible and invisible laser radiation when open.
Avoid exposure to beam.
Recycle notice
This electronic equipment contains a large
number of materials that can be recycled
or reused if disassembled by a specialized
company. If you are disposing of an old
machine, please take it to a recycling center.
Please observe the local regulations regarding
disposal of packaging materials, exhausted
batteries and old equipment.
Copyright notice
This product incorporates copyright
protection technology that is protected
by method claims of certain U.S. patents
and other intellectual property rights
owned by Macrovision Corporation and
other rights owners. Use of this copyright
protection technology must be authorised
by Macrovision Corporation, and is intended
for home and other limited viewing uses only
unless otherwise authorised by Macrovision
Corporation. Reverse engineering or
disassembly is prohibited.
About Progressive Scan
Consumers should note that not all high
definition television sets are fully compatible
with this product and may cause artifacts to
be displayed in the picture. In case of 525
or 625 progressive scan picture problems,
it is recommended that the user switch the
connection to the ‘standard definition’ output.
If there are questions regarding our TV set
compatibility with this model 525p and 625p
DVD player, please contact our customer
service center.
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LOCATION OF PCB BOARDS
LED BOARD
VERSION VARIATION:
Type/Versions
Features
Output Power-300W
Voltage(220V-240V)
SERVICE SCNARIO MATRIX:
Type/Versions
Board in used
Χ
HTS35 10E
/94
Χ
Χ
HTS35 10E
/94
DECODE BOARD
KEY BOARD
AMP BOARD
POWER BOARD
POWERboard C
AMPboard
C
LEDboard
C
KEYboard
C
*C=Component Level Repair
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DECODE board C

OPERATING CONTROLS AND FUNCTIONS
Front Panel
USB
Standby-On
—Turns on the player or
switches to standby mode
Disc Tray
Open/Close
—Opens or closes the disc
compartment.
Display Panel —Connects a USB
supported device
Play/Pause Stop
—starts or pauses —Stops playback
playback
SOURCE
—Selects a media to play or listen to
audio from the connected device.
Back Panel
VOLUME
—Increases or
decreases volume.
MIC
—Connects a microphone
MAINS~(AC Power cord)
—Connect to a standard
AC outlet
SPEAKERS
AUDIO IN
—Connect the audio cables(not supplied)
to the AUDIO IN_AUX1 jacks
VIDEO
VIDEO OUT
—Connect the component video cable(not
supplied) to the Y Pb Pr jacks
ANTENNA
—Connect the Speakers
to the matching jacks
—Connect a composite video
cable to the video jack
—Connect the FM antenna to
theFM75
Ωjack
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SPECIFICATIONS
AMPLIFIER
Total output power .................................. 300 W RMS(30%THD)
Frequency Response .........................…....……….180Hz – 18kHz / ±3 dB
Signal-to-Noise Ratio ..............................................>- 60 dB (A-weighted)
Input Sensitivity
- AUX1………................................................................................500 mV
- AUX2…………......… .............................................................. 500 mV
RADIO
Tuning Range ...............................................................FM 87.5-108 MHz
......................................................................................................(100kHz)
............................................................................................26 dB Quieting
Sensitivity..... ...........................................................................FM 22 dBf,
IF Rejection Ratio .....................................................................FM 50 dB
Signal-to-Noise Ratio ................................................................FM 30 dB
Harmonic Distortion ..................................................................... FM 3%
Frequency Response ..................................... FM 180 Hz–10 kHz / ±3 dB
Stereo Separation ......................................................... FM 26 dB (1 kHz)
Stereo Threshold .....................................................................FM 23.5 dB
DISC
Laser Type ......................................................... ........…...Semiconductor
Disc Diametre .........................................................................12cm / 8cm
Video Decoding ...............................................MPEG-1 / MPEG-2 /DivX
................................................................................................ / DivX Ultra
Video DAC ......................................................................12 Bits,108MHz
Signal System ........................................................................PAL / NTSC
Video S/N ......................................................................................... 56 dB
Audio DAC..........................................................................
............. 24bits/96KHz
Frequency Response ........................................... 4 Hz–20 kHz (44.1 kHz)
.............................................................................. ..4 Hz–22 kHz (48 kHz)
..................................................................................4 Hz–44 kHz (96 kHz)
PCM .......................................................................................... IEC 60958
Dolby Digital ......................................................... IEC 60958, IEC 61937
MAIN UNIT
Standby power consumption................................................................<1W
Power Consumption ............................................................................60 W
Dimensions ................................................................ 360 x 55 x 332 (mm)
......................................................................................................(w x h x d)
Weight ...............................................................................................2.64 kg
SPEAKERS
System .......................................................... Full range satellite
Speaker impedance ............................8 ohm(centre),4 ohm(Front/Rear)
Speaker drivers .................................................... .3” full range speaker
Frequency response .....................................................150 Hz – 20 kHz
Dimensions:
-Center……………………………………….....100 x 100x 75 (mm)
-Front/Rear..……………………….………….. 100 x 100x 75 (mm)
.................................................................................................(w x h x d)
Weight:
-Center……………………………………………….....…..…0.38kg
-Front/Rear……………………………………......…….0.38 kg/each
USB
Compatibility .................................................................................. USB
Class support .......................................... UMS(USB Mass storage Class)
File system............................................................FAT12,FAT16,FAT32
SUBWOOFER
Impedance .....................................................................................8 ohm
Speaker drivers .................................................... 165mm (6.5”) woofer
Frequency response .........................................................45Hz – 150 Hz
Dimensions ......................................................122.6x 309.5 x 369 (mm)
..................................................................................................(w x h x d)
Weight ............................................................................................3.54kg
Laser specification
Type.................................................
...........Semiconductor laser GaAlAs(CD)
Wave length...................................... 645-665nm (DVD) 770-800nm(CD)
Output power ................................................................6Mw(DVD) 7Mw(VCD/CD)
Beam divergence....................................................................... 60 degrees
.
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Power Supply
-For China........…………………………………….. 220 - 230 V~50Hz;
-For Asia Pacific…………….....…….............…...110 - 240 V~50-60Hz