
Trusted TMR 120 Vac Digital Input Module 40 Channel Table of Contents
Rockwell Automation Publication ICSTT-RM450C-EN-P Issue 11 1
Table of Contents
1. Description ............................................................................................................ 3
1.1. Field Termination Unit (FTU)...................................................................................................... 4
1.2. Field Interface Unit (FIU)............................................................................................................ 4
1.3. Host Interface Unit (HIU) ........................................................................................................... 5
1.4. Front Panel Unit (FPU) ............................................................................................................... 5
1.5. Line Monitoring Thresholds ....................................................................................................... 6
1.6. Housekeeping............................................................................................................................. 6
1.7. Fault Detection and Testing ....................................................................................................... 6
1.8. Sequence of Events Characteristics ........................................................................................... 7
2. Installation............................................................................................................8
2.1. Module Insertion/Removal ........................................................................................................ 8
2.2. Field Cable Selection .................................................................................................................. 8
2.3. Module Pin-out Connections ..................................................................................................... 9
2.4. Trusted Module Polarisation/Keying. ...................................................................................... 11
3. Application .......................................................................................................... 12
3.1. Module Configuration.............................................................................................................. 12
3.2. T8424 Complex Equipment Definition..................................................................................... 12
3.2.1. Rack 1: DI.......................................................................................................................... 14
3.2.2. Rack 2: STATE ................................................................................................................... 14
3.2.3. Rack 3: AI - Channel Field Voltage.................................................................................... 15
3.2.4. Rack 4: SPARE ................................................................................................................... 16
3.2.5. Rack 5: LINE_FLT............................................................................................................... 16
3.2.6. Rack 6: DISCREP................................................................................................................ 16
3.2.7. Rack 7: HKEEPING............................................................................................................. 17
3.2.8. Rack 8: Information .......................................................................................................... 19
3.3. Sequence of Events Configuration........................................................................................... 20
3.4. System.INI File Configuration................................................................................................... 21
4. Operation ............................................................................................................ 22
4.1. Front Panel ............................................................................................................................... 22
4.2. Module Status LEDs.................................................................................................................. 24
4.3. I/O Status LEDs......................................................................................................................... 25
5. Fault Finding and Maintenance............................................................................. 26
5.1. Fault Reporting......................................................................................................................... 26
5.2. Field Wiring Faults.................................................................................................................... 26