Quectel AF55C Supplement

AF55C Hardware Design
Automotive Wi-Fi&Bluetooth Module Series
Version: 1.0.0
Date: 2023-03-29
Status: Preliminary

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 1 / 58
At Quectel, our aim is to provide timely and comprehensive services to our customers. If you
require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai
200233, China
Tel: [phone]
Email: [e-mail]
Or our local offices. For more information, please visit:
http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm.
Or email us at: [e-mail].
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we
make every effort to ensure its quality. You agree that you are responsible for using independent analysis
and evaluation in designing intended products, and we provide reference designs for illustrative purposes
only. Before using any hardware, software or service guided by this document, please read this notice
carefully. Even though we employ commercially reasonable efforts to provide the best possible
experience, you hereby acknowledge and agree that this document and related services hereunder are
provided to you on an “as available” basis. We may revise or restate this document from time to time at
our sole discretion without any prior notice to you.
Use and Disclosure Restrictions
License Agreements
Documents and information provided by us shall be kept confidential, unless specific permission is
granted. They shall not be accessed or used for any purpose except as expressly provided herein.
Copyright
Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall
not be copied, reproduced, distributed, merged, published, translated, or modified without prior written
consent. We and the third party have exclusive rights over copyrighted material. No license shall be
granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid
ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal
non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for
noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of
the material.

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 2 / 58
Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights
to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel
or any third party in advertising, publicity, or other aspects.
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties
(“third-party materials”). Use of such third-party materials shall be governed by all restrictions and
obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials,
including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular
purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any
third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein
constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell,
offer for sale, or otherwise maintain production of any our products or any other hardware, software,
device, tool, information, or product. We moreover disclaim any and all warranties arising from the course
of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,
including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the
relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the
purpose of performing the service only or as permitted by applicable laws. Before data interaction with
third parties, please be informed of their privacy and data security policy.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein.
c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
otherwise provided by valid agreement, we make no warranties of any kind, either implied or express,
and exclude all liability for any loss or damage suffered in connection with the use of features and
functions under development, to the maximum extent permitted by law, regardless of whether such
loss or damage may have been foreseeable.
d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of
information, advertising, commercial offers, products, services, and materials on third-party websites
and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 3 / 58
Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 4 / 58
About the Document
Revision History
Version
Date
Author
Description
-
2023-01-04
Oir HUANG/
Ashley HUANG
Creation of the document
1.0.0
2023-03-29
Oir HUANG/
Ashley HUANG
Preliminary

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 5 / 58
Contents
Safety Information...................................................................................................................................... 3
About the Document.................................................................................................................................. 4
Contents...................................................................................................................................................... 5
Table Index.................................................................................................................................................. 7
Figure Index................................................................................................................................................ 8
1Introduction......................................................................................................................................... 9
1.1. Special Marks............................................................................................................................. 9
2Product Overview ............................................................................................................................. 10
2.1. General Description................................................................................................................. 10
2.2. Key Features............................................................................................................................ 10
2.3. Functional Diagram..................................................................................................................12
2.4. EVB Kit..................................................................................................................................... 12
3Application Interfaces ...................................................................................................................... 13
3.1. General Description................................................................................................................. 13
3.2. Pin Assignment ........................................................................................................................ 14
3.3. Pin Description.........................................................................................................................15
3.4. Power Supply........................................................................................................................... 19
3.5. Wi-Fi Application Interfaces .....................................................................................................19
3.5.1. WLAN_EN.....................................................................................................................20
3.5.2. PCIe Interfaces .............................................................................................................20
3.5.3. SDIO Interfaces*........................................................................................................... 22
3.6. Bluetooth Application Interfaces .............................................................................................. 23
3.6.1. BT_EN........................................................................................................................... 24
3.6.2. PCM Interfaces .............................................................................................................24
3.6.3. Bluetooth UART............................................................................................................ 25
3.7. Control Signals*.......................................................................................................................26
3.7.1. HOST_WAKE_BT & BT_WAKE_HOST ....................................................................... 26
3.7.2. HOST_WAKE_WLAN & WLAN_WAKE_HOST ........................................................... 26
3.8. Coexistence UART Interfaces.................................................................................................. 26
3.9. WLAN_SLP_CLK..................................................................................................................... 27
3.10. RFAntenna Interfaces.............................................................................................................27
3.10.1. Operating Frequencies.................................................................................................28
3.10.2. RFAntenna Reference Design..................................................................................... 28
3.10.3. RF Routing Guidelines..................................................................................................29
3.10.4. Antenna Design Requirements..................................................................................... 30
3.10.5. RF Connector Recommendation..................................................................................31
4Electrical Characteristics & Reliability........................................................................................... 33
4.1. Absolute Maximum Ratings.....................................................................................................33
4.2. Power Supply Ratings.............................................................................................................. 33

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 6 / 58
4.3. Digital I/O Characteristics ........................................................................................................34
4.4. Power Consumption................................................................................................................. 34
4.5. RF Performances.....................................................................................................................38
4.5.1. Wi-Fi Performances ......................................................................................................38
4.5.2. Bluetooth Performances ...............................................................................................41
4.6. ESD Protection......................................................................................................................... 41
4.7. Operating and Storage Temperatures......................................................................................42
4.8. Thermal Dissipation .................................................................................................................42
5Mechanical Information.................................................................................................................... 44
5.1. Mechanical Dimensions of the Module....................................................................................44
5.2. Recommended Footprint .........................................................................................................46
5.3. Top and Bottom Views ............................................................................................................. 47
6Storage, Manufacturing & Packaging............................................................................................. 48
6.1. Storage Conditions...................................................................................................................48
6.2. Manufacturing and Soldering................................................................................................... 49
6.3. Packaging Specifications......................................................................................................... 51
6.3.1. Carrier Tape...................................................................................................................51
6.3.2. Plastic Reel ...................................................................................................................52
6.3.3. Mounting Direction........................................................................................................52
6.3.4. Packaging Process .......................................................................................................53
7 Appendix References....................................................................................................................... 54

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 7 / 58
Table Index
Table 1: Special Marks.................................................................................................................................9
Table 2: Key Features................................................................................................................................10
Table 3: I/O Parameter Definition...............................................................................................................15
Table 4: Pin Description ............................................................................................................................. 15
Table 5: Definition of Power Supply and GND Pins................................................................................... 19
Table 6: Pin Definition of WLAN_EN..........................................................................................................20
Table 7: Pin Definition of PCIe Interfaces..................................................................................................20
Table 8: Pin Definition of SDIO Interfaces .................................................................................................22
Table 9: Pin Definition of BT_EN................................................................................................................24
Table 10: Pin Definition of PCM Interfaces................................................................................................ 24
Table 11: Pin Definition of Bluetooth UART ............................................................................................... 25
Table 12: Pin Definition of HOST_WAKE_BT & BT_WAKE_HOST.......................................................... 26
Table 13: Pin Definition of HOST_WAKE_WLAN & WLAN_WAKE_HOST .............................................. 26
Table 14: Pin Definition of Coexistence UART Interfaces..........................................................................26
Table 15: Pin Definition of WLAN_SLP_CLK............................................................................................. 27
Table 16: Pin Definition of RFAntenna Interfaces..................................................................................... 27
Table 17: Operating Frequencies (Unit: GHz)............................................................................................ 28
Table 18:Antenna Design Requirements...................................................................................................30
Table 19:Absolute Maximum Ratings (Unit: V) .........................................................................................33
Table 20: Module Power Supply Ratings (Unit: V)..................................................................................... 33
Table 21: VDD_IO I/O Requirements (Unit: V) ..........................................................................................34
Table 22: Power Consumption (Normal Operation)................................................................................... 34
Table 23: Tx Power at 2.4 GHz..................................................................................................................38
Table 24: Tx Power at 5 GHz.....................................................................................................................38
Table 25: Rx Sensitivity at 2.4 GHz (Unit: dBm)........................................................................................39
Table 26: Rx Sensitivity at 5 GHz (Unit: dBm)........................................................................................... 40
Table 27: RF Performance of Bluetooth (Unit: dBm) ................................................................................. 41
Table 28: Electrostatic Discharge Characteristics (Temperature: 25–30 ºC, Humidity: 40 ±5 %).............41
Table 29: Operating and Storage Temperatures (Unit: °C)........................................................................42
Table 30: Recommended Thermal Profile Parameters.............................................................................. 50
Table 31: Carrier Tape Dimension Table (Unit: mm).................................................................................. 51
Table 32: Plastic Reel Dimension Table (Unit: mm)...................................................................................52
Table 33: Related Documents....................................................................................................................54
Table 34: Terms and Abbreviations............................................................................................................ 54

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 8 / 58
Figure Index
Figure 1: Functional Diagram.....................................................................................................................12
Figure 2: PinAssignment (Top View).........................................................................................................14
Figure 3: Power-up Timing......................................................................................................................... 19
Figure 4: Wi-Fi Application Interface Connection.......................................................................................20
Figure 5: PCIe Interface Connection.......................................................................................................... 21
Figure 6: Bluetooth Interface Connection ..................................................................................................24
Figure 7: PCM Interface Connection..........................................................................................................25
Figure 8: Bluetooth UART Interface Connection ....................................................................................... 25
Figure 9: Coexistence UART Interface Connection...................................................................................27
Figure 10: RF Antenna Reference Design.................................................................................................28
Figure 11: Microstrip Design on a 2-layer PCB.......................................................................................... 29
Figure 12: Coplanar Waveguide Design on a 2-layer PCB....................................................................... 29
Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)....................29
Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)....................30
Figure 15: Dimensions of the Receptacle (Unit: mm)................................................................................31
Figure 16: Specifications of Mated Plugs................................................................................................... 32
Figure 17: Space Factor of Mated Connectors (Unit: mm)........................................................................32
Figure 18: Placement and Fixing of the Heatsink......................................................................................43
Figure 19: Top and Side Dimensions.........................................................................................................44
Figure 20: Bottom Dimension (Perspective View)..................................................................................... 45
Figure 21: Recommended Footprint..........................................................................................................46
Figure 22: Top and Bottom Views.............................................................................................................. 47
Figure 23: Recommended Reflow Soldering Thermal Profile ................................................................... 49
Figure 24: Carrier Tape Dimension Drawing..............................................................................................51
Figure 25: Plastic Reel Dimension Drawing ..............................................................................................52
Figure 26: Mounting Direction.................................................................................................................... 52
Figure 27: Packaging Process................................................................................................................... 53

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 9 / 58
1Introduction
This document defines the AF55C and describes its air interfaces and hardware interfaces which are
connected with your applications.
With this document, you can quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. The document, coupled with
application notes and user guides, makes it easy to design and set up automotive industry mobile
applications with the module.
1.1. Special Marks
Table 1: Special Marks
Mark
Definition
*
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin
name, AT command, or argument, it indicates that the function, feature, interface, pin, AT
command, or argument is under development and currently not supported; and the asterisk (*)
after a model indicates that the sample of the model is currently unavailable.
[…]
Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same
type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1,
SDIO_DATA2, and SDIO_DATA3.

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 10 / 58
2Product Overview
2.1. General Description
AF55C is an automotive-grade Wi-Fi and Bluetooth module with low power consumption. It is a single-die
Wi-Fi and Bluetooth combo solution supporting IEEE 802.11a/b/g/n/ac/ax 2.4 GHz and 5 GHz Wi-Fi
standards and Bluetooth 5.2 standard, which enables seamless integration of WLAN and Bluetooth Low
Energy (BLE) technologies.
AF55C is recommended to be used in conjunction with Quectel AG56xN series to provide Wi-Fi function
with a low-power PCIe Gen 2 interface and Bluetooth function with a UART and a PCM interfaces. It also
supports LTE & Wi-Fi/Bluetooth coexistence interface
2.2. Key Features
Table 2: Key Features
Feature
Details
Power Supply
⚫VBAT Power Supply
Voltage range: 3.0–4.8 V
Typical voltage: 3.3 V
⚫VDD_IO Power Supply
Voltage range: 1.71–1.89 V
Typical voltage: 1.8 V
Operating Frequencies
⚫2.4 GHz Wi-Fi: 2.400–2.4835 GHz
⚫5 GHz Wi-Fi: 5.150–5.850 GHz
⚫Bluetooth: 2.402–2.480 GHz
Wi-Fi Transmission Data
Rates
⚫802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps
⚫802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps,
48 Mbps, 54 Mbps
⚫802.11n: HT20 (MCS 0–7), HT40 (MCS 0–7)
⚫802.11ac: VHT20 (MCS 0–8), VHT40 (MCS 0–9), VHT80 (MCS 0–9)
⚫802.11ax: HE20 (MCS 0–11), HE40 (MCS 0–11), HE80 (MCS 0–11)

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 11 / 58
1
To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation,
e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module’s performance
complies with IEEE and Bluetooth specifications requirements.
Wi-Fi Protocol
⚫IEEE 802.11a/b/g/n/ac/ax
Wi-Fi Operation Modes
⚫AP
⚫STA
Wi-Fi Modulations
CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM, 1024QAM
Wi-Fi Application Interfaces
⚫PCIe
⚫SDIO*
Bluetooth Protocol
Bluetooth 5.2
Bluetooth Modulations
GFSK, 8-DPSK, π/4-DQPSK
Bluetooth Operating Modes
⚫Bluetooth Classic (BR + EDR)
⚫Bluetooth Low Energy (BLE)
Bluetooth Application
Interfaces
⚫PCM
⚫UART
Antenna Interfaces
⚫Wi-Fi and Bluetooth antenna interface (ANT_WIFI/BT)
⚫Wi-Fi antenna interface (ANT_WIFI)
⚫Reserved dedicated Bluetooth antenna interface (ANT_BT)
⚫50 Ω impedance
Physical Characteristics
⚫Size: (21.5 ±0.2) mm ×(19.5 ±0.2) mm ×(2.85 ±0.2) mm
⚫Package: LGA
⚫Weight: 2.7g
Temperature Ranges
⚫Operating temperature range: -40 °C to +85 °C 1
⚫Storage temperature range: -40 °C to +95 °C
RoHS
All hardware components are fully compliant with EU RoHS directive

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 12 / 58
2.3. Functional Diagram
The following figure shows a block diagram of the module:
Diplexer ANT_WIFI
VBAT
XO
5G_TX
Main Chip
Switch
COEX_UART
VDD_IO
Diplexer ANT_WIFI/BT
2.4G_TX
5G_RX
5G_TX
5G_RX
SAW
BTRF_OP
ANT_BT
SAW
Optional
WLAN_SLP_CLK
SAW
BTRF_13dBm_OP
2.4G_TX
2.4G_RX
2.4G_RX
SDIO
PCIe
BT_UART
BT_EN
BT_PCM
Switch
Switch
Switch
Switch
BT_WAKE_HOST
HOST_WAKE_BT
WLAN_EN
WLAN_WAKE_HOST
HOST_WAKE_WLAN
GPIO
Figure 1: Functional Diagram
2.4. EVB Kit
To help you develop applications with the module, Quectel supplies an evaluation board (V2X&5G EVB)
with accessories to control or test the module. For more details, see document [1].

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 13 / 58
3Application Interfaces
3.1. General Description
The module is equipped with 108 LGA pins that can be connected to the cellular application platform. The
subsequent chapters will provide a detailed introduction to the following interfaces and pins of the module:
⚫Power supply
⚫Wi-Fi application interfaces
- WLAN_EN
- PCIe interfaces
- SDIO interfaces*
⚫Bluetooth application interfaces
- BT_EN
- PCM interfaces
- Bluetooth UART
⚫Control signals*
- HOST_WAKE_BT
- BT_WAKE_HOST
- HOST_WAKE_WLAN
- WLAN_WAKE_HOST
⚫Coexistence UART interfaces*
⚫WLAN_SLP_CLK
⚫RF antenna interfaces

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 14 / 58
3.2. Pin Assignment
Power Pins GND Pins
RESERVED Pins
PCIe Pins
UART Pins ANT Pins
1
SDIO_CMD
Signal Pins
PCM Pins
85
GND
47
SDIO_CLK
2
SDIO_DATA
0 3
GPIO3
48
GPIO2
4
SDIO_DATA
1 5
GPIO4
6
GND
7
PCIE_TX_M
8
RESERVED
9
PCIE_
REFCLK_M
10
RESERVED
49
SDIO_DATA
3
50
SDIO_DATA
2
51
GND
52
PCIE_TX_P
53
RESERVED
54
PCIE_
REFCLK_P
55
RESERVED
11
PCIE_RX_M
56
PCIE_RX_P
106
GND
22
RESERVED
21
WLAN_DBG
_TXD
20
VBAT
19
VBAT
18
RESERVED
17
GPIO1
16
COEX_RXD
15
WLAN_SLP
_CLK
14
PCIE_
RST_N
13
PCIE_
WAKE_N
12
PCIE_
CLKREQ_N
23
RESERVED
65
WLAN_DBG
_RXD
64
RESERVED
63
VBAT
62
RESERVED
61
HOST_WAK
E_BT
60
BT_WAKE_
HOST
59
COEX_TXD
58
RESERVED
57
RESERVED
34
GND
33
ANT_WIFI
32
GND
31
GND
30
GND
29
GND
28
ANT_WIFI/
BT
27
GND
26
GND
25
ANT_BT
24
GND
107
GND
75
GND
74
GND
73
GPIO7
72
GPIO6
71
GPIO5
70
GND
69
GND
68
RESERVED
67
GND
66
GND
36
PCM_DOUT
37
PCM_CLK
38
BT_CTS
39
BT_TXD
40
HOST_WAKE
_WLAN
41
RESERVED
42
RESERVED
43
VDD_IO
44
GND
45
RESERVED
46
RESERVED
35
PCM_SYNC
76
PCM_DIN
77
BT_RTS
78
BT_RXD
79
WLAN_WAKE
_HOST
80
RESERVED
81
RESERVED
82
RESERVED
83
BT_EN
84
WLAN_EN
108
GND
86
GND 87 GND 88 GND
98
GND 99 GND 100 GND 89 GND
97
GND 104 GND 101 GND 90 GND
96
GND 103 GND 102 GND 91 GND
95
GND 94 GND 93 GND 92 GND
105
GND
SDIO Pins
Figure 2: Pin Assignment (Top View)
1. Keep all RESERVED and unused pins unconnected.
2. All GND pins should be connected to ground.
NOTE

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 15 / 58
3.3. Pin Description
Table 3: I/O Parameter Definition
DC characteristics include power domain and rate current, etc.
Table 4: Pin Description
Type
Description
AI
Analog Input
AO
Analog Output
AIO
Analog Input/Output
DI
Digital Input
DO
Digital Output
DIO
Digital Input/Output
PI
Power Input
Power Supply
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
VBAT
19, 20, 63
PI
Power supply for the
module
Vmin = 3.0 V
Vnom = 3.3 V
Vmax = 4.8 V
RF performance is
only tested under
3.13–3.5 V (typ.
3.3 V) currently.
It must be
provided with
sufficient current
up to 1.5A.
VDD_IO
43
PI
Power supply for the
module’s I/O pins
Vmin = 1.71 V
Vnom = 1.8 V
Vmax = 1.89 V
It must be
provided with
sufficient current
up to 100 mA.
GND
6, 24, 26, 27, 29–32, 34, 44, 51, 66, 67, 69, 70, 74, 75, 85–108
Wi-Fi Application Interfaces

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 16 / 58
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
WLAN_EN
84
DI
Wi-Fi function
enable control
VDD_IO
Active high.
PCIE_REFCLK_P
54
AI
PCIe reference
clock (+)
Requires
differential
impedance of
100 Ω.
PCIE_REFCLK_M
9
AI
PCIe reference
clock (-)
PCIE_TX_P
52
AO
PCIe transmit (+)
PCIE_TX_M
7
AO
PCIe transmit (-)
PCIE_RX_P
56
AI
PCIe receive (+)
PCIE_RX_M
11
AI
PCIe receive (-)
PCIE_CLKREQ_
N
12
DO
PCIe clock request
VDD_IO
Active low.
PCIE_RST_N
14
DI
PCIe reset
PCIE_WAKE_N
13
DO
PCIe wake up
SDIO_CMD*
1
DIO
SDIO command
SDIO is optional
and is not
supported by
default.
Requires
impedance of
50 Ω.
If unused, keep
them open.
SDIO_CLK*
47
DI
SDIO clock
SDIO_DATA0*
2
DIO
SDIO data bit 0
SDIO_DATA1*
4
DIO
SDIO data bit 1
SDIO_DATA2*
50
DIO
SDIO data bit 2
SDIO_DATA3*
49
DIO
SDIO data bit 3
Bluetooth Application Interfaces
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
BT_EN
83
DI
Bluetooth enable
control
VDD_IO
Active high.
PCM_DIN
76
DI
PCM data input
If unused, keep
them open.
PCM_SYNC
35
DI
PCM data frame
sync
PCM_CLK
37
DI
PCM clock
PCM_DOUT
36
DO
PCM data output

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 17 / 58
BT_RTS
77
DO
DCE request to
send signal to DTE
BT_CTS
38
DI
DCE clear to send
signal from DTE
BT_TXD
39
DO
Bluetooth UART
transmit
BT_RXD
78
DI
Bluetooth UART
receive
Control Signals*
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
HOST_WAKE_BT
61
DI
Host wakes up
Bluetooth
VDD_IO
If unused, keep
them open.
BT_WAKE_HOST
60
DO
Bluetooth wakes up
the host
HOST_WAKE_
WLAN
40
DI
Host wakes up
WLAN
WLAN_WAKE_
HOST
79
DO
WLAN wakes up the
host
Coexistence Interfaces*
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
COEX_TXD
59
DO
LTE &
Wi-Fi/Bluetooth
coexistence transmit
VDD_IO
If unused, keep
them open.
COEX_RXD
16
DI
LTE &
Wi-Fi/Bluetooth
coexistence receive
Debug Interfaces
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
WLAN_DBG_
TXD
21
DO
Wi-Fi/Bluetooth
debug UART
transmit
VDD_IO
Test points must
be reserved.
These pins can be
used as GPIOs.
If unused, keep
them open.
WLAN_DBG_
RXD
65
DI
Wi-Fi/Bluetooth
debug UART
receive
RF Antenna Interfaces
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 18 / 58
ANT_WIFI/BT
28
AIO
Wi-Fi and Bluetooth
antenna interface
50 Ωimpedance
ANT_WIFI
33
AIO
Wi-Fi antenna
interface
ANT_BT
25
AIO
Reserved dedicated
Bluetooth antenna
interface
GPIO Interfaces
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
GPIO1
17
DIO
General-purpose
input/output
VDD_IO
If unused, keep
them open.
GPIO2
48
DIO
General-purpose
input/output
GPIO3
3
DIO
General-purpose
input/output
GPIO4
5
DIO
General-purpose
input/output
GPIO5
71
DIO
General-purpose
input/output
GPIO6
72
DIO
General-purpose
input/output
GPIO7
73
DIO
General-purpose
input/output
Other Interface
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
WLAN_SLP_CLK
15
DI
External 32.768 kHz
WLAN sleep clock
input
VDD_IO
RESERVED
Pin Name
Pin No.
Comment
RESERVED
8, 10, 18, 22, 23, 41, 42, 45, 46, 53, 55, 57, 58, 62, 64, 68,
80–82
Keep them open.

Automotive Wi-Fi&Bluetooth Module Series
AF55C_Hardware_Design 19 / 58
3.4. Power Supply
The following table shows the power supply and ground pins of the module.
Table 5: Definition of Power Supply and GND Pins
The power-up timing is illustrated in the flowing figure.
VBAT
VDD_IO
Sleep Clock (32.768 kHz)
90 % of VH
Figure 3: Power-up Timing
1. VBAT and VDD_IO should not rise 10 %–90 % faster than 40 μs.
2. VBAT should be up before or at the same time as VDD_IO. VDD_IO should not be present first or be
held high before VBAT is high.
3.5. Wi-Fi Application Interfaces
The following figure shows the Wi-Fi application interface connection between the module and the host.
Pin Name
Pin No.
Description
Min.
Typ.
Max.
Unit
VBAT
19, 20,
63
Power supply for the module
3.0
3.3
4.8
V
VDD_IO
43
Power supply for the module’s I/O pins
1.71
1.8
1.89
V
GND
6, 24, 26, 27, 29–32, 34, 44, 51, 66, 67, 69, 70, 74, 75, 85–108
NOTE