Quectel AF50T Supplement

AF50T Hardware Design
Wi-Fi&BT Module Series
Version: 1.0.1
Date: 2020-12-17
Status: Preliminary
www.quectel.com

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Transmitting, reproducing, disseminating and editing this document as well as using the content without
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Copyright © Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved.

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About the Document
Revision History
Version Date Author Description
- 2019-11-25 Jone CHEN/
Felix FU Creation of the document
1.0.0 2019-11-25 Jone CHEN/
Felix FU Preliminary
1.0.1 2020-12-17 Jone CHEN/
Michael DU
Preliminary:
1. Updated the key features (Table 1).
2. Changed the name of pin 48, pin 60, pin 61, pin 3,
pin 21 and pin 65 to RESERVED, pin 22 from
BT_DBG_RXD to BT_WAKEUP_HOST, pin 23 from
BT_DBG_TXD to HOST_WAKEUP_BT.
3. Updated the pin description (Table 3).
4. Updated the recommended operating power supply
range (Table 4 and Table 19).
5. Deleted Chapter 3.5.3.
6. Updated the reference circuit for RF antenna
interfaces (Figure 12).
7. Added data of current consumption (Chapter 4.4).
8. Updated data of RF performance (Chapter 4.5).
9. Added data of electrostatic discharge (Table 28).

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Contents
About the Document .................................................................................................................................. 3
Contents ...................................................................................................................................................... 4
Table Index .................................................................................................................................................. 6
Figure Index ................................................................................................................................................ 7
1 Introduction ......................................................................................................................................... 8
1.1. Safety Information ...................................................................................................................... 9
2 Product Concept ............................................................................................................................... 10
2.1. General Description ................................................................................................................. 10
2.2. Key Features ............................................................................................................................ 10
2.3. Functional Diagram .................................................................................................................. 12
2.4. Evaluation Board ...................................................................................................................... 12
3 Application Interfaces ...................................................................................................................... 13
3.1. General Description ................................................................................................................. 13
3.2. Pin Assignment ........................................................................................................................ 14
3.3. Pin Description ......................................................................................................................... 15
3.4. Power Supply ........................................................................................................................... 19
3.5. WLAN Interface ........................................................................................................................ 20
3.5.1. WLAN_EN ..................................................................................................................... 21
3.5.2. PCIe Interface ............................................................................................................... 21
3.6. BT Interface .............................................................................................................................. 22
3.6.1. BT_EN ........................................................................................................................... 23
3.6.2. PCM Interface* .............................................................................................................. 23
3.6.3. UART Interface .............................................................................................................. 24
3.7. Control Signal Pins* ................................................................................................................. 25
3.7.1. SW_CTRL ..................................................................................................................... 25
3.7.2. HOST_WAKEUP_BT and BT_WAKEUP_HOST .......................................................... 25
3.8. Coexistence Interfaces ............................................................................................................ 26
3.8.1. UART Coexistence Interface ......................................................................................... 26
3.8.2. Other Coexistence Interfaces* ...................................................................................... 27
3.9. WLAN_SLP_CLK Interface ...................................................................................................... 27
3.10. RF Antenna Interfaces .......................................................................................................... 28
3.10.1. Operating Frequency .................................................................................................... 28
3.10.2. Reference Design of RF Antenna Interfaces ................................................................ 28
3.10.3. Reference Design of RF Layout ................................................................................... 29
3.10.4. Antenna Requirements ................................................................................................. 31
3.10.5. Recommended RF Connector for Antenna Installation ................................................ 32
4 Reliability, Radio and Electrical Characteristics ........................................................................... 34
4.1. General Description ................................................................................................................. 34

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4.2. Electrical Characteristics .......................................................................................................... 34
4.3. I/O Interface Characteristics .................................................................................................... 35
4.4. Current Consumption ............................................................................................................... 36
4.5. RF Performances ..................................................................................................................... 37
4.5.1. Conducted RF Performance of Wi-Fi ............................................................................ 37
4.5.2. Conducted RF Performance of Bluetooth ..................................................................... 41
4.6. Electrostatic Discharge ............................................................................................................ 42
5 Mechanical Dimensions ................................................................................................................... 43
5.1. Mechanical Dimensions of the Module .................................................................................... 43
5.2. Recommended Footprint ......................................................................................................... 45
5.3. Top and Bottom Views of the Module ...................................................................................... 46
6 Storage, Manufacturing and Packaging ......................................................................................... 47
6.1. Storage ..................................................................................................................................... 47
6.2. Manufacturing and Soldering ................................................................................................... 48
6.3. Packaging ................................................................................................................................ 49
7 Appendix A References .................................................................................................................... 51

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Table Index
Table 1: Key Features ................................................................................................................................ 10
Table 2: I/O Parameters Definition ............................................................................................................. 15
Table 3: Pin Description ............................................................................................................................. 15
Table 4: Definition of Power Supply and GND Pins ................................................................................... 19
Table 5: Pin Definition of WLAN_EN .......................................................................................................... 21
Table 6: Pin Definition of PCIe Interface .................................................................................................... 21
Table 7: Pin Definition of BT_EN ................................................................................................................ 23
Table 8: Pin Definition of PCM Interface .................................................................................................... 23
Table 9: Pin Definition of UART Interface .................................................................................................. 24
Table 10: Pin Definition of SW_CTRL ........................................................................................................ 25
Table 11: Pin Definition of HOST_WAKEUP_BT and BT_WAKEUP_HOST ............................................. 26
Table 12: Pin Definition of UART Coexistence Interface ........................................................................... 26
Table 13: Pin Definition of Other Coexistence Interface ............................................................................ 27
Table 14: Pin Definition of WLAN_SLP_CLK Interface .............................................................................. 27
Table 15: Pin Definition of RF Antenna Interfaces ..................................................................................... 28
Table 16: Operating Frequency of the Module ........................................................................................... 28
Table 17: Antenna Cable Requirements .................................................................................................... 31
Table 18: Antenna Requirements ............................................................................................................... 31
Table 19: Absolute Maximum Ratings ........................................................................................................ 34
Table 20: Recommended Operating Conditions ........................................................................................ 35
Table 21: General DC Electrical Characteristics ........................................................................................ 35
Table 22: Current Consumption of the Module (Normal Operation) .......................................................... 36
Table 23: Conducted RF Output Power at 2.4 GHz (SISO) ....................................................................... 37
Table 24: Conducted RF Output Power at 2.4 GHz (MIMO) ..................................................................... 38
Table 25: Conducted RF Output Power at 5 GHz (SISO) .......................................................................... 38
Table 26: Conducted RF Output Power at 5 GHz (MIMO) ........................................................................ 39
Table 27: Conducted RF Receiving Sensitivity at 2.4 GHz ........................................................................ 40
Table 28: Conducted RF Receiving Sensitivity at 5 GHz ........................................................................... 40
Table 29: Conducted RF Performance of Bluetooth .................................................................................. 41
Table 30: Electrostatic Discharge Characteristics ...................................................................................... 42
Table 31: Recommended Thermal Profile Parameters .............................................................................. 49
Table 32: Reel Packaging .......................................................................................................................... 50
Table 33: Related Documents .................................................................................................................... 51
Table 34: Terms and Abbreviations ............................................................................................................ 51

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Figure Index
Figure 1: Functional Diagram of AF50T Module ........................................................................................ 12
Figure 2: Pin Assignment (Top View) ......................................................................................................... 14
Figure 3: Reference Circuit for VDD_CORE_VL, VDD_CORE_VM, VDD_CORE_VH, and VDD_IO ..... 19
Figure 4: Reference Circuit for VDD_RF ................................................................................................... 20
Figure 5: WLAN Interface Connection ....................................................................................................... 20
Figure 6: PCIe Interface Connection .......................................................................................................... 22
Figure 7: Block Diagram of BT Interface Connection ................................................................................ 23
Figure 8: PCM Interface Connection .......................................................................................................... 24
Figure 9: UART Interface Connection ........................................................................................................ 25
Figure 10: SW_CTRL Connection .............................................................................................................. 25
Figure 11: UART Coexistence Interface Connection ................................................................................. 26
Figure 12: Reference Circuit for RF Antenna Interfaces ............................................................................ 29
Figure 13: Microstrip Design on a 2-layer PCB ......................................................................................... 29
Figure 14: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 29
Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 30
Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 30
Figure 17: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................ 32
Figure 18: Mechanicals of UF.L-LP Connectors (Unit: mm) ...................................................................... 32
Figure 19: Space Factor of Mated Connector (Unit: mm) .......................................................................... 33
Figure 20: AF50T Top and Side Dimensions ............................................................................................. 43
Figure 21: AF50T Bottom Dimension (Bottom View) ................................................................................. 44
Figure 22: Recommended Footprint (Bottom View) .................................................................................. 45
Figure 23: Top View of the Module ............................................................................................................. 46
Figure 24: Bottom View of the Module ....................................................................................................... 46
Figure 25: Recommended Reflow Soldering Thermal Profile ................................................................... 48

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1
Introduction
This document defines the AF50T module and describes its air interface and hardware interfaces which
are connected with customers’ applications.
The document helps customers quickly understand module interface specifications, as well as the
electrical and mechanical details. Associated with application notes and user guides, customers can use
AF50T module to design and set up automotive industry mobile applications easily.

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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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2
Product Concept
2.1. General Description
AF50T is an automotive grade Wi-Fi and Bluetooth (BT) module with low power consumption. It is a
single-die WLAN (Wireless Local Area Network) and BT combo solution supporting IEEE 802.11
a/b/g/n/ac/ax 2.4/5 GHz WLAN standards and BT5.1 standard, which enables seamless integration of
WLAN and BT Low Energy technologies.
AF50T supports a low-power PCIe Gen 2 interface for WLAN and a UART/PCM interface for BT, and also
supports LTE & WLAN/BT coexistence interface. It is designed to be used in conjunction with Quectel 5G
V2X module AG55xQ series to provide it with WLAN and BT functions.
2.2. Key Features
The following table describes the key features of AF50T module.
Table 1: Key Features
Features Details
Power Supply
Core supply voltage: 0.95 V, 1.35 V, 1.9 V
I/O supply voltage: 1.8 V
RF supply voltage: 3.85 V
Operating Frequency
 2.4 GHz WLAN: 2.412–2.472 GHz
 5 GHz WLAN: 5.180–5.825 GHz
 BT: 2.402–2.480 GHz
Transmission Data
Rates
 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps
 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps,
48 Mbps, 54 Mbps
 802.11n: HT20 (MCS0-7), HT40 (MCS0-7)
 802.11ac: VHT20 (MCS0-8), VHT40 (MCS0-9), VHT80 (MCS0-9)
 802.11ax: HE20 (MCS0-11), HE40 (MCS0-11), HE80 (MCS0-11)

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Transmitting Power
2.4 GHz
802.11b/11 Mbps: 20 dBm
802.11g/54 Mbps: 16 dBm
802.11n/HT20 MCS7: 16 dBm
802.11n/HT40 MCS7: 16 dBm
802.11ax/HE20 MCS11: 14 dBm
802.11ax/HE40 MCS11: 14 dBm
5 GHz
802.11a/54 Mbps: 15 dBm
802.11n/HT20 MCS7: 15 dBm
802.11n/HT40 MCS7: 15 dBm
802.11ac/VHT20 MCS8: 14 dBm
802.11ac/VHT40 MCS9: 13 dBm
802.11ac/VHT80 MCS9: 13 dBm
802.11ax/HE20 MCS11: 12 dBm
802.11ax/HE40 MCS11: 12 dBm
802.11ax/HE80 MCS11: 12 dBm
Protocol Features
 IEEE 802.11 a/b/g/n/ac/ax
 Bluetooth 5.1
Operation Mode AP, STA
Modulation CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM, 1024QAM
WLAN Interface PCIe
BT Interface UART and PCM
Antenna Interface
 Wi-Fi/BT antenna interface
 50 Ω impedance
Physical Characteristics
 Size: (19.5 ±0.2) mm × (21.5 ±0.2) mm × (2.3 ±0.2) mm
 Package: LGA
 Weight: 2.1 g
Temperature Range
 Operating temperature range: -40 °C to +85 °C
 Storage temperature range: -40 °C to +95 °C
RoHS All hardware components are fully compliant with EU RoHS directive

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2.3. Functional Diagram
The following figure shows a block diagram of AF50T module.
Figure 1: Functional Diagram of AF50T Module
2.4. Evaluation Board
To help customers develop applications with AF50T module conveniently, Quectel supplies the evaluation
board (EVB), USB to RS232 converter cable, USB data cable, power adapter, antenna and other
peripherals to control or test the module. For more details, see document [1] and/or document [2].

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3
Application Interfaces
3.1. General Description
AF50T module is equipped with 108 LGA pins that can be connected to the cellular application platform.
The subsequent chapters will provide a detailed introduction to the following interfaces and pins of the
module:
 Power supply
 WLAN interface
 BT interface
 Control signal pins*
 Coexistence interfaces
 WLAN_SLP_CLK interface
 RF antenna interfaces

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3.2. Pin Assignment
Power Pins GND Pins
RESERVED Pins
PCIe Pins
UART Pins ANT Pins Signal Pins
PCM Pins
85
GND
106
GND
22
BT_
WAKEUP_
HOST
21
RESERVED
20
VDD_RF
19
VDD_RF
18
RESERVED
17
RESERVED
16
COEX_RXD
15
WLAN_SLP
_CLK
14
PCIE_RST_
N
13
PCIE_WAK
E_N
12
PCIE_CLKR
EQ_N
23
HOST_
WAKEUP_
BT
65
RESERVED
64
RESERVED
63
VDD_RF
62
RESERVED
61
RESERVED
60
RESERVED
59
COEX_TXD
58
RESERVED
57
SW_CTRL
107
GND
36
PCM_DOUT
37
PCM_CLK
38
BT_CTS
39
BT_TXD
40
RESERVED
41
LAA_TXEN
42
WLAN_TXE
N
43
VDD_IO
44
GND
45
VDD_CORE
_VM
46
VDD_CORE
_VH
35
PCM_SYNC
76
PCM_DIN
77
BT_RTS
78
BT_RXD
79
RESERVED
80
PA_MUTE
81
LAA_RX
82
LAA_AS_EN
83
BT_EN
84
WLAN_EN
108
GND
86
GND
87
GND
88
GND
98
GND
99
GND
100
GND
89
GND
97
GND
104
GND
101
GND
90
GND
96
GND
103
GND
102
GND
91
GND
95
GND
94
GND
93
GND
92
GND
105
GND
Figure 2: Pin Assignment (Top View)
Please keep all RESERVED pins open.
NOTE

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3.3. Pin Description
The following tables show the pin description of AF50T module.
Table 2: I/O Parameters Definition
Table 3: Pin Description
Type Description
AI Analog Input
AO Analog Output
DI Digital Input
DO Digital Output
IO Bidirectional
PI Power Input
Power Supply
Pin Name Pin
No. I/O Description DC Characteristics Comment
VDD_CORE_
VL
1, 2,
47 PI Voltage for core, low voltage
Vmin = 0.9 V
Vnorm = 0.95 V
Vmax = 1.05 V
It must be provided
with sufficient current
up to 1.7 A.
VDD_CORE_
VM 45 PI Voltage for core, mid voltage
Vmin = 1.28 V
Vnorm = 1.35 V
Vmax = 1.42 V
It must be provided
with sufficient current
up to 0.4 A.
VDD_CORE_
VH 46 PI Voltage for core, high voltage
Vmin = 1.85 V
Vnorm = 1.9 V
Vmax = 2.0 V
It must be provided
with sufficient current
up to 0.4 A.
VDD_IO 43 PI Power supply for the
module’s I/O pins
Vmin = 1.71 V
Vnorm = 1.8 V
Vmax = 1.89 V
It must be provided
with sufficient current
up to 50 mA.
VDD_RF 19, 20,
63 PI Power supply for the module’s RF part
Vmin = 3.3 V
Vnorm = 3.85 V
Vmax = 4.25 V
It must be provided
with sufficient current
up to 1.3 A.
GND 6, 24, 26, 27, 29, 30, 31, 32, 34, 44, 51, 66, 67, 69, 70, 74, 75, 85–108

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WLAN Interface
Pin Name Pin
No. I/O Description DC Characteristics Comment
WLAN_EN 84 DI WLAN function
enable control
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
Active high.
PCIE_
REFCLK_P 54 AI PCIe reference clock (+)
Require differential
impedance of 85 Ω.
PCIE_
REFCLK_M 9 AI PCIe reference clock (-)
PCIE_TX_P 52 AO PCIe transmit (+)
PCIE_TX_M 7 AO PCIe transmit (-)
PCIE_RX_P 56 AI PCIe receive (+)
PCIE_RX_M 11 AI PCIe receive (-)
PCIE_
CLKREQ_N 12 DO
PCIe clock request VOLmax = 0.45 V
VOHmin = 1.35 V 1.8 V power domain
PCIE_RST_N 14 DI PCIe reset
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain
PCIE_
WAKE_N 13 DO
PCIe wakes up host VOLmax = 0.45 V
VOHmin = 1.35 V 1.8 V power domain
BT Interface
Pin Name Pin
No. I/O Description DC Characteristics Comment
BT_EN 83 DI BT enable control
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
Active high.
PCM_DIN* 76 DI PCM data input
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
PCM_SYNC* 35 DI PCM data frame
sync
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.

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PCM_CLK* 37 DI PCM clock
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
PCM_DOUT* 36 DO PCM data output VOLmax = 0.45 V
VOHmin = 1.35 V 1.8 V power domain.
BT_RTS 77 DO
BT UART request to
send
VOLmax = 0.45 V
VOHmin = 1.35 V 1.8 V power domain.
BT_CTS 38 DI BT UART clear to
send
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
BT_TXD 39 DO BT UART transmit VOLmax = 0.45 V
VOHmin = 1.35 V 1.8 V power domain.
BT_RXD 78 DI BT UART receive
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
Control Signal Pins*
Pin Name Pin
No. I/O Description DC Characteristics Comment
SW_CTRL 57 DO
Control PMIC
outputs
VOLmax = 0.45 V
VOHmin = 1.35 V 1.8 V power domain.
HOST_
WAKEUP_ 23 DI Host wakes up BT
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
If unused, keep this
pin open.
BT_WAKEUP_
HOST 22 DO
BT wakes up the
host
VOLmax = 0.45 V
VOHmin = 1.35 V
1.8 V power domain.
If unused, keep this
pin open.
Coexistence Interfaces
Pin Name Pin
No. I/O Description DC Characteristics Comment
COEX_TXD 59 DO
LTE/WLAN & BT
coexistence
transmit
VOLmax = 0.45 V
VOHmin = 1.35 V
1.8 V power domain.
If unused, keep this
pin open.
COEX_RXD 16 DI
LTE/WLAN & BT
coexistence
receive
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
If unused, keep this
pin open.
LAA_AS_EN* 82 DI Allow LAA to control VILmin = -0.3 V 1.8 V power domain.

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WLAN FEM during
WLAN sleep mode
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
If unused, keep this
pin open.
LAA_TXEN* 41 DI WLAN XFEM control
LAA TX enable
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
If unused, keep this
pin open.
LAA_RX* 81 DI WLAN XFEM control
for LAA receiver
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
If unused, keep this
pin open.
WLAN_TXEN* 42 DO
WLAN XFEM control
for WLAN TX enable
VOLmax = 0.45 V
VOHmin = 1.35 V
1.8 V power domain.
If unused, keep this
pin open.
PA_MUTE* 80 DI WLAN XFEM control
to disable WLAN PA
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
If unused, keep this
pin open.
RF Antenna Interfaces
Pin Name Pin
No. I/O Description DC Characteristics Comment
ANT_WIFI0 28 IO
BT and 2.4/5 GHz
WLAN antenna
interface 0
50 Ω impedance
ANT_WIFI1 33 IO 2.4/5 GHz WLAN
antenna interface 1 50 Ω impedance
ANT_BT 25 IO Reserved dedicated
BT antenna interface
50 Ω impedance
WLAN_SLP_CLK Interface
Pin Name Pin
No. I/O Description DC Characteristics
Comment
WLAN_SLP_C
LK 15 DI External 32.768 kHz sleep clock input
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
RESERVED Interfaces
Pin Name Pin No. Comment
RESERVED 3, 4, 5, 8, 10, 17, 18, 21, 40, 48, 49, 50, 53, 55, 58, 60, 61,62,
64, 65, 68, 71–73, 79
Keep these pins
open.

Wi-Fi&BT Module Series
AF50T Hardware Design
AF50T_Hardware_Design 19 / 52
3.4. Power Supply
The following table shows the power supply pins and ground pins of AF50T module.
Table 4: Definition of Power Supply and GND Pins
The VDD_CORE_VL, VDD_CORE_VM, VDD_CORE_VH, and VDD_IO can be powered by AG55xQ
series module, as the following figure shows.
Figure 3: Reference Circuit for VDD_CORE_VL, VDD_CORE_VM, VDD_CORE_VH, and VDD_IO
1. Please keep all RESERVED and unused pins open.
2. “*” means under development.
Pin Name Pin No. Description Min. Typ. Max. Unit
VDD_
CORE_VL 1, 2, 47 Voltage for core, low voltage 0.9 0.95 1.05 V
VDD_
CORE_VM
45 Voltage for core, mid voltage 1.28 1.35 1.42 V
VDD_
CORE_VH
46 Voltage for core, high voltage 1.85 1.9 2.0 V
VDD_IO 43 Power supply for the module’s I/O
pins 1.71 1.8 1.89 V
VDD_RF 19, 20, 63 Power supply for the module’s RF
part 3.3 3.85 4.25 V
GND 6, 24, 26, 27, 29, 30, 31, 32, 34, 44, 51, 66, 67, 69,
70, 74, 75, 85–108
NOTES