RAKINDA SCANMAX M5 User manual

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RAKINDA（SCANMAX)
3D TOF Depth Camera M5
User Manual
Document Version：V1.4
Confidential：Open

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Revision Records
Revision
Date
Version
No.
Revision
Description
2018/12/06
V1.0
First Version
2019/02/26
V1.1
Update working distance range and power consumption
data
2019/03/16
V1.2
1) Add interface description and radiating design guide
2019/04/08
V1.3
1) Adjust size, thickness changed to 10.6mm and update
diagram
2) The max ideal working distance adjusted to 1.2m;
3) The max working temperature adjusted to 45℃and
for the embedded type design, the whole machine
radiating must be considered.
2019/04/08
V1.4
1) Update interface terminal description

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Contents
Revision records.................................................................................................................................2
ⅠProduct Brief.................................................................................................................................. 4
ⅡProduct Introduction.......................................................................................................................5
2.1 Product Specs....................................................................................................................5
2.2 Firmware Components......................................................................................................6
2.3 Product Structure Size.......................................................................................................6
2.4 Interface Description.......................................................................................7
2.5 Module Radiating Design Guide.........................................................................8
ⅢFunctions Introduction................................................................................................................ 11
ⅣUsage Guide................................................................................................................................ 12
ⅤApplication Scenario....................................................................................................................13

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ⅠProduct Brief
M5 Facial Recognition Module is new generation small size 3D TOF Depth camera developed
by Shenzhen Rakinda Technologies Co., Ltd. M5 combines 640×480 pixel TOF camera and 5
million pixel RGB camera. The small and thin structure makes it easy for various embedded type,
handheld detection terminal application to realize facial recognition, face liveness detection,
scene recognition and gestures recognition. We provide SDK. Users can make product
integration and secondary development according to own requirement.
Figure1:M5Module
Features:
Designed basedon TOF;
High resolution 640×480;
High precision:up to 0.1%
With940nm VCSELlight source, canbe usedoutdoor;
Smallandthin,dimensions55mm×18mm×10.6mm,fit for various embedded type
application;
Accuratesynchronization andmatchingamong Depth map,IR picture and RGB picture.

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ⅡProduct Introduction
2.1. Specs
1：See table 1 for products specs
Table 1: M5 Specs
Specifications
Model
M5
TOF
Precision (horizontal x
vertical)
640×480
Field of View (horizontal x
vertical)
60°× 45°
FPs
30 Max
RGB
Precision (horizontal x
vertical)
1080P/960P/720P/VGA
Field of View (horizontal x
vertical)
74°× 56° @960P（Default）
63°× 37° @1080P
74°× 42°@720P
74°× 56°@VGA
FPs
30 Max
Video Coding
JPEG, RGB
Measurement Distance (Unit: m)
Note
1
0.3 - 1.2
Measurement Precision Note
2
0.1%
Measurement Accuracy Note
3
1%
Light Source
940nm VCSEL
Data Transmission Interface
Micro USB
Supply Note
4
5V
Typical Power Consumption (W)
3.4
Working Temperature （℃） Note
5
0-45
Operating System
Windows7 or above, Linux, Android
Dimension (length x width x
thickness mm)
55×18×10.6 (module without steel fixture)
65.8×18×10.6 (module with steel fixture)
Note 1: measurement distance: testing with 90% reflectivity white wall, it is detective distance in the central area.
The reflectivity has impact on measurement distance, precision and accuracy.
Note 2: measurement precision: RMS error of central area with repeated testing on 90% reflectivity white wall;
Note 3: measurement accuracy: the error between measurement distance and real distance for testing on 90%
reflectivity white wall;
Note 4: board USB 5V power supply, current above 1A, direct USB power supply can be used; if current less than
1A, the special power supply cable needs to be used.
Note 5: The radiating design must take the whole machine into consideration; please refer to the radiation design
guide or contact factory for support.

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2.2. Main Hardware Components
1 TOF camera module
1VCSELlaser
1 RGB camera module
1 dedicated ASIC processingchip
1 control motherboard (including CPU, FLASH, etc.)
2.3. Product Structure & Size
（Unit：mm）
M5 module structure & size：
Figure
2 M5
structure & size
1. Fixing Instruction
(1) If the customer's product is a metal material, the module can be fixed to the product through two
fixed steel sheets on the module. Customer can design the limit structure according to the internal
structure of the product to facilitate assembly, and also prevent assembly deviations from causing
deviations between the lens and the glass transparent area.

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(2) If the customer's products are plastic parts, in addition to meeting the above requirements, the screw
column should also have enough strength to prevent the fracture in the process of assembly. It is not
recommended to use self-tapping screws for screw selection. It is recommended to add copper column
of screws in the screw column and fix it with mechanical screws.
(3) During the module installation, do not touch the lens by hand. Wear anti-static gloves and anti-static
bracelet to prevent the damage of the module's main board components caused by static electricity.
2. Operating Instructions for Front Panel Glass
(1) Glass size set according to the customer product structure and light transmittance of glass all band ≧
98%, glass installation needs to have enough of the bearing surface, cannot affect the safe use, in the
case of address security thinned as far as possible, suggest 1 mm thickness, in order to prevent the
VCSEL infrared light reflection to the CCD camera, Suggestions on the glass CCD and VCSEL window
around the area to increase absorption of infrared coating.
(2) The windowing area of CCD,VCSEL and RGB on the glass is designed according to the market
Angle (refer to the 3D picture for details), and a margin should be left to prevent the assembly deviation
from causing the blocking of glass screen printing.
Figure 3. Field View of M5 Module
(3) Between the module and the glass, light-blocking cotton shall be added around the CCD and VCSEL
to prevent the infrared light of VCSEL from reflecting into the CCD lens. The compressed light-
blocking cotton shall not exceed the windowing area of the glass.
(4) Glass, light-blocking cotton and modules shall be fitted closely.
2.4 Interface Definition

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Terminal
model
Name
Figure 4: terminal definition of module
1. Power supply requirement: 5V / 1A
Photo5 A1251WR-5P connector description
Attention: The male seat is configured in the equipment, the corresponding female seat is 1.25mm, 5P,
and the data cable is made into a twisted pair.
2.5. Module thermal design description
1. Because the product volume is too small, the chip temperature is relatively high, heat conduction
treatment is required to avoid excessive temperature to reduce product life, you can add a radiator on the
back, the radiator material is AL6063, aluminum extrusion or machining, the heat dissipation area is not
less than 100cm², the surface treatment is anodized black (increasing the emissivity), the radiator
selection should avoid using long strips;
2. If the back of the customer's product is made of metal, the temperature can be directly led to the back
cover;

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3. The entire motherboard conducts heat to the heat sink (the heat sink is a whole) through a thermally
conductive silicone sheet (without viscosity). The thermal conductivity of the thermally conductive
adhesive is 3W / mk and the thickness is 1mm and the module presses the thermally conductive silicone
sheet. However, it should be noted that the pressure should be controlled within the compression amount
of the thermal conductive glue to prevent the chip from being crushed;
4：The ambient temperature of the equipment doesn’t exceed 45 ℃;
5: When installing the radiator, please pay attention not to contact with other components of the
motherboard to prevent damage to the motherboard due to short circuit
6: It is forbidden to stick tape and other materials that affect heat dissipation on the motherboard and
bracket, so as not to cause the motherboard temperature to be too high and affect product performance.
Installation location of thermally conductive silicone sheet
Examples of fixing methods:
Example 1: Add a radiator on the back:
Example 2: Conduct heat to the rear shell:

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For the long rear shell in the above figure, a layer of graphene can be attached inside the shell to quickly
and evenly spread the heat to avoid local overheating of the shell.