q-Tech QSRV-26 Series User manual

РУКОВОДСТВО ПОЛЬЗОВАТЕЛЯ
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QTECH QSRV-26xxxx platform 2U manual
server barebones

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PREFACE
This manual is the product technical manual of Purley 2U dual-channel cabinet server.
It mainly introduces and explains the technical characteristics, system architecture,
installation method, and basic operation of this product. Purley 2U dual-channel server
is divided into 2U8 bays and 2U12 bays. This product has the characteristics of low
energy consumption, flexible expansion, high reliability, easy management and easy
deployment.
This manual is for reference research by professional system integrators and personal
computer technicians. This product should only be installed and maintained by
experienced technicians.
MANUAL STRUCTURE
Chapter 1 Security Statement
This chapter describes some environmental conditions, precautions and instructions
related to this product that need to be paid attention to when using this product.
Chapter 2 Product Introduction
This chapter provides the specifications of the main components of the system and
describes the main features of each model of the Purley 2U dual cabinet server series.
Chapter 3 Installing System Components
This chapter describes the installation methods and main precautions of various main
system components using Purley 2U dual-channel cabinet server.
Chapter 4 System cabinet Installation
This chapter describes the installation steps and precautions of using the rails provided
with Purley 2U dual-channel cabinet server.
Chapter 5 BIOS parameter setting description
This chapter mainly introduces the parameter settings and main functions of the system
BIOS.
Chapter 6 RAID Setting Instructions
This chapter mainly introduces how to set up RAID.
Chapter 7 IPMI Rapid Deployment
This chapter mainly describes how to quickly deploy IPMI.
Chapter 8 Product Technical Specifications
This chapter focuses on the main technical specifications of Purley 2U dual-socket
cabinet server products.

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STATEMENT
Copyright statement
©QTECH LLC. All rights reserved.
All information contained in this user manual, including but not limited to it, is protected
by copyright law. Without the permission of QTECH LLC (hereinafter referred to as
QTECH), no copying, copying, or excerpting is allowed. , Re-issuance, or other use.
Disclaimer
QTECH provides this user manual "as is". Within the scope of the law, it does not
provide any express or implied guarantees and guarantees, including but not limited to
commercial marketability, applicability for specific purposes, non-infringement of the
rights of any other person, and any The guarantee of using this user manual or the
inability to use this user manual, and QTECH does not provide guarantees and
guarantees for the accuracy or reliability of the results obtained from using this user
manual or any information obtained through this user manual.
Due to product version upgrades or other reasons, the contents of this user manual will
be updated from time to time. Unless otherwise agreed, this user manual is only used
as a guide, and the user shall bear all risks of using this user manual.
Trademark statement
Intel and Xeon are trademarks of Intel Corporation in the United States and other
countries. Microsoft and Windows are trademarks of companies in the Microsoft group.
Linux is a registered trademark of Linus Torvalds.
Aspeed is a trademark of Xinhua Technology.
The ownership of other trademarks belongs to their respective owners.
Product name: Purley platform 2U dual-channel L-shaped server barebone system
manual version: V1.0
Publication date: May 2021
Glossary:
noun
Paraphrase
Intel® Xeon®
Scalable
Processors
Intel Xeon Scalable Processor
Platinum efficiency
power supply
Platinum certified power supply is "80 PLUS Platinum" standard,
that is, the conversion rate of 20% load is above 90%, the
conversion rate of 50% load is above 94%, and the conversion rate
is 100%.

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Rate above 91%
M.2
M.2 interface is a new generation interface standard tailored for
Ultrabook.
It is a new interface specification introduced by Intel®to replace
mSATA
C621/C622
Intel®Chipset
RJ45
Common name for standard 8-bit modular interface
AST2500
Aspeed®BMC chip
Socket P
One of the Intel®processor interface types
-F CPU
Refers to CPUs supporting Intel®Omni-Path Host Fabric interface,
Omni-Path
High-speed optical cable interconnection technology, which can
support up to 100Gbps end-to-end interconnection
8038 fan
Fan with size 80x80x38mm
LGA3647
The full name Land Grid Array, grid array package, LGA3647
represents 3647
Contacts
CR2032
It is a 3V CR2032 lithium manganese battery, shaped like a button,
referred to as button battery or lithium manganese button
battery
RS-232
One of the communication interfaces on the computer is the
asynchronous transmission standard interface, called COM port
Jtag
Joint Test Action Group, a joint test working group, mainly used for
internal chip testing
test
NC Pin
Empty pin
XDP
Extend Debug Port, Intel®CPU debugging interface
Abbreviations
Explain the abbreviations used in this article, and provide the full English name and
Chinese explanation of each abbreviation, as shown in the following table:

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Abbreviat
ions
original
Chinese meaning
PCH
Platform Controller Hub
It was previously collectively referred to
as "South Bridge"
GbE
Gigabit Ethernet
Gigabit Ethernet
BMC
Baseboard Management
Controller
Baseboard management controller
IPMI
Intelligent Platform Management
Interface
Intelligent platform management
interface
CPU
Central Processing Unit
CPU
SATA
Serial Advanced Technology
Attachment
Serial ATA interface specification
SAS
Serial Attached SCSI
Serial SCSI
sSATA
secondary SATA
Expansion SATA interface
LAN
Local Area Network
local area network
VGA
Video Graphics Array
Video transmission standard
MB
Mother Board
Motherboard
MIB
Motherboard Interface Board
Motherboard adapter board/side board
BP
Backplane
Backplane
PDB
Power Distribution Board
Power distribution board
FIB
Fan Interface Board
Fan adapter board
PCIE
Peripheral Component
Interconnect
Express
High-speed serial computer expansion
bus standard
USB
Universal Serial Bus
Universal Serial Bus
FW
Firmware
firmware

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TPM
Trusted Platform Module
Trusted Platform Module
IO
Input/Output
input Output
BIOS
Basic Input-Output System
Basic Input Output System
CMOS
Complementary Metal Oxide
Semiconductor
Complementary metal oxide
semiconductor
ME
Management Engine
Management engine
DDR4
Double Data Rate 4 SDRAM
The fourth generation double data rate
synchronous dynamic
Random access memory
DIMM
Dual-Inline-Memory-Modules
Dual in-line storage module
RDIMM
Registered DIMM
Registered two-wire memory module
LRDIMM
Load-Reduced DIMM
Low load DIMM
AEP
Apache Pass
Intel®Optane DDR4 memory code
name
MEZZ
CONN
Mezzanine Connector
Mezzanine/buckle card
KVM
Keyboard Video Mouse
Can access and control computing by
directly connecting keyboard, video, and
mouse ports
machine
CPLD
Complex Programmable Logic
Device
Complex programmable logic device
ECC
Error Correcting Code
Error checking and correction
CFM
Cubic Feet Per Minute
Cubic feet per minute
RPM
Revolution Per Minute
Rpm
Symbol convention:
Note: It is used to transmit equipment or environmental safety warning messages. If
not avoided, it may cause equipment replacement, data loss, equipment performance
degradation or other unpredictable results.

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Warning: Used to warn of potentially dangerous situations, which, if unavoidable,
may cause death or serious personal injury.
Red arrow: means pointing to a certain position.
Blue arrow: represents the action of pulling out or inserting downward or tilting.
Hollow arrow: represents the next action or result.
Dark blue rotating arrow 1: represents the action of turning the screw clockwise or
pulling out.
Dark blue rotating arrow 2: represents the action of turning the screw
counterclockwise or buckling inward

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Table of Contents
PREFACE 2
MANUAL STRUCTURE 2
STATEMENT 3
1 SECURITY STATEMENT 12
1.1 General safety matters 12
1.2 Product name and content identification table of toxic and hazardous substances
or elements 13
1.3 Warning notice 16
1.4 Climate and environmental requirements 16
1.5 Other important description 17
2 PRODUCT INTRODUCTION 18
2.1 System introduction 18
2.2 System Configuration 18
2.2.1 System parameters 18
2.2.2 System structure 19
2.3 System model specification introduction 21
2.4 System component introduction 25
2.4.1 Front panel components 25
2.4.2 Rear panel components 29
2.4.3 Motherboard components 32
2.4.4 Hard disk backplane assembly 34
2.4.5 DIMM slot location 42
2.4.6 Hard disk label 43
2.4.7 Hard Disk Indicator 43
2.4.8 System fan 44
3 INSTALLING SYSTEM COMPONENTS 45
3.1 CPU installation 45
3.2 Radiator installation 46
3.3 Memory installation 46
3.4 Hard disk installation 48
3.5 Front hard disk backplane installation. 50
3.6 M.2 SSD installation 52
3.7 PCI-E module installation 53
3.8 Rear hard disk module backplane installation 54

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3.9 Rear hard disk module installation 55
3.10 Power supply module installation 58
3.11 PCI-E expansion card installation 59
3.12 Fan module installation 61
3.13 Installation of air duct 62
3.14 CD-ROM installation 63
3.15 Installation of the upper cover of the chassis 65
4 SYSTEM CABINET INSTALLATION 66
4.1 Rail installation 66
4.2 Install the outer rail to cabinet 68
4.3 Install server to cabinet 69
5 BIOS PARAMETER SETTING DESCRIPTION 71
5.1 Enter the BIOS Setup interface 71
5.2 Setup menu parameter description 71
5.2.1 Navigation key description 71
5.2.2 Main menu description 72
5.2.3 Advanced menu description 74
5.2.4 Trusted Computing 76
5.2.5 Serial Port Console Redirection 77
5.2.6 Console Redirection Settings 78
5.2.7 SIO Configuration 80
5.2.8 [*Active*] Serial Port 81
5.2.9 Option ROM Dispatch Policy 82
5.2.10 PCI Subsystem Settings 84
5.2.11 CSM Configuration 85
5.2.12 NVMe Configuration 86
5.2.13 Network Stack Configuration 88
5.2.14 iSCSI Configuration 90
5.2.15 Platform Configuration menu 91
5.2.16 PCH SATA Configuration 92
5.2.17 PCH sSATA Configuration 94
5.2.18 USB Configuration 95
5.2.19 Miscellaneous Configuration 96
5.2.20 Server ME Configuration 97
5.2.21 Runtime Error Logging 97
5.2.22 Socket Configuration menu 98
5.2.23 Processor Configuration 99

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5.2.24 Common RefCode Configuration 103
5.2.25 UPI Configuration 104
5.2.26 Memory Configuration 106
5.2.27 Memory Topology 109
5.2.28 Memory Map 110
5.2.29 Memory RAS Configuration 112
5.2.30 IIO Configuration 114
5.2.31 Advanced Power Management Configuration 116
5.2.32 CPU P State Control 117
5.2.33 Hardware PM State Control 118
5.2.34 CPU C State Control 119
5.2.35 Package C State Control 120
5.2.36 CPU-Advanced PM Tuning 121
5.2.37 Energy Perf BIAS 122
5.2.38 Server Mgmt menu 123
5.2.39 System Event Log menu 125
5.2.40 BMC network configuration menu 127
5.2.41 View System Event Log menu 130
5.2.42 BMC User Setting 131
5.2.43 Add User 132
5.2.44 Delete User 133
5.2.45 Change User Setting 134
5.2.46 Security menu 136
5.2.47 Boot menu 137
5.2.48 Save & Exit menu 139
5.3 User operation reminder 141
6 RAID SETTING INSTRUCTIONS 142
6.1 PCH group RAID 142
6.1.1 Configure RAID in UEFI boot mode 142
6.1.2 Configure RAID in Legacy Boot Mode 149
6.1.3 Delete RAID: 155
6.2 LSI 9361-8i group RAID 156
6.2.1 Configure RAID in UEFI boot mode 156
6.2.2 Create RAID: 159
6.2.3 Configure hot spare disk: 167
6.2.4 Delete RAID: 170
6.2.5 Erase disk data: 185
6.2.6 Migrate RAID level: 191
6.2.7 Clear disk RAID information: 197

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6.3 Configure RAID in Legacy Boot Mode 200
6.4 Configure hot spare disk: 205
6.5 Delete RAID: 207
6.6 Locate the disk location: 209
6.7 Initialize the logical disk: 210
6.8 Erase disk data: 212
6.9 Clear disk RAID information: 215
7 IPMI RAPID DEPLOYMENT 216
7.1 Rapid deployment of IPMI process 216
7.1.1 Make sure the motherboard supports IPMI function 216
7.1.2 Enter BIOS to set IPMI function 216
7.1.3 IPMI interface configuration Static mode 219
7.1.4 IPMI configuration Java SOL 219
7.2 IPMI function quick start instructions 220
7.2.1 Enter the operation interface 220
7.2.2 Default username and password 221
7.2.3 IPMI management system content 221
7.2.4 Introduction to KVM remote management 224
7.2.5 KVM page introduction 224
7.2.6 Remote control quick operation 226
7.2.7 Introduction to SOL 226
7.3 Other ways to connect to IPMI 228
7.3.1 IPMI driver 228
7.3.2 IPMI tools and other open source software 228
8 PRODUCT TECHNICAL SPECIFICATIONS 229
8.1 Technical specifications 229

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1 SECURITY STATEMENT
1.1 General safety matters
To prevent the risk of major personal and property losses, please follow the following
recommendations.
Please do not open the system cover by yourself, and should be operated by
professionally trained maintenance technicians. There may be high voltage or electric
shock on the triangular mark with lightning symbol, please do not touch it.
Remember: Disconnect all cables before performing maintenance. (There may be more
than one cable) It is strictly forbidden to perform live operations such as starting the
machine before the cover is closed.
When it is necessary to open the cover, please wait for the internal equipment to cool
down before performing it, otherwise it is easy to burn you.
Do not use this device in a humid environment.
If an extension cable needs to be used, please use a three-wire cable and make sure it
is properly grounded.
Ensure that the computer is well grounded. Different grounding methods can be used,
but it must be actually connected to the ground. If you are not sure whether the
grounding protection has been secured, please contact the corresponding agency or
electrician for confirmation. If you need twisting table cable wiring, please contact
QTECH to provide suggestions.
Please use a three-core power cord and socket with grounding protection. Improper
grounding may cause leakage, burns, explosions and even personal injury.
Please make sure that the power socket and the power interface can be in close
contact, loose contact may cause a fire hazard.
Please use your computer under 220V AC voltage. Working at an improper voltage will
cause electric shock, fire and computer damage.
The computer is required to be well ventilated and far away from heat and fire sources,
and do not block the cooling fan, otherwise the computer may cause smoke, fire or
other dangers due to overheating.
If you smell or see smoke from your computer, please turn off the computer
immediately and unplug the power cord.
It is required to be able to easily plug and unplug the power cord from the power source
and the power socket. Please keep the power cord and plug clean and intact, otherwise
there may be a risk of electric shock or fire.
Note: If the battery is replaced incorrectly, there is a danger of explosion. Only use the
same or equivalent type of replacement recommended by the manufacturer. The used
battery will pollute the environment. Please follow the relevant instructions for the
replacement of the old battery.
Keep the computer away from electromagnetic fields.

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Keep away from electronic noise caused by high-frequency safety equipment such as
air-conditioning, large fans, large motors, radio and television transmission towers.
Please do not plug or unplug the backplane cable or move the computer while the
computer is running, otherwise it may cause the computer to crash or damage the
components.
Please try to avoid frequent restarting or switching on and off to extend the life of the
computer.
Please keep the environment clean and avoid dust. The working environment
temperature of the equipment is 10℃~35℃, and the humidity is 35%~80%.
Users are requested to back up important data in time. QTECH is not responsible for
data loss caused by any circumstances.
The optical drive used in this product is a Class 1 laser device.
Figure 6-1
1.2 Product name and content identification table of toxic and
hazardous substances or elements
Within the 10-year environmental protection use period, the toxic and hazardous
substances or elements contained in the product will not leak or mutate under normal
use conditions, and the use of electronic information products by users of electronic
information products will not cause serious pollution to the environment or affect them.
Cause serious damage to person and property.
Part Name
Harmful Substance
Lead
(Pb)
Mercur
y (Hg)
Cadmiu
m (Cd)
Hexavale
nt
Chromiu
m (Cr VI)
Polybromin
ated
biphenyls
(PBB)
Polybromin
ated
Diphenyl
Ether
(PBDE)
Chassis/Baffle
X
O
O
O
O
O
Mechanical
components
(fans,
radiators,
X
O
O
O
O
O

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motors, etc.)
Printed Circuit
Components-
PCA*
X
O
O
O
O
O
Cable/wire/con
nector
X
O
O
O
O
O
Hard disk drive
X
O
O
O
O
O
Table 1-1

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Part Name
Harmful Substance
Lead
(Pb)
Mercury
(Hg)
Cadmiu
m (Cd)
Hexavale
nt
Chromiu
m (Cr VI)
Polybromin
ated
biphenyls
(PBB)
Polybrom
inated
Diphenyl
Ether
(PBDE)
Media
reading/storag
e device (CD,
etc.)
X
O
O
O
O
O
Power
supply/power
adapter
X
O
O
O
O
O
power cable
X
O
O
O
O
O
Pointing device
(mouse, etc.)
X
O
O
O
O
O
keyboard
X
O
O
O
O
O
UPS
X
O
O
O
O
O
Complete
cabinet/rail
products
X
X
O
O
O
O
Table 1- 2
O - It means that the content of this toxic and hazardous substance in all homogeneous
materials of this part is below the limit requirement stipulated in GB/T26572-2011 "Limit
Requirements for Restricted Substances in Electronic and Electrical Products".
X - Indicates that the content of the toxic and hazardous substance in at least one of
the homogeneous materials of the part exceeds the limit requirement specified in
GB/T26572-2011 "Limited Requirements for Restricted Substances in Electronic and
Electrical Products". But it complies with the EU RoHS directive (including its
exemption clauses).
Note: This table shows the status of toxic and hazardous substances contained in all
components that may be used in QTECH server, storage and workstation products.

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Customers can check the status of toxic and hazardous substances contained in each
component of the purchased product based on this table.
1.3 Warning notice
This product complies with EMC Class A standards.
1.4 Climate and environmental requirements
❖The best working temperature of the equipment is 10°C—35°C; the highest indoor
ambient temperature of the equipment is 40°C.
❖System battery: 3 V CR2032 lithium battery.
Note: Some configurations have been tested for performance at 45°C temperature and
90% (29°C maximum dew point) humidity.
Temperature
Operating
temperature
10°C to 35°C (50°F to 95°F), the
maximum temperature gradient is
Hour 10°C
Continuous operating
temperature range
(under the sea
(At 950 meters or
3117 feet)
In the case of equipment without direct
light, 10°C to 35°C (50°F to
95°F)
Storage temperature
range
-40°C to 65°C (-40°F to 149°F)
Humidity
storage
When the maximum dew point is 33°C
(91°F), the relative humidity is 5% to
95%. The air must never condense.
Continuous operating
humidity percentage
range
When the maximum dew point is 26°C
(78.8°F), the relative humidity is 10% to
80%
Table 1-3

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❖If the computer use environment has poor or no lightning protection facilities, please
shut down during a thunderstorm and unplug the power cord, network cable,
telephone line, etc. connected to the computer.
❖Please use genuine operating system and software, and configure it correctly.
QTECH assumes no maintenance responsibility for server failures caused by
operating systems and software.
❖Please do not disassemble the case and increase or decrease the server hardware
configuration by yourself. QTECH is not responsible for the hardware and data
damage caused by this.
❖When the server fails, please first check the "Troubleshooting" section of this
manual to determine and eliminate common failures. If you are not sure of the
cause of the failure, please contact the technical support department of QTECH for
help.
❖Choosing a suitable environment for the computer is helpful for the stable operation
of the computer and can extend the service life of the computer.
QTECH reserves the right of final interpretation of the above terms
1.5 Other important description
"If the equipment is marked with a logo, it means that the equipment with the logo is
only fully designed and evaluated at an altitude of 2000m . Therefore, it is only
suitable for safe use below 2000m and in the sea.
When used at a distance of more than 2000m, there may be safety hazards."
"If the device is marked with this logo, it means that the device with the logo is
only designed and evaluated for safety in non-tropical climatic conditions.
Therefore, it is only suitable for safe use under non-tropical climatic conditions.
When used in tropical climates, there may be safety hazards."

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2. Product Introduction 18
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2 PRODUCT INTRODUCTION
2.1 System introduction
Purley 2U dual-channel L-type server is a new generation of 2U dual-channel cabinet
server with a wide range of uses that QTECH has launched for the needs of the
Internet, IDC (Internet Data Center), cloud computing, enterprise market and telecom
business applications. It is suitable for IT core business, cloud computing virtualization,
high-performance computing, distributed storage, big data processing, enterprise or
telecom business applications and other complex workloads. The server has the
advantages of low energy consumption, strong scalability, high reliability, easy
management, and easy deployment.
2.2 System Configuration
Nebulas 2 Purley 2U dual-channel L-shaped server products include 2U8 (3.5” hard
disk) disk bays, 2U12
(3.5” hard disk) The two models have the same specifications except for the hard disk
connection method and the maximum number of compatible hard disks.
2.2.1 System parameters
Features
Technical specifications
Series
models
2U8 (3.5" hard disk) bay, 2U12 (3.5" hard disk)
bay
size
2U cabinet type, 748*433.4*87.6mm
processor
1st and 2nd generation Intel® Xeon® Scalable
processors
Maximum support 205W
RAM
Support DDR4 LRDIMM/RDIMM/NV-DIMM ECC
memory
Memory frequency support
2133/2400/2666/2933MHz
A single CPU supports 6 DDR4 Channels, with 2
slots per Channel, and a total of 24 DDR4 slots
for CPU0/CPU1
Support a single capacity of 8GB, 16GB, 32GB,
64GB, 128G

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Storage
controller
Internal storage: 2 SATA ports (7Pin), 2 PCIe 3.0
X2 M.2
Interface, 3 minisas 8643 interfaces, 2 slimline x8
interfaces
driver
The front panel supports up to 8/12/hot-plug
3.5/2.5 inch SAS/SATA (HDD/SSD)
The rear supports 4*2.5" and 4*3.5" hard disks or
8*2.5"
power
supply
Platinum 550W, 800W, 1200W, 1600W hot-
swappable redundant power
Source (adapted according to actual power)
External
port&PCI
E
Front port: 1 VGA; 2 USB3.0
Rear: 1 VGA, 1 DB-9COM port, 2 USB3.0, 1
RJ45 Gigabit management network port, 2
Gigabit/10 Gigabit RJ45 network ports
PCIE expansion: supports up to 11 PCIe3.0 slots
System
fan
N+1 hot-swappable redundant fans
The
internet
2 Gigabit/10 Gigabit RJ45 network ports
safety
Support TPM module
Chassis opening intrusion detection
managem
ent
The onboard iBMC management module
supports IPMI, SOL, KVM Over IP,
Management features such as virtual media
Table 1-4
2.2.2 System structure
The dual-socket L-shaped server uses the Intel Purley platform with Intel® Xeon®
scalable processors; supports DDR4 LRDIMM/RDIMM/NV-DIMM ECC server memory,
and the memory frequency supports 2133/2400/2666/2933MHz; a single CPU supports
6 Two channels, each channel supports 2 DIMMs; two CPUs support a total of 24
DDR4 slots; supports a single capacity of 8GB, 16GB, 32GB, 64GB, 128GB.
The main board features are as follows:
❖The CPU adopts the first and second generation Intel® Xeon® scalable processors,
LGA3647 socket, TDP power consumption 205W;

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❖Each CPU supports six-channel DDR4, each channel has 2 DIMM strips,
RDIMM/LRDIMM. And each CPU supports a maximum capacity of 1.5TB;
❖DDR4 type: DDR4-2133/2400/2666/2933ECC-RDI, ECC-LRDIMM;
❖There are 3 PCIE RISER slots on the board, of which: RISER1 24 PCIE LANEs are
all from CPU0, 24 PCIE LANEs of Riser2, of which 8 PCIE LANEs are from CPU0,
16 PCIE LANEs are from CPU1, 16 PCIE LANEs of Riser3 Also from CPU1;
❖The G3DCL-B motherboard provides 2 M.2 Key M SSD slots, supports 2280 size,
and only supports PCIe X2 signals;
❖Two Gigabit Ethernet ports are integrated on the motherboard, using 88E1512 chip,
from PCH;
❖Southbridge PCH uses INTEL LEWISBURG C621/C622 series chipset;
❖PCH leads to 14 SATA Ports, the highest rate: 6Gb/s, compatible with SATA
1.5Gb/s, 3.0Gb/s; SATA Controller provides 8 SATA PORTs, and SSATA provides
6 SATA PORTs, of which SATA PORT 8 PORT, according to Two SFF8643
connectors are introduced in order, and the first four PORTs of SSATA are
introduced into one SFF8643 connector, and the latter two PORTs are introduced
into the 7PIN SATA connector for access to SATA DOM and DVD;
❖The BMC chip in this single board uses ASPEED's AST2500 control chip to
Do IPMI remote management. VGA output port, dedicated Gigabit RJ45 management
network port, and connected to PCH through RMII/NCSI.
The main board block diagram of the system architecture is as follows:
Figure 2-1