Quectel SC20-WL Supplement

SC20-WL Hardware Design
Smart Wi-Fi Module Series
Rev: SC20-WL_Hardware_Design_V1.0
Date: 2019-12-16
www.quectel.com

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About the Document
History
Revision
Date
Author
Description
1.0
2019-12-16
Quinn.lv
Initial

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Contents
About the Document...................................................................................................................................2
Contents.......................................................................................................................................................3
Table Index...................................................................................................................................................5
Figure Index.................................................................................................................................................6
1Introduction........................................................................................................................................11
1.1. Safety Information....................................................................................................................11
2Product Concept................................................................................................................................13
2.1. General Description.................................................................................................................13
2.2. Key Features ...........................................................................................................................14
2.3. Functional Diagram .................................................................................................................16
2.4. Evaluation Board .....................................................................................................................17
3Application Interfaces .......................................................................................................................18
3.1. General Description.................................................................................................................18
3.2. Pin Assignment........................................................................................................................19
3.3. Pin Description.........................................................................................................................20
3.4. Power Supply...........................................................................................................................29
3.4.1. Power Supply Pins.........................................................................................................29
3.4.2. Decrease Voltage Drop..................................................................................................29
3.4.3. Reference Design for Power Supply..............................................................................30
3.5. Turn on and off Scenarios .......................................................................................................31
3.5.1. Turn on Module Using the PWRKEY.............................................................................31
3.5.2. Turn off Module..............................................................................................................33
3.6. VRTC Interface........................................................................................................................34
3.7. Power Output...........................................................................................................................35
3.8. Battery Charge and Management...........................................................................................35
3.9. USB Interface ..........................................................................................................................37
3.10. UART Interfaces......................................................................................................................39
3.11. SD Card Interface....................................................................................................................40
3.12. GPIO Interfaces.......................................................................................................................42
3.13. SPI Interface............................................................................................................................44
3.14. I2C Interfaces ..........................................................................................................................45
3.15. ADC Interfaces ........................................................................................................................46
3.16. Motor Drive Interface...............................................................................................................46
3.17. LCM Interface..........................................................................................................................47
3.18. Touch Panel Interface..............................................................................................................50
3.19. Camera Interfaces...................................................................................................................51
3.19.1. Rear Camera Interface...................................................................................................51
3.19.2. Front Camera Interface..................................................................................................53
3.19.3. Design Considerations...................................................................................................55
3.20. Sensor Interfaces.....................................................................................................................56

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3.21. Audio Interfaces.......................................................................................................................57
3.21.1. Reference Circuit Design for Microphone......................................................................58
3.21.2. Reference Circuit Design for Receiver Interface...........................................................58
3.21.3. Reference Circuit Design for Headphone Interface.......................................................59
3.21.4. Reference Circuit Design for Loudspeaker Interface.....................................................59
3.21.5. Audio Interface Design Considerations .........................................................................59
3.22. Emergency Download Interface..............................................................................................60
4Wi-Fi and BT.......................................................................................................................................61
4.1. Wi-Fi Overview ........................................................................................................................61
4.1.1. Wi-Fi Performance.........................................................................................................61
4.2. BT Overview ............................................................................................................................63
4.2.1. BT Performance.............................................................................................................64
5Antenna Interface...............................................................................................................................65
5.1. Wi-Fi/BTAntenna Interface .....................................................................................................65
5.1.1. Reference Design of RF Layout.....................................................................................66
5.2. Antenna Installation.................................................................................................................68
5.2.1. Antenna Requirements ..................................................................................................68
5.2.2. Recommended RF Connector for Antenna Installation.................................................68
6Electrical, Reliability and Radio Characteristics............................................................................70
6.1. Absolute Maximum Ratings.....................................................................................................70
6.2. Power Supply Ratings.............................................................................................................70
6.3. Charging Performance Specifications.....................................................................................71
6.4. Operation and StorageTemperatures......................................................................................71
6.5. Current Consumption ..............................................................................................................72
6.6. Electrostatic Discharge............................................................................................................73
7Mechanical Dimensions....................................................................................................................74
7.1. Mechanical Dimensions of the Module....................................................................................74
7.2. Recommended Footprint.........................................................................................................76
7.3. Top and Bottom Views of the Module......................................................................................77
8Storage, Manufacturing and Packaging..........................................................................................78
8.1. Storage.....................................................................................................................................78
8.2. Manufacturing and Soldering ..................................................................................................79
8.3. Packaging................................................................................................................................80
9Appendix A References.....................................................................................................................82

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Table Index
TABLE 1: SC20-WL FREQUENCY BANDS...................................................................................................... 13
TABLE 2: SC20-WL KEY FEATURES............................................................................................................... 14
TABLE 3: I/O PARAMETERS DEFINITION....................................................................................................... 20
TABLE 4: PIN DESCRIPTION........................................................................................................................... 20
TABLE 5: POWER DESCRIPTION................................................................................................................... 35
TABLE 6: PIN DEFINITION OF USB INTERFACE ........................................................................................... 37
TABLE 7: USB TRACE LENGTH INSIDE THE MODULE................................................................................. 38
TABLE 8: PIN DESCRIPTION OF UART INTERFACES .................................................................................. 39
TABLE 9: PIN DEFINITION OF SD CARD INTERFACE .................................................................................. 40
TABLE 10: SDIO TRACE LENGTH INSIDE THE MODULE............................................................................. 42
TABLE 11: PIN DEFINITION OF GPIO INTERFACES...................................................................................... 42
TABLE 12: PIN DEFINITION OF SPI INTERFACE........................................................................................... 45
TABLE 13: PIN DEFINITION OF I2C INTERFACE........................................................................................... 45
TABLE 14: PIN DEFINITION OF ADC INTERFACES....................................................................................... 46
TABLE 15: PIN DEFINITION OF MOTOR DRIVE INTERFACE ....................................................................... 46
TABLE 16: PIN DEFINITION OF LCM INTERFACE......................................................................................... 47
TABLE 17: PIN DEFINITION OF TOUCH PANEL INTERFACE ....................................................................... 50
TABLE 18: PIN DEFINITION OF REAR CAMERA INTERFACE ...................................................................... 52
TABLE 19: PIN DEFINITION OF FRONT CAMERA INTERFACE.................................................................... 53
TABLE 20: MIPI TRACE LENGTH INSIDE THE MODULE............................................................................... 55
TABLE 21: PIN DEFINITION OF SENSOR INTERFACES............................................................................... 56
TABLE 22: PIN DEFINITION OF AUDIO INTERFACES................................................................................... 57
TABLE 23: Wi-Fi TRANSMITTING PERFORMANCE....................................................................................... 61
TABLE 24: Wi-Fi RECEIVING PERFORMANCE.............................................................................................. 62
TABLE 25: BT DATA RATE AND VERSION...................................................................................................... 63
TABLE 26: BT TRANSMITTING AND RECEIVING PERFORMANCE ............................................................. 64
TABLE 27: PIN DEFINITION OF Wi-Fi/BT ANTENNA...................................................................................... 65
TABLE 28: Wi-Fi/BT FREQUENCY................................................................................................................... 65
TABLE 29: ANTENNA REQUIREMENTS.......................................................................................................... 68
TABLE 30: ABSOLUTE MAXIMUM RATINGS.................................................................................................. 70
TABLE 31: SC20-WL MODULE POWER SUPPLY RATINGS.......................................................................... 70
TABLE 32: CHARGING PERFORMANCE SPECIFICATIONS......................................................................... 71
TABLE 33: OPERATION TEMPERATURE........................................................................................................ 71
TABLE 34: SC20-WL CURRENT CONSUMPTION .......................................................................................... 72
TABLE 35: ESD CHARACTERISTICS (TEMPERATURE: 25°C, HUMIDITY: 45%)......................................... 73
TABLE 36: RECOMMENDED THERMAL PROFILE PARAMETERS............................................................... 79
TABLE 37: REEL PACKAGING......................................................................................................................... 81
TABLE 38: RELATED DOCUMENTS................................................................................................................ 82
TABLE 39: TERMS AND ABBREVIATIONS...................................................................................................... 82

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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 17
FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 19
FIGURE 3: VOLTAGE DROP SAMPLE............................................................................................................. 30
FIGURE 4: POWER SUPPLY ........................................................................................................................... 30
FIGURE 5: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 31
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT................................................................... 32
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 32
FIGURE 8: TIMING OF TURNING ON MODULE ............................................................................................. 33
FIGURE 9: TIMING OF TURNING OFF MODULE ........................................................................................... 34
FIGURE 10: RTC POWERED BY COIN CELL................................................................................................. 34
FIGURE 11: RTC POWERED BY CAPACITOR................................................................................................ 34
FIGURE 12: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT................................................... 36
FIGURE 13: USB INTERFACE REFERENCE DESIGN (OTG IS NOT SUPPORTED) ................................... 37
FIGURE 14: USB INTERFACE REFERENCE DESIGN (OTG IS SUPPORTED)............................................ 38
FIGURE 15: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART1) ............................... 39
FIGURE 16: RS232 LEVEL MATCH CIRCUIT (FOR UART1).......................................................................... 40
FIGURE 17: REFERENCE CIRCUIT FOR SD CARD INTERFACE................................................................. 41
FIGURE 18: REFERENCE CIRCUIT FOR MOTOR CONNECTION................................................................ 47
FIGURE 19: REFERENCE CIRCUIT DESIGN FOR LCM INTERFACE........................................................... 49
FIGURE 20: REFERENCE DESIGN FOR BACKLIGHT DIRVING CIRCUIT................................................... 50
FIGURE 21: REFERENCE CIRCUIT DESIGN FOR TP INTERFACE.............................................................. 51
FIGURE 22: REFERENCE CIRCUIT DESIGN FOR REAR CAMERA INTERFACE........................................ 53
FIGURE 23: REFERENCE CIRCUIT DESIGN FOR FRONT CAMERA INTERFACE...................................... 54
FIGURE 24: REFERENCE CIRCUIT DESIGN FOR MICROPHONE INTERFACE ......................................... 58
FIGURE 25: REFERENCE CIRCUIT DESIGN FOR RECEIVER INTERFACE................................................ 58
FIGURE 26: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE ........................................... 59
FIGURE 27: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE....................................... 59
FIGURE 28: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE..................... 60
FIGURE 29: REFERENCE CIRCUIT DESIGN FOR Wi-Fi/BTANTERNNA..................................................... 65
FIGURE 30: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB...................................................................... 66
FIGURE 31: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB.................................................. 66
FIGURE 32: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND).......................................................................................................................................................... 67
FIGURE 33: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND).......................................................................................................................................................... 67
FIGURE 34: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)................................................ 68
FIGURE 35: MECHANICAL PARAMETERS OF U.FL-LP CONNECTORS...................................................... 69
FIGURE 36: SPACE FACTOR OF MATED CONNECTORS (UNIT: MM)......................................................... 69
FIGURE 37: MODULE TOPAND SIDE DIMENSIONS..................................................................................... 74
FIGURE 38: MODULE BOTTOM DIMENSIONS (TOP VIEW)......................................................................... 75
FIGURE 39: RECOMMENDED FOOTPRINT (TOP VIEW).............................................................................. 76

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FIGURE 40: TOP VIEWS OF THE MODULE ................................................................................................... 77
FIGURE 41: BOTTOM VIEW OF THE MODULE.............................................................................................. 77
FIGURE 42: REFLOW SOLDERING THERMAL PROFILE.............................................................................. 79
FIGURE 43: TAPE DIMENSIONS..................................................................................................................... 80
FIGURE 44: REEL DIMENSIONS..................................................................................................................... 81

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OEM/Integrators Installation Manual
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B,
the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter
module(s) are installed and operating. The modules should be transmitting and the evaluation should
confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band
emissions). The host manufacturer must verify that there are no additional unintentional emissions other
than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The
Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on
the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a
second label must be placed on the outside of the final device that contains the following text:
“Contains FCC ID: XMR201911SC20WL ”
“Contains IC: 10224A-2019SC20WL “
The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC
ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular

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installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
Industry Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following
two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired operation
of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement."
The device could automatically discontinue transmission in case of absence of information to transmit, or
operational failure. Note that this is not intended to prohibit transmission of control or signaling information
or the use of repetitive codes where required by the technology.
The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for
harmful interference to co-channel mobile satellite systems; The maximum antenna gain permitted for
devices in the bands 5250–5350 MHz and 5470–5725 MHz shall comply with the e.i.r.p. limit; and The
maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p.
limits specified for point-to-point and non point-to-point operation as appropriate.
L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations à
transmettre ou de panne opérationnelle. Notez que ceci n'est pas destinéàinterdire la transmission
d'informations de contrôle ou de signalisation ou l'utilisation de codes répétitifs lorsque cela est requis par
la technologie.
Le dispositif utilisédans la bande 5150-5250 MHz est réservéàune utilisation en intérieur afin de réduire
le risque de brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal; Le gain
d'antenne maximal autorisépour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725 MHz doit
être conforme àla norme e.r.p. limite; et Le gain d'antenne maximal autorisépour les appareils de la

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bande 5725-5825 MHz doit être conforme àla norme e.i.r.p. les limites spécifiées pour un fonctionnement
point àpoint et non point àpoint, selon le cas
CAN ICES-3(B)/ NMB-3(B)
Radiation Exposure Statement
This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm between the radiator &
your body.

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1Introduction
This document defines the SC20-WL module, its air interface and hardware interface which are
connected with customers’ application.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details as well as other related information of SC20-WL module. Associated with application
notes and user guides, customers can use SC20-WL module to design and set up mobile applications
easily.
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating SC20-WL module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with

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unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver.When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fueling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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2Product Concept
2.1. General Description
SC20-WL is a series of Smart Wi-Fi module based on Qualcomm platform and Linux operating system,
and provides industrial grade performance. Its general features are listed below:
Support short-range wireless communication via
Wi-Fi 802.11a/b/g/n and BT4.2 LE.
Support multiple audio and video codecs.
Built-in high performance AdrenoTM 304 graphics
processing unit.
Enable smooth play of 720P videos.
Provide multiple audio and video input/output interfaces as
well as abundant GPIO interfaces.
The following table shows the supported Wi-Fi/BT standards and frequency range of SC20-WL series
module.
Table 1: SC20-WL Frequency Bands
SC20-WL is an SMD type module, which can be embedded into applications through its 210-pin pads
including 146 LCC signal pads and 64 other pads. With a compact profile of 40.5mm ×40.5mm ×2.8mm,
SC20-WL can meet almost all requirements for M2M applications such as CPE, wireless POS, smart
metering, automotive, digital signage, alarm panel, security and industrial PDA.
Type
Network Standard
Frequency Range
SC20-WL R1.1
IEEE 802.11b/g/n
2402MHz~2482MHz
IEEE 802.11a/n
5180MHz~5825MHz
BT4.2 LE
2402MHz~2480MHz

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2.2. Key Features
The following table describes the detailed features of SC20-WL module.
Table 2: SC20-WL Key Features
Feature
Details
Applications Processor
ARM Cortex-A7 microprocessor cores (quad-core) up to 1.1 GHz
512KB L2 cache
Modem DSP
QDSP6 v5 core up to 691.2MHz
768KB L2 cache
Memory
8GB eMMC + 8Gb LPDDR3
16GB eMMC + 16Gb LPDDR3
Operating System
Linux
Power Supply
Supply voltage: 3.5V~4.2V
Typical supply voltage: 3.8V
WLAN Features
SC20-WL R1.1
2.4GHz/5GHz double frequency bands
Support 802.11a/b/g/n standards, with max data rate up to 150Mbps
Support AP mode
Bluetooth Feature
BT4.2 LE
AT Commands
3GPP TS 27.007 and 3GPP TS 27.005 AT commands as well as Quectel
enhanced AT commands
LCM Interface
4-lane MIPI_DSI, up to 1.5Gbps for each lane
Support WVGA (2-lane MIPI_DSI), up to 720p (4-lane MIPI_DSI)
24-bit color depth
Camera Interfaces
Use MIPI_CSI, up to 1.5Gbps per lane
Support two cameras:
2-lane MIPI_CSI for rear camera, max pixel up to 8MP
1-lane MIPI_CSI for front camera, max pixel up to 2MP
Video Codec
Video encoding:
H.264 BP/MP –720p @30fps
MPEG-4 SP/H.263 P0 –WVGA @30fps
VP8 –WVGA @30fps
Video decoding:
H.264 BP/MP/HP –1080P @30fps
MPEG-4 SP/ASP –1080P @30fps
DivX 4x/5x/6x –1080P @30fps
H.263 P0 –WVGA @30fps

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VP8 –1080P @30 fps
(HEVC) H.265 MP 8 bit –1080P @30fps
Audio Interfaces
Audio input:
2 groups of analog microphone input, integrating internal bias voltage
Audio output:
Class AB stereo headphone output
Class AB earpiece differential output
Class D speaker differential amplifier output
Audio Codec
HR, FR, EFR, AMR, AMR-WB
USB Interface
Compliant with USB 2.0 specification; the data transfer rate can reach up to
480Mbps
Used for AT command communication, data transmission, software
debugging and firmware upgrade
Support USB OTG (Need additional 5V power supply chip)
USB Driver: Support Windows XP, Windows Vista, Windows 7/8/8.1,
Linux 2.6 or later
UART Interfaces
2 UART interfaces: UART1 and UART2
UART1: 4-wire UART interface with RTS/CTS hardware flow control;
baud rate up to 4Mbps
UART2: 2-wire UART interface used for debugging
Motor Drive Interface
Drive ERM motor
SD Card Interface
Support SD 3.0, 4-bit SDIO
Support hot-plug
I2C Interfaces
3 groups of I2C
Used for peripherals such as camera, sensor, touch panel, etc.
ADC Interfaces
Support 3 ADC interfaces;
Used for input voltage sense, battery temperature detection and
general-purpose ADC
Real Time Clock
Supported
Antenna Interface
Wi-Fi/BT antenna
Physical Characteristics
Size: (40.5±0.15)mm × (40.5±0.15)mm × (2.8±0.2) mm
Package: LCC
Weight: approx. 9.8g
Temperature Range
Operation temperature range: -35°C~+65°C 1)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
Over USB interface
RoHS
All hardware components are fully compliant with EU RoHS directive

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1. 1) Within operation temperature range, the module is IEEE specifications.
2. 2) Within extended temperature range, the module remains
the ability for data transmission. There is no unrecoverable malfunction. There are also no effects on
radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in
their value and exceed the specified tolerances. When the temperature returns to the normal
operation temperature levels, the module will meet IEEE specifications again.
2.3. Functional Diagram
The following figure shows a block diagram of SC20-WL and illustrates the major functional parts.
Power management
Radio frequency
Baseband
LPDDR3+EMMC flash
Peripheral interfaces
-- USB interface
-- UART interfaces
-- SD card interface
-- I2C interfaces
-- ADC interfaces
-- LCM (MIPI) interface
-- Touch Panel interface
-- Camera (MIPI) interfaces
-- Audio interfaces
NOTES

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Baseband
PMIC
LPDDR3+
EMMC
USB_VBUS
PWRKEY
ADC
LDO Output USBTP UART I2C
AUDIO
19.2M
XO
GPIO
VBAT_BB
LCM (MIPI) CAM (MIPI) SD
Card
SAW
ANT_WIFI/BT
WCN
RESET_N
VRTC
Figure 1: Functional Diagram
2.4. Evaluation Board
In order to help customers to develop applications with SC20-WL, Quectel supplies the evaluation board
(Smart-EVB), RS-232 to USB cable, USB data cable, earphone, antenna and other peripherals to control
or test the module. For more details, please refer to document [1].

Smart Wi-Fi Module Series
SC20-WL Hardware Design
SC20-WL_Hardware_Design 18 / 81
3Application Interfaces
3.1. General Description
SC20-WL is equipped with 146-pin 1.0mm pitch SMT pads plus 64-pin ground/reserved pads that can be
embedded into wireless application platforms. The following chapters provide the detailed description of
pins/interfaces listed below.
Power supply
VRTC interface
USB interface
UART interfaces
SD card interface
GPIO interfaces
SPI interface
I2C interfaces
ADC interfaces
Motor drive interface
LCM interface
TP interface
Camera interfaces
Sensor interfaces
Audio interfaces
Emergency download interface

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SC20-WL Hardware Design
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3.2. Pin Assignment
The following figure shows the pin assignment of SC20-WL module.
GND
USB OTHERS
102
GND GND
GND
SDC2 GPIO ANT
UART
AUDIO CAMERA
MIPI_CSI1_LN0P
MIPI_CSI1_LN0N
MIPI_CSI1_CLKP
MIPI_CSI1_CLKN
MIPI_CSI0_LN1P
MIPI_CSI0_LN1N
MIPI_CSI0_LN0P
MIPI_CSI0_LN0N
MIPI_CSI0_CLKP
MIPI_CSI0_CLKN
MIPI_DSI_LN3P
MIPI_DSI_LN3N
MIPI_DSI_LN2P
MIPI_DSI_LN2N
MIPI_DSI_LN1P
MIPI_DSI_LN1N
MIPI_DSI_LN0P
MIPI_DSI_LN0N
MIPI_DSI_CLKP
MIPI_DSI_CLKN
LCD_TE
TP
LCD_RST
VBAT_BB
VBAT_BB
GND
MIC1P
MIC_GND
MIC2P
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
101
100
99
98
97
96
95
103
102
105
104
107
106
109
108
110
112
111
114
113
116
115
118
117 119
121
120
123
122
125
124
126 128
127
130
129
132
131
133 135
134
137
136
139
138
140 142
141
144
143
146
145
148
147
152
151
154
167
169
168
170
165
164
166
163
180
181 188
189
158 156
157
155
160
161
159
162
184
186
185
175 177
176
178
173
172
174
171
193
192
208
209
201
202
200
206
203
GND
EARP
EARN
GND
USB_VBUS USB_VBUS
GND GND
HS_DET
HPH_L
HPH_GND
HPH_R
GND
VBAT_THERM
VBAT_SNS
GND GND
ADC
CHARGE_SEL
LDO17_2V85
VRTC
LDO6_1V8
GPIO_17 GPIO_16 GND GND
GPIO_8 GPIO_9
GPIO_10 GPIO_11 GPIO_95
PWRKEY
GPIO_99 GPIO_58
LDO5_1V8
GPIO_96
GPIO_65
GPIO_36
GPIO_94
GPIO_98
GPIO_0
GPIO_110
GPIO_97
GPIO_68
GPIO_69
GPIO_89
GPIO_88
GPIO_92
GPIO_31
KEY_VOL_DOWN
KEY_VOL_UP
UART2_TXD
UART2_RXD
SENSOR_I2C_SDA
SENSOR_I2C_SCL
GPIO_32
GND
GND
GND
GND
CAM_I2C_SDA
CAM_I2C_SCL
CAM1_PWD
CAM1_RST
CAM0_PWD
CAM0_RST
GND
GND
ANT_WIFI/BT
CAM1_MCLK
CAM0_MCLK
SPKP
SPKN
GND
USB_DM
USB_DP
GND
USB_ID
GND
VIB_DRV
PWM
TP_INT
TP_RST
SD_LDO12
GPIO_23
UART1_TXD
UART1_RXD
UART1_CTS
UART1_RTS
SD_LDO11
SD_CLK
SD_CMD
SD_DATA0
SD_DATA1
SD_DATA2
SD_DATA3
SD_DET
USB_BOOT
TP_I2C_SCL
TP_I2C_SDA
LCM POWER
179
182
195
196
197
198 187
190
205
204
207 191
194
210
149
150
153
199
183
RESERVED
Figure 2: Pin Assignment (Top View)